CN114050389B - High-power ferrite load - Google Patents
High-power ferrite load Download PDFInfo
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- CN114050389B CN114050389B CN202111456376.XA CN202111456376A CN114050389B CN 114050389 B CN114050389 B CN 114050389B CN 202111456376 A CN202111456376 A CN 202111456376A CN 114050389 B CN114050389 B CN 114050389B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/24—Terminating devices
- H01P1/26—Dissipative terminations
- H01P1/264—Waveguide terminations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Reversible Transmitting Devices (AREA)
Abstract
The invention relates to the technical field of microwave power sources, in particular to a high-power ferrite load; the high-power waveguide ferrite load comprises a matching section, wherein a first waveguide straight section is arranged on one side of the matching section, a second waveguide straight section is arranged on one side of the first waveguide straight section, which is far away from the matching section, a waveguide wedge-shaped section is arranged on one side of the second waveguide straight section, which is far away from the first waveguide straight section, the waveguide high-power waveguide ferrite load mainly absorbs power through an internal ferrite substrate, the ferrite substrate is uniformly distributed in a load waveguide, waveguides at a load terminal are shorted together, the ferrite is bonded on a water-cooling plate, absorbed heat is taken away through water flowing in the water-cooling plate, and the ferrite load with the magnitude of hundreds of kilowatts can be designed by using the method.
Description
Technical Field
The invention relates to the technical field of microwave power sources, in particular to a high-power ferrite load.
Background
The high-power matching load is mainly used for absorbing microwave energy, and devices such as a circulator, a magic T and the like need the high-power absorbing load to absorb reflected power from a transmission system and an accelerator, so that the microwave source is protected. The ferrite load adopts ferrite as a wave-absorbing material, the ferrite wave-absorbing material is manufactured according to the principle that the ferrite generates larger electromagnetic loss under the action of a high-frequency electromagnetic field, and in order to meet the purpose of non-reflective absorption, the absorption material is required to have larger electromagnetic loss within the range of a use frequency band and to realize impedance matching in electromagnetic wave transmission. For waveguide type ferrite load, the ferrite substrate close to the input end can absorb most of the power of the system, and the heating rate is faster than that of the ferrite substrate at the rear end. And the ferrite has small heat conductivity coefficient, and the problems of ferrite outgassing, cracking and the like are easily caused by thermal deposition after high-frequency power is absorbed. Currently, ferrite loads of several kilowatts and small power are being developed. The invention avoids the problem that heat is mainly deposited on the ferrite substrate at the input end by the modes of sectional design, optimization of power distribution of each section, progressive increase of the thickness of the ferrite substrate and the like, reduces the thermal deposition of the front-end ferrite, and can design the ferrite load of hundreds of kilowatts by utilizing the method.
Disclosure of Invention
The invention aims to overcome the defects that the ferrite in the prior art has small heat conductivity coefficient, and the ferrite is easy to outgas and crack due to thermal deposition after absorbing high-frequency power, and provides a high-power ferrite load. The high-power ferrite load has the characteristics of reducing the cracking problem caused by thermal deposition of the front-end ferrite, improving the load stability and the like.
In order to achieve the purpose, the invention provides the following technical scheme: a high-power ferrite load comprises a matching section, wherein a first waveguide straight section is arranged on one side of the matching section, a second waveguide straight section is arranged on one side of the first waveguide straight section, which is far away from the matching section, a waveguide wedge-shaped section is arranged on one side of the second waveguide straight section, which is far away from the first waveguide straight section, a plurality of ferrite substrates are arranged in the first waveguide straight section, the second waveguide straight section and the waveguide wedge-shaped section, gaps exist between adjacent ferrite substrates, the thickness of the ferrite substrate in the second waveguide straight section is larger than that of the ferrite substrate in the first waveguide straight section, the thickness of the ferrite substrate in the waveguide wedge-shaped section is larger than that of the ferrite substrate in the second waveguide straight section, the matching section, the first waveguide straight section, the second waveguide straight section and the waveguide wedge-shaped section are fixed on a water cooling plate, a plurality of matching blocks are arranged in the matching section, and the matching section, the first waveguide straight section, the second waveguide straight section and the waveguide wedge-shaped section are fixed on the water cooling plate through bonding glue.
