CN114068662A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN114068662A
CN114068662A CN202111356895.9A CN202111356895A CN114068662A CN 114068662 A CN114068662 A CN 114068662A CN 202111356895 A CN202111356895 A CN 202111356895A CN 114068662 A CN114068662 A CN 114068662A
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CN
China
Prior art keywords
layer
display panel
light emitting
organic light
black light
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CN202111356895.9A
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Chinese (zh)
Inventor
叶超
魏小丹
何宝生
彭毅
杨堂
王霄熠
邓祖文
邵志亮
刘沛
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Chengdu BOE Optoelectronics Technology Co Ltd
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Priority to CN202111356895.9A priority Critical patent/CN114068662A/en
Publication of CN114068662A publication Critical patent/CN114068662A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The application provides a display panel and display device, display panel includes organic light emitting layer, covers organic light emitting layer's packaging layer with be located packaging layer keeps away from organic light emitting layer's color filter layer. The color filter layer comprises red color membranes, green color membranes and blue color membranes which are arranged at intervals, a black light absorption block is arranged between the adjacent color membranes, and a reflection layer is arranged on the side surface of the black light absorption block. This application is through preparing the reflection stratum at black extinction piece side, has strengthened right the reflection of the light that organic light emitting layer sent to display panel and display device's display brightness and contrast have been increased, the reduction power consumption.

Description

Display panel and display device
Technical Field
The present application relates to the field of display, and in particular, to a display panel and a display device.
Background
The organic electroluminescent diode (OLED) display panel has a series of advantages of self-luminescence, wide viewing angle, high contrast, high luminous efficiency, flexible display and the like, and the luminous mechanism is that electrons and holes are respectively injected from a cathode and an anode, the injected electrons and holes are respectively transmitted through an electron transmission layer and a hole transmission layer, and are finally compounded in a luminous layer, molecules of the luminous layer are excited to generate singlet excitons, and the singlet excitons are radiated and attenuated to emit light.
With the development of display technology and the demand of market, flexible screens become a hot development trend. The coe (color Filter on encapsulation) technology, one of the Organic Light Emitting Diode (OLED) display panel schemes, has been developed. The COE technology is to directly fabricate a color filter on an encapsulation layer after the conventional Organic Light Emitting Diode (OLED) is encapsulated. According to the technical scheme, the color film replaces the polarizer, the filtering function is directly integrated on the display back plate, the thickness of the back plate is obviously reduced, the display color gamut of the display is improved, the mass production cost is saved, and the flexible characteristic of an organic light-emitting diode (OLED) device is well realized.
However, this technique has a problem that since the black light absorbing block is made of a light absorbing organic material, most of the light emitted from the light emitting layer is absorbed and cannot be used when the light is irradiated to the surface of the black light absorbing block, which causes a reduction in panel luminance and an increase in power consumption.
Disclosure of Invention
The application provides a display panel and a display device to improve the brightness and contrast of an OLED display panel prepared by the conventional COE technology and reduce power consumption.
According to a first aspect of embodiments of the present application, there is provided a display panel including:
an organic light emitting layer;
an encapsulation layer covering the organic light emitting layer;
the color filter layer is arranged on one side of the packaging layer, which is far away from the organic light-emitting layer; wherein the content of the first and second substances,
the color filter layer comprises a plurality of color films arranged at intervals, a black light absorption block is arranged between the adjacent color films, and a reflection layer is arranged on the side surface of the black light absorption block.
In one embodiment, the reflective layer covers the entire side of the black light absorbing block.
In one embodiment, the material of the reflective layer comprises a metal material or a metal oxide material.
In one embodiment, the surface of the reflecting layer away from the black light absorption block is a plane or a curved surface.
In one embodiment, a bottom reflection layer is arranged between the black light absorption block and the packaging layer, and the projection of the bottom reflection layer on the packaging layer is positioned in the projection area of the black light absorption block on the packaging layer.
In one embodiment, a flat layer is disposed between the color filter layer and the package layer, and the bottom reflective layer is a planar structure and is located between the flat layer and the package layer.
