CN114054881A - 3D probe based on laser welding assembly - Google Patents
3D probe based on laser welding assembly Download PDFInfo
- Publication number
- CN114054881A CN114054881A CN202111338594.3A CN202111338594A CN114054881A CN 114054881 A CN114054881 A CN 114054881A CN 202111338594 A CN202111338594 A CN 202111338594A CN 114054881 A CN114054881 A CN 114054881A
- Authority
- CN
- China
- Prior art keywords
- probe
- laser welding
- tail
- welding
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention relates to a 3D probe assembled based on laser welding, which comprises a probe head, a probe tail, a probe body, a welding plate and a PCB (printed Circuit Board), wherein the probe head, the probe body and the probe tail are sequentially connected, the probe tail is welded and connected with the welding plate, and the welding plate is fixedly connected with the PCB. The probe is welded and fixed on the PCB by adopting the laser welding process, so that the uncertainty of CNC (computer numerical control) processing and manual assembly is reduced, the cost is reduced, the Guide Plate is removed by the laser welding fixing process, and the stability of the elasticity of the probe is improved; the end part of the probe tail is provided with the sawtooth device, so that the contact area is increased, and the contact reliability of the probe is improved; the probe body is of an S-shaped structure, so that the Scrub distance of the probe head is reduced, and the left and right deformation of the probe body is small.
Description
Technical Field
The invention relates to the technical field of 3D probes, in particular to a 3D probe assembled based on laser welding.
Background
Aiming at the SOC wafer test market, most of the same-row Probe Head designs at home and abroad need to utilize a CNC (computerized numerical control) or laser processing method to realize mechanical support for a Probe, and the mechanical support part usually comprises an Upper Guide Plate and a Lower Guide Plate; and (2) carrying out CNC (computer numerical control) machining or laser machining on the related Guide Plate, and then carrying out mechanical assembly on the Probe Head through manual assembly, wherein the machining cost and the manual assembly cost of the Guide Plate are higher, and meanwhile, the Guide Plate has contact abrasion on the Probe, so that the stability of the elastic force of the Probe is influenced.
Disclosure of Invention
The invention aims to provide a 3D probe assembled based on laser welding, which is used for solving the problems that the stability of a probe supported by a machine is relatively poor, the machining cost of the machine support is high, and the manual assembly cost is high in the prior art.
The invention provides a 3D probe assembled based on laser welding, which comprises a probe head, a probe tail, a probe body, a welding plate and a PCB (printed circuit board), wherein the probe head, the probe body and the probe tail are sequentially connected, the probe tail is welded and connected with the welding plate, and the welding plate is fixedly connected with the PCB.
Furthermore, the contact end of the probe tail and the welding plate is arranged to be zigzag.
Furthermore, the probe head, the probe tail and the probe body are integrally formed.
Further, the needle body is of an S-shaped structure.
The invention provides a welding method of a 3D probe assembled based on laser welding, which comprises the following steps:
(1) arranging the probes in an array, and grabbing the probes by a probe manipulator;
(2) after grabbing the probe by the manipulator, wetting the end part of the probe tail with tin;
(3) carrying out laser welding point alignment by mechanical arm XY alignment;
(4) laser welding;
(5) checking the welding quality;
(6) repeatedly grabbing and welding until the whole card is processed;
(7) and (6) checking the whole probe.
The technical scheme of the invention has the beneficial effects that:
the probe is welded and fixed on the PCB by adopting the laser welding process, so that the uncertainty of CNC (computer numerical control) processing and manual assembly is reduced, the cost is reduced, the Guide Plate is removed by the laser welding fixing process, and the stability of the elasticity of the probe is improved; the end part of the probe tail is provided with the sawtooth device, so that the contact area is increased, and the contact reliability of the probe is improved; the probe body is of an S-shaped structure, so that the Scrub distance of the probe head is reduced, and the left and right deformation of the probe body is small.
Drawings
FIG. 1 is a schematic view of a 3D probe assembled based on laser welding according to the present invention;
FIG. 2 is a front view of a 3D probe of the present invention;
FIG. 3 is a flow chart of the 3D probe laser welding process of the present invention;
in the drawings, the components represented by the respective reference numerals are listed below:
1-probe head, 2-probe tail, 3-probe body, 4-welding plate and 5-PCB plate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention.