Preferably, the ferrite substrates are uniformly distributed in the waveguide straight section I, the waveguide straight section II and the waveguide wedge section, and the gap between the adjacent ferrite substrates is 1 mm.
Preferably, the length of the side of the waveguide wedge-shaped section close to the two sides of the waveguide straight section is larger than that of the other side of the waveguide wedge-shaped section.
Preferably, the water cooling plate is of a stainless steel-copper-stainless steel three-layer structure.
Preferably, the matching section, the first waveguide straight section, the second waveguide straight section and the wedge waveguide section are fixed on the water cooling plate through adhesive glue.
Compared with the prior art, the invention has the beneficial effects that:
(1) The ferrite load mainly comprises a matching section, a waveguide straight section and a waveguide wedge-shaped section, the ferrite substrates are uniformly distributed in the load waveguide, the distance between each block and each block is 1mm, the waveguides at the load terminal are in short circuit, and extrusion fragmentation caused by thermal stress concentration can be effectively prevented.
(2) The thin ferrite sheet is paved in front when the ferrite sheet is arranged from the load inlet to the terminal, and the thickness of the ferrite sheet is gradually increased from the inlet to the terminal, so that the power density difference absorbed by the ferrite sheet is reduced, the thermal deposition of the ferrite at the front end is reduced, and meanwhile, the attenuation of the ferrite sheet near the load terminal is also increased;
(3) The ferrite sheet is adhered to the stainless steel water cooling plate through the heat-conducting adhesive glue by adopting an adhesive process, the water cooling plate is of a stainless steel-copper-stainless steel three-layer structure, the heat dissipation performance can be effectively improved, and the using effect is good.
Drawings
FIG. 1 is a schematic diagram of a loaded microwave configuration according to the present invention;
FIG. 2 is a formula of relationship between temperature Δ T of the ferrite substrate and its area S, thickness d, absorption power P and thermal conductivity k;
FIG. 3 is a graph of peak temperature for ferrite pieces of different thicknesses according to the present invention;
FIG. 4 is a table of the resulting power attenuation for ferrite pieces of different thicknesses in accordance with the present invention;
FIG. 5 is a power distribution diagram of the present invention;
figure 6 is a plot of standing wave ratio (VSWR) versus frequency band for a load of the present invention over the entire bandwidth of a waveguide.
Reference numbers in the figures: 1. a matching section; 2. a first waveguide straight section; 3. a waveguide straight section II; 4. a waveguide wedge segment; 5. A ferrite substrate; 6. a water-cooling plate; 7. and matching the blocks.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows: referring to fig. 1-6, the present invention provides a technical solution: a high-power ferrite load comprises a matching section 1, wherein a plurality of matching blocks 7 are arranged in the matching section 1, a first waveguide straight section 2 is arranged on one side of the matching section 1, a second waveguide straight section 3 is arranged on one side, far away from the matching section 1, of the first waveguide straight section 2, a waveguide wedge-shaped section 4 is arranged on one side, far away from the first waveguide straight section 2, of the second waveguide straight section 3, the side, close to the second waveguide straight section 3, of the waveguide wedge-shaped section 4 is larger than the side, on the other side, of the waveguide wedge-shaped section 4, a plurality of ferrite substrates 5 are arranged in the first waveguide straight section 2, the second waveguide straight section 3 and the waveguide wedge-shaped section 4, the size of each ferrite substrate 5 is 15mm multiplied by 15mm multiplied by 1mm, the highest temperature and power attenuation data of the ferrite substrates 5 are obtained, the ferrite substrates 5 are uniformly distributed in the first waveguide straight section 2, the second waveguide straight section 3 and the waveguide wedge-shaped section 4, gaps between adjacent ferrite substrates 5 are separated by 1mm, extrusion and fragmentation caused by thermal stress concentration can be effectively prevented, the matching section 1, the first waveguide straight section 3, the waveguide straight section 1, the waveguide straight section and the waveguide wedge-shaped section are all adhered to a water-cooled stainless steel plate are adhered to realize a three-layer heat dissipation structure, and a water-cooled stainless steel heat dissipation plate.