In one embodiment, a flat layer and a transparent film layer are arranged between the color filter layer and the packaging layer, the flat layer is positioned between the color filter layer and the packaging layer, and the transparent film layer is positioned between the flat layer and the packaging layer;
the surface of the transparent film layer, which is far away from the packaging layer, is provided with a curved recess, and the projection of the curved recess on the packaging layer is positioned in the projection area of the black light absorption block on the packaging layer;
the bottom reflecting layer is of a curved surface structure and is positioned in the curved recess, and a space region defined by the bottom reflecting layer is filled with the flat layer material.
In one embodiment, a transparent film layer is arranged between the packaging layer and the color filter layer;
the surface of the transparent film layer, which is far away from the packaging layer, is provided with a curved recess, and the projection of the curved recess on the packaging layer is positioned in the projection area of the black light absorption block on the packaging layer;
the bottom reflecting layer is of a curved surface structure and is positioned in the curved recess, and a space area defined by the bottom reflecting layer is filled with the black light absorbing block material.
In one embodiment, the bottom reflective layer comprises a one-segment circular arc structure or a continuous multi-segment circular arc structure.
In one embodiment, a touch film layer is disposed between the color filter layer and the encapsulation layer.
According to a second aspect of embodiments of the present application, there is provided a display device including the display panel.
The technical scheme provided by the embodiment of the application has the following beneficial effects:
the application provides a display panel and display device, through be provided with the reflection stratum in the black light absorption piece side of colored filter layer, when not influencing black light absorption piece and prevent the anti-reflection function, reflected the light that the luminescent layer shines black matrix piece surface, made it penetrate at various membrane pieces to avoid the light loss that this part light shines black light absorption piece surface and causes, increased the luminance and the contrast of display, reduce the consumption.
Furthermore, a bottom reflection layer is arranged in a projection area of the black light absorption block of the color filter layer on the packaging layer, and loss of light irradiating the bottom surface of the black light absorption block is avoided by reflecting the light irradiating the bottom surface of the black matrix block by the light emitting layer.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
Fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, and fig. 6 are schematic cross-sectional views of embodiments of an organic electroluminescent diode display panel according to an exemplary embodiment of the present application.
The various references in the drawings are:
10. substrate
20. Organic light emitting layer
21. Red organic light emitting layer
22. Green organic light emitting layer
23. Blue organic light emitting layer
30. Encapsulation layer
31. A first encapsulation layer
32. Second packaging layer
33. Third encapsulation layer
40. Color filter layer
41. Red color film
42. Green color film
43. Blue color film
44. Black light absorption block
51. Organic protective layer
101. Touch substrate layer
102. A first electrode
103. Lap orifice layer
104. Second electrode
105. Protective layer
201. Transparent film layer
202. Bottom reflective layer
203. Bottom reflecting surface
204. Planarization layer
301. Reflective layer
302. Reflecting surface
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
The principle of the COE technology is that a color filter layer is directly made on a packaging layer of an organic light-emitting diode (OLED) display panel, wherein the color filter layer comprises various color films which are arranged at intervals, and a black light absorption block (black matrix, BM) is arranged between the adjacent color films. When external natural light irradiates downwards from an organic light-emitting diode (OLED) device, the external natural light irradiates a light-emitting layer through a color film, light rays penetrate through the color film layer again after being reflected by the light-emitting layer, and the light rays are overlapped with light emitted by the light-emitting layer, so that the display color gamut of the organic light-emitting diode (OLED) display device is increased, and the power consumption is reduced. Compared with the traditional organic light-emitting diode (OLED) display panel with the externally-hung polaroid, the thickness of the film layer of the OLED display panel prepared by the technology is reduced, and the organic light-emitting diode (OLED) display panel is favorable for realizing the light, thin and bendable performance.
However, in the display panel manufactured by the COE technology, since the black light absorption block has a strong light absorption capacity, most of light emitted by the organic light emitting layer is absorbed and cannot be utilized when the light passes through the black light absorption block, which causes loss of light energy.
In view of the above problem, an embodiment of the present application provides a display panel, as shown in fig. 1, the display panel includes a substrate 10, an organic light emitting layer 20 covering the substrate 10, an encapsulation layer 30 disposed on one side of the substrate 10 far away from the organic light emitting layer 20, a color filter layer 40 disposed on one side of the organic light emitting layer 20 far away from the encapsulation layer 30, and an organic protection layer 51 disposed on one side of the encapsulation layer 30 far away from the color filter layer 40.
