CN114082966A - Processing method and equipment capable of controlling diameter of BGA solder ball - Google Patents
Processing method and equipment capable of controlling diameter of BGA solder ball Download PDFInfo
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- CN114082966A CN114082966A CN202111366071.XA CN202111366071A CN114082966A CN 114082966 A CN114082966 A CN 114082966A CN 202111366071 A CN202111366071 A CN 202111366071A CN 114082966 A CN114082966 A CN 114082966A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 20
- 238000003672 processing method Methods 0.000 title claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 91
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 68
- 239000007788 liquid Substances 0.000 claims abstract description 49
- 230000007246 mechanism Effects 0.000 claims abstract description 48
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 238000004401 flow injection analysis Methods 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 23
- 239000004744 fabric Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 15
- 230000009471 action Effects 0.000 claims description 11
- 238000012216 screening Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 230000005484 gravity Effects 0.000 claims description 6
- 238000005498 polishing Methods 0.000 claims description 3
- 230000003139 buffering effect Effects 0.000 claims 1
- 238000013016 damping Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 6
- 238000000889 atomisation Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F2009/065—Melting inside a liquid, e.g. making spherical balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0832—Handling of atomising fluid, e.g. heating, cooling, cleaning, recirculating
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a processing method and equipment capable of controlling the diameter of a BGA solder ball. The technical scheme is as follows: comprises a tin ball melting device, a jet flow injection device, a tin column cutting device, a liquid nitrogen cooling device and a ball forming device; the tin ball melting device is cylindrical, the lower portion of the center of the lower side wall of the tin ball melting device is fixedly connected with the top of the jet flow injection device, a first screen mechanism and a second screen mechanism are arranged inside the jet flow injection device, the lower portion of the jet flow injection device is fixedly connected with a top feed inlet of the tin column cut-off device, the lower portion of the tin column cut-off device is in threaded connection with the top end of the liquid nitrogen cooling device through a flange, and the bottom end of the liquid nitrogen cooling device is in threaded connection with the top end of the sphere forming device through a flange. The invention has the beneficial effects that: the operation difficulty is reduced, the circular screen meshes with different apertures are quickly switched, the switching is quick, the production efficiency is improved, and the batch quick production of the solder balls with different sizes is realized.
Description
Technical Field
The invention belongs to the technical field of BGA solder ball production and manufacturing, and relates to a processing method and equipment capable of controlling the diameter of a BGA solder ball.
Background
At present, the production equipment of the BGA tin ball is researched more at home and abroad by an atomization method, a shredding remelting method and an excitation injection method. The atomization method is a traditional powder preparation technology, and a method for dispersing metal liquid flow into metal liquid drops by utilizing kinetic energy of an atomization medium. Although the atomization method has high productivity, the atomization process characteristics determine that the size distribution range of the produced powder or particles is very wide, and the shape is difficult to ensure to be a strict geometric sphere, so the screening process is complex, and the product yield is very low; the main advantages of the shredding remelting method are that the controllability of the production process is good, the yield of the product is high, but the production procedures are multiple, the investment of required equipment is large, various impurities are easily introduced in the process of multiple processing, the brittle solder containing Bi and the like is not easily processed into wires or foils, and in addition, because the diameter of the solder ball for CSP packaging is smaller, the required processing precision of the used mechanical equipment is high, and the realization is difficult; the jet flow fracture method is that under the action of pressure, the molten metal passes through a nozzle to generate metal jet flow, the flow rate is controlled to keep the jet flow in a laminar state, mechanical vibration with certain frequency acts on the jet flow, and when the vibration frequency, the amplitude, the diameter of the nozzle and other process parameters are matched, the jet flow can be fractured into uniform metal droplets; however, although the conventional jet flow cracking method can set the jetting pressure, the jetting speed and the oscillation frequency according to calculation, the tin material is jetted to form liquid flow, then the liquid flow is vibrated and cracked, and then the tin ball is formed by falling, the formed tin ball is poor in true sphericity by the physical characteristics of the liquid flow, in addition, if the tin balls with different sizes are required to be produced in batches, the parameters are required to be repeatedly calculated and adjusted, the process is complicated, and the industrial operation is not convenient.
