CN114082966B - Processing method and equipment for controllable BGA solder ball diameter - Google Patents
Processing method and equipment for controllable BGA solder ball diameter Download PDFInfo
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- CN114082966B CN114082966B CN202111366071.XA CN202111366071A CN114082966B CN 114082966 B CN114082966 B CN 114082966B CN 202111366071 A CN202111366071 A CN 202111366071A CN 114082966 B CN114082966 B CN 114082966B
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 37
- 238000003672 processing method Methods 0.000 title abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 85
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 68
- 230000007246 mechanism Effects 0.000 claims abstract description 59
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 28
- 238000005520 cutting process Methods 0.000 claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 238000005507 spraying Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 19
- 238000012545 processing Methods 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 238000002347 injection Methods 0.000 claims description 15
- 239000007924 injection Substances 0.000 claims description 15
- 230000009471 action Effects 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 8
- 230000005484 gravity Effects 0.000 claims description 6
- 238000012216 screening Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 5
- 230000003139 buffering effect Effects 0.000 claims 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 8
- 238000000889 atomisation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F2009/065—Melting inside a liquid, e.g. making spherical balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0832—Handling of atomising fluid, e.g. heating, cooling, cleaning, recirculating
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a processing method and equipment for controlling the diameter of a BGA solder ball. The technical scheme adopted is as follows: comprises a solder ball melting device, a jet flow spraying device, a solder column cutting device, a liquid nitrogen cooling device and a sphere forming device; the tin ball melting device is cylindrical, the lower part of the center of the lower side wall of the tin ball melting device is fixedly connected with the top of the jet flow spraying device, a first screen mechanism and a second screen mechanism are arranged in the jet flow spraying device, the lower part of the jet flow spraying device is fixedly connected with a top feed inlet of the tin column cutting device, the lower part of the tin column cutting device is in threaded connection with the top end of the liquid nitrogen cooling device through a flange, and the bottom end of the liquid nitrogen cooling device is in threaded connection with the top end of the sphere forming device through a flange. The invention has the beneficial effects that: the operation difficulty is reduced, circular screens with different apertures are rapidly switched, the production efficiency is improved, and therefore batch rapid production of solder balls with different sizes is achieved.
Description
Technical Field
The invention belongs to the technical field of BGA solder ball production and manufacturing, and relates to a processing method and equipment for controlling the diameter of a BGA solder ball.
Background
At present, many production equipment of BGA solder balls at home and abroad are researched by an atomization method, a shredding remelting method and an excitation spraying method. The atomization method is a traditional powder preparation technology, and utilizes the kinetic energy of an atomization medium to disperse a metal liquid flow so as to form metal liquid drops. Although the atomization method has high productivity, the atomization process characteristics determine that the size distribution range of the produced powder or particles is very wide, and the morphology is difficult to ensure to be a strict geometric sphere, so that the screening process is complex, and the product yield is very low; the shredding remelting method has the main advantages that the controllability of the production process is good, the yield of products is high, but the production process is numerous, the required equipment investment is large, various impurities are easy to introduce in the process of multiple times of processing, the fragile solder containing Bi and the like is not easy to process into filaments or foil materials, in addition, the diameter of a tin ball for CSP packaging is smaller, the processing precision of the used mechanical equipment is high, and the realization is difficult; the jet breaking method is that under the action of pressure, molten metal is made to pass through a nozzle to produce metal jet, the flow speed is controlled to make the jet maintain laminar flow state, mechanical vibration with certain frequency is acted on the jet, when the vibration frequency, amplitude and technological parameters of nozzle diameter are matched, the jet can be broken into uniform metal drops, and the technological process is simple, easy to implement automatic control, short in flow, low in production cost and uniform in obtained metal particle size, so that the method is the current precise solder ball preparation method with the most development prospect; however, in the conventional jet breaking method, although the jet pressure, the jet speed and the oscillation frequency can be set according to calculation, the tin material is jetted to form liquid flow, and then is oscillated to break, and then the tin ball is formed by falling down in the process of forming the tin ball, the formed tin ball often depends on the physical characteristics of the liquid flow, so that the true sphericity is poor, in addition, if the tin balls with different sizes are required to be produced in batches, various parameters are required to be repeatedly calculated and adjusted, the process is complicated, and the industrialization operation is inconvenient.