The base 10 is typically used as a supporting substrate for subsequent formation of layers. While a general rigid organic electroluminescent diode (OLED) display panel generally uses glass as a material of the substrate 10, a flexible organic electroluminescent diode (OLED) display panel uses plastic or Polyimide (PI) as the substrate 10.
The organic light emitting layer 20 is a film layer in which electrons and holes are transported and recombined to emit light, the organic light emitting layer 20 includes a red organic light emitting layer 21, a green organic light emitting layer 22, and a blue organic light emitting layer 23 which are disposed at intervals, and a Pixel Defining Layer (PDL)11 is disposed between adjacent organic light emitting layers 20. The red organic light emitting layer 21 is configured to emit red light, the green organic light emitting layer 22 is configured to emit green light, and the blue organic light emitting layer 23 is configured to emit blue light. The red, green and blue organic light emitting layers 21, 22 and 23 are respectively prepared from organic light emitting materials emitting light of corresponding colors.
The red organic light emitting layer 21, the green organic light emitting layer 22 and the blue organic light emitting layer 23 are all prepared by an evaporation process.
The Pixel Definition Layer (PDL)11 is a pixel pattern layer that is fabricated by a photolithography process before an organic electroluminescent diode (OLED) display panel is evaporated, and functions to divide a sub-pixel light emitting area and reduce color mixing between adjacent pixels. A material for preparing the Pixel Defining Layer (PDL)11 used in a conventional organic electroluminescent diode (OLED) display panel is generally transparent, and in a special case, the material of the Pixel Defining Layer (PDL)11 is a black opaque pixel defining material. When external light enters the inside of the organic electroluminescent diode (OLED) display panel through the color filter layer 40, the black Pixel Defining Layer (PDL)11 may absorb light that is not reflected and absorbed by the organic light emitting layer 20, while blocking a Thin Film Transistor (TFT) metal reflection thereunder.
The encapsulation layer 30 is composed of a first encapsulation layer 31, a second encapsulation layer 32 and a third encapsulation layer 33, wherein the second encapsulation layer 32 is located between the first encapsulation layer 31 and the third encapsulation layer 33. The first encapsulating layer 31 and the third encapsulating layer 33 are both inorganic encapsulating layers, and the used materials are inorganic materials such as oxides, nitrides, composite materials and the like, such as SiO2、AlN、Si3N4、Al2O3Or Al2O3/ZrO2And the like, which is characterized by having very good barrier property to water vapor and oxygen. The second encapsulation layer 32 is an organic encapsulation layer, and the used encapsulation material is an organic material, such as organic silicon resin, phenolic resin, and the like, and has the characteristics of good insulation, low cost, convenient processing, and good film forming property.
The color filter layer 40 includes a plurality of color films arranged at intervals, and the color films are divided into a red color film 41, a green color film 42, and a blue color film 43. A black light absorption block 44 is arranged between the adjacent color films, and a reflection layer 301 is arranged on the side surface of the black light absorption block 44.
The red color filter 41, the green color filter 42, and the blue color filter 43 in the color filter layer 40 correspond to the red organic light emitting layer 21, the green organic light emitting layer 22, and the blue organic light emitting layer 23 in the organic light emitting layer 20, respectively. Therefore, when the light emitted from the organic light emitting layer 20 irradiates the side surface of the black light absorbing block 44, at least a portion of the light is reflected to the color film and is emitted from the color film.
The red color film 41, the green color film 42 and the blue color film 43 are all prepared by a coating exposure process.
The black light-absorbing block 44 is made of black organic material, and is generally prepared by adding black toner into an organic film so that the black light-absorbing block 44 can absorb light. Typically, the black light absorbing block 44 is made of a material doped with a carbon black material having certain electrical conductivity. The plurality of black light-absorbing blocks 44 provided in the same layer constitute a Black Matrix (BM). The black light absorption block 11 is arranged on the Organic Light Emitting Diode (OLED) display panel, the packaging layer 30 is far away from one side of the organic light emitting layer 20, can be completely isolated from the Organic Light Emitting Diode (OLED) display layer, and can effectively avoid the difficult problem of poor material insulation.
