CN114054599A - Assembling method of bipolar plate stamping die - Google Patents
Assembling method of bipolar plate stamping die Download PDFInfo
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- CN114054599A CN114054599A CN202111430846.5A CN202111430846A CN114054599A CN 114054599 A CN114054599 A CN 114054599A CN 202111430846 A CN202111430846 A CN 202111430846A CN 114054599 A CN114054599 A CN 114054599A
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000009434 installation Methods 0.000 claims description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- 238000007723 die pressing method Methods 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims 4
- 238000000465 moulding Methods 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 6
- 239000000446 fuel Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000007770 graphite material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/02—Stamping using rigid devices or tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
- B21D37/12—Particular guiding equipment, e.g. pliers; Special arrangements for interconnection or cooperation of dies
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
Abstract
The invention provides an assembling method of a bipolar plate stamping die, which comprises the steps of S1, installing an inner guide post, an outer guide post and a lower die base plate on a lower die fixing plate to form a first assembling part; s2, mounting the lower die core frame and the lower die core assembly on a lower die base plate in the first assembly; s3, mounting the upper mold core frame on the lower mold core frame; s4, mounting the upper mold core in the upper mold core frame to form a third assembly part; s5, positioning the mounting position of the upper die base plate on the third assembly through a positioning pin, and respectively connecting the upper die base plate with the upper die core and the upper die core frame through fastening screws; s6, positioning the mounting position of the upper die base on the upper die base plate through a positioning pin, and connecting the upper die base and the upper die base plate together through a fastening screw; s7, mounting the outer guide sleeve on the upper die holder; s8, installing the upper die blank holder and the lower die blank holder, effectively overcoming the generation of accumulated errors, and ensuring the matching precision of the upper die core profile and the lower die core profile, thereby improving the molding quality.
Description
Technical Field
The invention belongs to the technical field of die assembly, and particularly relates to an assembly method of a bipolar plate stamping die.
Background
The bipolar plate is one of the core components of the proton exchange membrane fuel cell and has good gas barrier property, electrical conductivity and thermal conductivity; the bipolar plate mainly comprises a metal bipolar plate (made of a metal material), a graphite bipolar plate (made of a graphite material) and a composite bipolar plate (made of a metal-graphite composite material); the metal bipolar plate is easy to process and suitable for mass production, and the forming process of the metal bipolar plate mainly comprises various processing processes such as punch forming, casting forming, electrochemical etching, micro electric spark milling and the like. The precision punch forming has the advantages of high production efficiency, low cost, high forming precision and the like, and becomes a main manufacturing process of the metal bipolar plate. However, as the power density of fuel cells is gradually increased, the product flow channel is developed to a more compact place; therefore, the formability and consistency of the flow channel (i.e. the formed groove), the distortion and resilience of the parts, etc. become the difficulty and challenge of the stamping forming of the metal bipolar plate; if the quality of the metal bipolar plate can not meet the requirement, the performance and the service life of the fuel cell are seriously influenced.
The forming quality of the bipolar plate is mainly influenced by the stamping die of the bipolar plate, particularly the assembling precision of the stamping die of the bipolar plate; the assembly mode of the bipolar plate stamping die at present is as follows: the upper die with the upper die pressing edge ring and the lower die with the lower die pressing edge ring are respectively and independently assembled, and then the die assembly is completed by matching the outer guide pillar with the outer guide sleeve, so that the installation of the stamping die is easily caused by accumulated errors, the upper die and the lower die cannot be smoothly assembled, reworking and reassembly are required, and even if the upper die and the lower die can be smoothly assembled, the matching precision of the upper die core profile and the lower die core profile is not high, and the forming quality of the bipolar plate is influenced.
Disclosure of Invention
In view of the above disadvantages of the prior art, an object of the present invention is to provide a novel assembling method for a bipolar plate stamping die, which first assembles a lower die and then completes the assembly of an upper die from bottom to top by using a lower die core frame on the lower die as a reference; then, splitting the die, and installing an upper die blank holder and a lower die blank holder to complete the assembly of the stamping die; because the upper die assembly is carried out by taking the lower die core frame as a reference, the smooth die assembly is ensured, the generation of accumulated errors is effectively reduced, and the matching precision of the upper die core profile and the lower die core profile is ensured, thereby improving the forming quality.
