CN114047805A - Environment-friendly mainboard is with fixed heat dissipation integrated device - Google Patents
Environment-friendly mainboard is with fixed heat dissipation integrated device Download PDFInfo
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- CN114047805A CN114047805A CN202111280738.4A CN202111280738A CN114047805A CN 114047805 A CN114047805 A CN 114047805A CN 202111280738 A CN202111280738 A CN 202111280738A CN 114047805 A CN114047805 A CN 114047805A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 98
- 238000001816 cooling Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 56
- 238000003825 pressing Methods 0.000 claims description 24
- 229910052753 mercury Inorganic materials 0.000 claims description 21
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 13
- 240000004282 Grewia occidentalis Species 0.000 claims description 11
- 230000007613 environmental effect Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 7
- 239000007788 liquid Substances 0.000 abstract description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the field of computers, in particular to an environment-friendly fixing and heat-dissipating integrated device for a mainboard. The invention aims to solve the problems that: when the mainboard is fixed in the prior art, the position of the mainboard is easy to deviate, the mainboard is damaged, and extra energy is wasted to dissipate heat of the mainboard. The technical scheme is as follows: a fixed heat dissipation integrated device for an environment-friendly mainboard comprises an air pressure fixing unit, a water cooling unit and the like; a rear chassis plate is arranged on the rear side of the chassis frame; and a water cooling unit for cooling the main board is arranged on the front surface of the air pressure fixing unit. The computer mainboard is fixed by adopting an air pressure type fixing method, the mainboard cannot be damaged, the position of the mainboard cannot deviate after the mainboard is fixed, the mainboard is simpler and more convenient to disassemble, the mainboard is subjected to circulating liquid cooling by the heat generated by the mainboard, no additional heat dissipation equipment is needed, the cooling effect is good, the mainboard is automatically cooled according to the temperature of the mainboard, the energy is effectively saved, and the service life of the mainboard is prolonged.
Description
Technical Field
The invention relates to the field of computers, in particular to an environment-friendly fixing and heat-dissipating integrated device for a mainboard.
Background
In the prior art, a computer mainboard is fixed manually through screws, so that the position of the mainboard is easy to deviate in the fixing process, the mainboard is easy to be damaged in the fixing process, partial functions of the mainboard cannot be used, and the mainboard after being fixed is inconvenient to take down;
secondly, the mainboard can take place the problem that generates heat when using, and prior art all adopts heat radiation equipment such as fans to dispel the heat and cool down to it, and this radiating effect is not only poor, needs additionally to connect the electricity in addition, when the extravagant energy, can not play fine radiating effect to the mainboard.
Disclosure of Invention
The invention provides an environment-friendly fixing and heat-dissipating integrated device for a mainboard, aiming at overcoming the defects that the position of the mainboard is easy to deviate when the mainboard is fixed in the prior art, the mainboard is damaged, and energy is additionally wasted to dissipate heat of the mainboard.
The technical scheme is as follows: a fixed heat dissipation integrated device for an environment-friendly mainboard comprises an organic case frame, a case back plate, a horizontal plate, an air pressure fixing unit and a water cooling unit; a rear chassis plate is arranged on the rear side of the chassis frame; a horizontal plate is arranged on the right side of the rear surface of the rear plate of the case; an air pressure fixing unit for fixing the main board by air pressure is arranged on the left side of the rear surface of the rear board of the case; and a water cooling unit for cooling the main board is arranged on the front surface of the air pressure fixing unit.
More preferably, the air pressure fixing unit comprises a protective fixing frame, a first telescopic piece, a bearing plate, a fixing plate, a hollow frame, a supporting frame, a first piston, a first hollow cylinder, a first air pipe, a second telescopic piece, a first sliding block, a fixing frame, a third telescopic piece, a pressing plate and a first sealing plug; a protective fixing frame is arranged on the left side of the rear surface of the rear plate of the case; the rear wall of the inner side of the protective fixing frame is connected with four first telescopic pieces which are arranged in a rectangular shape; the rear wall of the inner side of the protective fixing frame is connected with two fixing plates which are in oblique angle symmetry; the telescopic ends of the four first telescopic pieces are connected with a bearing plate; the middle part of the bearing plate is connected with a water cooling unit; the rear side surface of the bearing plate is connected with two first pistons which are arranged diagonally; the front sides of the two fixed plates are respectively connected with a hollow frame; the rear sides of the two hollow frames are respectively connected with a supporting frame; the inner sides of the two supporting frames are respectively connected with a first hollow cylinder; the inner sides of the two support frames are connected with a second telescopic piece, the upper second telescopic piece is positioned above the upper first hollow cylinder, and the lower second telescopic piece is positioned below the lower first hollow cylinder; the rear sides of the two first pistons are respectively connected with a first hollow cylinder; the rear sides of the two first hollow cylinders are respectively communicated with a first gas pipe; the two first gas transmission pipes are respectively communicated with a hollow frame; two first sliding blocks are respectively arranged inside the two hollow frames; the lower parts of the front sides of the two hollow frames are respectively provided with a first sealing plug; a fixed frame is connected between the two first sliding blocks positioned above the sliding block, and a fixed frame is connected between the two first sliding blocks positioned below the sliding block; the rear sides of the two fixed frames are respectively connected with a telescopic end of a second telescopic piece; two third telescopic pieces which are symmetrical front and back are respectively arranged inside the two fixed frames; the opposite sides of the two third telescopic parts positioned below are respectively connected with a pressing plate, and the opposite sides of the two third telescopic parts positioned above are respectively connected with a pressing plate.
