CN114047532A - Double-frequency-band processing circuit and positioning equipment - Google Patents
Double-frequency-band processing circuit and positioning equipment Download PDFInfo
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- CN114047532A CN114047532A CN202210034942.6A CN202210034942A CN114047532A CN 114047532 A CN114047532 A CN 114047532A CN 202210034942 A CN202210034942 A CN 202210034942A CN 114047532 A CN114047532 A CN 114047532A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S19/00—Satellite radio beacon positioning systems; Determining position, velocity or attitude using signals transmitted by such systems
- G01S19/01—Satellite radio beacon positioning systems transmitting time-stamped messages, e.g. GPS [Global Positioning System], GLONASS [Global Orbiting Navigation Satellite System] or GALILEO
- G01S19/13—Receivers
- G01S19/35—Constructional details or hardware or software details of the signal processing chain
- G01S19/37—Hardware or software details of the signal processing chain
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B19/00—Generation of oscillations by non-regenerative frequency multiplication or division of a signal from a separate source
- H03B19/06—Generation of oscillations by non-regenerative frequency multiplication or division of a signal from a separate source by means of discharge device or semiconductor device with more than two electrodes
- H03B19/14—Generation of oscillations by non-regenerative frequency multiplication or division of a signal from a separate source by means of discharge device or semiconductor device with more than two electrodes by means of a semiconductor device
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
- H03F3/195—High frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/294—Indexing scheme relating to amplifiers the amplifier being a low noise amplifier [LNA]
Abstract
The application provides a dual-band processing circuit and a positioning device. The method comprises the following steps: the front end matching module is used for receiving the mixed positioning signals of the double frequency bands, filtering the mixed positioning signals and outputting the filtered mixed positioning signals; the input end of the low-noise amplifier is connected with the output end of the front-end matching module and is used for amplifying and outputting the signal output by the front-end matching module; and the input end of the frequency division module is connected with the output end of the low-noise amplifier and is used for carrying out frequency division processing on the signal output by the low-noise amplifier and outputting the positioning signal of the first frequency band and the positioning signal of the second frequency band. According to the method, the dual-frequency mixed signal is subjected to filtering processing and signal amplification processing firstly and then subjected to frequency division processing, so that two independent frequency band positioning signals are obtained. The dual-band processing circuit reduces the number of low-noise amplifiers, effectively reduces energy consumption during positioning, is favorable for further reducing the area of a circuit board, and improves the integration level of the circuit.
Description
Technical Field
The present application relates to integrated circuit technologies, and in particular, to a dual band processing circuit and a positioning device.
Background
With the vigorous development of intelligent wearable device technology, more and more wearable devices are beginning to penetrate the aspects of people's daily life, for example, smart watches, health wristbands, etc. People can record own motion behavior by utilizing the motion function of the wearable device. Among them, the implementation of the motion function of the wearable device needs to be applied to the positioning technology.
At present, the device is small in size and is used by being attached to the skin, so that the positioning precision is not influenced. The positioning precision of the wearable equipment is improved by adopting a GPS dual-frequency positioning technology. Conventional circuit configurations for processing dual frequency positioning signals include a prescaler filter and a low noise amplifier. Firstly, frequency division is carried out on a double-frequency positioning signal to obtain two single-frequency signals, then, each single-frequency signal is subjected to signal amplification through a low-noise amplifier, and then accurate positioning information is obtained.
However, the circuit described above employs two low noise amplifiers, and the increase of components in the designed circuit is not favorable for further reducing the area of the circuit board in the device.
Disclosure of Invention
The application provides a dual-band processing circuit and a positioning device, which are used for further reducing the area of a device circuit board.
In one aspect, the present application provides a dual-band processing circuit, including a front-end matching module, a low-noise amplifier, and a frequency division module; the front end matching module is used for receiving the mixed positioning signals of the double frequency bands, filtering the mixed positioning signals and outputting the filtered mixed positioning signals; the input end of the low-noise amplifier is connected with the output end of the front-end matching module, and the low-noise amplifier is used for amplifying and outputting the signal output by the front-end matching module; and the input end of the frequency division module is connected with the output end of the low-noise amplifier, and the frequency division module is used for carrying out frequency division processing on the signal output by the low-noise amplifier and outputting the positioning signal of the first frequency band and the positioning signal of the second frequency band.