Wherein, the black light absorption block 44 is prepared by adopting a coating exposure process.
The reflective layer 301 covers the side of the black light-absorbing block 44, and further, the reflective layer 301 completely covers the side of the black light-absorbing block 44, thereby improving the reflectivity of the reflective layer 301. When the light emitted by the organic light emitting layer 20 is irradiated to the side surface of the black light absorbing block 44, the light is reflected to the color film and then emitted from the color film, so that the energy consumption of the black light absorbing block 44 to the light emitting layer 20 is reduced.
The reflective layer 301 may be a planar structure or a curved structure, and the planar structure has a high reflectivity to light due to the effect of specular reflection. The reflective layer 301 shown in fig. 1 is a planar structure. The surface of the reflective layer 301 away from the black light-absorbing block 44 is a reflective surface 302, which is an active surface when the reflective layer 301 reflects light emitted from the organic light-emitting layer 20.
Specifically, when the green light emitted from the green organic light emitting layer 22 of the organic light emitting layer 20 is irradiated onto the reflection surface 302 of the reflection layer 301, the green color filter 42 of the color filter layer 40 is emitted through reflection of the reflection surface 302. Similarly, the red light and the blue light respectively emitted by the red organic light emitting layer 21 and the blue organic light emitting layer 23 of the organic light emitting layer 20 are also reflected by the reflective layer 301 and then emitted from the red color filter 41 and the blue color filter 43 of the color filter layer 40, respectively.
In order to achieve a better reflection effect, the material of the reflective layer 301 is a material with a higher refractive index, such as a metal material or a metal oxide material, so as to ensure that the reflective surface 302 of the reflective layer 301 can realize a reflection function. In some application scenarios, the metal oxide material in which the reflective layer 301 is made may also include a transparent conductive oxide material, such as Indium Zinc Oxide (IZO), tin-doped indium oxide (ITO), and the like.
Preferably, the material for preparing the reflective layer 301 is a metal material, and the metal material at least includes silver (Ag), magnesium (Mg), copper (Cu), aluminum (Al), or the like.
Meanwhile, the surface flatness of the reflective layer 301 also has a certain influence on the reflective effect of the reflective layer 301, and the higher the surface flatness of the reflective layer 301 is, the stronger the reflective effect of the mirror effect is, and the better the reflective effect is.
The reflective layer 301 is prepared by coating, exposing, etching and stripping processes.
The organic protection layer 51 is a protection film layer formed by coating organic paint on the color filter layer 40 by a certain method and by a coating exposure process, and mainly plays a role in protecting the color filter layer 40, and the organic protection layer 51 is prepared by adopting a transparent material so as to ensure the normal display function of an organic light-emitting diode (OLED) display panel.
As shown in fig. 1, the specific scheme for the preparation of the embodiment of the present application is as follows: preparing the substrate 10; preparing the Pixel Defining Layer (PDL)11 on the substrate 10 by an evaporation process; forming the organic light emitting layers 20 on the surfaces of the substrate 10 on which the Pixel Defining Layers (PDL)11 are prepared by evaporation, respectively; preparing an encapsulation layer 30 on the side of the organic light-emitting layer 20 away from the substrate 11; preparing the black light absorption block 44 on the side of the encapsulation layer 30 far away from the organic light emitting layer 20 through a coating and exposing process; preparing the reflecting layer 301 on the side of the black light absorption block 44; preparing the red color film 41, the green color film 42 and the blue color film 43 on the side of the encapsulation layer 30 away from the organic light emitting layer 20; the organic protective layer 51 is prepared on the side of the color film sheet away from the encapsulation layer 30.
In some embodiments, the organic electroluminescent diode (OLED) panel further includes a bottom reflective layer 202, as shown in fig. 2-6, the bottom reflective layer 202 is located between the black light-absorbing block 44 and the encapsulation layer 30, and a projection of the bottom reflective layer 202 on the encapsulation layer 30 is located in a projection area of the black light-absorbing block 44 on the encapsulation layer 30. By arranging the bottom reflection layer 202, the absorption of the black light absorption block 44 to light is further reduced, and the light extraction rate of the Organic Light Emitting Diode (OLED) display panel is improved.
In one embodiment, the bottom reflective layer 202 is a planar structure that has a specular reflective effect and thus a high reflective efficiency.