More preferably, the support plate is provided with a plurality of round holes.
More preferably, the two pressing plates are provided in an arc shape.
More preferably, the water cooling unit comprises a heat conducting plate, a first connecting plate, a second connecting plate, a first transit water frame, a second transit water frame, a water flowing pipe, an L-shaped water suction pipe, a second hollow cylinder, a second piston, a mercury storage pipe, a first sealing disc, a sealing plate and a return pipe; the middle part of the bearing plate is connected with a heat conducting plate; the right part of the rear side surface of the bearing plate is connected with four first connecting plates from top to bottom; the left part of the rear side surface of the bearing plate is connected with four second connecting plates from top to bottom; the upper surfaces of the four first connecting plates are respectively provided with a first transfer water frame; the upper surfaces of the four second connecting plates are respectively provided with a second transit water frame; the back side surface of the heat conducting plate is connected with four water flowing pipes from top to bottom; the right ends of the four water flowing pipes are respectively communicated with a first transfer water frame; the left ends of the four water flowing pipes are respectively communicated with a second transit water frame; the upper sides of the four second transit water frames are respectively communicated with an L-shaped water suction pipe; the lower parts of the left sides of the four water suction pipes are respectively communicated with a return pipe; the right ends of the upper sides of the four water suction pipes are respectively connected with a second hollow cylinder; the right ends of the four return pipes are respectively communicated with a first transit water frame; a second piston is arranged at the inner side of each of the four second hollow cylinders; the left part of the back side surface of the heat conducting plate is connected with four mercury storage tubes from top to bottom; the right parts of the inner sides of the four mercury storage tubes are respectively provided with a first sealing disc; the left side surfaces of the four first sealing discs are respectively connected with a sealing plate; a second piston is connected to each of the upper sides of the four first sealing discs.
More preferably, the four water flow pipes are arranged in a wave shape.
More preferably, a sponge body is arranged inside each of the four L-shaped suction pipes.
More preferably, the four mercury storage tubes each store a certain amount of mercury therein.
More preferably, the four return pipes are arranged to be inclined.
More preferably, the pneumatic sealing device further comprises a four-corner fixing unit, the four-corner fixing unit is installed at the diagonal position of the pneumatic fixing unit, and the four-corner fixing unit comprises a third hollow cylinder, a fourth telescopic piece, a second sealing disc, a second gas pipe, a sliding rail, a second sliding block, a third connecting plate, an L-shaped hollow frame, an L-shaped positioning plate, a third sliding block, a fourth connecting plate pressing disc and a second sealing plug; two third hollow cylinders which are arranged diagonally are connected inside the rear side of the protective fixing frame; the back sides of the two hollow frames are respectively connected with a slide rail; the opposite sides of the two third hollow cylinders are respectively provided with a fourth telescopic piece; a second sealing disc is arranged on the front side of the inner part of each of the two third hollow cylinders; the rear sides of the interiors of the two third hollow cylinders are respectively communicated with a second gas conveying pipe; the rear sides of the interiors of the two third hollow cylinders are respectively provided with a second sealing plug, the second sealing plug positioned at the lower part is positioned above the second gas pipe positioned at the lower part, and the second sealing plug positioned at the upper part is positioned below the second gas pipe positioned at the upper part; a second sliding block is connected in each of the two sliding rails in a sliding manner; the opposite sides of the two second sliding blocks are respectively connected with a third connecting plate; the back sides of the two third connecting plates are respectively connected with an L-shaped hollow frame; the rear sides of the two third connecting plates are respectively connected with an L-shaped positioning plate; a third sliding block is connected inside each L-shaped hollow frame in a sliding manner; the rear parts of the lower sides of the two L-shaped hollow frames are respectively communicated with a second gas pipe; the upper surfaces of the two third sliding blocks are respectively connected with a fourth connecting plate; and two opposite sides of the fourth connecting plates are respectively connected with a pressing plate.
