CN114068450A - Cooling member for printed circuit board member and printed circuit system - Google Patents
Cooling member for printed circuit board member and printed circuit system Download PDFInfo
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- CN114068450A CN114068450A CN202010751771.XA CN202010751771A CN114068450A CN 114068450 A CN114068450 A CN 114068450A CN 202010751771 A CN202010751771 A CN 202010751771A CN 114068450 A CN114068450 A CN 114068450A
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- cooling
- printed circuit
- circuit board
- flow path
- component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention provides a cooling component for printed circuit board components and a printed circuit system. The cooling member for a printed circuit board component according to the present invention includes two cooling units for contacting a chip of the printed circuit board component from both sides in a thickness direction of the chip, and the two cooling units form parallel cooling flow paths through which a cooling medium flows, thereby achieving excellent heat dissipation to the chip of the printed circuit board component. The printed circuit system according to the present invention, which includes the above-described cooling part and the corresponding printed circuit board part, improves the cooling efficiency of the printed circuit system and improves the system stability.
Description
Technical Field
The present invention relates to the field of heat dissipation, and more particularly, to a cooling member for a printed circuit board component and a printed circuit system.
Background
In inverter systems that convert direct current to alternating current, insulated gate bipolar transistor chips (IGBTs) are often mounted on a Printed Circuit Board (PCB) to form a Printed Circuit Board Assembly (PCBA). But due to the limited space of the printed circuit board components and the high power consumption of the igbt chips, the heat dissipation of the igbt chips becomes increasingly difficult.
Disclosure of Invention
The present invention has been made in view of the above-mentioned drawbacks of the prior art. An object of the present invention is to provide a novel cooling member for a printed circuit board member, which can achieve good heat dissipation to a chip of the printed circuit board member. It is another object of the present invention to provide a printed circuit system including the cooling component and the printed circuit board component described above.
In order to achieve the above object, the present invention adopts the following technical solutions.
The invention provides a cooling component for a printed circuit board component, which is used for cooling a chip of the printed circuit board component by flowing a cooling medium,
the cooling member includes a first cooling block and a second cooling block assembled to each other, the first cooling block being located on one side in a thickness direction of the chip so as to be in contact with the chip and having a first cooling flow path formed therein through which the cooling medium flows, the second cooling block being located on the other side in the thickness direction of the printed circuit board member so as to be in contact with the chip and having a second cooling flow path formed therein, the second cooling flow path being arranged in parallel with the first cooling flow path.
Preferably, the first cooling assembly comprises a plurality of first fins disposed within the first cooling flow path; and/or
The second cooling assembly includes a plurality of second fins disposed within the second cooling flow path.
More preferably, the second cooling assembly includes a heat conductive member for contacting the chip, the heat conductive member being made of a material having a thermal conductivity greater than that of the material of the other portion of the second cooling assembly.
More preferably, a material of at least a portion of the first cooling block for contact with the chip is the same as a material of the heat conductive member of the second cooling block.
More preferably, the material of the heat-conducting member is copper, and the material of the other portion is aluminum alloy.
More preferably, the first cooling module is formed with two convex portions that protrude toward the other side in the thickness direction, one of the convex portions is formed with a first inflow passage that communicates with the first cooling flow path, and the other of the convex portions is formed with a first outflow passage that communicates with the first cooling flow path; and is
The second cooling module is formed with two recessed portions that receive the two protruding portions, one of the recessed portions having formed therein a second inflow passage that communicates with the second cooling flow path, and the other of the recessed portions having formed therein a second outflow passage that communicates with the second cooling flow path, such that the second inflow passage communicates with the first inflow passage and the second outflow passage communicates with the first outflow passage.
More preferably, the first inflow passage and the first outflow passage are located at both longitudinal end portions of the first cooling flow passage, respectively, and the second inflow passage and the second outflow passage are located at both longitudinal end portions of the second cooling flow passage, respectively.