In view of the above problems, the invention adopts the jet flow fracture method, designs the screen mechanism which is convenient to replace, and further realizes the fast switching production of the solder balls with different sizes through the switchable screen mechanism by matching the physical characteristics of the screen and the characteristics of the jet flow fracture method.
Disclosure of Invention
In view of the problems in the prior art, the invention discloses a processing device capable of controlling the diameter of a BGA solder ball, which adopts the technical scheme that the processing device comprises a tin material melting device, a jet flow injection device, a tin column cutting device, a liquid nitrogen cooling device and a ball forming device; the tin material melting device comprises a cylindrical barrel, wherein the left side and the right side of the upper surface of the cylindrical barrel are respectively provided with a feed inlet and a vent hole, the center of the lower surface of the cylindrical barrel is provided with a discharge hole, the discharge hole is fixedly connected with the feed inlet at the top of the jet flow injection device, the discharge hole at the bottom of the jet flow injection device is in threaded connection with the feed pipe at the top of the tin column cut-off device, the lower part of the feed pipe is fixedly connected with a first buffer cavity, the lower part of the first buffer cavity is provided with a first flange, the lower part of the first flange is in threaded connection with a first screen mechanism, the first screen mechanism comprises a front semicircular ring and a rear semicircular ring, the central side wall of the front semicircular ring is provided with a first screen mounting hole, the left end and the right end of the front semicircular ring are fixedly connected with fixed blocks, the side walls of the left side and the right side of the first screen mounting hole are respectively and fixedly connected with the two ends of a handle, the second screen mounting hole is formed in the central side wall of the rear semi-circular ring, the left end and the right end of the rear semi-circular ring are fixedly connected with the fixing seats, the circular screen is arranged in the front semi-circular ring and the rear semi-circular ring, the front edge and the rear edge of the circular screen are respectively in threaded connection with the end face of one end of the vibrating rod, the other end of the vibrating rod is sleeved in the first screen mounting hole and the second screen mounting hole respectively, the lower portion of the first screen mechanism is provided with a second buffer cavity, the lower portion of the second buffer cavity is provided with a second screen mechanism, the lower portion of the second screen mechanism is provided with a second flange plate, the lower portion of the second flange plate is provided with the liquid nitrogen cooling device, the liquid nitrogen cooling device comprises a cooling pipeline, the upper end port and the lower end port of the cooling pipeline are respectively welded with a third flange plate, and the central hole of the side wall of the cooling pipeline is fixedly connected with a liquid nitrogen feeding pipe, the lower part of the liquid nitrogen cooling device is provided with the sphere forming device; the heating rods are arranged on the circumference and the center of the cylindrical barrel, so that the tin material can be uniformly dissolved, and meanwhile, the temperature is controllable, and the production parameters can be conveniently controlled; separable tin post cuts the device around the design, the built-in circular screen cloth of quick replacement of being convenient for to the circular screen cloth in different apertures of quick adjustment realizes the quick production in batches of not equidimension tin ball, reduces the operation degree of difficulty, improves switching efficiency, improves production efficiency.
As a preferred scheme of the invention, the circumferential edge and the central opening of the cylindrical barrel are respectively provided with a heating rod, and the circumferential edge of the bottom of the cylindrical barrel is respectively provided with a support leg; heating rods are arranged on the circumference, the edge and the center to ensure uniform heating, so that the tin material is fully dissolved.
As a preferable scheme of the invention, a first electromagnetic valve is installed on the pipe wall of the discharge hole at the bottom of the jet flow injection device; and the electromagnetic valve is adopted for control, so that remote automatic control is convenient to realize, and the safety is improved.