The invention has the beneficial effects that: the computer mainboard is fixed by adopting an air pressure type fixing method, the mainboard cannot be damaged, the position of the mainboard cannot deviate after the mainboard is fixed, the mainboard is simpler and more convenient to disassemble, the mainboard is subjected to circulating liquid cooling through the heat generated by the mainboard, no additional heat dissipation equipment is needed, the cooling effect is good, the mainboard is automatically cooled according to the temperature of the mainboard, the energy is effectively saved, and the service life of the mainboard is prolonged.
Drawings
FIG. 1 is a schematic view of a first three-dimensional structure of a fixing and heat-dissipating integrated device for an environmentally-friendly motherboard according to the present invention;
FIG. 2 is a schematic diagram of a second three-dimensional structure of the fixing and heat-dissipating integrated device for an environmentally-friendly motherboard according to the present invention;
FIG. 3 is a schematic view of a first partial three-dimensional structure of the integrated device for fixing and dissipating heat for an environmentally friendly motherboard according to the present invention;
FIG. 4 is a schematic diagram of a second partial three-dimensional structure of the integrated device for fixing and dissipating heat for an environmentally friendly motherboard according to the present invention;
FIG. 5 is a schematic view of a combined three-dimensional structure of a fixing and heat-dissipating integrated device for an environmentally-friendly motherboard according to the present invention;
FIG. 6 is a schematic view of a first three-dimensional structure of an air pressure fixing unit of the fixing and heat-dissipating integrated device for an environmentally friendly motherboard according to the present invention;
FIG. 7 is a schematic diagram of a second three-dimensional structure of an air pressure fixing unit of the fixing and heat-dissipating integrated device for an environmentally-friendly motherboard according to the present invention;
FIG. 8 is a schematic perspective view of a portion of an air pressure fixing unit of the integrated device for fixing and dissipating heat for an environmentally friendly motherboard according to the present invention;
FIG. 9 is a cross-sectional view of the fixing and heat-dissipating integrated apparatus for an environmentally friendly motherboard according to the present invention;
FIG. 10 is a schematic diagram of a first three-dimensional structure of a water cooling unit of the integrated device for fixing and dissipating heat for an environmentally friendly motherboard according to the present invention;
FIG. 11 is a schematic diagram of a second three-dimensional structure of a water cooling unit of the integrated device for fixing and dissipating heat for an environmentally friendly motherboard according to the present invention;
FIG. 12 is a schematic perspective view of a water cooling unit of the integrated device for fixing and dissipating heat for an environmentally friendly motherboard according to the present invention;
FIG. 13 is a sectional view of a water cooling unit of the integrated device for fixing and dissipating heat for an environmentally friendly motherboard according to the present invention;
FIG. 14 is a schematic perspective view of a four-corner fixing unit of the fixing and heat-dissipating integrated device for an environmentally friendly motherboard according to the present invention;
FIG. 15 is a schematic perspective view of a part of a four-corner fixing unit of the fixing and heat-dissipating integrated device for an environmentally friendly motherboard according to the present invention;
fig. 16 is a cross-sectional view of the four corner fixing units of the integrated fixing and heat dissipating device for an environmentally friendly motherboard according to the present invention.
In the above drawings: 1-chassis frame, 2-chassis back plate, 3-horizontal plate, 201-protective fixed frame, 202-first telescopic part, 203-supporting plate, 204-fixed plate, 205-hollow frame, 206-supporting frame, 207-first piston, 208-first hollow cylinder, 209-first air pipe, 2010-second telescopic part, 2011-first slider, 2012-fixed frame, 2013-third telescopic part, 2014-pressing plate, 2015-first sealing plug, 301-heat conducting plate, 302-first connecting plate, 303-second connecting plate, 304-first transit water frame, 305-second transit water frame, 306-water flow pipe, 307-L-shaped water suction pipe, 308-second hollow cylinder, 309-second piston, 3010-mercury storage pipe, 3011-first sealing disc, 3012-sealing plate, 3013-return pipe, 401-third hollow cylinder, 402-fourth expansion piece, 403-second sealing plate, 404-second gas pipe, 405-slide rail, 406-second slide block, 407-third connecting plate, 408-L-shaped hollow frame, 409-L-shaped positioning plate, 4010-third slide block, 4011-fourth connecting plate, 4012-pressure plate and 4013-second sealing plug.
Detailed Description
The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which presently preferred embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided for completeness and fully convey the scope of the invention to the skilled person.
Example 1
An environment-friendly fixing and heat-dissipating integrated device for a mainboard is shown in figures 1-13 and comprises an organic case frame 1, a case back plate 2, a horizontal plate 3, an air pressure fixing unit and a water cooling unit; a rear cabinet plate 2 is arranged at the rear side of the cabinet frame 1; a horizontal plate 3 is arranged on the right side of the rear surface of the case rear plate 2; the left side of the rear surface of the case rear plate 2 is provided with an air pressure fixing unit; the front surface of the air pressure fixing unit is provided with a water cooling unit.