As shown in fig. 1-2, in one aspect, the invention provides a 3D probe assembled based on laser welding, which includes a probe head 1, a probe tail 2, a probe body 3, a welding plate 4 and a PCB 5, wherein the probe head 1, the probe body 3 and the probe tail 2 are sequentially connected, the probe tail 2 is welded to the welding plate 4, and the welding plate 4 is fixedly connected to the PCB 5.
Preferably, the contact end of the probe tail 2 and the welding plate 4 is arranged to be in a sawtooth shape, the contact area of the probe tail 2 is increased through the sawtooth structure, and the contact connection is firmer.
The probe head 1, the probe tail 2 and the needle body 3 are integrally formed, preferably, the needle body 3 is of an S-shaped structure, the Scrub distance of the probe head 1 is controlled, and the left and right deformation of the needle body 3 is small.
As shown in fig. 3, the welding method of the 3D probe assembled based on laser welding includes the following steps:
(1) arranging the probes in an array, and grabbing the probes by a probe manipulator;
(2) after grabbing the probe by the manipulator, tin is adhered to the end part of the probe tail 2;
(3) carrying out laser welding point alignment by mechanical arm XY alignment;
(4) laser welding;
(5) checking the welding quality;
(6) repeatedly grabbing and welding until the whole card is processed;
(7) and (6) checking the whole probe.
The laser welding technology is used for fixing, so that mechanical support is reduced, labor is liberated, cost is reduced, and stability of the probe is improved.
In conclusion, the probe is welded and fixed on the PCB by adopting the laser welding process, the uncertainty of CNC machining and manual assembly is reduced, the cost is reduced, the Guide Plate is removed by the laser welding fixing process, and the stability of the elastic force of the probe is improved; the end part of the probe tail is provided with the sawtooth device, so that the contact area is increased, and the contact reliability of the probe is improved; the probe body is of an S-shaped structure, so that the Scrub distance of the probe head is reduced, and the left and right deformation of the probe body is small.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (5)
1. The utility model provides a 3D probe based on laser welding equipment, its characterized in that, includes probe head, probe tail, needle body, welded plate and PCB board, probe head, needle body and probe tail connect gradually, probe tail welded connection welded plate, welded plate fixed connection PCB board.
2. The laser welding assembly-based 3D probe of claim 1, wherein the probe tail and the weld plate contacting end are arranged in a zigzag pattern.
3. The laser welding assembly-based 3D probe of claim 1, wherein the probe head, probe tail, and body are integrally formed.
4. The laser welding assembly-based 3D probe of claim 1, wherein the needle body is an S-shaped structure.
5. A welding method of a 3D probe assembled based on laser welding is characterized by comprising the following steps:
(1) arranging the probes in an array, and grabbing the probes by a probe manipulator;
(2) after grabbing the probe by the manipulator, wetting the end part of the probe tail with tin;
(3) carrying out laser welding point alignment by mechanical arm XY alignment;
(4) laser welding;
(5) checking the welding quality;
(6) repeatedly grabbing and welding until the whole card is processed;
(7) and (6) checking the whole probe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111338594.3A CN114054881A (en) | 2021-11-12 | 2021-11-12 | 3D probe based on laser welding assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111338594.3A CN114054881A (en) | 2021-11-12 | 2021-11-12 | 3D probe based on laser welding assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114054881A true CN114054881A (en) | 2022-02-18 |
Family
ID=80275352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111338594.3A Withdrawn CN114054881A (en) | 2021-11-12 | 2021-11-12 | 3D probe based on laser welding assembly |
Country Status (1)
Country | Link |
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CN (1) | CN114054881A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116338266A (en) * | 2023-05-23 | 2023-06-27 | 上海泽丰半导体科技有限公司 | Segmented probe, probe card and welding method |
-
2021
- 2021-11-12 CN CN202111338594.3A patent/CN114054881A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116338266A (en) * | 2023-05-23 | 2023-06-27 | 上海泽丰半导体科技有限公司 | Segmented probe, probe card and welding method |
CN116338266B (en) * | 2023-05-23 | 2023-08-25 | 上海泽丰半导体科技有限公司 | Segmented probe, probe card and welding method |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220218 |
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WW01 | Invention patent application withdrawn after publication |