CN114079371A - Electronic device - Google Patents
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- CN114079371A CN114079371A CN202010831677.5A CN202010831677A CN114079371A CN 114079371 A CN114079371 A CN 114079371A CN 202010831677 A CN202010831677 A CN 202010831677A CN 114079371 A CN114079371 A CN 114079371A
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
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Abstract
The application provides an electronic equipment, improve the transient response of first power through the compensation power supply circuit who sets up, the required electric current when transient response is responded to first power is compensated through the higher power supply of switching frequency, make electronic equipment when overcoming transient response, satisfy simultaneously and reduce the DCR loss, reduce the requirement of encapsulation cost and improvement compensation efficiency, thereby compensation power supply circuit through setting up is on the basis of realizing carrying out high efficiency compensation to the transient response of first power, need not to pack in the load first power or compensation power supply circuit, and then the design and the cost of realization that have still reduced electronic equipment.
Description
Technical Field
The present application relates to electronic technologies, and in particular, to an electronic device.
Background
With the continuous development of electronic technology, the integration level and the working frequency of devices such as a processor in electronic equipment are continuously improved, the required working current is also increased, and more design requirements are provided for a power supply for supplying power to the processor in the electronic equipment. When the working current required by the processor is subjected to step jump, the power supply generally cannot immediately output a large current required by a load, so that the voltage output by the power supply to the processor is temporarily dropped, and although the voltage is gradually restored to be normal in a period of time, the short-time drop of the output voltage of the power supply also greatly influences the reliable operation of the processor.
In the prior art, in order to improve the transient response problem of the power supply, a capacitor for compensating the transient voltage of the power supply is usually arranged in the electronic device. When the working current of the processor jumps, the electric energy stored in the capacitor compensates the voltage drop output by the power supply so as to reduce the influence of the voltage drop output by the power supply on the processor. However, the added capacitor affects the layout of the existing power supply and processor on the motherboard, and in one technology, the capacitor is arranged on the surface of the motherboard, and a circuit between the capacitor and the processor can introduce path loss, so that the energy efficiency of the processor is reduced; another technique, in which a capacitor is integrated in a processor, increases the circuit complexity of the processor, thereby increasing the design and implementation costs of the electronic device.
Therefore, how to improve the transient response of the power supply of the electronic device while considering both the processor energy efficiency and the cost of the electronic device is an urgent technical problem to be solved in the art.
Disclosure of Invention
The application provides an electronic device, which is used for enabling the electronic device to give consideration to processor energy efficiency and cost, and reducing the cost of the electronic device while improving the processor energy efficiency.
Specifically, a first aspect of the present application provides an electronic device, including:
a load, a first power supply and a compensation power supply circuit;
the load, the first power supply and the compensation power supply circuit are arranged on the same printed circuit board PCB;
the first power supply is connected with the load;
the compensation power supply circuit is respectively connected with the first power supply and the load;
the working voltage of the load is a first voltage;
the first power supply is configured to: sending to the load a voltage and a current for use when the load is operating;
the compensation power supply circuit is used for: when the current change of the load causes the voltage output by the first power supply to be less than the first voltage, a compensation current is sent to the load.
Specifically, the electronic device provided by this embodiment enables the electronic device to meet the requirements of reducing DCR loss, reducing packaging cost, and improving compensation efficiency when overcoming the transient response, and the design and implementation cost of the electronic device is reduced by providing the compensation power supply circuit without packaging the first power supply or the compensation power supply circuit in the load on the basis of realizing high-efficiency compensation for the transient response of the first power supply.
In an embodiment of the first aspect of the present application, the load is disposed on a first side of the PCB; the first power supply is disposed at a second side of the PCB.
Specifically, the electronic device provided by this embodiment may adopt a vertical power supply technology, reduce DCR loss on a power supply path by vertically setting the first power supply and the load, and reduce design and implementation costs of the electronic device without packaging the first power supply in the load.
In an embodiment of the first aspect of the present application, the compensation power circuit may be disposed on a first side of the PCB or the compensation power circuit may be disposed on a second side of the PCB.
Specifically, the electronic device provided by this embodiment may be disposed on any side of the PCB without limitation to the newly added compensation power supply circuit, thereby improving the flexibility of the electronic device in design.
In an embodiment of the first aspect of the present application, the compensation power circuit and the load are disposed on a first side of the PCB; meanwhile, the load and the compensation power supply circuit are packaged on the same chip substrate.
Specifically, in the electronic device provided in this embodiment, the compensation power supply circuit and the load are integrated in a package manner, so that a power supply path for supplying power to the load is further reduced, and a compensation effect of the compensation power supply circuit on the current of the load when the current of the load is increased transiently is improved.
In an embodiment of the first aspect of the present application, the compensation power supply circuit is further configured to: when the voltage output by the first power supply is equal to the first voltage, the sending of the compensation current to the load is stopped.