The air pressure fixing unit comprises a protective fixing frame 201, a first telescopic piece 202, a supporting plate 203, a fixing plate 204, a hollow frame 205, a supporting frame 206, a first piston 207, a first hollow cylinder 208, a first air pipe 209, a second telescopic piece 2010, a first sliding block 2011, a fixing frame 2012, a third telescopic piece 2013, a pressing plate 2014 and a first sealing plug 2015; a protection fixing frame 201 is arranged on the left side of the rear surface of the case rear plate 2; four first telescopic pieces 202 which are arranged in a rectangular shape are fixedly connected to the rear wall of the inner side of the protective fixing frame 201; two fixing plates 204 which are in oblique angle symmetry are connected to the rear wall of the inner side of the protective fixing frame 201 through bolts; the telescopic ends of the four first telescopic pieces 202 are fixedly connected with supporting plates 203; the middle part of the bearing plate 203 is connected with a water cooling unit; two first pistons 207 which are arranged diagonally are fixedly connected to the rear side surface of the supporting plate 203; the front sides of the two fixing plates 204 are respectively welded with a hollow frame 205; the rear sides of the two hollow frames 205 are respectively welded with a support frame 206; a first hollow cylinder 208 is fixedly connected to the inner sides of the two supporting frames 206; a second telescopic part 2010 is fixedly connected to the inner sides of the two support frames 206, the upper second telescopic part 2010 is positioned above the upper first hollow cylinder 208, and the lower second telescopic part 2010 is positioned below the lower first hollow cylinder 208; a first hollow cylinder 208 is connected to the rear sides of the two first pistons 207; the rear sides of the two first hollow cylinders 208 are respectively communicated with a first air conveying pipe 209; the two first gas transmission pipes 209 are respectively communicated with a hollow frame 205; two first sliding blocks 2011 are respectively arranged inside the two hollow frames 205; the lower parts of the front sides of the two hollow frames 205 are respectively provided with a first sealing plug 2015; a fixed frame 2012 is fixedly connected between the two first sliding blocks 2011 positioned at the upper part, and a fixed frame 2012 is fixedly connected between the two first sliding blocks 2011 positioned at the lower part; the rear sides of the two fixed frames 2012 are fixedly connected with the telescopic ends of a second telescopic piece 2010 respectively; two third telescopic pieces 2013 which are symmetrical front and back are respectively arranged inside the two fixing frames 2012; the opposite sides of the two lower third telescopic parts 2013 are respectively fixedly connected with a pressing plate 2014, and the opposite sides of the two upper third telescopic parts 2013 are respectively fixedly connected with a pressing plate 2014.
The support plate 203 is provided with a plurality of round holes.
The two compression plates 2014 are arranged in an arc shape.
The water cooling unit comprises a heat conduction plate 301, a first connection plate 302, a second connection plate 303, a first transit water frame 304, a second transit water frame 305, a water flowing pipe 306, an L-shaped water suction pipe 307, a second hollow cylinder 308, a second piston 309, a mercury storage pipe 3010, a first sealing disc 3011, a sealing plate 3012 and a return pipe 3013; the middle part of the bearing plate 203 is fixedly connected with a heat conducting plate 301; four first connecting plates 302 are fixedly connected to the right part of the rear side surface of the supporting plate 203 from top to bottom; the left part of the rear side surface of the bearing plate 203 is fixedly connected with four second connecting plates 303 from top to bottom; a first transit water frame 304 is respectively arranged on the upper surfaces of the four first connecting plates 302; a second water transfer frame 305 is respectively arranged on the upper surfaces of the four second connecting plates 303; the rear side surface of the heat conducting plate 301 is fixedly connected with four water flowing pipes 306 from top to bottom; the right ends of the four water flowing pipes 306 are respectively communicated with a first transit water frame 304; the left ends of the four water flowing pipes 306 are respectively communicated with a second water transferring frame 305; the upper sides of the four second transfer water frames 305 are respectively communicated with an L-shaped suction pipe 307; the lower parts of the left sides of the four water suction pipes are respectively communicated with a return pipe 3013; the right ends of the upper sides of the four water suction pipes are respectively fixedly connected with a second hollow cylinder 308; the right ends of the four return pipes 3013 are respectively communicated with a first transit water frame 304; a second piston 309 is arranged inside each of the four second hollow cylinders 308; four mercury storage tubes 3010 are fixedly connected to the left part of the rear side surface of the heat conducting plate 301 from top to bottom; a first sealing disk 3011 is arranged on the right part of the inner side of each of the four mercury storage tubes 3010; a sealing plate 3012 is fixedly connected to each of the left side faces of the four first sealing discs 3011; the upper sides of the four first sealing discs 3011 are fixedly connected with a second piston 309 respectively.