Fig. 2 shows the structure of a specific organic electroluminescent diode (OLED) display panel including a bottom reflective layer 202. As shown in fig. 2, the organic electroluminescent diode (OLED) display panel further includes a planarization layer 204, and the planarization layer 204 is located between the encapsulation layer 30 and the color filter layer 40. The planarization layer 204 can smooth the difference of the inner levels of the display device substrate caused by various layer patterns, and the planarization layer 204 can smooth the surface to better adhere to the color filter layer 40.
The bottom reflective layer 202 is disposed between the flat layer 204 and the encapsulation layer 30 and located in the projection area of the black light absorption block 44 on the encapsulation layer 30, and preferably, the bottom reflective layer 202 completely fills the projection area of the black light absorption block 44 on the encapsulation layer 30. Meanwhile, the bottom reflective layer 202 is located right above the Pixel Defining Layer (PDL) 11. The bottom reflective layer 202 is located closer to the organic light emitting layer 20 than the reflective layer 301 located at the side, and thus the bottom reflective surface 203 reflects more light emitted from the organic light emitting layer 20 than the reflective surface 302.
In this embodiment, the bottom reflective layer 202 has a planar structure, a surface of the bottom reflective layer 202 away from the black light-absorbing block 44 is a bottom reflective surface 203, and the bottom reflective surface 203 is an active surface when the light emitted from the organic light-emitting layer 20 is reflected by the bottom reflective layer 202.
Specifically, when the green light emitted from the green organic light emitting layer 22 of the organic light emitting layer 20 is irradiated to the bottom reflective surface 203 of the bottom reflective layer 202, the green light is reflected by the bottom reflective surface 203 to the surface of the first encapsulation layer 31 away from the organic light emitting layer 20, and is emitted from the green color filter 42 of the color filter layer 40 by the reflection of the surface. Similarly, the red light and the blue light respectively emitted by the red organic light emitting layer 21 and the blue organic light emitting layer 23 of the organic light emitting layer 20 are also reflected to the surface of the first encapsulation layer 31 away from the organic light emitting layer 20 through the bottom reflection surface 203, and are respectively emitted from the red color film 41 and the blue color film 43 of the color filter layer 40 through the reflection of the bottom reflection surface 203.
The material of the bottom reflective layer 202 is the same as that of the reflective layer 301, and is a material with a higher refractive index, such as a metal material or a metal oxide material, so as to ensure that the bottom reflective surface 203 of the bottom reflective layer 202 can complete reflection. In some application scenarios, the metal oxide material used to fabricate the bottom reflective layer 202 includes a transparent conductive oxide material, such as Indium Zinc Oxide (IZO), tin-doped indium oxide (ITO), and the like.
Preferably, the material for preparing the bottom reflective layer 202 is a metal material, and the metal material at least includes silver (Ag), magnesium (Mg), copper (Cu), aluminum (Al), or the like.
When the bottom reflective layer 202 is of a planar structure, under the condition that the film layer preparation process of other organic electroluminescent diode (OLED) display panels is not changed, it is only necessary to prepare the bottom reflective layer 202 on the side of the encapsulation layer 30 away from the organic light emitting layer 20, prepare the flat layer 204 on the surface of the bottom reflective layer 202, and then prepare the color filter layer 40 on the side of the flat layer 204 away from the encapsulation layer 30. The flat layer 204 can be directly prepared by a coating and exposing process, and the process is relatively simple and the cost is low.
However, when the bottom reflective layer 202 has a planar structure, the bottom reflective surface 203 of the bottom reflective layer 202 has a planar structure. The light emitted from the organic light emitting layer 20 is easily emitted from the adjacent color filter, thereby causing color mixing and lowering the contrast. Thus, in some embodiments, the bottom reflective layer 202 is a curved structure.
Fig. 3 shows an embodiment in which the bottom reflective layer 202 has a curved surface structure. As can be seen, the organic electroluminescent diode (OLED) display panel further includes a planarization layer 204 and a transparent film layer 201. The transparent film layer 201 is located on a side of the encapsulation layer 30 away from the organic light emitting layer 20, and the flat layer 204 is located on a side of the transparent film layer 201 away from the encapsulation layer 30.