According to the method, the double-frequency mixed signal is subjected to filtering processing and signal amplification processing firstly and then subjected to frequency division processing, two independent frequency band positioning signals are obtained, the using quantity of low-noise amplifiers in the circuit is reduced, the positioning energy loss can be effectively reduced, the area of the circuit board is further reduced, and the integration level of the circuit is improved.
Further, the front-end matching module includes: the device comprises a filtering module and a first matching module; the input end of the filter module is used as the input end of the front end matching module and is used for receiving the mixed positioning signal of the double frequency bands; the filtering module is used for filtering the mixed positioning signal; the input end of the first matching module is connected with the output end of the filtering module, and the output end of the first matching module is used as the output end of the front-end matching module; the first matching module is used for adjusting matching impedance.
A filtering module in a front-end matching module in the circuit filters the mixed positioning signal, filters interference noise and filters out signals of two specific frequency bands; after filtering, the circuit impedance changes, the first matching module adjusts the matching impedance to a certain impedance value, the signal transmission efficiency is improved, the interference is reduced, and the signal distortion is avoided.
Further, the filtering module includes: a first frequency band filter circuit and a second frequency band filter circuit; the first frequency band filter circuit is connected in series with the second frequency band filter circuit, the first frequency band filter circuit is used for filtering out high-frequency out-of-band interference, and the second frequency band filter circuit is used for filtering out low-frequency out-of-band interference.
A higher frequency band and a lower frequency band are involved in the hybrid positioning signal, and accordingly, there are high frequency interference signals and low frequency interference signals. Therefore, the circuit is provided with two filter circuits in the filter module, and the two filter circuits are respectively responsible for filtering out high-frequency interference signals and low-frequency interference signals.
In a possible manner, the first frequency band filter circuit includes a first inductor and a first capacitor; the first end of the first inductor is connected with the first end of the first capacitor and serves as the input end of the filtering module; the second end of the first inductor is connected with the second end of the first capacitor and serves as the output end of the first frequency band filter circuit; the second frequency band filter circuit comprises a second inductor and a second capacitor; the first end of the second capacitor is connected with the output end of the first frequency band filter circuit and serves as the output end of the filter module; the second end of the second capacitor is connected with the first end of the second inductor, and the second end of the second inductor is grounded.
The above circuit provides a feasible filter circuit structure.
In one possible approach, the first matching module includes: a third capacitor and a fourth capacitor; the first end of the third capacitor is connected with the output end of the filtering module and serves as the input end of the first matching module; the second end of the third capacitor is connected with the first end of the fourth capacitor and serves as the output end of the first matching module; the second end of the fourth capacitor is grounded.
The circuit provides a feasible circuit structure for adjusting impedance and a connection mode with the filter circuit.
Furthermore, a front end debugging unit is arranged between the front end matching module and the low noise amplifier; the input end of the front end debugging unit is connected with the output end of the front end matching module, and the output end of the front end debugging unit is connected with the input end of the low noise amplifier; and the front end debugging unit is used for adjusting the input impedance of the low noise amplifier.
The circuit is provided with a front end debugging unit in front of the low noise amplifier, and the front end debugging unit is used for adjusting input impedance so as to ensure the good working state of the low noise amplifier.
In one possible approach, the front-end debugging unit includes: a third inductor; the first end of the third inductor is connected with the output end of the front end matching module, and the second end of the third inductor is connected with the input end of the low noise amplifier.
The circuit structure of the feasible front-end debugging unit is used for impedance matching and ensuring the good working state of the low-noise amplifier.
Further, the low noise amplifier includes: the low-noise amplifier comprises a low-noise amplification chip, a power supply filtering module and an impedance element; the signal input pin of the low-noise amplification chip is used as the input end of the low-noise amplifier; the signal output pin of the low-noise amplification chip is used as the output end of the low-noise amplifier;
the power input pin of the low-noise amplifier is connected to a power supply through a power filter module; the power supply is used for providing a power supply signal; the power supply filtering module is used for filtering noise in the power supply signal; the enable pin of the low noise amplifier is connected with an enable signal through an impedance element.
The circuit connection structure of the low-noise amplification chip in the low-noise amplifier is further explained by the circuit.
Further, the frequency division module comprises a double-sound-meter filter; the signal input pin of the double-sound-meter filter is used as the input end of the frequency division module; and a first signal output pin and a second signal output pin of the double-sound-meter filter are used as output ends of the frequency division module and respectively output the positioning signal of the first frequency band and the positioning signal of the second frequency band.