Four water flow pipes 306 are arranged in a wave shape.
A sponge body is arranged inside each of the four L-shaped suction pipes 307.
A certain amount of mercury is stored inside each of the four mercury storage tubes 3010.
The four return pipes 3013 are arranged to be inclined.
Before the preparation work, in order to conveniently install the mainboard, the case frame 1, the case back plate 2 and the horizontal plate 3 which are combined together can be flatly placed, namely the horizontal plate 3 is contacted with the ground, after the flat placement, the mainboard is installed manually, namely the mainboard is fixed at the corresponding positions of the case frame 1 and the case back plate 2, six round holes for installing screws are formed in the mainboard, so that the mainboard is conveniently installed and cannot be damaged, the device does not adopt screws to install the mainboard, and the mainboard is fixedly installed by utilizing the self gravity of the mainboard;
with the chassis frame 1, the chassis back plate 2 and the horizontal plate 3 laid flat, that is, with the horizontal plate 3 in contact with the ground as a reference, when starting to install, the main board is manually laid on the front side of the supporting plate 203, and slightly faces downward toward the main board, under the action of the gravity and the human force of the main board, the main board presses the supporting plate 203 downward, that is, the supporting plate 203 presses four first expansion members 202 downward via the supporting plate 203, and also pushes two first pistons 207 to move downward, after the main board is pressed down to a specified installation position, for convenience of explanation, the diagonally arranged parts are only described as a group located below, when the first pistons 207 move downward, the first pistons 207 press the air in the first hollow cylinders 208 into the hollow frame 205 via the first air pipes 209, and as the main board is pressed down continuously, the air pressed into the hollow frame 205 is gradually increased, so that the air pressure in the hollow frame 205 is increased continuously, under the action of air pressure, the fixed frame 2012 is pushed out upwards, that is, the two first sliding blocks 2011 slide upwards in the hollow frame 205, the second expansion piece 2010 is compressed by the fixed frame 2012, the second expansion piece 2010 is a spring expansion rod, when the fixed frame 2012 is pushed out from the hollow frame 205, the two third expansion pieces 2013 and the two pressing plates 2014 are driven to move simultaneously, when the two pressing plates 2014 are in contact with the main board, the main board pushes the two pressing plates 2014 apart, that is, when the two pressing plates 2014 move away from each other, the two third expansion pieces 2013 are compressed, the two third expansion pieces 2013 are spring expansion rods, one corner of the main board is pressed by the resilience force of the two third expansion pieces 2013, meanwhile, the two pressing plates 2014 at the opposite corners press the other corner of the main board, so as to fix the main board, and when the main board needs to be taken down, only the two first sliding blocks need to be taken away manually, the air pressure in the two hollow frames 205 is gradually reduced, and then under the action of the resilience force of the two second telescopic pieces 2010, the two fixing frames 2012 enter the two hollow frames 205 again, that is, the four pressing plates 2014 loosen the main board, so that the main board can be easily taken down;
in the operation process of the main board, the main board generates a heat problem, and as the temperature of the main board increases, the main board needs to be cooled down to prevent the main board from being burned out, so as to prolong the service life of the main board, similarly, for convenience of explanation, only one of the same components is described below, a certain amount of cold water is in advance in the flow pipe 306, the first transit water frame 304 and the second transit water frame 305, and as the temperature of the main board increases, the main board transfers heat to the flow pipe 306 through the heat conducting plate 301, and then absorbs heat through the cold water inside the flow pipe 306, so as to achieve the cooling effect of the main board, meanwhile, in order to enable the cooling to be continuously and effectively performed, the heat absorbed inside the flow pipe 306 needs to flow and circulate with the cold water inside the first transit water frame 304 and the second transit water frame 305, so as to achieve the effect of cooling the main board by cold water circulation, as the temperature of the main board rises, the heat conducting plate 301 simultaneously transfers heat to the mercury storing pipe 3010, so that the temperature of the mercury inside the mercury storing pipe 3010 rises, then the mercury in the mercury storing pipe 3010 automatically pushes the first sealing disc 3011 to move, and further the second piston 309 and the sealing plate 3012 are simultaneously driven to move by the first sealing disc 3011, when the second piston 309 moves, the cold water in the second transit water frame 305 is pumped up by the L-shaped water suction pipe 307 in an air suction manner, and because the sponge is arranged in the L-shaped water suction pipe 307, and the return pipe 3013 is arranged in an inclined shape, so that the cold water pumped up from the second transit water frame 305 automatically flows into the first transit water frame 304 through the L-shaped water suction pipe 307, and further the water having absorbed heat in the water flowing pipe 306 can automatically flow into the second transit water frame 305 under the air suction of the second piston 309 and the water flow of the first transit water frame 304, the cooling is performed by the cold water in the second transit water frame 305, and the cold water inside the first transit water frame 304 automatically flows into the water flowing pipe 306, and the effect of cooling by circulating the changed water is achieved.