Example two: referring to fig. 1-6, the present invention provides a technical solution: a high-power ferrite load comprises a matching section 1, wherein a plurality of matching blocks 7 are arranged in the matching section 1, a first waveguide straight section 2 is arranged on one side of the matching section 1, a second waveguide straight section 3 is arranged on one side, far away from the matching section 1, of the first waveguide straight section 2, a waveguide wedge-shaped section 4 is arranged on one side, far away from the first waveguide straight section 2, of the second waveguide straight section 3, the side, close to the second waveguide straight section 3, of the waveguide wedge-shaped section 4 is larger than the side, on the other side, of the waveguide wedge-shaped section 4, a plurality of ferrite substrates 5 are arranged in the first waveguide straight section 2, the second waveguide straight section 3 and the waveguide wedge-shaped section 4, the size of each ferrite substrate 5 is 15mm multiplied by 15mm multiplied by 1.3mm, the highest temperature and power attenuation data of the ferrite substrates 5 are obtained, the ferrite substrates 5 are uniformly distributed in the first waveguide straight section 2, the second waveguide straight section 3 and the waveguide wedge-shaped section 4, the gap distance between adjacent ferrite substrates 5 is 1mm, extrusion fracture caused by heat concentration can be effectively prevented, the matching section 1, the first waveguide straight section, the waveguide straight section 4 and the waveguide wedge-shaped section are all fixed on a water-cooled stainless steel plate are bonded, and a water-cooled stainless steel heat dissipation structure is reduced, and a three-layer stainless steel heat dissipation structure is realized.
Example three: referring to fig. 1-6, the present invention provides a technical solution: a high-power ferrite load comprises a matching section 1, wherein a plurality of matching blocks 7 are arranged in the matching section 1, a first waveguide straight section 2 is arranged on one side of the matching section 1, a second waveguide straight section 3 is arranged on one side, far away from the matching section 1, of the first waveguide straight section 2, a waveguide wedge-shaped section 4 is arranged on one side, far away from the first waveguide straight section 2, of the second waveguide straight section 3, the side, close to the second waveguide straight section 3, of the waveguide wedge-shaped section 4 is larger than the side, on the other side, of the waveguide wedge-shaped section 4, a plurality of ferrite substrates 5 are arranged in the first waveguide straight section 2, the second waveguide straight section 3 and the waveguide wedge-shaped section 4, the size of each ferrite substrate 5 is 15mm multiplied by 15mm multiplied by 1.6mm, the highest temperature and power attenuation data of the ferrite substrates 5 are obtained, the ferrite substrates 5 are uniformly distributed in the first waveguide straight section 2, the second waveguide straight section 3 and the waveguide wedge-shaped section 4, the gap distance between adjacent ferrite substrates 5 is 1mm, extrusion fracture caused by heat concentration can be effectively prevented, the matching section 1, the first waveguide straight section, the waveguide straight section 4 and the waveguide wedge-shaped section are all fixed on a water-cooled stainless steel plate are bonded, and a water-cooled stainless steel heat dissipation structure is reduced, and a three-layer stainless steel heat dissipation structure is realized.
From the results of the above high-frequency and thermal simulations, it can be seen that the thinner the ferrite substrate 5 in the waveguide is, the better the heat conduction effect is, the lower the power absorbed by the ferrite substrate 5 in a unit area is, considering the directionality of the load power flow of the waveguide-type ferrite substrate 5, the more the power absorbed at the waveguide inlet of the ferrite substrate 5 with the same thickness is, the higher the heat flux density is, in order to avoid the problem that heat is mainly deposited on the ferrite substrate 5 at the input end, the thermal deposition of the ferrite substrate 5 at the front end is reduced, therefore, when the ferrite substrate 5 is laid out, the thin ferrite substrate 5 is laid in front, the thickness of the ferrite substrate 5 is gradually increased from the inlet to the terminal, so that the difference of the power density absorbed by the ferrite substrate 5 is reduced, thereby reducing the thermal deposition of the ferrite substrate 5 at the front end, and simultaneously increasing the attenuation of the ferrite substrate 5 near the load terminal.