In view of the problems, the invention adopts a jet fracture method, designs a screen mechanism convenient to replace, and further realizes the rapid switching production of solder balls with different sizes through the switchable screen mechanism by matching the physical characteristics of the screen with the characteristics of the jet fracture method.
Disclosure of Invention
In view of the problems existing in the prior art, the invention discloses a processing device capable of controlling the diameter of a BGA solder ball, which adopts the technical scheme that the processing device comprises a solder melting device, a jet injection device, a solder column cutting device, a liquid nitrogen cooling device and a ball forming device; the tin material melting device comprises a cylindrical barrel, a charging hole and an air vent are respectively formed in the left side and the right side of the upper surface of the cylindrical barrel, a discharging hole is formed in the center of the lower surface of the cylindrical barrel, the discharging hole is fixedly connected with a feeding hole at the top of the jet injection device, the discharging hole at the bottom of the jet injection device is connected with a feeding pipe at the top of the tin column cutting device through threads, the lower part of the feeding pipe is fixedly connected with a first buffer cavity, the lower part of the first buffer cavity is provided with a first flange plate, the lower part of the first flange plate is in threaded connection with a first screen mechanism, the first screen mechanism comprises a front semicircular ring and a rear semicircular ring, a first screen mounting hole is formed in the central side wall of the front semicircular ring, the left end and the right end of the front semicircular ring are fixedly connected with fixing blocks, the side walls at the left side and the right side of the first screen mounting hole are respectively fixedly connected with the two ends of a handle, the central side wall of the rear semicircular ring is provided with a second screen mounting hole, the left end and the right end of the rear semicircular ring are fixedly connected with fixed seats, round screens are arranged in the front semicircular ring and the rear semicircular ring, the front edge and the rear edge of each round screen are respectively in threaded connection with the end face of one end of a vibrating rod, the other ends of the vibrating rods are respectively sleeved in the first screen mounting hole and the second screen mounting hole, the lower part of the first screen mechanism is provided with a second buffer cavity, the lower part of the second buffer cavity is provided with a second screen mechanism, the lower part of the second screen mechanism is provided with a second flange plate, the lower part of the second flange plate is provided with a liquid nitrogen cooling device, the liquid nitrogen cooling device comprises a cooling pipeline, the upper end opening and the lower end opening of the cooling pipeline are respectively welded with a third flange plate, the central side wall of the cooling pipeline is fixedly connected with a liquid nitrogen feeding pipe, the sphere forming device is arranged at the lower part of the liquid nitrogen cooling device; by arranging the heating rods at the circumference and the center of the cylindrical barrel, the tin material can be ensured to be uniformly melted, and meanwhile, the temperature is controllable, so that the production parameters can be conveniently controlled; the tin column cutting device capable of being separated from the front part and the rear part is designed, so that the built-in circular screen can be replaced conveniently, circular screens with different apertures can be adjusted quickly, batch quick production of tin balls with different sizes can be realized, the operation difficulty is reduced, the switching efficiency is improved, and the production efficiency is improved.
As a preferable scheme of the invention, the circumference edge and the center opening of the cylindrical barrel are respectively provided with a heating rod, and the circumference edge of the bottom of the cylindrical barrel is respectively provided with a bracket leg; the circumference, the edge and the center are provided with heating rods to ensure the heating uniformity, thereby fully dissolving the tin material.
As a preferable scheme of the invention, a first electromagnetic valve is arranged on the pipe wall of a discharge hole at the bottom of the jet injection device; the electromagnetic valve is adopted for control, so that remote automatic control is convenient to realize, and safety is improved.