As a preferred scheme of the present invention, the upper and lower side walls of the front semicircular ring are slidably connected to the first flange and the second buffer cavity, and the upper and lower side walls of the rear semicircular ring are fixedly connected to the first flange and the second buffer cavity, respectively; the screws between the fixing blocks at the left end and the right end of the front semicircular ring and the fixing seats at the left end and the right end of the rear semicircular ring are detached, the front semicircular ring can be separated from the rear semicircular ring together with the built-in circular screen, and the circular screen can be taken down quickly to complete replacement.
As a preferable scheme of the present invention, the first and second screening mechanisms have the same structure, and the second screening mechanism further includes a high frequency vibrator mounted on a vibrator rod at the rear side of the second screening mechanism; the high-frequency vibrator drives the vibrating rod to vibrate back and forth at a high speed, and the high-speed back and forth reciprocating motion of the circular screen can be realized, so that multiple strands of molten tin flowing downwards are cut off, and uniform and equal-length tin columns are formed.
As a preferable scheme of the invention, the aperture range of the circular screen is 0.1-0.8 mm, and the diameter of the circular screen is smaller than the inner diameter of a circular ring enclosed by the front semicircular ring and the rear semicircular ring; by the design, the circular screen can be prevented from being blocked by the inner wall of the circular ring formed by the front semicircular ring and the rear semicircular ring when vibrating in the front and the rear.
As a preferable scheme of the invention, a second electromagnetic valve is arranged on the liquid nitrogen feeding pipe.
As a preferred scheme of the invention, the sphere forming device is a hollow pipeline with the height of 10 meters and is erected between an upper floor and a lower floor of a factory building; the higher pipeline is adopted and nitrogen is filled in so that the tin column can fully rotate to form a ball shape from a column shape when the tin column is subjected to free falling, and meanwhile, the nitrogen cools and shapes the tin column.
According to the processing equipment capable of controlling the diameter of the BGA solder ball, the specific processing method comprises the following steps:
the method comprises the following steps: starting a system power supply, setting the heating temperature of the heating rod to 300 ℃, then slowly feeding the tin material into the cylindrical barrel through the feeding port, and waiting for the tin material to be melted into liquid;
step two: setting the pressure of a jet injection device at 0.05-0.15 MPA, injecting a liquid tin material to a first screen mechanism of a tin column cut-off device through the jet injection device by an electromagnetic valve, and shunting a thicker liquid tin column into a plurality of strands of thin-flow tin columns under the action of a built-in circular screen;
step three: the tin columns formed by the first screen mechanism flow downwards to pass through the second screen mechanism, and are divided again by the second screen mechanism to be divided into more uniform multiple strands of thin flow tin columns;
step four: when the multiple strands of trickle tin columns pass through the circular screen arranged in the second screen mechanism, the high-frequency vibrator vibrates and breaks the multiple strands of trickle tin columns into uniform and equal-length tin column sections through setting the range of 2500HZ-3000 HZ;
step six: the tin column section does free falling motion in a pipeline of the sphere forming device under the action of gravity, and rotates and falls through the pipeline with the height of 10 meters to form a sphere structure;
step seven: collecting, polishing and screening the solder balls formed by the rotation and the falling, and selecting qualified products within an error range;
step eight: in the whole production process, the size of the solder ball is controlled by replacing the circular screens with different apertures.
The invention has the beneficial effects that: the heating rods are arranged on the circumference and the center of the cylindrical barrel, so that the tin material can be uniformly dissolved, and meanwhile, the temperature is controllable, and the production parameters can be conveniently controlled; separable tin post cuts the device around the design, the built-in circular screen cloth of quick replacement of being convenient for to the circular screen cloth in different apertures of quick adjustment reduces the operation degree of difficulty, and fast switch-over improves production efficiency, thereby realizes the batch rapid production of not equidimension tin ball.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a tin melting apparatus according to the present invention;
FIG. 3 is a bottom view of the tin melting apparatus of the present invention;
FIG. 4 is a schematic view of a jet spray apparatus of the present invention;
FIG. 5 is a left side view of the tin column cutting apparatus according to the present invention;
FIG. 6 is a rear view of the tin column cutting apparatus of the present invention;
FIG. 7 is a cross-sectional view of a tin column cutting apparatus according to the present invention;
FIG. 8 is a schematic view of a liquid nitrogen cooling apparatus of the present invention.