The circuit adopts the double-sound-meter filter to divide the frequency of the mixed positioning signal into two independent frequency band positioning signals for subsequent accurate positioning acquisition.
Further, a second matching module is arranged between the low-noise amplifier and the frequency dividing module; the input end of the second matching module is connected with the output end of the low noise amplifier, and the output end of the second matching module is connected with the input end of the frequency dividing module; the second matching module is used for adjusting the insertion loss between the output end of the low noise amplifier and the input end of the frequency dividing module.
The circuit is provided with the second matching module behind the low-noise amplifier and in front of the frequency division module, and insertion loss between the low-noise amplifier and the frequency division module is reduced by adjusting the input impedance of the frequency division module.
In one possible approach, the second matching module includes: a sixth capacitor, a seventh capacitor and an eighth capacitor; the first end of the sixth capacitor is connected with the output end of the low noise amplifier and the first end of the seventh capacitor, and the second end of the sixth capacitor is grounded; the second end of the seventh capacitor is connected with the first end of the eighth capacitor and the input end of the frequency dividing module; and the second end of the eighth capacitor is grounded.
The above provides a feasible circuit structure of the second matching module, which is used for impedance matching and ensuring the working state of the frequency division module.
In a second aspect, the present application provides a positioning apparatus comprising: the dual-band processing circuit comprises a dual-band processing circuit in the first aspect and a positioning processing module; the dual-frequency band processing circuit is connected with the positioning processing module and outputs a positioning signal of a first frequency band and a positioning signal of a second frequency band based on a received mixed positioning signal of the dual-frequency band; the positioning processing module obtains a positioning result based on the positioning signal of the first frequency band and the positioning signal of the second frequency band.
The double-frequency-band processing circuit and the positioning device comprise a front-end matching module, a low-noise amplifier and a frequency division module; the front end matching module is used for receiving the mixed positioning signals of the double frequency bands, filtering the mixed positioning signals and outputting the filtered mixed positioning signals; the input end of the low-noise amplifier is connected with the output end of the front-end matching module and is used for amplifying and outputting the signal output by the front-end matching module; and the input end of the frequency division module is connected with the output end of the low-noise amplifier and is used for carrying out frequency division processing on the signal output by the low-noise amplifier and outputting the positioning signal of the first frequency band and the positioning signal of the second frequency band. According to the method, the dual-frequency mixed signal is subjected to filtering processing and signal amplification processing firstly and then subjected to frequency division processing, so that two independent frequency band positioning signals are obtained. The dual-band processing circuit reduces the number of low-noise amplifiers, effectively reduces energy consumption during positioning, is favorable for further reducing the area of a circuit board, and improves the integration level of the circuit.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
FIG. 1 is a circuit diagram of a conventional dual-band positioning signal processing circuit;
fig. 2 is an application scenario of a dual-band processing circuit provided in the present application;
fig. 3 is a schematic structural diagram of a dual band processing circuit provided in the present application;
fig. 4 is a schematic structural diagram of a front-end processing module in a dual-band processing circuit provided in the present application;
fig. 5 is a circuit diagram of a filtering module in a front-end processing module provided in the present application;
fig. 6 is a circuit diagram of a first matching module in a front-end processing module provided in the present application;
FIG. 7 is a schematic diagram of another dual band processing circuit according to the present application;
FIG. 8 is a circuit diagram of a front-end debug unit provided by the present application;
fig. 9 is a circuit diagram of a low noise amplifier provided in the present application;
fig. 10 is a circuit diagram of a frequency-division module provided in the present application;
fig. 11 is a schematic diagram of another dual-band processing circuit provided in the present application;
fig. 12 is a circuit diagram of a second matching module provided in the present application;
fig. 13 is a circuit diagram of a dual band processing circuit provided herein;
fig. 14 is a diagram illustrating an insertion loss simulation result of a front-end matching module in a dual-band processing circuit according to the present application;
fig. 15 is a schematic structural diagram of a positioning apparatus provided in the present application.
With the above figures, there are shown specific embodiments of the present application, which will be described in more detail below. These drawings and written description are not intended to limit the scope of the inventive concepts in any manner, but rather to illustrate the inventive concepts to those skilled in the art by reference to specific embodiments.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with aspects of the present application.