As a preferable scheme of the invention, the upper and lower side walls of the front semicircular ring are respectively connected with the first flange plate and the second buffer cavity in a sliding way, and the upper and lower side walls of the rear semicircular ring are respectively connected with the first flange plate and the second buffer cavity in a fixed way; the screws between the fixing blocks at the left end and the right end of the front semicircular ring and the fixing seats at the left end and the right end of the rear semicircular ring are removed, the front semicircular ring can be separated from the rear semicircular ring together with the built-in circular screen, and the circular screen can be quickly taken down to complete replacement.
As a preferable scheme of the invention, the first screen mechanism and the second screen mechanism have the same structure, the second screen mechanism also comprises a high-frequency vibrator, and the high-frequency vibrator is arranged on a vibrating rod at the rear side of the second screen mechanism; the high-frequency vibrator drives the vibrating rod to vibrate at a front and back high speed, and the high-speed front and back reciprocating motion of the circular screen can be realized, so that a plurality of strands of molten tin flowing downwards are cut off, and a tin column with uniform length is formed.
As a preferable scheme of the invention, the aperture range of the circular screen is 0.1-0.8 mm, and the diameter of the circular screen is smaller than the inner diameter of a circular ring surrounded by the front semicircular ring and the rear semicircular ring; by means of the design, the circular screen can be prevented from being blocked by the inner wall of the circular ring surrounded by the front semicircular ring and the rear semicircular ring when the circular screen oscillates front and back.
As a preferable scheme of the invention, the liquid nitrogen feeding pipe is provided with a second electromagnetic valve.
As a preferable scheme of the invention, the sphere forming device is a hollow pipeline with the height of 10 meters and is erected between the upper floor and the lower floor of a factory building; the high pipeline is adopted, and nitrogen is flushed, so that the tin column can fully rotate to form a sphere by the column when falling freely, and the nitrogen cools and shapes the tin column.
According to the processing equipment for controlling the diameter of the BGA solder ball, the specific processing method comprises the following steps:
step one: starting a system power supply, setting the heating temperature of the heating rod to 300 ℃, then slowly feeding tin materials into the cylindrical barrel through the charging hole, and waiting for the tin materials to melt into liquid;
step two: the pressure of the jet injection device is set to be 0.05MPA-0.15MPA, a first electromagnetic valve and liquid tin material are injected to a first screen mechanism of the tin column cutting device through the jet injection device, and a thicker liquid tin column is split into a plurality of thin tin columns under the action of a built-in circular screen;
step three: the multi-strand thin-flow tin columns formed through the first screen mechanism downwards flow through the second screen mechanism, and are split again through the second screen mechanism, so that the tin columns are divided into more uniform multi-strand thin-flow tin columns again;
step four: when the multi-strand trickle tin column passes through a circular screen mesh arranged in the second screen mesh mechanism, the high-frequency vibrator is used for vibrating the multi-strand trickle tin column into tin column sections with uniform length by setting the range of 2500HZ-3000 HZ;
step six: the tin column section performs free falling movement in a pipeline of the sphere forming device due to gravity, and falls through the rotation of the pipeline with the height of 10 meters to form a sphere structure;
step seven: collecting, polishing and screening solder balls formed by rotary falling, and selecting qualified products within an error range;
step eight: in the whole production process, the control of the size of the solder balls is realized by replacing circular screens with different apertures.
The invention has the beneficial effects that: by arranging the heating rods at the circumference and the center of the cylindrical barrel, the tin material can be ensured to be uniformly melted, and meanwhile, the temperature is controllable, so that the production parameters can be conveniently controlled; the tin column cutting device capable of being separated from the front part and the rear part is designed, so that the built-in circular screen can be replaced conveniently and quickly, circular screens with different apertures can be adjusted quickly, the operation difficulty is reduced, the quick switching is realized, the production efficiency is improved, and the batch quick production of tin balls with different sizes is realized.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a solder melting apparatus according to the present invention;
fig. 3 is a bottom view of the tin melting device of the invention;
FIG. 4 is a schematic diagram of a jet ejector of the present invention;
FIG. 5 is a left side view of the tin column cutting device of the invention;
FIG. 6 is a rear view of the tin column cutting device of the present invention;
FIG. 7 is a cross-sectional view of a tin column cutting device according to the present invention;
FIG. 8 is a schematic diagram of a liquid nitrogen cooling device of the present invention.