In the figure: 1-tin material melting device, 2-jet injection device, 3-tin column cutting device, 4-liquid nitrogen cooling device, 5-sphere forming device, 11-cylindrical barrel, 12-charging opening, 13-air vent, 14-discharging opening, 15-heating rod, 16-bracket leg, 21-first electromagnetic valve, 31-feeding pipe, 32-first buffer cavity, 321-first flange, 33-first screen mechanism, 331-front semicircular ring, 3311-first screen mounting hole, 3312-fixed block, 3313-handle, 332-rear semicircular ring, 3321-second screen mounting hole, 3322-fixed seat, 333-circular screen, 334-vibrating rod, 34-second buffer cavity, 35-second screen mechanism, 351-high frequency vibrator, 36-second flange, 41-cooling pipeline, 42-third flange, 43-liquid nitrogen feeding pipe and 44-second electromagnetic valve.
Detailed Description
Example 1
As shown in fig. 1 to 8, the processing equipment for controlling the diameter of the BGA solder ball according to the present invention adopts the technical solution that the processing equipment comprises a tin material melting device 1, a jet injection device 2, a tin column cutting device 3, a liquid nitrogen cooling device 4 and a ball forming device 5; tin material melting device 1 includes cylinder bucket 11, charge door 12, bleeder vent 13 are seted up respectively to the 11 upper surface left and right sides of cylinder bucket, discharge opening 14 is seted up at the lower surface center of cylinder bucket 11, heating rod 15 is installed respectively to the circumferential edge reason and the central trompil of cylinder bucket 11, the circumferential edge reason difference erection support leg 16 of the bottom of cylinder bucket 11.
The discharge hole 14 is fixedly connected with a feed inlet at the top of the jet flow injection device 2, and a first electromagnetic valve 21 is installed on the wall of a discharge hole at the bottom of the jet flow injection device 2.
The discharge gate of 2 bottoms of efflux injection apparatus with the tin post cuts inlet pipe 31 threaded connection at device 3 tops together, the first buffer cavity 32 of inlet pipe 31 lower part fixed connection, first buffer cavity 32 lower part sets up first ring flange 321, first ring flange 321 lower part and first screen cloth mechanism 33 threaded connection, first screen cloth mechanism 33 includes preceding semicircle ring 331 and latter half ring 332, first screen cloth mounting hole 3311 is seted up to preceding semicircle ring 331 central lateral wall, both ends fixed connection fixed block 3312 about preceding semicircle ring 331, the lateral wall on both sides is fixed connection handle 3313's both ends respectively about first screen cloth mounting hole 3311, second screen cloth mounting hole 3321 is seted up to latter half ring 332 central lateral wall, both ends fixed connection fixing base 3322 about latter half ring 332, preceding semicircle ring 331, the inside circular screen cloth 333 that is provided with of latter half ring 332, the front edge and the rear edge of the circular screen 333 are respectively in threaded connection with the end face of one end of the vibration rod 334, the other ends of the front vibration rod 334 and the rear vibration rod 334 are respectively sleeved in the first screen mounting hole 3311 and the second screen mounting hole 3321, the lower part of the first screen mechanism 33 is provided with a second buffer cavity 34, the lower part of the second buffer cavity 34 is provided with a second screen mechanism 35, and the lower part of the second screen mechanism 35 is provided with a second flange 36;
the upper and lower side walls of the front semicircular ring 331 are respectively connected with the first flange 321 and the second buffer cavity 34 in a sliding manner, and the upper and lower side walls of the rear semicircular ring 332 are respectively connected with the first flange 321 and the second buffer cavity 34 in a fixed manner;
the first and second screening mechanisms 33 and 35 have the same structure, and the second screening mechanism 35 further includes a high-frequency vibrator 351, wherein the high-frequency vibrator 351 is mounted on a vibrator rod at the rear side of the second screening mechanism 35;
the aperture range of the circular screen 333 is 0.1-0.8 mm, and the diameter of the circular screen 333 is smaller than the inner diameter of a circular ring enclosed by the front semicircular ring 331 and the rear semicircular ring 332.