Example 2
On the basis of embodiment 1, as shown in fig. 1 and fig. 14 to 16, the pneumatic sealing device further comprises a four-corner fixing unit, the four-corner fixing unit is installed at a diagonal position of the pneumatic fixing unit, and the four-corner fixing unit comprises a third hollow cylinder 401, a fourth telescopic piece 402, a second sealing disc 403, a second air pipe 404, a sliding rail 405, a second sliding block 406, a third connecting plate 407, an L-shaped hollow frame 408, an L-shaped positioning plate 409, a third sliding block 4010, a fourth connecting plate 4011, a pressure plate 4012 and a second sealing plug 4013; two third hollow cylinders 401 which are arranged diagonally are fixedly connected inside the rear side of the protective fixing frame 201; two slide rails 405 are welded on the opposite back sides of the two hollow frames 205 respectively; the opposite sides of the two third hollow cylinders 401 are respectively provided with a fourth telescopic part 402; a second sealing disc 403 is respectively arranged on the front sides of the interiors of the two third hollow cylinders 401; a second air conveying pipe 404 is respectively communicated with the rear sides of the interiors of the two third hollow pipes 401; a second sealing plug 4013 is arranged on the rear side of the inside of each of the two third hollow barrels 401, the second sealing plug 4013 positioned on the lower part is positioned above the second air conveying pipe 404 positioned on the lower part, and the second sealing plug 4013 positioned on the upper part is positioned below the second air conveying pipe 404 positioned on the upper part; a second sliding block 406 is connected in each of the two sliding rails 405 in a sliding manner; the back sides of the two second sliding blocks 406 are fixedly connected with a third connecting plate 407 respectively; the opposite back sides of the two third connecting plates 407 are respectively welded with an L-shaped hollow frame 408; the rear sides of the two third connecting plates 407 are fixedly connected with an L-shaped positioning plate 409 respectively; a third slide block 4010 is connected inside each L-shaped hollow frame 408 in a sliding manner; the rear parts of the lower sides of the two L-shaped hollow frames 408 are respectively communicated with a second air conveying pipe 404; the upper surfaces of the two third sliding blocks 4010 are fixedly connected with a fourth connecting plate 4011 respectively; and the opposite sides of the two fourth connecting plates 4011 are fixedly connected with a pressure plate 4012 respectively.
When the main board is fixed, in order to ensure that the main board is more stably fixed and does not loosen due to shaking and the like, the main board needs to be further fixed, when the main board is pressed down, round holes formed in the upper left side and the lower right side of the main board are respectively contacted with the outer surface of one third hollow cylinder 401, namely, two third hollow cylinders 401 are respectively inserted into the corresponding round holes on the main board, at the same time, the main board compresses two fourth telescopic parts 402, the fourth telescopic parts 402 are spring telescopic plates, two second sealing discs 403 are driven by the two fourth telescopic parts 402 to gradually enter the two third hollow cylinders 401, at the same time, the main board simultaneously drives two L-shaped positioning plates 409 to be pressed down, namely, the two L-shaped positioning plates 409 drive two third connecting plates 407 to move down, and further drives two second sliding blocks 406 to slide in the two sliding rails 405 through the two third connecting plates 407, meanwhile, the two L-shaped hollow frames 408, the two third sliding blocks 4010, the two fourth connecting plates 4011 and the two pressing disks 4012 are driven by the two third connecting plates 407 to move, so that the two pressing disks 4012 are always flush with the front side surface of the main board, then when the two second sealing disks 403 gradually enter the two third hollow cylinders 401, the two second sealing disks 403 press the air in the two third hollow cylinders 401 into the two L-shaped hollow frames 408 through the two second air pipes 404, so that the air pressure in the two L-shaped hollow frames 408 is increased, and as the air pressure is increased, the two third sliding blocks 4010 gradually slide out of the two L-shaped hollow frames 408, namely the two fourth connecting plates 4011 and the pressing disks 4012 are driven to gradually contact with the two corners of the main board, meanwhile, round holes formed in the upper left side and the lower right side of the main board already enter the two third hollow cylinders 401, so that the two third hollow cylinders 401 are matched with the two pressing disks 4012, further fixed the mainboard, meanwhile, when the mainboard was taken off to needs, just need two artifical second sealing plugs 4013 to extract equally for atmospheric pressure in the L shape hollow frame 408 resumes normally, and then makes two pressure disks 4012 and mainboard separation, and then can take off the mainboard.