In the figure: 1-tin material melting device, 2-jet injection device, 3-tin column cutting device, 4-liquid nitrogen cooling device, 5-sphere forming device, 11-cylinder barrel, 12-feed inlet, 13-vent hole, 14-discharge hole, 15-heating rod, 16-bracket leg, 21-first solenoid valve, 31-feed pipe, 32-first buffer cavity, 321-first flange, 33-first screen mechanism, 331-front semicircle ring, 3311-first screen mounting hole, 3312-fixed block, 3313-handle, 332-rear semicircle ring, 3321-second screen mounting hole, 3322-fixed seat, 333-circular screen, 334-vibration rod, 34-second buffer cavity, 35-second screen mechanism, 351-high frequency vibrator, 36-second flange, 41-cooling pipeline, 42-third flange, 43-liquid nitrogen feed pipe, 44-second solenoid valve.
Detailed Description
Example 1
As shown in fig. 1 to 8, the processing equipment for controlling the diameter of the BGA solder ball adopts the technical scheme that the processing equipment comprises a solder melting device 1, a jet injection device 2, a solder column cutting device 3, a liquid nitrogen cooling device 4 and a ball forming device 5; the tin material melting device 1 comprises a cylindrical barrel 11, a charging hole 12 and an air vent 13 are respectively formed in the left side and the right side of the upper surface of the cylindrical barrel 11, a discharging hole 14 is formed in the center of the lower surface of the cylindrical barrel 11, a heating rod 15 is respectively installed at the circumferential edge and the center of the cylindrical barrel 11, and support legs 16 are respectively installed at the circumferential edge of the bottom of the cylindrical barrel 11.
The discharge hole 14 is fixedly connected with a feed inlet at the top of the jet injection device 2, and a first electromagnetic valve 21 is arranged on the wall of the discharge hole at the bottom of the jet injection device 2.
The discharging hole at the bottom of the jet spraying device 2 is in threaded connection with the feeding pipe 31 at the top of the tin column cutting device 3, the lower part of the feeding pipe 31 is fixedly connected with the first buffer cavity 32, the lower part of the first buffer cavity 32 is provided with the first flange plate 321, the lower part of the first flange plate 321 is in threaded connection with the first screen mechanism 33, the first screen mechanism 33 comprises a front semicircular ring 331 and a rear semicircular ring 332, the central side wall of the front semicircular ring 331 is provided with a first screen mounting hole 3311, the left end and the right end of the front semicircular ring 331 are fixedly connected with fixing blocks 3312, the side walls of the left side and the right side of the first screen mounting hole 3311 are respectively fixedly connected with the two ends of a handle 3313, the central side wall of the rear semicircular ring 332 is provided with a second screen mounting hole 3321, the left end and the right end of the rear semicircular ring 332 are fixedly connected with a fixing seat 3322, the inside of the front semicircular ring 331 and the rear semicircular ring 332 is provided with a circular ring 333, the front end surface and the rear end surface of the front semicircular ring 333 are respectively connected with a 334, the second screen mechanism is provided with a second screen mechanism 34, the lower end surface of the second screen mechanism is provided with a second screen mechanism 33, the second screen mechanism is sleeved with a second screen 35, the second screen mechanism is provided with a second screen mechanism 33 is provided with a second vibrating cavity 35, and the second screen mechanism is provided with a vibrating mechanism is provided with a second vibrating screen mechanism 34, and a vibrating mechanism is provided with a vibrating screen mechanism, and a vibrating mechanism is provided;
the upper and lower side walls of the front semicircular ring 331 are respectively connected with the first flange 321 and the second buffer cavity 34 in a sliding manner, and the upper and lower side walls of the rear semicircular ring 332 are respectively connected with the first flange 321 and the second buffer cavity 34 in a fixed manner;
the first screen mechanism 33 has the same structure as the second screen mechanism 35, the second screen mechanism 35 further comprises a high-frequency vibrator 351, and the high-frequency vibrator 351 is mounted on a vibrating rod at the rear side of the second screen mechanism 35;
the diameter of the circular screen 333 is in the range of 0.1-0.8 mm, and the diameter of the circular screen 333 is smaller than the inner diameter of the ring enclosed by the front semicircle 331 and the rear semicircle 332.