Specifically, in the electronic device provided by this embodiment, the compensation power supply circuit may be only used for compensation when the voltage output by the first power supply drops, and when the voltage output by the first power supply is equal to the first voltage, the compensation power supply circuit may not send a compensation current to the load, so as to improve the use efficiency of the compensation power supply circuit.
In an embodiment of the first aspect of the present application, the compensation power supply circuit includes: a second power supply and a capacitor; wherein the second power supply is connected to the first power supply and the load through the capacitor, and the second power supply is used for providing the compensation current.
In one specific implementation, the second power supply comprises: a GaN high-frequency switching power supply, a silicon-based switching power supply or a low dropout regulator LDO.
And/or, in another specific implementation, the capacitor includes: a ceramic capacitor.
In an embodiment of the first aspect of the present application, the second power supply satisfies at least one of:
the response speed of the second power supply is greater than that of the first power supply, the response time of the second power supply is less than that of the first power supply, and the switching frequency of the second power supply is greater than that of the first power supply.
Specifically, in the electronic device provided in this embodiment, the first power supply is compensated by the second power supply with a high switching bandwidth and a faster response speed, so that the output compensation current can be immediately increased, the influence of voltage drop of the first power supply on the load can be more quickly reduced, and the transient response of the processor of the electronic device can be improved.
For example, in a specific implementation manner, the switching frequency of the second power supply is greater than 3MHz, or the switching frequency of the second power supply can be a value in a range from 5MHz to 10MHz
And/or, in another specific implementation manner, the first power supply is a voltage regulation module VRM power supply, and the range of the switch frequency which can be taken is 500kHz-1 MHz.
In an embodiment of the first aspect of the present application, the load includes: CPU, GPU, AI chip, etc.
To sum up, the electronic device provided in the embodiment of the present application adopts a mode of "the first power supply + the second power supply" to improve the transient response of the first power supply, and compensates the current required by the first power supply in the transient response through the second power supply with higher switching frequency, so as to reduce the voltage drop of the first power supply, and since there is no need to provide more capacitors, a vertical power supply technology can be adopted when implementing on the PCB, compared with the prior art shown in fig. 8, the layout of the capacitors cannot be affected, the performance of the transient response can be effectively improved, and the electronic device is applicable to a scene with higher current step-type jump of the load; and the DCR loss of the first power supply on a power supply path to the load can be reduced, and the cost of the electronic equipment is greatly reduced because the first power supply is not arranged by adopting a packaging structure.
Therefore, the electronic device provided by the application can simultaneously meet the requirements of reducing the DCR loss, reducing the packaging cost and improving the compensation efficiency when overcoming the transient response, overcomes the defects existing in the prior various technologies, wherein the DCR loss on the power supply path is reduced by vertically setting the first power supply and the load on the basis of realizing the high-efficiency compensation of the transient response of the first power supply by the set second power supply, the first power supply is not required to be packaged in the load, and the design and implementation cost of the electronic device are reduced.
Drawings
FIG. 1 is a schematic diagram of an electronic device to which the present application is applied;
FIG. 2 is a schematic diagram illustrating the variation of the current of a load in an electronic device;
FIG. 3 is a schematic diagram illustrating variations in output voltage of a first power supply in an electronic device;
FIG. 4 is a schematic diagram of a circuit structure of an electronic device;
FIG. 5 is a schematic diagram of an electronic device according to the prior art;
FIG. 6 is a schematic diagram of another prior art electronic device;
FIG. 7 is a schematic diagram of another prior art electronic device;
fig. 8 is a schematic structural diagram of an embodiment of an electronic device provided in the present application;
fig. 9 is a schematic circuit diagram of an embodiment of an electronic device provided in the present application;
FIG. 10 is a waveform diagram illustrating transient response compensation of an electronic device according to the present application;
fig. 11 is a schematic structural diagram of an implementation of an embodiment of an electronic device provided in the present application;
FIG. 12 is a DCR loss versus histogram;
fig. 13 is a schematic structural diagram of an implementation of an embodiment of an electronic device provided in the present application;
fig. 14 is a schematic circuit diagram of a second power supply provided in the present application;
fig. 15 is a schematic flow chart of a power supply method provided in the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a schematic diagram of an electronic device applied in the present application, and as shown in fig. 1, the electronic device 1 applied in the present application includes: a first power source 11 and a load 12. The first power source 11 is connected to the load 12, and is configured to send voltage and current to the load 12, wherein the voltage and current provide power required by the load. The first power source 11 is a power source provided in the electronic device 1 for supplying power to the load 12, and the first power source 11 may be a power conversion circuit provided in the electronic device 1, and is configured to receive power transmitted by an external power source connected to the electronic device 1 and supply power to the load 12. The load 12 may be a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a Micro Control Unit (MCU), an Artificial Intelligence (AI) chip or a system on chip (SoC) of the electronic device 1, and the load 12 is taken as the CPU in the embodiments of the present application for illustration and not limitation.