In order to achieve the above objects and other related objects, the present invention provides an assembly method of a bipolar plate stamping die, the bipolar plate stamping die comprises a lower die and an upper die which are matched with each other, the lower die comprises a lower die base, a lower die fixing plate, a lower die base plate, a lower die core frame, a lower die core assembly, an inner guide post and an outer guide post; the lower mold core assembly comprises a lower mold core; the upper die comprises an upper die core, an upper die core frame, an upper die base plate, an outer guide sleeve and an upper die base; the assembling method of the bipolar plate stamping die comprises the following steps:
s1, mounting the inner guide post, the outer guide post and the lower die base plate on the lower die fixing plate to form a first assembly;
s2, mounting the lower die core frame and the lower die core assembly on a lower die base plate in the first assembly to meet the mounting precision requirement;
s3, positioning the mounting position of the upper die core frame on the lower die core frame through a positioning pin, and mounting the upper die core frame on the lower die core frame;
s4, mounting the upper mold core in the upper mold core frame to form a third assembly part, wherein the mounting clearance between the upper mold core and the upper mold core frame is not more than 0.015 mm;
s5, positioning the mounting position of the upper die base plate on the third assembly through a positioning pin, and respectively connecting the upper die base plate with the upper die core and the upper die core frame through fastening screws;
s6, positioning the mounting position of the upper die base on the upper die base plate through a positioning pin, and connecting the upper die base and the upper die base plate together through a fastening screw;
s7, mounting the outer guide sleeve on the upper die holder, wherein the mounting gap between the outer guide sleeve and the corresponding outer guide pillar is required to be not more than 0.003 mm;
and S8, separating the upper mold core from the lower mold core, and then installing the upper mold pressing edge ring and the lower mold pressing edge ring to meet the requirement of installation accuracy.
Preferably, in S2, the lower core assembly is first assembled into the lower core frame to form a second assembly; the mounting clearance between a lower mold core in the lower mold core assembly and a lower mold core frame is required to be not more than 0.015 mm; then, the second assembly is placed on the first assembly, the positioning pin is used for positioning the placement position of the second assembly, and the lower die core frame in the second assembly is connected with the lower die base plate in the first assembly through the fastening screw, so that the installation difficulty is reduced.
Preferably, in S8, when the upper mold blank holder is installed, the upper mold blank holder is firstly sleeved on the upper mold core frame, so that the installation gap between the upper mold blank holder and the upper mold core frame is not greater than 0.015mm, and then the upper mold blank holder and the upper mold base are connected together by fastening screws; when the lower die blank holder is installed, the installation is completed by matching the inner guide sleeve on the lower die blank holder with the corresponding inner guide pillar on the lower die fixing plate, the matching gap between the inner guide sleeve and the corresponding inner guide pillar is not more than 0.003mm, and the matching precision of the upper die blank holder and the lower die blank holder is ensured to meet the requirement.
Preferably, before the step S1, the installation position of the lower die fixing plate on the lower die base needs to be located by the positioning pin, so as to complete the installation of the lower die fixing plate; and then the installation of each lower die nitrogen cylinder is completed.
As described above, the assembling method of the bipolar plate stamping die of the present invention has the following beneficial effects:
the lower die is assembled firstly, and then the upper die is assembled from bottom to top by taking the lower die core frame on the lower die as a reference, so that the smooth die assembly of the upper die and the lower die is ensured, the generation of accumulated errors is reduced, the matching precision of the upper die core and the lower die core is ensured, and the product forming quality is improved; in addition, the upper die blank holder and the lower die blank holder are installed after die assembly, the matching precision of the upper die blank holder and the lower die blank holder is effectively guaranteed, and the product forming quality is further improved.