The liquid nitrogen cooling device 4 is installed at the lower part of the second flange 36, the liquid nitrogen cooling device 4 comprises a cooling pipeline 41, a third flange 42 is welded at the upper end opening and the lower end opening of the cooling pipeline 41 respectively, a liquid nitrogen feeding pipe 43 is fixedly connected with a hole in the center of the side wall of the cooling pipeline 41, and a second electromagnetic valve 44 is installed on the liquid nitrogen feeding pipe 43.
The lower part of the liquid nitrogen cooling device 4 is provided with the sphere forming device 5, the sphere forming device 5 is a hollow pipeline with the height of 10 meters, and the sphere forming device is erected between an upper floor and a lower floor of a factory building.
A processing device capable of controlling the diameter of BGA solder balls comprises the following specific processing methods:
step one: starting a system power supply, setting the heating temperature of the heating rod 15 to 300 ℃, then slowly feeding tin materials into the cylindrical barrel 11 through the feed inlet 12, and waiting for the tin materials to melt into liquid;
step two: the pressure of the flow jet device 2 is set to be 0.05MPA-0.15MPA, an electromagnetic valve 21 is used for jetting liquid tin material to a first screen mechanism 33 of the tin column cutting device 3 through the jet device 2, and a thicker liquid tin column is split into a plurality of thin flow tin columns under the action of a built-in circular screen 333;
step three: the multi-strand trickle tin column formed by the first screen mechanism 33 flows downwards through the second screen mechanism 35, and is split again by the second screen mechanism 35, so that the tin column is split into more uniform multi-strand trickle tin columns again;
step four: when the multi-strand trickle tin column passes through a circular screen built in the second screen mechanism 35, the high-frequency vibrator 351 is used for vibrating the multi-strand trickle tin column into tin column sections with uniform length by setting the range of 2500HZ-3000 HZ;
step five: the tin column section continues to move downwards under the action of gravity and enters the liquid nitrogen cooling device 4, liquid nitrogen flows into the pipeline of the lower sphere forming device 5, and the whole pipeline is filled with liquid nitrogen;
step six: the tin column section freely falls in the pipeline of the sphere forming device 5 due to gravity, and falls through the pipeline with the height of 10 meters to form a sphere structure;
step seven: collecting, polishing and screening solder balls formed by rotary falling, and selecting qualified products within an error range;
step eight: in the whole production process, the control of the size of the solder balls is realized by replacing the circular screen 333 with different apertures.
The working principle of the invention is as follows: when the device is used, a system power supply is started, the heating temperature of the heating rod 15 is set to 300 ℃, tin is added into the tin melting device 1 through the charging port 12 above the cylindrical barrel 11, the tin is melted into liquid in the cylindrical barrel 11, the liquid is sprayed into the tin column cutting device 3 below through the jet spraying device 2 under the pressure of the system, thicker liquid tin columns pass through the first screen mechanism 33 in the tin column cutting device 3 and are filtered through the built-in circular screen 333 to form a plurality of thin-flow tin columns, the plurality of thin-flow tin columns continuously flow downwards under the action of gravity, and the circular screen 333 uniformly cuts off the thin-flow tin columns passing through the screen holes of the tin columns under the action of the front-back high-frequency oscillation of the high-frequency oscillator 351, the cut-off small tin columns Duan Xizhu fall into a pipeline of the sphere forming device 5 filled with liquid nitrogen after the movement of a higher free fall, the small columns Duan Xizhu are rotated in the process of liquid nitrogen to form spherical shapes gradually, and finally cool the tin columns gradually under the action of liquid nitrogen.