With the continuous development of electronic technology, as the integration level and the operating frequency of the load 12 such as a CPU in the electronic device 1 shown in fig. 1 are continuously improved, the required operating current is also increased, and when the operating current required by the load 12 is rapidly increased, the first power supply 11 in the electronic device 1 is easy to have a short voltage drop, which may affect the normal operation of the load 12. For example, fig. 2 is a schematic diagram of a change in current of a load in an electronic device, and fig. 3 is a schematic diagram of a change in output voltage of a first power supply in the electronic device. The working voltage of the load is marked as V1, and the first power supply can stably output the first voltage to the load before t 1; when the current of the load has a step jump of a large transient current a at time t1, the value of the current a may be several hundreds of amperes, and the jump rate may be 1000A/us, at this time, at the jump time of the load current, since the first power supply cannot immediately output the current required by the load, the output voltage of the first power supply deviates from the set value, and a short voltage drop occurs, for example, from V1 to V2 in fig. 3. Although the output voltage of the first power supply is restored to V1 at time t3, the drop in the output voltage of the first power supply between t1 and t3 may affect the normal operation of the load, which may affect the reliable operation of the load.
Further, in the electronic device 1 shown in fig. 1, in addition to the first power source 11 and the load 12, a capacitor 13 is provided, and the capacitor 13 may be used to improve the influence of the above-mentioned transient response of the presence of the first power source. When the current of the load 12 jumps as shown in fig. 2, a voltage drop occurs because the first power supply 11 cannot immediately output the current required by the load 12, and then a compensation current is output to the load 12 by the capacitor 13. Finally, between the time t1-t3 shown in fig. 3, the current output by the capacitor 13 and the current and the voltage output by the first power supply 11 can jointly supply power to the load 12, so that the influence of the output voltage drop of the first power supply 11 due to transient response on the load 12 is improved, and the reliable operation of the load 12 is ensured.
More specifically, fig. 4 is a schematic circuit structure diagram of an electronic device, and fig. 4 shows a specific circuit implementation manner of the electronic device in fig. 1, wherein a capacitor 13 is disposed between the first power source 11 and the load 12, the capacitor 13 is only illustrated, and in actual use, the capacitor 13 shown in fig. 4 may include a plurality of capacitors connected in parallel, one end of each capacitor is connected to the first power source 11 and the load 12, and the other end of each capacitor is connected to ground. The capacitors may be disposed at an output end of the first power supply 11 for filtering an output of the first power supply 11, or may be disposed at an input end of the load 12 for filtering an input of the load 12 and providing a transient current, where the capacitors are connected in parallel and only have different positions, and in order to enable a voltage drop during a load transient state to meet a specification requirement, a parallel capacitor is added in the current design to improve a power supply transient response.
Meanwhile, in the electronic device shown in fig. 4, the load 12 may be a CPU, and the first power source 11 may be a Voltage Regulator Module (VRM) power source, wherein the VRM power source includes: the controller 111, a plurality of DRMOS112, each DRMOS112 connects an inductance 113. The DRMOS is integrated with a power switch and a synchronous rectifier, and the DRMOS is connected to an input power supply of the electronic device 1, so that the controller 111 can be used to send Pulse Width Modulation (PWM) signals to the connected DRMOS 112. For each DRMOS112, the power switch or synchronous rectifier may be turned on and off in time division in response to the PWM signal after receiving the PWM signal, such that an electrical signal from the input power source, including voltage and current, is output to the load 12 through the connected inductor 113. In the embodiments of the present application, the first power supply that supplies power to the load in the electronic device is a VRM power supply as an example, and is not limited thereto.
In the circuit structure shown in fig. 4, the transient response of the first power source 11 is improved by "first power source + capacitor", and the first power source 11, the load 12 and the capacitor 13 included in the electronic device are all disposed on a Printed Circuit Board (PCB), and the larger the current required by the load 12, the more the voltage dropped during the transient response of the first power source is, the larger the number of capacitors 13 required to be disposed on a PCB, and thus the energy efficiency and cost of the load cannot be considered when the capacitors 13 disposed on the PCB overcome the transient response.