The transparent film 201 is prepared by a coating and exposing process using a photoresist, and the photoresist is a corrosion-resistant film material whose solubility changes by irradiation or radiation such as ultraviolet light, deep ultraviolet light, electron beam, ion beam, X-ray, and the like. The surface of the transparent film layer 201 on the side away from the encapsulation layer 30 has curved recesses, and the projection of the curved recesses on the encapsulation layer 30 is located in the projection area of the black light absorption block 44 on the encapsulation layer 30. Preferably, the projection of the curved recess on the encapsulation layer 30 completely occupies the projection area of the black light absorption block 44 on the encapsulation layer 30, i.e. the projection of the curved recess on the encapsulation layer 30 completely coincides with the projection of the black light absorption block 44 on the encapsulation layer 30.
The bottom reflective layer 202 is located in the curved recess of the transparent film 201, preferably, the bottom reflective layer 202 completely covers the surface of the curved recess of the transparent film 201, and the surface of the bottom reflective layer 202 away from the black light-absorbing block 44 is a bottom reflective surface 203. The bottom reflective layer 202 is located right above the Pixel Defining Layer (PDL)11 to ensure a more efficient reflection function.
Specifically, when the light emitted from the green organic light emitting layer 22 of the organic light emitting layer 20 passes through the bottom reflective surface 203 of the bottom reflective layer 202, the light is reflected to the green color film 42 of the color filter layer 40 and is emitted therefrom. Similarly, when light emitted from the red organic light emitting layer 21 and the blue organic light emitting layer 23 of the organic light emitting layer 20 pass through the bottom reflective surface 203 of the bottom reflective layer 202, the light is reflected to the red color film 41 and the blue color film 43 of the color filter layer 40 and is emitted therefrom.
The flat layer 204 is made of a transparent material, and can have a smooth surface so as to be better attached to the color filter layer 40. The area enclosed by the bottom reflective layer 202 (i.e., the remaining space above the curved concave bottom reflective layer 202) is filled with the material used to make the planar layer 204.
The flat layer 204 is prepared through a coating and baking process, and the transparent film layer 201 is prepared through the coating and exposure process.
In preparing the embodiment as shown in fig. 3, the transparent film layer 201 containing the curved recesses is prepared on the side of the encapsulation layer 30 away from the organic light-emitting layer 20; preparing the bottom reflective layer 202 on the curved concave surface of the transparent film layer 201; preparing the flat layer 204; the color filter layer 40 is prepared on the side of the flat layer 204 far away from the transparent film layer 201. The process and sequence for preparing the film layers of other organic electroluminescent diode (OLED) display panels are the same as those of the previous embodiments.
In a specific embodiment, the number of the curved recesses of the transparent film 201 is multiple, accordingly, the bottom reflective layer 202 includes a continuous multi-segment arc structure, and the bottom reflective layer 202 covers the surface of the curved recesses of the transparent film 201, and preferably, the bottom reflective layer 202 completely covers the entire surface of the curved recesses of the transparent film 201.
Fig. 4 shows an embodiment of the bottom reflective layer 202 when the curved surface structure is three. The structure of this embodiment is the same as that of the embodiment shown in fig. 4 except for the number of the curved surface structures of the bottom reflective layer 202, and the manufacturing process and sequence are the same as those of the embodiment shown in fig. 3.
Unlike the embodiment shown in fig. 3, in the embodiment shown in fig. 4, the light emitted from the organic light emitting layer 20 is reflected by the bottom reflective surface 203 of the bottom reflective layer 202 and then emitted from the color filter, or may be emitted after multiple reflections.
Specifically, after the green organic light emitting layer 22 of the organic light emitting layer 20 emits light, the light irradiates the bottom reflective surface 203 of the bottom reflective layer 202, is reflected by the bottom reflective surface 203 to the surface of the first encapsulation layer 31 away from the organic light emitting layer 20, is reflected again by the surface, and is emitted from the green color film 42 of the color filter layer 40. Similarly, after the red organic light emitting layer 21 and the blue organic light emitting layer 23 of the organic light emitting layer 20 emit light, the light may also be reflected by the bottom reflective surface 203 of the bottom reflective layer 202, and then irradiate the first encapsulation layer 31, and be reflected by the surface of the first encapsulation layer 31 away from the organic light emitting layer 20 to the corresponding red color film 41 and blue color film 43, respectively, and then be emitted.