Electrical connections or structures not described in detail herein are prior art.
Although the specific embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various changes and modifications without inventive labor may be made within the scope of the present invention without departing from the spirit of the present invention, which is within the scope of the present invention.
Claims (9)
1. The processing equipment capable of controlling the diameter of the BGA solder ball is characterized in that: comprises a tin material melting device (1), a jet flow spraying device (2), a tin column cutting device (3), a liquid nitrogen cooling device (4) and a sphere forming device (5); the tin material melting device (1) comprises a cylindrical barrel (11), a charging hole (12) and an air vent (13) are respectively formed in the left side and the right side of the upper surface of the cylindrical barrel (11), a discharging hole (14) is formed in the center of the lower surface of the cylindrical barrel (11), the discharging hole (14) is fixedly connected with a feeding hole at the top of the jet injection device (2), a discharging hole at the bottom of the jet injection device (2) is in threaded connection with a feeding pipe (31) at the top of the tin column cutting device (3), a first buffer cavity (32) is fixedly connected to the lower part of the feeding pipe (31), a first flange plate (321) is arranged at the lower part of the first buffer cavity (32), the lower part of the first flange plate (321) is in threaded connection with the first screen mechanism (33), the first screen mechanism (33) comprises a front semicircular ring (331) and a rear semicircular ring (332), a first screen mounting hole (3311) is formed in the central side wall of the front semicircular ring (331), fixing blocks (3312) are fixedly connected with the left end and the right end of the front semicircular ring (331), the side walls of the left side and the right side of the first screen mounting hole (3311) are respectively and fixedly connected with the two ends of a handle (3313), a second screen mounting hole (3321) is formed in the central side wall of the rear semicircular ring (332), fixing seats (3322) are fixedly connected with the left end and the right end of the rear semicircular ring (332), the utility model discloses a ball forming device, including front semicircle ring (331), back semicircle ring (332), round screen (333) are provided with inside around round screen (333), around round screen (333) the front and back edge respectively with the terminal surface threaded connection of the one end of vibrations stick (334), around the other end of vibrations stick (334) suit is in respectively in first screen cloth mounting hole (3311), second screen cloth mounting hole (3321), first screen cloth mechanism (33) lower part is provided with second buffering cavity (34), second buffering cavity (34) lower part is provided with second screen cloth mechanism (35), second screen cloth mechanism (35) lower part is provided with second ring flange (36), install second ring flange (36) lower part liquid nitrogen cooling device (4), liquid nitrogen cooling device (4) are including cooling tube (41), both ends mouth weld third ring flange (42) respectively about cooling tube (41) lateral wall centre trompil fixed connection liquid nitrogen inlet pipe (43), cooling device (4) lower part is provided with ball forming device (5).
2. The processing apparatus for controlling the diameter of a BGA solder ball according to claim 1, wherein: the heating rod (15) is respectively installed at the circumferential edge and the center opening of the cylindrical barrel (11), and the bracket legs (16) are respectively installed at the circumferential edge of the bottom of the cylindrical barrel (11).
3. The processing apparatus for controlling the diameter of a BGA solder ball according to claim 1, wherein: the pipe wall of the discharge hole at the bottom of the jet injection device (2) is also provided with a first electromagnetic valve (21).
4. The processing apparatus for controlling the diameter of a BGA solder ball according to claim 1, wherein: the upper side wall and the lower side wall of the front semicircular ring (331) are respectively connected with the first flange plate (321) and the second buffer cavity (34) in a sliding mode, and the upper side wall and the lower side wall of the rear semicircular ring (332) are respectively connected with the first flange plate (321) and the second buffer cavity (34) in a fixed mode.