For example, fig. 5 is a schematic structural diagram of an electronic device in the prior art, and shows a manner of arranging the first power source 11, the load 12 and the capacitor 13 on a PCB to realize the circuit structure shown in fig. 4. Wherein the first power source 11 and the load 12 are horizontally disposed and disposed on the upper surface of the PCB10 in the cross-sectional view shown in fig. 5, the load 12 may be a CPU, a core (Die)121 of the CPU is packaged in the chip substrate 122, the capacitor 13 includes a capacitor 131 disposed on one side of the first power source 11, and the capacitor 131 may provide the load 12 with a voltage and a current for operating the load 12 in a transient response of the first power source 11. The capacitor 13 further includes a plurality of capacitors 132 disposed on one side of the load 12, one capacitor 132 (not shown in fig. 5) may be connected to each pin of the load 12, and the capacitor 131 and the capacitor 132 may be decoupling capacitors, which may be used to reduce noise coupling from components disposed on the PCB10 to the power supply, thereby providing stable voltage and current. Meanwhile, in the structure shown in fig. 5, the first power source 11 may send voltage and current to the load 12 through the copper sheet 101 on the PCB, and since the copper sheet on the PCB also has a certain resistivity, a part of the copper sheet 102 between the first power source 11 and the load 12 forms a direct-current resistor (DCR), and the larger the current flowing through the DCR is, the larger the energy loss on the DCR is, which not only reduces the power efficiency of the first power source 11 to the load 12, but also increases the through-current and heat dissipation pressure of the PCB 10. For example, when the load 12 is a CPU with power of 150W, and the core voltage is 0.75V and the current is 200A, a typical value of DCR on the power supply path from the first power source 11 to the load 12 is about 0.5mohm, the loss Ploss on the power supply path is i2 RDCR is 20W, and the energy loss is about 13% relative to 150W of the power consumption of the CPU itself. It can be seen that, as shown in fig. 5, in the electronic device, when the current of the load is large, more capacitors for improving the transient response of the first power supply need to be disposed on the PCB, and the first power supply and the load are horizontally disposed, so that the copper sheet disposed between the first power supply and the load needs to meet the circulation requirement, and the DCR on the copper sheet has large loss, so that the energy efficiency of the load is reduced, the through-flow heat dissipation pressure of the PCB is increased, and the electronic device has obvious disadvantages.
Fig. 6 is a schematic structural diagram of another electronic device in the prior art, which also illustrates that the circuit structure shown in fig. 4 is implemented by disposing the first power source 11, the load 12 and the capacitor 13 on a PCB, and it is understood that the improvement is made on the basis of the embodiment shown in fig. 5, the first power source 11 and the capacitor 131 are integrated on a package of the load 12, that is, the first power source 11, the capacitor 131 and the core 121 are packaged in a same chip substrate 122, and in some implementations, this power supply structure may also be referred to as an On Package Voltage Regulator (OPVR). Therefore, in the electronic device shown in fig. 6, since the first power supply 11 and the core 121 are packaged in one chip substrate, a path from the first power supply 11 to the core 121 is greatly shortened, so that DCR loss on a power supply path for transmitting an electrical signal between the first power supply and a load is greatly reduced, and energy efficiency of the load is improved. However, when the first power supply is integrated into the package of the load, a larger package area is required, higher requirements are put on the package technology, and the package difficulty and cost of the load are greatly increased.
Fig. 7 is a schematic structural diagram of another electronic device in the prior art, which also illustrates that the circuit structure shown in fig. 4 is implemented by disposing the first power supply 11, the load 12 and the capacitor 13 on the PCB, wherein a "vertical power supply technology" is adopted to overcome the problems of large loss of the power supply path DCR in the technology shown in fig. 5 and high packaging cost in the technology shown in fig. 6. Specifically, in the electronic apparatus shown in fig. 7, the first power source 11 and the load 12 are in a vertical arrangement, and in the sectional view shown in fig. 7, the load 12 is disposed on the upper surface of the PCB10 and the first power source 11 is disposed on the lower surface of the PCB 10. In this case, the path for the first power supply 11 to supply power to the load 12 is short, so that DCR loss on the power supply path can be reduced relatively significantly, energy efficiency of the load can be improved, and cost can be reduced without packaging the first power supply 11. Since the first power source 11 is disposed on the lower surface of the PCB010, it takes up the layout space of the decoupling capacitor 132 connected to the load 12, and some common adjustment is to reduce the number of capacitors 132 connected to the load 12, and the reduced location of the capacitors 132 can be used for the soldering of the first power source 11. However, after reducing a portion of the capacitor 132, the voltage droop of the transient response of the first power supply 11 is compensated by the remaining capacitor 132, which in turn degrades the transient response of the first power supply 11 and increases the voltage droop as the current of the load 12 increases transiently. This results in the electronic device shown in fig. 7, which can be used only in a scenario where the instantaneous jump of the current of the load is small, and the electronic device does not need to provide too much capacitance to compensate the transient response of the first power source.
In summary, in the prior art shown in fig. 5-7, when the electronic device overcomes the transient response of the first power supply by using the "first power supply + capacitor", there are disadvantages that the DCR loss of the electronic device shown in fig. 5 is large in the power supply current path, the electronic device shown in fig. 6 can maintain the capacitor, but the implementation cost is increased, and the electronic device shown in fig. 7 sacrifices the efficiency of compensating the transient response in order to reduce the path loss. Therefore, how to overcome the above-mentioned deficiencies of the prior art, so as to enable the electronic device to compensate the transient response of the first power supply, and have higher compensation efficiency and reduce the cost of the electronic device, is a technical problem to be solved in the art.