Drawings
Fig. 1 is a perspective view of a bipolar plate stamping die.
Figure 2 is an exploded view of a bipolar plate stamping die.
Fig. 3 is a front sectional view of a bipolar plate stamping die.
Description of the reference numerals
The die comprises a lower die 1, a lower die seat 11, a lower die fixing plate 12, a lower die backing plate 13, a lower die core frame 14, a lower die core assembly 15, a lower die core 151, a lower die core supporting plate 152, an inner guide pillar 16, an outer guide pillar 17, an upper die 2, an upper die core 21, an upper die core frame 22, an upper die backing plate 23, an upper die seat 24, an outer guide sleeve 25, an upper die blank holder 31, a lower die blank holder 32, an inner guide sleeve 321, a lower die nitrogen cylinder 4 and a positioning pin 5.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
Please refer to fig. 1 to 3. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.
As shown in fig. 1, the assembling method of the bipolar plate stamping die of the present invention relates to a bipolar plate stamping die, which comprises a lower die, an upper die and a blank holder.
Specifically, as shown in fig. 1, the lower die 1 includes a lower die base 11, a lower die fixing plate 12, a lower die backing plate 13 and a lower die core frame 14 arranged from bottom to top; a lower die core assembly 15 is movably arranged in the lower die core frame 14; the lower mold core assembly 15 comprises a lower mold core 151 and a lower mold core supporting plate 152 which are connected through fastening screws, and the lower mold core 151 and the lower mold core supporting plate 152 are connected through the fastening screws; an inner guide post 16 and an outer guide post 17 are arranged on the lower die fixing plate 12; the upper die 2 comprises an upper die core frame 22, an upper die backing plate 23 and an upper die base 24 which are arranged from bottom to top; an upper die core 21 is arranged in the upper die core frame 22, and an outer sleeve 25 matched with the outer guide pillar 17 is arranged on the upper die base 24; the blank holder comprises an upper die blank holder 31 and a lower die blank holder 32, and an inner guide sleeve 321 matched with the inner guide pillar 16 is arranged on the lower die blank holder 32.
Due to the arrangement of the lower mold core supporting plate 152, the risk of stress deformation of the lower mold core 151 is reduced, the service life of the lower mold core 151 is prolonged, and the purpose of reducing the replacement cost is achieved.
Because the current bipolar plate stamping die has the following assembly modes: firstly, respectively and independently assembling a lower die 1 with a lower die pressing edge ring 32 and an upper die 2 with an upper die pressing edge ring 31, and then utilizing an outer guide pillar 17 and an outer guide sleeve 25 to realize the die assembly of the upper die 2 and the lower die 1 so as to complete the assembly of a stamping die; however, this mounting method is prone to generate an accumulated error, so that the upper mold 2 and the lower mold 1 cannot be smoothly clamped, and even if the upper mold and the lower mold are smoothly clamped, the fitting accuracy between the upper mold core 21 and the lower mold core 151 is reduced due to the accumulated error.
Based on the above, the invention provides a novel bipolar plate stamping die assembly method, which comprises the following steps:
s1, mounting the inner guide post 16, the outer guide post 17 and the lower die backing plate 13 on the lower die fixing plate 12 to form a first assembly;
s2, mounting the lower die core frame 14 and the lower die core assembly 15 on the lower die backing plate 13 in the first assembly to meet the mounting accuracy requirement;
s3, positioning the mounting position of the upper mold core frame 22 on the lower mold core frame 14 by the positioning pin 5, so that the upper mold core frame 22 is mounted on the lower mold core frame 14;
s4, mounting the upper mold core 21 in the upper mold core frame 22 to form a third assembly, wherein the mounting gap between the upper mold core 21 and the upper mold core frame 22 is not more than 0.015 mm;
s5, positioning the mounting position of the upper die backing plate 23 on the third assembly through the positioning pin 5, and respectively connecting the upper die backing plate 23 with the upper die core 21 and the upper die core frame 22 through fastening screws;
s6, positioning the mounting position of the upper die holder 24 on the upper die backing plate 23 through the positioning pin 5, and connecting the upper die holder 24 and the upper die backing plate 23 together through a fastening screw;
s7, mounting the outer guide sleeve 25 on the upper die holder 24, wherein the mounting clearance between the outer guide sleeve 25 and the corresponding outer guide pillar 17 is required to be not more than 0.003 mm;
and S8, separating the upper die core 21 from the lower die core 151, and then installing the upper die pressing edge ring 31 and the lower die pressing edge ring 32 to meet the requirement of installation accuracy.