5. The processing apparatus for controlling the diameter of a BGA solder ball according to claim 1, wherein: the first screen mechanism (33) and the second screen mechanism (35) are identical in structure, the second screen mechanism (35) further comprises a high-frequency vibrator (351), and the high-frequency vibrator (351) is arranged on a vibrating rod at the rear side of the second screen mechanism (35).
6. The processing apparatus for controlling the diameter of a BGA solder ball according to claim 1, wherein: the aperture range of the circular screen (333) is 0.1-0.8 mm, and the diameter of the circular screen (333) is smaller than the inner diameter of a circular ring surrounded by the front semicircular ring (331) and the rear semicircular ring (332).
7. The processing apparatus for controlling the diameter of a BGA solder ball according to claim 1, wherein: and a second electromagnetic valve (44) is also arranged on the liquid nitrogen feeding pipe (43).
8. The processing apparatus for controlling the diameter of a BGA solder ball according to claim 1, wherein: the sphere forming device (5) is a hollow pipeline with the height of 10 meters and is erected between an upper floor and a lower floor of a factory building.
9. A method of processing solder balls using the controllable BGA solder ball diameter processing apparatus of any one of claims 1-8, comprising the steps of:
step one: starting a system power supply, setting the heating temperature of the heating rod (15) to 300 ℃, then slowly feeding tin materials into the cylindrical barrel (11) through the feed inlet (12), and waiting for the tin materials to melt into liquid;
step two: the pressure of the jet injection device (2) is set to be 0.05MPA-0.15MPA, a first electromagnetic valve (21) is used for injecting liquid tin material to a first screen mechanism (33) of the tin column cutting device (3) through the jet injection device (2), and a thicker liquid tin column is split into a plurality of thin tin columns under the action of a built-in circular screen (333);
step three: the multi-strand thin-flow tin columns formed by the first screen mechanism (33) downwards flow through the second screen mechanism (35), and are split again by the second screen mechanism (35) to be divided into more uniform multi-strand thin-flow tin columns again;
step four: when the multi-strand trickle tin column passes through a circular screen mesh arranged in the second screen mesh mechanism (35), the high-frequency vibrator (351) is used for vibrating the multi-strand trickle tin column into tin column sections with uniform length by setting the range of 2500HZ-3000 HZ;
step five: the tin column section continues to move downwards due to gravity and enters a liquid nitrogen cooling device (4)
In, liquid nitrogen flows into a pipeline of a sphere forming device (5) at the lower part, and the whole pipeline is filled with the liquid nitrogen;
step six: the tin column section freely falls in the pipeline of the sphere forming device (5) due to gravity, and falls through the pipeline with the height of 10 meters to form a sphere structure;
step seven: collecting, polishing and screening solder balls formed by rotary falling, and selecting qualified products within an error range;
step eight: in the whole production process, the control of the size of the solder balls is realized by replacing circular screens (333) with different apertures.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579479B1 (en) * | 2000-11-09 | 2003-06-17 | Honeywell International Inc. | Methods of forming a plurality of spheres; and pluralities of spheres |
| CN111558724A (en) * | 2020-06-29 | 2020-08-21 | 泰安晶品新材料科技有限公司 | BGA solder ball preparation device and preparation process based on jet instability principle |
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
| CN113634758A (en) * | 2021-08-16 | 2021-11-12 | 广州海普电子材料科技有限公司 | Vibration injection type BGA tin ball processing and producing equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6565342B1 (en) * | 2000-11-17 | 2003-05-20 | Accurus Scientific Co. Ltd. | Apparatus for making precision metal spheres |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6579479B1 (en) * | 2000-11-09 | 2003-06-17 | Honeywell International Inc. | Methods of forming a plurality of spheres; and pluralities of spheres |
| CN111558724A (en) * | 2020-06-29 | 2020-08-21 | 泰安晶品新材料科技有限公司 | BGA solder ball preparation device and preparation process based on jet instability principle |
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
| CN113634758A (en) * | 2021-08-16 | 2021-11-12 | 广州海普电子材料科技有限公司 | Vibration injection type BGA tin ball processing and producing equipment |
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