The technical solution of the present application will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Fig. 8 is a schematic structural diagram of an embodiment of an electronic device provided in the present application, where the electronic device shown in fig. 8 may be an electronic device such as a mobile phone, a notebook computer, a desktop computer, a server, and the like, and the electronic device includes a load and a power supply for supplying power to the load, where the load may specifically be a CPU, a GPU, an AI chip, and the like of the electronic device. As shown in fig. 8, the electronic apparatus 1 includes: a first power supply 11, a load 12 and a compensation power supply circuit 14 arranged on the same PCB, said compensation power supply circuit 14 comprising a power supply operable to output a compensation current. The first power supply 11 is connected to the load 12, and the operating voltage of the load 12 is referred to as a first voltage, and the first power supply 11 is configured to transmit a voltage and a current used when the load operates to the load 12. The compensating power supply circuit 14 is connected to both the output of the first power supply 11 and the input of the load 12 and is operable to deliver current to the load.
The electronic device 1 as shown in fig. 8 comprises at least the following two states: 1. and (3) normal working state: when the voltage sent by the first power source 11 to the load 12 is not less than the first voltage, the compensation power source circuit 14 does not send the compensation current to the load 12, and only the voltage and the current sent by the first power source 11 to the load 12 provide the load 12 with the electric energy required for operation, so that the load 12 can operate normally. 2. Transient response compensation state: when the current of the load 12 changes in a step manner as shown in fig. 2, so that the voltage output by the first power supply 11 is smaller than the first voltage at which the load 12 operates, the compensation power supply circuit 14 sends a compensation current to the load, so that the load 12 operates according to the voltage and the current sent by the first power supply 11 and the compensation current sent by the compensation power supply circuit 14, at this time, the current provided by the compensation power supply circuit 14 can be used for compensating for a current demand of the voltage output by the first power supply 11 when the voltage drops to be smaller than the first voltage, and further, when the voltage output by the first power supply 11 is smaller than the first voltage, the influence on the normal operation of the load 12 is reduced, thereby ensuring the stable operation of the load 12, and the current provided by the compensation power supply circuit 14 can be referred to as a compensation current.
More specifically, fig. 9 is a schematic circuit structure diagram of an embodiment of an electronic device provided in the present application, which can be implemented as a specific circuit of the electronic device shown in fig. 8. As shown in fig. 9, in the electronic device, the first power source 11 may be a VRM power source, and reference may be made to fig. 4 for implementation and principle of the VRM power source, which is not described again. The first power supply 11 commonly sends multiple electrical signals output by multiple DRMOS to the load 12 to provide the load 12 with electric energy during operation, and in fig. 9, taking n of the multiple DRMOS as 1 … … n as an example, the n electrical signals output by the first power supply 11 are the voltage and the current output by the first power supply 11 in this embodiment.
The compensation power supply circuit 14 provided in the present embodiment includes: a capacitor 141 and a second power supply 142. Wherein the second power source 142 is connected to the first power source 11 and the load 12 through the capacitor 141, such that the second power source 142 is coupled to the reference plane where the first power source 11 is located through the capacitor 141, and the second power source 142 can be used for outputting the compensation current. The second power source 142 may be a power conversion circuit disposed in the electronic device 1, and is configured to receive power transmitted by an external power source connected to the electronic device 1, and output a compensation current according to the power of the external power source.
Alternatively, the second power supply 142 and the first power supply 11 each operate independently, and the response speed of the second power supply 142 is set to be greater than the response speed of the first power supply 11 in the present embodiment. The response speed may be measured by a switching frequency (or referred to as a bandwidth) or a response time of the power supply, for example, the switching frequency of the first power supply 11 may be 500kHz, and the response time may be 2 us; the switching frequency of the second power supply 142 may be 5MHz with a response time of 0.2 us. That is, when the response time of the second power supply 142 is shorter than the response time of the first power supply 11, or the switching frequency of the second power supply 142 is higher than the switching frequency of the first power supply 11, the response speed of the second power supply 142 is higher than the response speed of the first power supply 11, and at least one of the three indexes may be satisfied in actual design. As a specific implementation, the switching frequency of the second power supply 142 may be about 10 times that of the first power supply 11, for example, the switching frequency of the first power supply 11 may range from 500kHz to 1MHz, the switching frequency of the second power supply 142 may be greater than the switching frequency of the first power supply 11, for example, the switching frequency of the second power supply 142 may be greater than 3MHz, or the switching frequency of the second power supply 142 may range from 5MHz to 10 MHz.