More preferably, an outer side wall of the convex portion is formed with a first step structure, an inner side wall of the concave portion is formed with a second step structure cooperating with the first step structure, and
the cooling member further includes a sealing ring interposed between the first stepped structure of the convex portion and the second stepped structure of the concave portion to seal a connection portion between the convex portion and the concave portion.
More preferably, the first cooling module includes a first housing and a first cover assembled together, the first housing and the first cover enclosing the first cooling flow path, the boss being formed at the first housing; and is
The second cooling module includes a second housing and a second cover assembled together, the second housing and the second cover enclosing the second cooling flow path, the recess being formed in the second housing.
The invention provides a printed circuit system, which comprises the cooling component and a printed circuit board component mounted on the cooling component, wherein the printed circuit board component comprises a printed circuit board and a plurality of chips arranged on the printed circuit board, and the parts of the printed circuit board corresponding to the chips form gaps, so that a first cooling assembly and a second cooling assembly of the cooling component can be respectively contacted with the chips from two sides in the thickness direction.
By adopting the technical scheme, the invention provides the cooling component for the printed circuit board component. The cooling component for the printed circuit board component comprises two cooling assemblies which are used for contacting with the chip from two sides of the thickness direction of the chip of the printed circuit board component, and the two cooling assemblies form parallel cooling flow paths for cooling media to flow through, thereby realizing good heat dissipation for the chip of the printed circuit board component. The present invention also provides a printed circuit system including the cooling member and a corresponding printed circuit board member, so that the cooling efficiency of the printed circuit system is improved and the system stability is improved.
Drawings
FIG. 1a is a schematic diagram illustrating a perspective structure of a printed circuit system according to an embodiment of the present invention; FIG. 1b is an exploded schematic diagram illustrating the printed circuitry of FIG. 1 a; FIG. 1c is a schematic diagram showing a longitudinal cross-section of the printed circuitry of FIG. 1a taken along a widthwise centerline; FIG. 1d is a schematic diagram showing a cross-sectional view of the printed circuitry of FIG. 1a taken along a centerline of a pair of male and female portions mated with each other; fig. 1e is a longitudinal sectional view taken along a widthwise centerline showing a partial structure of the printed circuit system in fig. 1a, in which the first cooling assembly is omitted.
FIG. 2a is a schematic perspective view of a printed circuit board assembly showing the printed circuitry of FIG. 1 a; fig. 2b is a schematic perspective view of a printed circuit board showing the printed circuit board components of fig. 2 a.
Description of the reference numerals
1 first cooling module 11 first case 11p first protrusion 11h1 first inflow passage 11h2 first outflow passage 11e boss 12 first cover 13 first fin 1T first cooling flow passage
2 second cooling module 21 second case 21p second projection 21c concave 21h1 second inflow passage 21h2 second outflow passage 22 second cover 22h1 common inflow port 22h2 common outflow port 23 second fin 24 heat plate 2T second cooling passage
3 printed circuit board part 31 printed circuit board 31c notch 31h mounting through hole 32 chip
4 sealing ring
L longitudinal direction W width direction H thickness direction.
Detailed Description
Exemplary embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the detailed description is intended only to teach one skilled in the art how to practice the invention, and is not intended to be exhaustive or to limit the scope of the invention. In the present invention, "the length direction", "the width direction" and "the thickness direction" refer to the length direction, the width direction and the thickness direction of a printed circuit board component (printed circuit board), respectively, unless otherwise specified. The structure of the printed circuit system according to the invention will be described in detail below with reference to the drawings.
As shown in fig. 1a to 1e, the printed circuit system according to an embodiment of the present invention includes a cooling member for a printed circuit board member (two cooling assemblies 1, 2 and a sealing ring 4) for cooling a chip 32 of the printed circuit board member 3 and the printed circuit board member 3 mounted on the cooling member.