The lower part of the liquid nitrogen cooling device 4 is provided with the sphere forming device 5, and the sphere forming device 5 is a hollow pipeline with the height of 10 meters and is erected between an upper floor and a lower floor of a factory building.
A processing device capable of controlling the diameter of a BGA solder ball comprises the following specific processing method:
the method comprises the following steps: starting a system power supply, setting the heating temperature of the heating rod 15 to 300 ℃, then slowly feeding the tin material into the cylindrical barrel 11 through the feeding port 12, and waiting for the tin material to be melted into liquid;
step two: setting the pressure of the jet flow injection device 2 at 0.05MPA-0.15MPA, injecting the liquid tin material to a first screen mechanism 33 of the tin column cut-off device 3 through the jet flow injection device 2 by an electromagnetic valve 21, and dividing a thicker liquid tin column into a plurality of strands of thin flow tin columns under the action of a built-in circular screen 333;
step three: the multiple strands of thin flow tin columns formed by the first screen mechanism 33 flow downwards to pass through the second screen mechanism 35, and are divided again by the second screen mechanism 35 to be divided into more uniform multiple strands of thin flow tin columns again;
step four: when the multiple strands of trickle tin columns pass through the circular screen arranged in the second screen mechanism 35, the high-frequency vibrator 351 vibrates and breaks the multiple strands of trickle tin columns into uniform and equal-length tin column sections by setting the range of 2500HZ-3000 HZ;
step five: the tin column section continues to move downwards under the action of gravity and enters a liquid nitrogen cooling device 4, and liquid nitrogen flows into a pipeline of a sphere forming device 5 at the lower part to fill the whole pipeline with liquid nitrogen;
step six: the tin column section does free falling motion in the pipeline of the sphere forming device 5 under the action of gravity and falls to form a sphere structure through the rotation of the pipeline with the height of 10 meters;
step seven: collecting, polishing and screening the solder balls formed by the rotation and the falling, and selecting qualified products within an error range;
step eight: in the whole production process, the size of the solder ball is controlled by replacing the circular screen 333 with different apertures.
The working principle of the invention is as follows: when in use, a system power supply is started, the heating temperature of the heating rod 15 is set to 300 ℃, a tin material is added into the tin material melting device 1 from a feed inlet 12 above the cylindrical barrel 11, the tin material is melted into liquid in the cylindrical barrel 11, then the liquid is sprayed into a tin column cut-off device 3 below by the jet flow spraying device 2 under the pressure intensity set by the system, a thicker tin column of the liquid passes through a first screen mechanism 33 in the tin column cut-off device 3 and then is filtered by a built-in circular screen 333 to form a plurality of thin tin columns, the plurality of thin tin columns continuously flow downwards under the action of gravity, when passing through the circular screen 333 in a second screen mechanism 35, the circular screen 351 uniformly cuts off the thin tin columns passing through the screen holes at equal intervals under the high-frequency oscillating motion back and forth, the cut-off small tin columns fall into a pipeline of a ball forming device 5 filled with liquid nitrogen for cooling, after high free falling motion, in the falling process, the small section of tin column rotates to form a ball shape from a column shape gradually, and is cooled and shaped gradually under the action of liquid nitrogen to finally form the tin column.
Electrical connections or structures not described in detail herein are prior art.
Although the present invention has been described in detail with reference to the specific embodiments, the present invention is not limited to the above embodiments, and various changes and modifications without inventive changes may be made within the knowledge of those skilled in the art without departing from the spirit of the present invention.