Fig. 10 is a waveform diagram illustrating transient response compensation of an electronic device according to the present application, which can be used to explain an operation principle of the electronic device shown in fig. 9 in a transient response compensation state. As shown in fig. 10, at time t0-t1, the current of the load 12 remains unchanged, the voltage output by the first power source 11 to the load 12 remains constant, and the current also remains stable (there is a reciprocal increase and decrease, but the average value is constant), and at this time, the electronic device is in a normal operating state. When the current of the load 12 suddenly increases due to a step jump at time t1, it can be seen that the current output by the first power supply 11 gradually increases after time t1, and since the first power supply 11 cannot immediately output the large current required by the load 12, assuming that no compensation power supply circuit is provided, the voltage output by the first power supply 11 will deviate from the set value more significantly in the variation manner of reference symbol ± (r) in fig. 10, and a transient response of a short fall occurs.
When the compensating power supply circuit 14 for improving the transient response of the first power supply 11 is provided in the electronic device provided in this embodiment, after the current of the load is increased in a step manner at time t1, once the voltage output by the first power supply 11 starts to drop, since the first power supply 11 and the compensating power supply circuit 14 are closed-loop systems, the capacitor 141 in the compensating power supply circuit 14 can couple the voltage drop of the first power supply 11 to the second power supply 142, and since the switching frequency of the second power supply 142 is high and the response speed is fast, the output compensating current can be increased immediately. Therefore, after time t1, the voltage at the output terminal of the first power supply 11 drops after time t1 in the manner of the change marked by symbol (r) in fig. 10 due to the compensation current output from the second power supply 142 to the output terminal of the first power supply 11, and the voltage deviates from the set value only slightly, and a short drop occurs. That is, the compensation current output by the second power source 14 can supply the load 12 together with the voltage and current output by the first power source 11, which is equivalent to reducing the voltage drop of the output voltage of the first power source 11 caused by the transient response.
Therefore, when the voltage output by the first power supply 11 is smaller than the first voltage between times t1-t2, the second power supply will continue to output the compensation current to compensate the voltage drop of the first power supply 11 and increase the voltage of the first power supply 11 to the first voltage as much as possible. The maximum output current of the second power source 142 may be 20% of the load current, and the current magnitude of the second power source 142 directly affects the voltage variation of the load 12 in the transient response, so that when the second power source 142 can compensate the current of the load by 20%, the compensation current output by the second power source can reduce the voltage drop denoted by the symbol (c) in fig. 10 by 20% or more, thereby realizing the voltage drop denoted by the symbol (r), and even in some ideal cases, the voltage drop can be cancelled. Alternatively, the capacitor 141 may be a ceramic capacitor, and the capacitance of the capacitor 141 may affect the compensation current i of the output of the second power supply 142cCan be represented by formula
Where C is the capacitance value of capacitor 141 and du/dt is the rate of change of voltage in transient response of first power source 11, the capacitance value C of capacitor 141 may be selected
Then, in a transient response, the load's current transient increase is provided by the decoupling capacitance of second power supply 142 and load 12,
wherein icpuIs the current of the load 12, ihA compensation current, C, for compensating transient response output from the second power supply 142capIs the decoupling capacitance, V, of load 12outIs the voltage output by the first power supply 11.
After time t2, since the voltage output by the first power supply 11 is stabilized at the first voltage, the output current can reach the large current required by the load 12, and at this time, the voltage across the capacitor 141 is constant, so that the second power supply 142 can stop sending the compensation current to the load 12 after time t 2.
Further, a change curve as shown in fig. 10 can be obtained from simulation experiment data, for example, when the current of the load jumps from 5A to 48A in a step at t1 for 1ms, the current change rate is 1000A/us, and the voltage of the first power supply drops by 75mV because the first power supply cannot output the current of 48A immediately. Then, the voltage drop of the first power supply is compensated by the second power supply, so that the voltage drop of the first power supply is reduced, the voltage drop of the first power supply is 55mV, and the optimization rate of the transient response performance of the first power supply reaches 26% compared with the original voltage drop of 75 mV.
Further, since the first power supply 11, the load 12 and the compensation power supply circuit 14 provided by the present application are disposed on the same PCB, the position of the compensation power supply circuit 14 added between the first power supply 11 and the load 12 needs to be set, so that the compensation power supply circuit 14 can compensate the transient response of the first power supply 11, and at the same time, the compensation power supply circuit 14 can have reduced loss, lower cost and higher compensation efficiency.
Specifically, fig. 11 is a schematic structural diagram of an implementation of an embodiment of the electronic device provided in the present application, and illustrates an implementation manner of the arrangement of the structure shown in fig. 9 on a PCB. The first power source 11 and the load 12 provided in the present embodiment are disposed in a vertical direction, the load 12 and the compensation power source circuit 14 are disposed on a first side of the PCB, and the first power source 11 is disposed on a second side of the PCB. In the cross-sectional view shown in fig. 11, the upper surface of the PCB10 provided to the load 12 is referred to as a first side, and the lower surface of the PCB10 provided to the first power supply 11 is referred to as a second side, so that a path of power supplied from the first power supply 11 to the load 12 is short. Meanwhile, the second power source 142 and the capacitor 141 are also disposed on the first side of the PCB, and may also be disposed on the second side of the PCB.