The working principle is as follows: taking the load design of a waveguide type high-power ferrite substrate 5 with the peak frequency power of 3MW in the P wave band and the average power of 150kW as an example, because the tail electric field of the waveguide wedge-shaped section 4 is relatively concentrated and ignition is easy to occur, the power distribution relation shown in figure 4 is made, the attenuation of a waveguide straight section I2 is 4.7dB, and the absorbed average power is 100kW; the attenuation of the second waveguide straight section 3 is 6.2dB, and the absorbed average power is 38kW; attenuation of the waveguide wedge-shaped section 4 is 9dB, absorbed average power is 18kW, maximum electric field strength is 2.46e +05V/m when peak power is 3MW calculated through CST simulation, the maximum electric field strength is 1 order of magnitude lower than air breakdown electric field strength 3e6V/m, ignition probability is small, from a load inlet to a terminal along with thickness reduction, a thin ferrite substrate 5 is laid in front during layout, the thickness of the ferrite substrate 5 is gradually increased from the inlet to the terminal, so that the power density difference absorbed by the ferrite substrate 5 is reduced, thermal deposition of the ferrite substrate 5 at the front end is reduced, meanwhile, attenuation of the ferrite substrate 5 near the load terminal is also increased, in order to reduce processing complexity and processing cost of the ferrite substrate 5, the types of the waveguide ferrite substrate 5 are divided into three types, thicknesses of the ferrite substrate 5 of the waveguide straight section I2 and the waveguide straight section II 3 are respectively 1mm,1.3mm, the thickness d of the ferrite substrate 5 of the waveguide wedge-shaped section 5 is 1.6mm, properties of three ferrite substrates 5 maintain the same, dielectric constant of the ferrite substrate CST 12, the magnetic temperature of the waveguide straight section II 2, the waveguide straight section is 16.3 ℃, the waveguide straight section is used for calculating, the long-acting waveguide straight section temperature is 3.63 ℃ and the waveguide is 3.3 ℃ under the long-acting temperature, the long-acting waveguide straight section is 3 ℃ and the long-acting temperature is equal to be 3.63 ℃ after the waveguide temperature is calculated;
the matching section 1 is not added, the design is carried out according to the method, the standing wave ratio (VSWR) of the load in the whole bandwidth of the waveguide is less than 1.1, the frequency range is 490 MHz-750 MH, the extremely wide use bandwidth is provided, the VSWR is less than 1.01 when the frequency is 549MHz, and if other frequency points need lower VSWR, the matching section 1 of the load is only required to be connected with the load for matching adjustment;
by the method, the designed ferrite load has the advantages of large power capacity, wide bandwidth and good standing wave performance, the difference of power density absorbed by the ferrite substrate 5 is reduced by means of sectional design, gradual increase of the thickness of the ferrite substrate 5 and the like, the problem that heat is mainly deposited on the ferrite substrate 5 at the input end is avoided to a certain extent, the cracking problem of the front-end ferrite sheet caused by thermal deposition is reduced, the system stability is improved, and meanwhile, the power capacity of the load is increased.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A high power ferrite load comprising a matching section (1), characterized in that: the waveguide straight section I (2) is arranged on one side of the matching section (1), the waveguide straight section I (2) is far away from one side of the matching section (1) and is provided with the waveguide straight section II (3), the waveguide straight section II (3) is far away from one side of the waveguide straight section I (2) and is provided with the waveguide wedge-shaped section (4), a plurality of ferrite substrates (5) are arranged in the waveguide straight section I (2), the waveguide straight section II (3) and the waveguide wedge-shaped section (4), gaps exist among the ferrite substrates (5), the thickness of the ferrite substrate (5) in the waveguide straight section II (3) is larger than that of the ferrite substrate (5) in the waveguide straight section I (2), the thickness of the ferrite substrate (5) in the waveguide wedge-shaped section (4) is larger than that of the ferrite substrate (5) in the waveguide straight section II (3), the matching section I (1), the waveguide straight section I (2), the waveguide straight section II (3) and the waveguide wedge-shaped section (4) are fixed on the water cooling plate (6), and the matching section I (1), the waveguide straight section I (7) and the waveguide wedge-shaped section (3) are bonded through the waveguide wedge-shaped glue plate (6).
2. A high power ferrite load according to claim 1, characterized in that: the ferrite substrates (5) are uniformly distributed in the waveguide straight section I (2), the waveguide straight section II (3) and the waveguide wedge-shaped section (4), and the gap between every two adjacent ferrite substrates (5) is 1 mm.