The terms referred to in this application are explained first:
surface acoustic wave filter (surface acoustic wave): for SAW filters, a surface acoustic wave is an elastic wave that propagates along the surface of an object. The SAW filter can be regarded as consisting of two transducers, wherein the transducer at the input end converts electric energy into sound energy to emit surface acoustic waves; the output end transducer converts sound energy into electric energy and receives the surface acoustic wave to output the electric energy. The two transducers on the piezoelectric substrate are used to generate and detect surface acoustic waves, thus completing the filtering action.
Low noise amplifier (low noise amplifier): amplifiers with very low noise figure are commonly used as high-frequency or intermediate-frequency preamplifiers for various radio receivers and as amplifying circuits for high-sensitivity electronic detection devices. In the case of amplifying a weak signal, the noise of the amplifier itself may interfere with the signal seriously, and it is desirable to reduce the noise to improve the signal-to-noise ratio of the output.
With the vigorous development of intelligent wearable device technology, more and more wearable devices are beginning to penetrate the aspects of people's daily life, for example, smart watches, health wristbands, etc. People can record own motion behavior by utilizing the motion function of the wearable device. Among them, the implementation of the motion function of the wearable device needs to be applied to the positioning technology. A Global Positioning System (GPS) Positioning technology is used in wearable devices as the most conventional solution of the existing Positioning technology. Because the device is small in volume and is used closely to the skin, the performance of the GPS antenna is reduced, and the deviation of the GPS positioning precision is caused.
In order to solve the problem of positioning accuracy, a conventional method adopts a GPS dual-frequency positioning technology. The GPS dual-frequency positioning technology adopts an L1 wave band and an L5 wave band for positioning at the same time, wherein the L1 wave band is 1575.42MHz +/-1.023 MHz, and the L5 wave band is 1176.45MHz +/-1.023 MHz. The code rate of the L1 wave band is low, and the L1 wave band is easy to capture; the L5 wave band is high, the frequency spectrum density is easier to concentrate, and the signal is more accurate. The GPS dual-frequency positioning technology realizes quick positioning by capturing L1 wave band signals, and then realizes accurate positioning by capturing L5 wave band signals.
For processing of dual-frequency positioning signals, conventional design circuits include a prescaler filter and a low noise amplifier. Firstly, frequency division is carried out on a double-frequency positioning signal to obtain two single-frequency signals, then, each single-frequency signal is subjected to signal amplification through a low-noise amplifier, and then accurate positioning information is obtained.
Illustratively, fig. 1 is a conventional L1+ L5 dual band positioning signal processing circuit diagram, and as shown in fig. 1, the prescaler filter may be a surface acoustic wave filter, i.e., a SAW filter. "GPS _ IN" indicates an input GPS signal, which is first preliminarily filtered by a filter circuit, which may be a circuit configuration as shown IN fig. 1, including a grounded capacitor C1 and a grounded capacitor C2, and a protection resistor R1. The preliminarily filtered signal enters an antenna pin, namely an ANT pin, of the SAW filter, frequency division is carried out on the signal, and an L1 wave band signal and an L5 wave band signal are respectively output.
Next, the separated signals of each band are amplified, and as shown in fig. 1, the amplification processors may be low noise signal amplifiers, i.e., LNA1 amplifier and LNA2 amplifier. The L5 band signal is amplified by the LNA1 amplifier and outputs a GPS _ L5 signal. The L1 band signal is amplified by the LNA2 amplifier and outputs a GPS _ L1 signal.
Taking signal processing in the L5 waveband as an example, an impedance adjusting circuit is arranged between the LNA1 amplifier and the SAW filter, on one hand, the circuit impedance changes through preliminary filtering and SAW filtering processing of a front-end circuit, and signal transmission is interfered, so that the impedance in a transmission line needs to be stabilized by the adjusting circuit; on the other hand, the impedance adapted by different devices is different, and in order to ensure the working state of the LNA1 amplifier, the input impedance needs to be adjusted.
Specifically, the impedance adjusting circuit disposed between the LNA1 amplifier and the SAW filter may have a circuit structure as shown in fig. 1, and includes an adjusting capacitor C4, an adjusting capacitor C5, and an adjusting inductor L1. One end of the adjusting capacitor C4 is used for inputting the signal after front-end processing, and the other end of the adjusting capacitor C4 is connected to the adjusting capacitor C5 which is grounded and to one end of the adjusting inductor L1. The other end of the adjustment inductor L1 is connected to the LNA1 amplifier input. The circuit is used for adjusting the circuit impedance and adjusting the input impedance of the LNA amplifier, and interference in the signal transmission process is reduced.