In the above embodiment, when the bottom reflective layer 202 has a curved surface structure, the organic electroluminescent diode (OLED) display panel needs to prepare two film layers, namely the transparent film layer 201 and the flat layer 204, and the preparation process is relatively complex, so that, in order to achieve the effect of process simplification, the flat layer 204 between the color filter layer 40 and the transparent film layer 201 may be eliminated, and the color filter layer 40 is directly prepared on the transparent film layer 201.
Fig. 5 shows an embodiment in which the color filter layer 40 is directly formed on the transparent film layer 201 in the organic electroluminescent diode (OLED) display panel. The surface of the transparent film layer 201 away from the encapsulation layer 30 has curved recesses, and the projection of the curved recesses on the encapsulation layer 30 is located in the projection area of the black light absorption block 44 on the encapsulation layer 30. Preferably, the projection of the curved recess on the encapsulation layer 30 completely occupies the projection area of the black light absorption block 44 on the encapsulation layer 30, i.e. the projection of the curved recess on the encapsulation layer 30 completely coincides with the projection of the black light absorption block 44 on the encapsulation layer 30.
The bottom reflective layer 202 is located in the curved recess of the transparent film 201, preferably, the bottom reflective layer 202 completely covers the entire surface of the curved recess, and the surface of the bottom reflective layer 202 away from the black light-absorbing block 44 is a bottom reflective surface 203. The bottom reflective layer 202 is directly disposed on the side of the black light-absorbing block 44 away from the organic protection layer 51, wherein the space surrounded by the bottom reflective layer 202 (i.e., the remaining space above the bottom reflective layer 202 in the curved recess) is filled with the same material as the black light-absorbing block 44.
In some embodiments, the number of the curved recesses of the transparent film 201 may be multiple, and accordingly, the number of the circular arc segments included in each of the bottom reflective layers 202 may be multiple (the bottom reflective layer has a profile as shown in fig. 4), and other structures are the same as those of the embodiment shown in fig. 5.
In the preparation of the organic electroluminescent diode (OLED) display panel as shown in fig. 5, the transparent film layer 201 including the curved recesses is prepared on the side of the encapsulation layer 30 away from the organic light emitting layer 20; preparing the bottom reflective layer 202 on the curved concave surface of the transparent film layer 201; preparing the black light absorption block 44, wherein the material used by the black light absorption block 44 fills the space surrounded by the bottom reflection layer 202; the color filter layer 40 is prepared. The remaining layers were prepared in the same manner as in the previous examples.
In one integrated touch screen embodiment, the organic electroluminescent diode (OLED) display panel further includes a touch film layer including a touch base layer 101, a landing hole layer 103, a protective layer 105, a first electrode 102, and a second electrode 104. The landing hole layer 103 is located between the touch substrate layer 101 and the protection layer 105, the touch substrate layer 101 is located on one side of the encapsulation layer 30 away from the substrate 10, and the protection layer 105 is located on one side of the landing hole layer 103 away from the substrate 10.
The first electrode 102 is disposed between the touch substrate layer 101 and the landing hole layer 103, is located on one side of the landing hole layer 103 away from the protective layer 105, and is in direct contact with a surface of the landing hole layer 103 away from the touch substrate layer 101. The second electrode 104 is disposed between the landing hole layer 103 and the protection layer 105, and is located on a side of the protection layer 105 away from the transparent film layer 201, and directly contacts with a surface of the protection layer 105 away from the transparent film layer 201. The first electrode 102 and the second electrode 104 are respectively used as a transmitting electrode and a receiving electrode of the touch film layer.
When the organic electroluminescent diode (OLED) integrated touch screen shown in fig. 6 is manufactured, a touch substrate layer 101 is manufactured on the encapsulation layer 30; manufacturing a first electrode 102; making a lap hole layer 103; manufacturing a second electrode 104; a protective layer 105 is formed. All the processes were then completed according to the preparation protocol described in the above examples.
The embodiment of the application provides a display device, which comprises the display panel of the embodiment.