Because the first power supply 11 and the load 12 are arranged in the vertical direction, the path of the first power supply 11 supplying power to the load 12 is short, the DCR loss on the power supply path is effectively reduced, the energy efficiency of the load 12 is improved, and the heat dissipation pressure of the PCB is reduced. Fig. 12 is a DCR loss comparison histogram, in which the column a on the left side is the ratio of the DCR loss of the electronic device shown in fig. 5 to the total loss, and the column b on the right side is the DCR loss of the electronic device shown in fig. 12, and it can be seen that as the current of the abscissa load increases from left to right (50,70,90 … … 190,210), the ratio of the corresponding DCR loss on the ordinate becomes higher, so that the electronic device provided in fig. 11 can effectively reduce the DCR loss of the electronic device shown in fig. 5 under the same current condition.
To sum up, the electronic device provided in the embodiment of the present application adopts a mode of "the first power supply + the second power supply" to improve the transient response of the first power supply, and compensates the current required by the first power supply in the transient response through the second power supply with higher switching frequency, so as to reduce the voltage drop of the first power supply, and since there is no need to provide more capacitors, a vertical power supply technology can be adopted when implementing on the PCB, compared with the prior art shown in fig. 8, the layout of the capacitors cannot be affected, the performance of the transient response can be effectively improved, and the electronic device is applicable to a scene with higher current step-type jump of the load; compared with the prior art as shown in fig. 5, the loss of the DCR on the power supply path of the first power supply to the load can be reduced; compared with the prior art as shown in fig. 6, the cost of the electronic device is also greatly reduced because the first power supply is not provided with a packaged structure.
Therefore, the electronic device provided by the application can simultaneously meet the requirements of reducing the DCR loss, reducing the packaging cost and improving the compensation efficiency when overcoming the transient response, overcomes the defects existing in the prior various technologies, wherein the DCR loss on the power supply path is reduced by vertically setting the first power supply and the load on the basis of realizing the high-efficiency compensation of the transient response of the first power supply by the set second power supply, the first power supply is not required to be packaged in the load, and the design and implementation cost of the electronic device are reduced.
Optionally, on the basis of the above embodiment, an electronic device is further provided in the embodiment of the present application, fig. 13 is a schematic view of an implementation structure of an embodiment of the electronic device provided in the present application, where the electronic device shown in fig. 13 may be understood as that, on the basis of the electronic device shown in fig. 11, the capacitor 141 and the second power supply 142 are packaged in the load 12, and specifically, the core 121, the capacitor 141 and the second power supply 142 are all packaged in the same chip substrate 122.
In the electronic device shown in fig. 11, since the second capacitor 142 and the capacitor 141 are also connected to the plane of the first power supply 11 through the copper sheet on the PCB, the parasitic inductance on the copper sheet of the PCB will affect the compensation effect of the second power supply 142. In the electronic device provided by this embodiment, the second power source 142 and the load 12 are integrated together in a package manner, and on the basis that the vertical power supply structure is adopted to reduce the power supply path when the first power source 11 supplies power to the load 12, the power supply path for the second power source 142 to supply power to the load 12 is further reduced, so that the second power source 142 is closer to the load 12, and the compensation effect of the second power source 142 on the current of the load 12 is improved when the current of the load 12 is increased in a transient state.
Optionally, the present application does not limit the specific implementation form of the second power supply provided in each embodiment, for example, a GaN (gallium nitride) high frequency switching power supply, a silicon-based high frequency switching power supply, a low dropout regulator (LDO), etc., and a power supply with a bandwidth higher than that of the first power supply may be used as the second power supply.
For example, in a specific implementation manner, fig. 14 is a schematic circuit structure diagram of a second power supply provided in the present application, where the second power supply is implemented by a controller + a single high-frequency DC/DC (direct current to direct current) power conversion circuit of a GaN power device. As shown in fig. 14, the second power supply includes: the power supply comprises a switching tube and a controller, wherein the switching tube can be a high-power GaN power device, and the switching bandwidth can be 1MHz-10 MHz.