It can be appreciated that in S2, the lower core frame 14 and the lower core assembly 15 have two mounting manners:
the first installation mode: firstly, connecting a lower mold core 151 and a lower mold core supporting plate 152 together through fastening screws to form a lower mold core assembly 15, and then loading the lower mold core assembly 15 into a lower mold core frame 14 to form a second assembly part; the installation clearance between the lower mold core 151 in the lower mold core assembly 15 and the lower mold core frame 14 is required to be not more than 0.015 mm; finally, the second assembly is placed on the first assembly, the positioning pin 5 is used for positioning the placement position of the second assembly, and the lower die core frame 14 in the second assembly and the lower die base plate 13 in the first assembly are connected together through fastening screws.
The second installation mode is as follows: firstly, positioning the mounting position of a lower die core frame 14 on a lower die backing plate 13 through a positioning pin 5, and connecting the lower die core frame 14 with the lower die backing plate 13 in a first assembly through a fastening screw; and then, connecting the lower die core 151 and the lower die core supporting plate 152 together through fastening screws to form a lower die core assembly 15, and finally, installing the lower die core assembly 15 into the lower die core frame 14, wherein the installation gap between the lower die core 151 in the lower die core assembly 15 and the lower die core frame 14 is required to be not more than 0.015mm, so that the installation accuracy between the parts is ensured.
Further, in S8, when the upper mold blankholder 31 is installed, the upper mold blankholder 31 needs to be sleeved on the upper mold core frame 22, so that the installation gap between the upper mold blankholder 31 and the upper mold core frame 22 is not greater than 0.015mm, and then the upper mold blankholder 31 and the upper mold base 24 are connected together through fastening screws; when the lower die blank holder 32 is installed, the inner guide sleeve 321 on the lower die blank holder 32 is matched with the corresponding inner guide post 16 on the lower die fixing plate 12 to complete installation, and the matching gap between the inner guide sleeve 321 and the corresponding inner guide post 16 is not more than 0.003 mm.
It can be understood that the lower die nitrogen cylinder 4 has two mounting modes:
the first installation mode: before the step S1, the mounting position of the lower die fixing plate 12 on the lower die holder 11 needs to be positioned by the positioning pin 5, so as to complete the mounting of the lower die fixing plate 12; then, the lower die nitrogen cylinders 4 sequentially penetrate through the lower die fixing plate 12 to be installed on the lower die base 11 (the installation groove of the nitrogen cylinder on the lower die base 11 is a blind groove which is not communicated with the bottom of the lower die base).
The second installation mode is as follows: after the step S8 is completed, the mounting position of the lower die fixing plate 12 on the lower die holder 11 needs to be positioned by the positioning pin 5, and the assembly of the lower die 1 is completed; then, each lower die nitrogen cylinder 4 is installed in a nitrogen cylinder installation groove (namely a through groove communicated with the bottom of the lower die base) of the lower die base 11 from the bottom of the lower die base 11, and the lower die nitrogen cylinder 4 in the nitrogen cylinder installation groove is supported through the bottom sealing of a nitrogen cylinder support base.