However, the conventional dual-band positioning signal processing circuit employs two low-noise amplifiers for amplifying signals of the L1 band signal and the L5 band signal, which not only brings about twice energy loss, but also is not beneficial to further reducing the area of the circuit board in the device, and is not beneficial to improving the integration level.
The application provides a dual-band processing circuit and a positioning device, and aims to solve the technical problems in the prior art.
In the following, exemplary application scenarios of the present application are described.
Fig. 2 is an application scenario of a dual-band processing circuit provided in the present application. The positioning device is a device with a positioning function and can be an intelligent terminal device such as a mobile phone and a tablet personal computer; can be wearable equipment such as intelligent bracelet, children's location wrist-watch. The positioning device can receive GPS signals, process and analyze the received signals and obtain positioning results. The positioning result may be a location point displayed on the electronic map, and may be a location name in a text form, for example, a current local weather displayed in the mobile phone terminal (for example, the temperature of the hai lake area in beijing city is 27 degrees celsius).
When the device is configured with a GPS single-frequency-band positioning technology, the positioning result can be obtained after the signal is processed. When the device is configured with the GPS dual-band positioning technology, as shown in fig. 2, the received dual-band signal is separated into separate band signals, and then the subsequent signal processing is performed to obtain a positioning result.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
Fig. 3 is a schematic structural diagram of a dual-band processing circuit provided in the present application, and as shown in fig. 3, the dual-band processing circuit includes a front-end matching module 10, a low-noise amplifier 20, and a frequency dividing module 30; the front end matching module 10 is configured to receive a dual-band hybrid positioning signal, filter the hybrid positioning signal, and output the filtered hybrid positioning signal; the input end of the low-noise amplifier is connected with the output end of the front-end matching module 10, and the low-noise amplifier is used for amplifying and outputting the signal output by the front-end matching module 10; and the frequency dividing module 30, an input end of which is connected with an output end of the low noise amplifier, wherein the frequency dividing module 30 is used for performing frequency dividing processing on the signal output by the low noise amplifier and outputting a positioning signal of the first frequency band and a positioning signal of the second frequency band.
Illustratively, the dual-band hybrid positioning signal is specifically an L1+ L5 signal, the L1 band being 1575.42MHz + -1.023 MHz, and the L5 band being 1176.45MHz + -1.023 MHz. The L1+ L5 mixed positioning signal is input, and the out-of-band interference signal of the L1+ L5 mixed positioning signal is filtered out through a design circuit in the front-end matching module 10. The signal output from the front-end matching block 10 enters a low noise amplifier, which generates an amplified signal L1+ L5 and inputs the amplified signal to the frequency-dividing block 30. The frequency divider module 30 divides the L1+ L5 mixed signal into two channels, L1 and L5.
According to the design circuit, the double-frequency mixed signal is subjected to filtering processing and signal amplification processing firstly, and then is subjected to frequency division processing, so that two independent frequency band positioning signals are obtained. Compared with the traditional design circuit shown in fig. 1, the circuit has the advantages that the number of low-noise amplifiers in the circuit is reduced, the positioning energy loss can be effectively reduced, the area of the circuit board is further reduced, and the integration level of the circuit is improved.
Further, the front-end matching module 10 includes: a filtering module 11 and a first matching module 12. Fig. 4 is a schematic structural diagram of a front-end processing module in a dual-band processing circuit provided in the present application, and as shown in fig. 4, an input end of a filtering module 11 is used as an input end of a front-end matching module 10, and is configured to receive a dual-band hybrid positioning signal; the filtering module 11 is configured to perform filtering processing on the hybrid positioning signal; the input end of the first matching module 12 is connected with the output end of the filtering module 11, and the output end of the first matching module 12 is used as the output end of the front-end matching module 10; the first matching module 12 is used to adjust the matching impedance.
The dual-band signal includes two signals of different bands, and the design circuit of the filtering module 11 is described below by taking the L1+ L5 signal as an example.