The embodiments described above are provided to enable persons skilled in the art to make or use the invention and that modifications or variations can be made to the embodiments described above by persons skilled in the art without departing from the inventive concept of the present invention, so that the scope of protection of the present invention is not limited by the embodiments described above but should be accorded the widest scope consistent with the innovative features set forth in the claims.
Claims (10)
1. An environment-friendly fixing and heat-dissipating integrated device for a mainboard comprises an organic case frame (1), a case rear plate (2) and a horizontal plate (3); a rear cabinet plate (2) is arranged at the rear side of the cabinet frame (1); a horizontal plate (3) is arranged on the right side of the rear surface of the case rear plate (2); the method is characterized in that: the device also comprises an air pressure fixing unit and a water cooling unit; an air pressure fixing unit for fixing the main board by air pressure is arranged on the left side of the rear surface of the case rear plate (2); and a water cooling unit for cooling the main board is arranged on the front surface of the air pressure fixing unit.
2. The fixing and heat-dissipating integrated device for the environment-friendly mainboard as claimed in claim 1, wherein the air pressure fixing unit comprises a protection fixing frame (201), a first telescopic member (202), a supporting plate (203), a fixing plate (204), a hollow frame (205), a supporting frame (206), a first piston (207), a first hollow cylinder (208), a first air pipe (209), a second telescopic member (2010), a first slider (2011), a fixing frame (2012), a third telescopic member (2013), a pressing plate (2014) and a first sealing plug (2015); a protective fixing frame (201) is arranged on the left side of the rear surface of the case rear plate (2); the rear wall of the inner side of the protective fixing frame (201) is connected with four first telescopic pieces (202) which are arranged in a rectangular shape; the rear wall of the inner side of the protective fixing frame (201) is connected with two fixing plates (204) which are in oblique angle symmetry; the telescopic ends of the four first telescopic pieces (202) are connected with a bearing plate (203); the middle part of the bearing plate (203) is connected with a water cooling unit; the rear side surface of the bearing plate (203) is connected with two first pistons (207) which are arranged diagonally; the front sides of the two fixing plates (204) are respectively connected with a hollow frame (205); the rear sides of the two hollow frames (205) are respectively connected with a supporting frame (206); the inner sides of the two support frames (206) are respectively connected with a first hollow cylinder (208); a second telescopic part (2010) is connected to the inner sides of the two support frames (206), the upper second telescopic part (2010) is positioned above the upper first hollow cylinder (208), and the lower second telescopic part (2010) is positioned below the lower first hollow cylinder (208); a first hollow cylinder (208) is connected to the rear sides of the two first pistons (207); the rear sides of the two first hollow cylinders (208) are respectively communicated with a first air conveying pipe (209); the two first air conveying pipes (209) are respectively communicated with a hollow frame (205); two first sliding blocks (2011) are respectively arranged inside the two hollow frames (205); the lower parts of the front sides of the two hollow frames (205) are respectively provided with a first sealing plug (2015); a fixed frame (2012) is connected between the two first sliding blocks (2011) positioned at the upper part, and a fixed frame (2012) is connected between the two first sliding blocks (2011) positioned at the lower part; the rear sides of the two fixed frames (2012) are respectively connected with the telescopic end of a second telescopic piece (2010); two third telescopic pieces (2013) which are symmetrical front and back are respectively arranged in the two fixing frames (2012); the opposite sides of the two lower third telescopic pieces (2013) are respectively connected with a pressing plate (2014), and the opposite sides of the two upper third telescopic pieces (2013) are respectively connected with a pressing plate (2014).
3. The fixed heat dissipation integrated device for the environment-friendly main board as claimed in claim 2, wherein the supporting plate (203) is provided with a plurality of circular holes.
4. An environment-friendly fixed heat dissipation integrated device for main boards as claimed in claim 3, wherein the two pressing plates (2014) are arranged in an arc shape.