Because the traditional mode of matching and closing the outer guide post and the outer guide sleeve is changed into the mode of matching and closing the upper die core frame and the lower die core frame, the invention avoids overlarge accumulated error caused by insufficient installation precision among all parts, effectively ensures the matching precision of the upper die core and the lower die core, improves the product molding quality,
the foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (4)
1. The assembling method of the bipolar plate stamping die comprises a lower die (1) and an upper die (2) which are matched with each other, wherein the lower die (1) comprises a lower die seat (11), a lower die fixing plate (12), a lower die base plate (13), a lower die core frame (14), a lower die core assembly (15), an inner guide post (16) and an outer guide post (17); the lower die core assembly (15) comprises a lower die core (151); the upper die (2) comprises an upper die core (21), an upper die core frame (22), an upper die base plate (23), an upper die seat (24) and an outer guide sleeve (25); the assembling method of the bipolar plate stamping die is characterized by comprising the following steps of:
s1, mounting the inner guide post (16), the outer guide post (17) and the lower die backing plate (13) on the lower die fixing plate (12) to form a first assembly;
s2, mounting the lower die core frame and the lower die core assembly on a lower die base plate in the first assembly to meet the mounting precision requirement;
s3, positioning the mounting position of the upper die core frame (22) on the lower die core frame (14) through the positioning pin (5), and mounting the upper die core frame (22) on the lower die core frame (14);
s4, mounting the upper die core (21) in the upper die core frame (22) to form a third assembly part, wherein the mounting clearance between the upper die core (21) and the upper die core frame (22) is not more than 0.015 mm;
s5, positioning the mounting position of the upper die base plate (23) on the third assembly through the positioning pin (5), and respectively connecting the upper die base plate (23) with the upper die core (21) and the upper die core frame (22) through fastening screws;
s6, positioning the mounting position of the upper die holder (24) on the upper die backing plate (23) through the positioning pin (5), and connecting the upper die holder (25) and the upper die backing plate (23) together through a fastening screw;
s7, mounting the outer guide sleeve (25) on the upper die holder (24), wherein the mounting clearance between the outer guide sleeve (25) and the corresponding outer guide pillar (17) is required to be not more than 0.003 mm;
s8, separating the upper die core (21) from the lower die core (151), and then installing the upper die pressing edge ring (31) and the lower die pressing edge ring (32) to meet the requirement of installation accuracy.
2. The assembling method of a bipolar plate stamping die according to claim 1, wherein in S2, the lower die core assembly (15) is installed into the lower die core frame (14) to form a second assembly; the installation clearance between a lower die core (151) in a lower die core assembly (15) and a lower die core frame (14) is required to be not more than 0.015 mm; then, the second assembly is placed on the first assembly, the placing position of the second assembly is positioned by using the positioning pin (5), and a lower die core frame (14) in the second assembly and a lower die base plate (13) in the first assembly are connected together by fastening screws.
3. The assembling method of a bipolar plate stamping die according to claim 1 or 2, wherein in S8, when the upper mold binder (31) is installed, the upper mold binder (31) is firstly sleeved on the upper mold core frame (22) to make the installation gap between the upper mold binder (31) and the upper mold core frame (22) not greater than 0.015mm, and then the upper mold binder (31) and the upper mold base (24) are connected together by fastening screws; when the lower die blank holder (32) is installed, the installation is completed by matching an inner guide sleeve (321) on the lower die blank holder (32) with a corresponding inner guide pillar (16) on the lower die fixing plate (12), and the matching gap between the inner guide sleeve (321) and the corresponding inner guide pillar (16) is not more than 0.003 mm.
4. The assembling method of a bipolar plate stamping die according to claim 1, wherein, before performing the step S1, the mounting position of the lower die fixing plate (12) on the lower die base (11) needs to be positioned by the positioning pin (5) to complete the mounting of the lower die fixing plate (12); then the installation of each lower die nitrogen cylinder (4) is completed.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111430846.5A CN114054599B (en) | 2021-11-29 | 2021-11-29 | Assembling method of bipolar plate stamping die |
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| CN202111430846.5A CN114054599B (en) | 2021-11-29 | 2021-11-29 | Assembling method of bipolar plate stamping die |
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| CN114054599A true CN114054599A (en) | 2022-02-18 |
| CN114054599B CN114054599B (en) | 2023-12-19 |
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| CN114054599B (en) | 2023-12-19 |
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