Specifically, the first end of the switching tube is connected to an input power VIN of the electronic device, which may be a direct current obtained by connecting the electronic device to an external power supply and then used as VIN, where the VIN may be any form of direct current, such as a primary power supply that is a direct current converted from alternating current of a mains supply, or a direct current output by a lithium battery; the output VOUT of second power is connected through the inductance to the second end of switch tube, the control end of controller connection switch tube, and the current signal of sampling switch tube output at A point, the voltage signal of B point sampling power conversion circuit output, through inside logic circuit and compensating circuit of controller, send the PWM signal to the control end of switch tube, through opening and shutting off of PWM signal control switch tube, make after the switch tube converts the signal of telecommunication VIN of input into the second signal of telecommunication VOUT, keep the voltage stability of the second signal of telecommunication VOUT. Meanwhile, the controller can also use the current signal sampled at the point A and the output voltage signal sampled at the point B as feedback signals, for example, when the voltage drop of VOUT is smaller than the set value of the controller, the controller can also increase the duty ratio of the PWM signal output by the internal logic circuit and increase the output current, so that the VOUT voltage output by the switching tube is stabilized at the set value.
In addition, in the above embodiments of the present application, the voltage drop of the first power supply is compensated by outputting current to the load through the compensation power supply circuit in a manner of a hardware circuit. In order to enable the compensation power supply circuit to achieve the functions provided by the present application, the present application may also implement control over the compensation power supply circuit in the form of software/software modules, etc. The performance of the various functions described above depends upon the particular application and design constraints imposed on the technical solution.
Fig. 15 is a flowchart illustrating a power supply method provided herein, where the method shown in fig. 15 can be applied to any electronic device described in the foregoing embodiments of the present application, and is executed by the electronic device, or executed by a processing module (e.g., a CPU, a GPU, an AI chip, etc., or a specially configured processor for compensating for the first power supply) in the electronic device. Specifically, the method provided by the embodiment includes:
s101: the output voltage of the first power supply is obtained.
The processing module as the execution main body of the embodiment can detect the output voltage of the first power supply in real time.
S102: and judging whether the output voltage of the first power supply is less than the first voltage.
In one possible example, the working voltage of the load is recorded as a first voltage, and the current change of the load may cause the output voltage of the first power supply to be smaller than the first voltage, so that the processing module may determine whether the output voltage of the first power supply is smaller than the first voltage after the output voltage of the first power supply is obtained in S101 each time.
S103: and when the output voltage of the first power supply is less than the first voltage, controlling the compensation power supply circuit to send compensation current to the load.
After the processing module determines that the output voltage of the first power supply is smaller than the first voltage, the processing module can control the compensation power supply circuit to send compensation current to the load to supplement the voltage drop of the output voltage of the first power supply, improve transient response and ensure reliable operation of the load.
For specific implementation and principle of the method, reference may be made to the description and description of the electronic device in the foregoing embodiments of the present application, and details are not repeated.
Those of ordinary skill in the art will understand that: all or a portion of the steps of implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
The foregoing is a preferred embodiment of the present application, which is not intended to be limiting in any way, and any simple modifications, equivalent variations and modifications made to the foregoing embodiment according to the technical spirit of the present application are within the scope of the present application.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. An electronic device, comprising:
a load, a first power supply and a compensation power supply circuit;
the load, the first power supply and the compensation power supply circuit are arranged on the same printed circuit board PCB;
the first power supply is connected with the load;
the compensation power supply circuit is respectively connected with the first power supply and the load;
the working voltage of the load is a first voltage;
the first power supply is configured to: sending to the load a voltage and a current for use when the load is operating;
the compensation power supply circuit is used for: when the current change of the load causes the voltage output by the first power supply to be less than the first voltage, a compensation current is sent to the load.
2. The electronic device of claim 1,
the compensation power supply circuit is disposed at the first side or the second side of the PCB.
3. The electronic device of claim 2,
the compensation power supply circuit and the load are arranged on a first side of the PCB;
the load and the compensation power supply circuit are packaged on a chip substrate.
4. The electronic device of any of claims 1-3,
the compensation power supply circuit is further configured to: when the voltage output by the first power supply is equal to the first voltage, the sending of the compensation current to the load is stopped.
5. The electronic device of any of claims 1-4, comprising:
the compensation power supply circuit includes: a second power supply and a capacitor; wherein the second power supply is connected to the first power supply and the load through the capacitor, and the second power supply is used for providing the compensation current.
6. The electronic device of claim 5, wherein the second power source satisfies at least one of:
the response speed of the second power supply is greater than that of the first power supply, the response time of the second power supply is less than that of the first power supply, and the switching frequency of the second power supply is greater than that of the first power supply.
7. The electronic device of claim 5 or 6,
the second power supply includes: a GaN high-frequency switching power supply, a silicon-based switching power supply or a low dropout regulator LDO.
8. The electronic device of any of claims 5-7,
the capacitor includes: a ceramic capacitor.
9. The electronic device of any of claims 5-8,
the switching frequency of the second power supply is greater than 3 MHz.
10. The electronic device of any of claims 1-9,
the first power supply is a voltage regulation module VRM power supply, and the switching frequency is 500kHz-1 MHz.
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| CN118677252A (en) * | 2024-08-22 | 2024-09-20 | 荣耀终端有限公司 | Power supply circuit, chip and electronic equipment |
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