5. The fixing and heat-dissipating integrated device for the environment-friendly mainboard as claimed in claim 4, wherein the water-cooling unit comprises a heat-conducting plate (301), a first connecting plate (302), a second connecting plate (303), a first transfer water frame (304), a second transfer water frame (305), a water flow pipe (306), an L-shaped water suction pipe (307), a second hollow cylinder (308), a second piston (309), a mercury storage pipe (3010), a first sealing disc (3011), a sealing plate (3012) and a return pipe (3013); the middle part of the bearing plate (203) is connected with a heat conducting plate (301); the right part of the rear side surface of the bearing plate (203) is connected with four first connecting plates (302) from top to bottom; the left part of the rear side surface of the bearing plate (203) is connected with four second connecting plates (303) from top to bottom; the upper surfaces of the four first connecting plates (302) are respectively provided with a first transit water frame (304); the upper surfaces of the four second connecting plates (303) are respectively provided with a second water transfer frame (305); the rear side surface of the heat conducting plate (301) is connected with four water flowing pipes (306) from top to bottom; the right ends of the four water flowing pipes (306) are respectively communicated with a first transit water frame (304); the left ends of the four water flowing pipes (306) are respectively communicated with a second water transfer frame (305); the upper sides of the four second transfer water frames (305) are respectively communicated with an L-shaped water suction pipe (307); the lower parts of the left sides of the four water suction pipes are respectively communicated with a return pipe (3013); the right ends of the upper sides of the four water suction pipes are respectively connected with a second hollow cylinder (308); the right ends of the four return pipes (3013) are respectively communicated with a first transit water frame (304); a second piston (309) is arranged at the inner side of each of the four second hollow cylinders (308); the left part of the rear side surface of the heat conducting plate (301) is connected with four mercury storage tubes (3010) from top to bottom; the right parts of the inner sides of the four mercury storage tubes (3010) are respectively provided with a first sealing disc (3011); the left side surfaces of the four first sealing discs (3011) are respectively connected with a sealing plate (3012); the upper sides of the four first sealing discs (3011) are respectively connected with a second piston (309).
6. The environment-friendly fixed heat dissipation integrated device for the mainboard as recited in claim 5, wherein four water flow pipes (306) are arranged in a wave shape.
7. The integrated fixed heat sink device for environmental friendly motherboard according to claim 6, wherein each of the four L-shaped suction pipes (307) has a sponge body inside.
8. The integrated fixed heat sink device for environmental friendly motherboard as recited in claim 7, wherein a certain amount of mercury is stored in each of four mercury storing tubes (3010).
9. An environment-friendly fixed heat dissipation integrated device for a motherboard as recited in claim 8, wherein four return pipes (3013) are arranged in an inclined shape.
10. The fixing and heat-dissipating integrated device for the environment-friendly mainboard as claimed in claim 9, further comprising a four-corner fixing unit, wherein the four-corner fixing unit is installed at the diagonal corner of the air pressure fixing unit, and comprises a third hollow cylinder (401), a fourth telescopic member (402), a second sealing disc (403), a second air pipe (404), a slide rail (405), a second slider (406), a third connecting plate (407), an L-shaped hollow frame (408), an L-shaped positioning plate (409), a third slider (4010), a fourth connecting plate (4011), a pressure plate (4012) and a second sealing plug (4013); two third hollow cylinders (401) which are arranged diagonally are connected inside the rear side of the protective fixing frame (201); the opposite back sides of the two hollow frames (205) are respectively connected with a slide rail (405); the opposite sides of the two third hollow cylinders (401) are respectively provided with a fourth telescopic piece (402); a second sealing disc (403) is arranged on the front side of the interior of each of the two third hollow cylinders (401); a second air conveying pipe (404) is respectively communicated with the rear sides of the interiors of the two third hollow pipes (401); a second sealing plug (4013) is arranged on the rear side of the interior of each of the two third hollow barrels (401), the second sealing plug (4013) positioned on the lower portion is positioned above the second air conveying pipe (404) positioned on the lower portion, and the second sealing plug (4013) positioned on the upper portion is positioned below the second air conveying pipe (404) positioned on the upper portion; a second sliding block (406) is connected in each of the two sliding rails (405) in a sliding manner; the opposite back sides of the two second sliding blocks (406) are respectively connected with a third connecting plate (407); the opposite back sides of the two third connecting plates (407) are respectively connected with an L-shaped hollow frame (408); the rear sides of the two third connecting plates (407) are respectively connected with an L-shaped positioning plate (409); a third sliding block (4010) is connected inside each L-shaped hollow frame (408) in a sliding manner; the rear parts of the lower sides of the two L-shaped hollow frames (408) are respectively communicated with a second air conveying pipe (404); the upper surfaces of the two third sliding blocks (4010) are respectively connected with a fourth connecting plate (4011); and the opposite sides of the two fourth connecting plates (4011) are respectively connected with a pressure plate (4012).
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Effective date of registration: 20231122 Address after: No. 5-2-24, No. 199 Tongji Road, Jiangbei District, Ningbo City, Zhejiang Province, 315000 Patentee after: Ningbo Ziqian Information Technology Co.,Ltd. Address before: 510630 Room 101, 1st floor, No. 4, Huangzhou Industrial Zone, chepo Road, Dongpu, Tianhe District, Guangzhou, Guangdong Patentee before: Guangdong Shangpin Electronic Technology Co.,Ltd. |