Claims (9)
1. The utility model provides a processing equipment of controllable BGA tin ball diameter size which characterized in that: comprises a tin material melting device (1), a jet flow injection device (2), a tin column cutting device (3), a liquid nitrogen cooling device (4) and a sphere forming device (5); the tin material melting device (1) comprises a cylindrical barrel (11), wherein a feeding port (12) and air holes (13) are respectively formed in the left side and the right side of the upper surface of the cylindrical barrel (11), a discharge hole (14) is formed in the center of the lower surface of the cylindrical barrel (11), the discharge hole (14) is fixedly connected with a feed inlet at the top of a jet injection device (2), a discharge port at the bottom of the jet injection device (2) is connected with a feed pipe (31) at the top of a tin column cutting device (3) in a threaded manner, a first buffer cavity (32) is fixedly connected with the lower part of the feed pipe (31), a first flange plate (321) is arranged on the lower part of the first buffer cavity (32), the lower part of the first flange plate (321) is connected with a first screen mechanism (33) in a threaded manner, and the first screen mechanism (33) comprises a front semicircular ring (331) and a rear semicircular ring (332), the utility model discloses a vibration damping device, including preceding semicircle ring (331) center lateral wall set up first screen cloth mounting hole (3311), both ends fixed connection fixed block (3312) about preceding semicircle ring (331), the both ends fixed connection both ends of handle (3313) are respectively fixed to the lateral wall on both sides about first screen cloth mounting hole (3311), second screen cloth mounting hole (3321) is seted up to latter semicircle ring (332) center lateral wall, both ends fixed connection fixing base (3322) about latter semicircle ring (332), preceding semicircle ring (331), latter semicircle ring (332) are inside to be provided with circular screen cloth (333), the edge is respectively with the terminal surface threaded connection of the one end of vibrting spear (334) around, the other end suit of vibrting spear (334) is in first screen cloth mounting hole (3311), second screen cloth mounting hole (3321) respectively, first screen cloth mechanism (33) lower part is provided with second buffering cavity (34), second buffer chamber (34) lower part is provided with second screen cloth mechanism (35), second screen cloth mechanism (35) lower part is provided with second ring flange (36), install second ring flange (36) lower part liquid nitrogen cooling device (4), liquid nitrogen cooling device (4) are including cooling tube (41), third flange dish (42) is welded respectively to both ends mouth about cooling tube (41), cooling tube (41) lateral wall center trompil fixed connection liquid nitrogen inlet pipe (43), liquid nitrogen cooling device (4) lower part is provided with spheroid forming device (5).
2. The apparatus of claim 1, wherein the processing tool comprises: the heating rod (15) is respectively installed at the circumferential edge and the central opening of the cylindrical barrel (11), and the support legs (16) are respectively installed at the circumferential edge of the bottom of the cylindrical barrel (11).
3. The apparatus of claim 1, wherein: and a first electromagnetic valve (21) is also arranged on the pipe wall of the discharge hole at the bottom of the jet flow injection device (2).
4. The apparatus of claim 1, wherein the processing tool comprises: the upper and lower lateral walls of preceding semicircle ring (331) respectively with first ring flange (321), second buffer cavity (34) sliding connection, the upper and lower lateral wall of back semicircle ring (332) respectively with first ring flange (321), second buffer cavity (34) fixed connection.
5. The apparatus of claim 1, wherein the processing tool comprises: the first screen mechanism (33) and the second screen mechanism (35) have the same structure, the second screen mechanism (35) further comprises a high-frequency vibrator (351), and the high-frequency vibrator (351) is mounted on a vibrating rod on the rear side of the second screen mechanism (35).
6. The apparatus of claim 1, wherein the processing tool comprises: the aperture range of the circular screen (333) is 0.1-0.8 mm, and the diameter of the circular screen (333) is smaller than the inner diameter of a circular ring formed by the front semicircular ring (331) and the rear semicircular ring (332).