In the present embodiment, the cooling unit includes the first cooling unit 1 and the second cooling unit 2 assembled to each other, and the two cooling units 1 and 2 are located on both sides of the chip 32 of the printed circuit board unit 3 in the thickness direction and form the cooling flow paths 1T and 2T connected in parallel, so that the chip 32 of the printed circuit board unit 3 can radiate heat well.
Specifically, in the present embodiment, the first cooling module 1 is integrally formed in a substantially rectangular parallelepiped shape, and the first cooling module 1 is made of a metal material such as copper, and thus has a good thermal conductivity. The first cooling block 1 is located on one side (upper side in fig. 1c and 1 d) of the printed circuit board component 3 in the thickness direction of the chip 32 so as to be in contact with the chip 32, and a first cooling flow path 1T through which a cooling medium flows is formed inside the first cooling block 1. In the present embodiment, the longitudinal direction, the width direction, and the thickness direction of the first cooling module 1 coincide with the longitudinal direction L, the width direction W, and the thickness direction H of the printed circuit board member 3, respectively, and since the plurality of chips 32 are arranged along the longitudinal direction L, the first cooling flow path 1T linearly extends from one longitudinal direction side to the other longitudinal direction side.
Further, the first cooling module 1 includes a first housing 11, a first cover 12, and a plurality of first cooling fins 13 assembled together. The first housing 11 is formed in a recessed shape for the first cooling flow path 1T by, for example, a press process, and the first cover 12 has a flat plate shape and is fixed to the first housing 11 from the thickness direction side by, for example, welding, so that the first housing 11 and the first cover 12 surround and form the first cooling flow path 1T. In addition, the first housing 11 is used for contacting the chip 32 of the printed circuit board assembly 3.
Each end portion in the length direction L of the first housing 11 is formed with two lugs 11e projecting toward both sides in the width direction, each lug 11e is formed with a mounting through hole for corresponding to the mounting hole of the second cooling module 2, and a connecting member (e.g., a bolt) passing through the mounting through hole and protruding into the corresponding mounting hole can fix the first cooling module 1 and the second cooling module 2 together. Two first protruding portions 11p protruding toward the other side in the thickness direction are formed at both end portions in the longitudinal direction L of the first case 11, respectively, a first inflow passage 11h1 communicating with the first cooling flow path 1T is formed in one first protruding portion 11p (located on the left side in fig. 1c), and a first outflow passage 11h2 communicating with the first cooling flow path 1T is formed in the other first protruding portion 11p (located on the right side in fig. 1 c). In this way, the first inflow passage 11h1 and the first outflow passage 11h2 are located at both ends of the first cooling passage 1T in the longitudinal direction L, so that the cooling medium can flow into the first cooling passage 1T from the first inflow passage 11h1 and then flow out from the first outflow passage 11h 2. Further, each first projection 11p is inserted into a recess 21c described below of the second cooling block 2, and an outer side wall of each first projection 11p forms a first stepped structure and cooperates with a second stepped structure of an inner side wall of the recess 21 c.
The plurality of first fins 13 are provided in the first cooling flow path 1T of the first cooling module 1. The plurality of first fins 13 are arranged in an array in the longitudinal direction L and the width direction W, and the height of each first fin 13 in the thickness direction H is equal to the height of the first cooling flow path 1T in the thickness direction H. In this way, the heat conduction efficiency of the first cooling module 1 can be improved by the plurality of first heat radiation fins 13.