The embodiment of the application provides an Organic Light Emitting Diode (OLED) display panel and a display device, the display panel comprises an organic light emitting layer 20, an encapsulation layer 30 covering the organic light emitting layer 20, and a color filter layer 40 located at a position where the encapsulation layer 30 is far away from the organic light emitting layer 20. The color filter layer 40 includes red color films 41, green color films 42, and blue color films 43 arranged at intervals, a black light-absorbing block 44 is arranged between adjacent color films, and a reflective layer 301 is arranged on a side surface of the black light-absorbing block 44. Optionally, a bottom reflective layer 202 is disposed between the black light-absorbing block 44 and the encapsulation layer 30, and a projection of the bottom reflective layer 202 on the encapsulation layer 30 is located in a projection area of the black light-absorbing block 44 on the encapsulation layer 30. According to the Organic Light Emitting Diode (OLED) display panel and the display device, the reflection layer 301 and the bottom reflection layer 202 are prepared on the side face and the bottom face of the black light absorption block 44, so that the reflection of the side face and the bottom face of the black light absorption block 44 to light emitted by the organic light emitting layer 20 is enhanced, the display brightness and the contrast of the OLED display panel and the display device are increased, and the power consumption is reduced.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (11)

1. A display panel, comprising:
an organic light emitting layer;
an encapsulation layer covering the organic light emitting layer;
the color filter layer is arranged on one side, away from the organic light emitting layer, of the packaging layer and comprises a plurality of color films arranged at intervals, a black light absorption block is arranged between the color films, and a reflection layer is arranged on the side face of the black light absorption block.
2. The display panel according to claim 1, wherein the reflective layer covers the entire side of the black light absorbing block.
3. The display panel according to claim 1, wherein a material of the reflective layer comprises a metal material or a metal oxide material.
4. The display panel according to claim 1, wherein a surface of the reflective layer away from the black light-absorbing block is a flat surface or a curved surface.
5. The display panel according to claim 1, wherein a bottom reflective layer is provided between the black light absorbing block and the encapsulation layer;
the projection of the bottom reflecting layer on the packaging layer is positioned in the projection area of the black light absorption block on the packaging layer.
6. The display panel according to claim 5, wherein a planarization layer is disposed between the color filter layer and the encapsulation layer;
the bottom reflecting layer is of a plane structure and is positioned between the flat layer and the packaging layer.
7. The display panel of claim 5, further comprising a planarization layer and a transparent film layer, wherein the planarization layer is located between the color filter layer and the encapsulation layer, and wherein the transparent film layer is located between the planarization layer and the encapsulation layer;
the surface of the transparent film layer, which is far away from the packaging layer, is provided with a curved recess, and the projection of the curved recess on the packaging layer is positioned in the projection area of the black light absorption block on the packaging layer;
the bottom reflecting layer is of a curved surface structure and is positioned in the curved recess, and the flat layer fills the residual space of the curved recess.
8. The display panel according to claim 5, wherein a transparent film layer is provided between the encapsulation layer and the color filter layer;
the surface of the transparent film layer, which is far away from the packaging layer, is provided with a curved recess, and the projection of the curved recess on the packaging layer is positioned in the projection area of the black light absorption block on the packaging layer;
the bottom reflecting layer is of a curved surface structure and is positioned in the curved recess, and the black light absorption block fills the residual space of the curved recess.
9. The display panel according to claim 7 or 8, wherein the bottom reflective layer comprises a one-segment circular arc structure or a continuous multi-segment circular arc structure.
10. The display panel of claim 1, wherein a touch film layer is disposed between the color filter layer and the encapsulation layer.
11. A display device characterized by comprising the display panel according to any one of claims 1 to 10.
CN202111356895.9A 2021-11-16 2021-11-16 Display panel and display device Pending CN114068662A (en)

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Application Number Priority Date Filing Date Title
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116723742A (en) * 2023-06-28 2023-09-08 惠科股份有限公司 Display module, manufacturing method thereof and display device
CN117560968A (en) * 2023-11-03 2024-02-13 惠科股份有限公司 Display panel and display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116723742A (en) * 2023-06-28 2023-09-08 惠科股份有限公司 Display module, manufacturing method thereof and display device
CN117560968A (en) * 2023-11-03 2024-02-13 惠科股份有限公司 Display panel and display device

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