7. The apparatus of claim 1, wherein the processing tool comprises: and a second electromagnetic valve (44) is also arranged on the liquid nitrogen feeding pipe (43).
8. The apparatus of claim 1, wherein the processing tool comprises: the sphere forming device (5) is a hollow pipeline with the height of 10 meters and is erected between an upper floor and a lower floor of a factory building.
9. A processing method for controlling the diameter of a BGA solder ball comprises the following specific steps:
the method comprises the following steps: starting a system power supply, setting the heating temperature of the heating rod (15) to 300 ℃, then slowly feeding the tin material into the cylindrical barrel (11) through the feeding port (12) and waiting for the tin material to be melted into liquid;
step two: setting the pressure of a flow injection device (2) at 0.05MPA-0.15MPA, and an electromagnetic valve (21), wherein the liquid tin material is injected to a first screen mechanism (33) of a tin column cut-off device (3) through the flow injection device (2), and the thick liquid tin column is divided into a plurality of strands of thin flow tin columns under the action of a built-in circular screen (333);
step three: the multi-strand thin flow tin column formed by the first screen mechanism (33) flows downwards to pass through the second screen mechanism (35), and is divided again by the second screen mechanism (35) to be divided into more uniform multi-strand thin flow tin columns again;
step four: when the multiple strands of trickle tin columns pass through a circular screen arranged in the second screen mechanism (35), the high-frequency vibrator (351) vibrates and breaks the multiple strands of trickle tin columns into uniform and equal-length tin column sections by setting the range of 2500HZ-3000 HZ;
step five: the tin column section continues to move downwards under the action of gravity and enters a liquid nitrogen cooling device (4), and liquid nitrogen flows into a pipeline of a sphere forming device (5) at the lower part to fill the whole pipeline with liquid nitrogen;
step six: the tin column section does free falling motion in the pipeline of the sphere forming device (5) due to the action of gravity, and rotates and falls through the pipeline with the height of 10 meters to form a sphere structure;
step seven: collecting, polishing and screening the solder balls formed by the rotation and the falling, and selecting qualified products within an error range;
step eight: in the whole production process, the size of the solder ball is controlled by replacing the circular screen (333) with different apertures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111366071.XA CN114082966B (en) | 2021-11-18 | 2021-11-18 | Processing method and equipment for controllable BGA solder ball diameter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111366071.XA CN114082966B (en) | 2021-11-18 | 2021-11-18 | Processing method and equipment for controllable BGA solder ball diameter |
Publications (2)
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020112566A1 (en) * | 2000-03-14 | 2002-08-22 | Chow Hubert K. | Apparatus and method of making precision metal spheres |
| US6579479B1 (en) * | 2000-11-09 | 2003-06-17 | Honeywell International Inc. | Methods of forming a plurality of spheres; and pluralities of spheres |
| CN111558724A (en) * | 2020-06-29 | 2020-08-21 | 泰安晶品新材料科技有限公司 | BGA solder ball preparation device and preparation process based on jet instability principle |
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
| CN113634758A (en) * | 2021-08-16 | 2021-11-12 | 广州海普电子材料科技有限公司 | Vibration injection type BGA tin ball processing and producing equipment |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020112566A1 (en) * | 2000-03-14 | 2002-08-22 | Chow Hubert K. | Apparatus and method of making precision metal spheres |
| US6579479B1 (en) * | 2000-11-09 | 2003-06-17 | Honeywell International Inc. | Methods of forming a plurality of spheres; and pluralities of spheres |
| CN111558724A (en) * | 2020-06-29 | 2020-08-21 | 泰安晶品新材料科技有限公司 | BGA solder ball preparation device and preparation process based on jet instability principle |
| CN113560587A (en) * | 2021-08-12 | 2021-10-29 | 广州海普电子材料科技有限公司 | BGA tin ball smelting and rapid forming method |
| CN113634758A (en) * | 2021-08-16 | 2021-11-12 | 广州海普电子材料科技有限公司 | Vibration injection type BGA tin ball processing and producing equipment |
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