Specifically, in the present embodiment, the second cooling module 2 is formed integrally in a substantially rectangular parallelepiped shape. The portions of the second cooling module 2 other than the heat conductive plate 24 are made of a metal material such as an aluminum alloy, and the material of the heat conductive plate 24 of the second cooling module 2 is the same as that of the first cooling module 1, so that the heat conductivity of the material of the portions of the second cooling module 2 other than the heat conductive plate 24 is smaller than that of the material of the first cooling module 1. The second cooling block 2 is located on the other side (lower side in fig. 1c and 1 d) in the thickness direction of the printed circuit board member 3 in contact with the chip 32, and a second cooling flow path 2T is formed inside the second cooling block 2, the second cooling flow path 2T being in parallel with and in fluid communication with the first cooling flow path 1T. In the present embodiment, the longitudinal direction, the width direction, and the thickness direction of the second cooling module 2 coincide with the longitudinal direction L, the width direction W, and the thickness direction H of the printed circuit board member 3, respectively, and since the plurality of chips 32 are arranged along the longitudinal direction L, the second cooling flow path 2T linearly extends from one longitudinal direction side to the other longitudinal direction side.
The second cooling block 2 includes a second housing 21, a second cover 22, a plurality of second heat radiating fins 23 and a heat conductive plate 24 assembled together. The second housing 21 is formed in a recessed shape for the second cooling flow path 2T by, for example, die casting, and the second cover 22 has a flat plate shape and is fixed to the second housing 21 from the other side in the thickness direction by, for example, bolting or the like, so that the second housing 21 and the second cover 22 surround and form the second cooling flow path 2T. In the present embodiment, the second casing 21 faces the first casing 11 in the thickness direction H through the heat conductive plate 24 and the printed circuit board member 3.
The second housing 21 is formed with a plurality of second projections 21p projecting toward one side in the thickness direction on both sides in the width direction of the portion for forming the second cooling flow path 2T, the second projections 21p are formed with mounting holes for corresponding to the mounting through holes 31h of the printed circuit board 31 of the printed circuit board component 3, and a connector (e.g., a bolt) passing through the mounting through holes 31h and projecting into the corresponding mounting holes can fixedly mount the printed circuit board component 3 to the second housing 21 of the second cooling module 2. Two recessed portions 21c recessed toward the other side in the thickness direction are formed at both end portions in the longitudinal direction L of the second casing 21, respectively, one recessed portion 21c (located on the left side in fig. 1c and 1 e) forms a second inflow passage 21h1 communicating with the second cooling flow passage 2T, and the other recessed portion 21c (located on the right side in fig. 1c and 1 e) forms a second outflow passage 21h2 communicating with the second cooling flow passage 2T. In this way, the second inflow passage 21h1 and the second outflow passage 21h2 are located at both ends of the second cooling flow path 2T in the longitudinal direction L, so that the cooling medium can flow into the second cooling flow path 2T from the second inflow passage 21h1 and then flow out from the second outflow passage 21h 2. Each recess 21c receives the corresponding first projection 11p of the first cooling module 1, and the first step structure of the outer side wall of each first projection 11p abuts against the second step structure of the inner side wall of each recess 21c, so that the second inflow passage 21h1 communicates with the first inflow passage 11h1 and the second outflow passage 21h2 communicates with the first outflow passage 11h 2.
It should be understood that although the recess 21c is formed as a through hole penetrating the second housing 21 in the thickness direction H in the illustrated example, the recess 21c is not necessarily a through hole in the thickness direction H. In particular, when the recess 21c is shifted from the inflow port 22H1 and the outflow port 22H2 described below, the recess 21c may be a blind hole in the thickness direction H.
Further, a common inlet port 22h1 communicating with the second inlet passage 21h1 and a common outlet port 22h2 communicating with the second outlet passage 21h2 are formed at both ends of the second cap 22 in the longitudinal direction L. In this way, the flow path of the cooling medium via the common inlet port 22h1 can be divided into two paths, a portion of the cooling medium flowing into the second inflow path 21h1 and then directly entering the second cooling flow path 2T and then flowing to the common outlet port 22h2 via the second outflow path 21h2, and another portion of the cooling medium flowing into the second inflow path 21h1 and then flowing into the first cooling flow path 1T via the first inflow path 11h1 and then flowing to the common outlet port 22h2 via the first outflow path 11h2 and the second outflow path 21h2, so that the first cooling flow path 1T and the second cooling flow path 2T form two parallel cooling flow paths.