3. A high power ferrite load according to claim 1, characterised in that: the side length of one side of the waveguide wedge-shaped section (4) close to the waveguide straight section II (3) is larger than that of the other side of the waveguide wedge-shaped section (4).
4. A high power ferrite load according to claim 1, characterized in that: the water cooling plate (6) is of a three-layer structure of stainless steel-copper-stainless steel.
5. A high power ferrite load according to claim 1, characterised in that: the matching section (1), the waveguide straight section I (2), the waveguide straight section II (3) and the waveguide wedge-shaped section (4) are fixed on the water cooling plate (6) in a welding mode.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111456376.XA CN114050389B (en) | 2021-12-01 | 2021-12-01 | High-power ferrite load |
| DE212022000083.8U DE212022000083U1 (en) | 2021-12-01 | 2022-04-27 | A high power ferrite load |
| PCT/CN2022/089493 WO2023097959A1 (en) | 2021-12-01 | 2022-04-27 | High-power ferrite load |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111456376.XA CN114050389B (en) | 2021-12-01 | 2021-12-01 | High-power ferrite load |
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| CN114050389A CN114050389A (en) | 2022-02-15 |
| CN114050389B true CN114050389B (en) | 2022-10-21 |
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| WO (1) | WO2023097959A1 (en) |
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| CN114050389B (en) * | 2021-12-01 | 2022-10-21 | 散裂中子源科学中心 | High-power ferrite load |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7868714B1 (en) * | 2008-03-28 | 2011-01-11 | L-3 Communications Corp. | Compact waveguide load |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07106813A (en) * | 1993-10-06 | 1995-04-21 | Nec Corp | Vswr matching member and waveguide provided with the vswr matching member |
| US6549088B1 (en) * | 2001-09-21 | 2003-04-15 | The Boeing Company | Frequency adjustable multipole resonant waveguide load structure |
| CN100493270C (en) * | 2004-11-09 | 2009-05-27 | 中国科学院等离子体物理研究所 | Antenna unit made of composite metal material and water cooling plate matching same |
| CN102354786A (en) * | 2011-10-21 | 2012-02-15 | 湖北汉鑫源真空电子科技有限公司 | C-band high-energy silicon carbide ceramic microwave load |
| US8878623B2 (en) * | 2012-08-17 | 2014-11-04 | Honeywell International Inc. | Switching ferrite circulator with an electronically selectable operating frequency band |
| KR101427720B1 (en) * | 2013-03-27 | 2014-08-13 | (주)트리플코어스코리아 | Plasma waveguide using step part and block part |
| CN105428768B (en) * | 2015-12-25 | 2018-11-13 | 清华大学 | Microwave pad and production method |
| CN106981709A (en) * | 2017-05-12 | 2017-07-25 | 北京无线电测量研究所 | A kind of large power waveguide load based on electromagnetism Meta Materials |
| CN107316663B (en) * | 2017-07-21 | 2023-05-23 | 中国原子能科学研究院 | Device for carrying out high Wen Qixi heat transfer characteristic test research |
| CN210926263U (en) * | 2019-08-14 | 2020-07-03 | 宜宾市泰众电子科技有限责任公司 | Microwave loader capable of absorbing waves in multiple sections |
| CN212342789U (en) * | 2020-07-20 | 2021-01-12 | 成都锐明合升科技有限责任公司 | Composite microwave load |
| CN112928412A (en) * | 2021-04-01 | 2021-06-08 | 成都市吉亨特科技有限公司 | Compact matching load |
| CN113270704B (en) * | 2021-05-18 | 2022-06-24 | 中电科思仪科技股份有限公司 | Waveguide matching load based on inverted wedge absorber structure and optimization method thereof |
| CN114050389B (en) * | 2021-12-01 | 2022-10-21 | 散裂中子源科学中心 | High-power ferrite load |
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2021
- 2021-12-01 CN CN202111456376.XA patent/CN114050389B/en active Active
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2022
- 2022-04-27 WO PCT/CN2022/089493 patent/WO2023097959A1/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7868714B1 (en) * | 2008-03-28 | 2011-01-11 | L-3 Communications Corp. | Compact waveguide load |
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| Publication number | Publication date |
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| CN114050389A (en) | 2022-02-15 |
| WO2023097959A1 (en) | 2023-06-08 |
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