The plurality of second fins 23 are provided in the second cooling flow path 2T of the second cooling module 2. The plurality of second fins 23 are arranged in an array in the longitudinal direction L and the width direction W, and the height of each second fin 23 in the thickness direction H is equal to the height of the second cooling flow channel 2T in the thickness direction H. In this way, the plurality of second heat radiation fins 23 can improve the heat conduction efficiency of the second cooling module 2.
The heat-conducting plate 24 is interposed between the chip 32 of the printed circuit board assembly 3 and the second casing 21 of the second cooling module 2. Since the thermal conductivity of the material of the thermal conductive plate 24 is greater than that of the material of the second housing 21 of the second cooling module 2, the thermal conductive plate 24 can improve the thermal conductivity efficiency. In addition, the heat conductive plate 24 has an appropriate thickness, so that the heat conductive plate 24 can also compensate for a mounting error of the printed circuit board part 3 to the second cooling module 2.
Further, the cooling member further includes a seal ring 4, and the seal ring 4 is interposed between the first step structure of the first convex portion 11p and the second step structure of the concave portion 21 c. Thus, the seal ring 4 can satisfactorily seal the connection portion between the first convex portion 11p and the concave portion 21c by the clamping force between the first stepped structure and the second stepped structure, thereby preventing the leakage of the cooling medium at the connection portion.
In the present embodiment, as shown in fig. 2a and 2b, the printed circuit board component 3 includes a printed circuit board 31 and a plurality of chips 32 provided on the printed circuit board 31. The plurality of chips 32 are mounted on the printed circuit board 31 by soldering or the like. In order to enable the second cooling module 2 to contact the plurality of chips 32, the portions of the printed circuit board 31 corresponding to the plurality of chips 32 form rectangular notches (openings) 31c, thereby ensuring that the second cooling module 2 of the cooling member can contact the chips 32 from the other side in the thickness direction. The printed circuit board 31 is also formed with mounting through holes 31h corresponding to the mounting holes of the second projecting portion 21p of the second housing 21.
In summary, the present invention provides a new cooling component for printed circuit board components, which is not limited to the examples listed in the above embodiments, but is described in supplementary detail below.
(i) Although the arrangement of the heat radiating fins in an array is described in the above specific embodiment, the present invention is not limited thereto, and for example, the heat radiating fins may be arranged in a stray irregular manner. In addition, the heat sink may be formed integrally with the corresponding case.
(ii) Although not illustrated in the above specific embodiments, it is to be understood that the chip 32 of the printed circuit board assembly 3 according to the present invention may be, but is not limited to, an insulated gate bipolar transistor chip 32.
In addition, although the plurality of chips 32 are arranged in such a manner as to be aligned along the longitudinal direction L in the above embodiment, the present invention is not limited thereto, and the plurality of chips 32 may be arranged in other layout manners.
(iii) Although not illustrated in the above embodiments, it is to be understood that the cooling medium may be a coolant in which water and glycol are mixed.
Claims (10)
1. A cooling component for a printed circuit board component for flowing a cooling medium for cooling a chip (32) of the printed circuit board component (3),
the cooling member includes a first cooling block (1) and a second cooling block (2) assembled to each other, the first cooling block (1) is located on one side in the thickness direction of the chip (32) so as to be in contact with the chip (32) and has a first cooling flow path (1T) formed therein through which the cooling medium flows, the second cooling block (2) is located on the other side in the thickness direction of the printed circuit board member (3) so as to be in contact with the chip (32) and has a second cooling flow path (2T) formed therein, and the second cooling flow path (2T) is arranged in parallel with the first cooling flow path (1T).
2. Cooling element for printed circuit board elements according to claim 1,
the first cooling module (1) includes a plurality of first fins (13) provided in the first cooling flow path (1T); and/or
The second cooling module (2) includes a plurality of second fins (23) provided in the second cooling flow path (2T).
3. A cooling component for printed circuit board components according to claim 1 or 2, characterized in that the second cooling assembly (2) comprises a heat conducting member (24) for contacting the chip (32), the heat conducting member (24) being of a material having a thermal conductivity which is greater than the thermal conductivity of the material of the other parts of the second cooling assembly (2).
4. Cooling element for printed circuit board components according to claim 3, characterized in that the material of at least the part of the first cooling assembly (1) intended for contact with the chip (32) is the same as the material of the heat conducting member (24) of the second cooling assembly (2).
5. A cooling member for a printed circuit board member according to claim 3, wherein the material of said heat conductive member (24) is copper, and the material of said other portion is an aluminum alloy.
6. Cooling part for printed circuit board components according to claim 1 or 2,
the first cooling module (1) is formed with two protrusions (11p) protruding toward the other side in the thickness direction, one of the protrusions (11p) is formed with a first inflow passage (11h1) communicating with the first cooling flow path (1T), and the other protrusion (11p) is formed with a first outflow passage (11h2) communicating with the first cooling flow path (1T); and is
The second cooling module (2) is formed with two recessed portions (21c) that receive the two convex portions (11p), one of the recessed portions (21c) forms a second inflow passage (21h1) that communicates with the second cooling flow path (2T), and the other recessed portion (21c) forms a second outflow passage (21h2) that communicates with the second cooling flow path (2T), so that the second inflow passage (21h1) communicates with the first inflow passage (11h1) and the second outflow passage (21h2) communicates with the first outflow passage (11h 2).
7. The cooling component for printed circuit board components according to claim 6, wherein the first inflow passage (11h1) and the first outflow passage (11h2) are located at both ends in the longitudinal direction (L) of the first cooling flow path (1T), respectively, and the second inflow passage (21h1) and the second outflow passage (21h2) are located at both ends in the longitudinal direction (L) of the second cooling flow path (2T), respectively.
8. The cooling member for printed circuit board member according to claim 6, wherein the outer side wall of the convex portion (11p) is formed with a first step structure, the inner side wall of the concave portion (21c) is formed with a second step structure fitted with the first step structure, and
the cooling part further comprises a sealing ring (4), wherein the sealing ring (4) is arranged between the first step structure of the convex part (11p) and the second step structure of the concave part (21c) so as to seal the connecting part between the convex part (11p) and the concave part (21 c).
9. Cooling part for printed circuit board components according to claim 6,
the first cooling module (1) includes a first housing (11) and a first cover (12) assembled together, the first housing (11) and the first cover (12) surrounding the first cooling flow path (1T), the projection (11p) being formed on the first housing (11); and is
The second cooling module (2) includes a second housing (21) and a second cover (22) assembled together, the second housing (21) and the second cover (22) surround and form the second cooling flow path (2T), and the recess (21c) is formed in the second housing (21).
10. A printed circuit system comprising the cooling component of any one of claims 1 to 9 and a printed circuit board component (3) mounted to the cooling component, the printed circuit board component (3) comprising a printed circuit board (31) and a plurality of chips (32) provided to the printed circuit board (31), portions of the printed circuit board (31) corresponding to the plurality of chips (32) forming notches (31c) so that a first cooling member (1) and a second cooling member (2) of the cooling component can be brought into contact with the chips (32) from both sides in a thickness direction, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010751771.XA CN114068450A (en) | 2020-07-30 | 2020-07-30 | Cooling member for printed circuit board member and printed circuit system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010751771.XA CN114068450A (en) | 2020-07-30 | 2020-07-30 | Cooling member for printed circuit board member and printed circuit system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114068450A true CN114068450A (en) | 2022-02-18 |
Family
ID=80227403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010751771.XA Pending CN114068450A (en) | 2020-07-30 | 2020-07-30 | Cooling member for printed circuit board member and printed circuit system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114068450A (en) |
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2020
- 2020-07-30 CN CN202010751771.XA patent/CN114068450A/en active Pending
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