In order to filter the interference of two different bands, the filtering module 11 may further include: a first band filter circuit and a second band filter circuit. The first frequency band filter circuit is connected in series with the second frequency band filter circuit, the first frequency band filter circuit is used for filtering out high-frequency out-of-band interference, and the second frequency band filter circuit is used for filtering out low-frequency out-of-band interference.
The L5 signal frequency band is higher than the L1 signal frequency band, so the first frequency band filter circuit is used for filtering out the out-of-band interference in the part higher than the L5 frequency band; the first frequency band filter circuit is used for filtering out-of-band interference below the L1 frequency band part. The relative position of the first frequency band filter circuit and the second frequency band filter circuit is not limited, namely, whether high-frequency out-of-band interference or low-frequency out-of-band interference is filtered out firstly is not limited.
Fig. 5 is a circuit diagram of a filtering module in a front-end processing module according to the present application, wherein a first band filtering circuit is disposed at a front end of a second band filtering circuit. The circuit for filtering out high frequency interference and the circuit for filtering out low frequency interference will be described with reference to fig. 5.
As for the first frequency band filter circuit for filtering out the high frequency interference, as shown in fig. 5, the first frequency band filter circuit includes a first inductor L101 and a first capacitor C101; a first end of the first inductor L101 is connected to a first end of the first capacitor C101, and is used as an input end of the filtering module 11; the second end of the first inductor L101 is connected to the second end of the first capacitor C101, and serves as an output end of the first band filter circuit.
Specifically, the first inductor L101 and the first capacitor C101 form a parallel filter circuit, and are connected in series in the matching circuit. When the signal frequency is
(L is the inductance of the first inductor L101, C is the capacitance of the first capacitor C101), the parallel resonant circuit achieves resonance, and exhibits a high impedance state at the resonance frequency, so as to achieve the purpose of filtering out high-frequency out-of-band signals.
For the second band filter circuit for filtering low frequency interference, as shown in fig. 5, the second band filter circuit includes a second inductor L102 and a second capacitor C102; a first end of the second capacitor C102 is connected to an output end of the first frequency band filter circuit, and serves as an output end of the filter module 11; a second terminal of the second capacitor C102 is connected to a first terminal of the second inductor L102, and a second terminal of the second inductor is grounded.
Specifically, the second inductor L102 and the second capacitor C102 form a series filter circuit, and are connected in parallel in the matching circuit. When the frequency of the signal is
(L is the inductance of the second inductor L102, C is the capacitance of the second capacitor C102), the series resonant circuit resonates, and presents a short-circuit to ground at the resonant frequency, so as to filter out the out-of-band signal.
The dual band processing Circuit of the present application is integrated on a Printed Circuit Board (PCB). The PCB is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. In the signal transmission process of the high-frequency circuit, when the impedances of the signal source or the transmission line and the load are not equal, namely the impedances are not matched, reflection occurs, and the original signal is further influenced. Since the signal has a short wavelength when the frequency of the signal is high, the shape of the original signal will be changed by the reflection signal superimposed on the original signal when the wavelength is comparable to the length of the transmission line.
When the high-speed signal line on the circuit board is not matched with the load impedance, oscillation, radiation interference and the like can be generated. Making the load impedance equal to the characteristic impedance of the transmission line so as not to generate reflection is called impedance matching. The impedance of the transmission line is affected by many factors, and the line itself will cause the variation of characteristic impedance value due to different factors such as etching, lamination thickness, and width of the conductive wire.
When the signal passes through the first frequency band filter circuit and the second frequency band filter circuit, the impedance of the circuit can be changed, and the impedance of the circuit needs to be adjusted in order to improve the signal transmission rate and quality of the transmission line. The first matching module 12 for impedance matching will be described below.
Based on the above example, fig. 6 is a circuit diagram of a first matching module in a front-end processing module provided by the present application. Wherein, the first matching module 12 includes: a third capacitor C103 and a fourth capacitor C104; a first end of the third capacitor C103 is connected to an output end of the filter module 11, and serves as an input end of the first matching module 12; a second end of the third capacitor C103 is connected to a first end of the fourth capacitor C104, and serves as an output end of the first matching module 12; the second terminal of the fourth capacitor C104 is grounded.
Specifically, the third capacitor C103 and the fourth capacitor C104 form an L-type matching network, or the L-type matching network may be formed by two inductors. The L-shaped matching network adjusts the impedance of the circuit to a stable value, optionally 50ohm or 75 ohm. In the actual circuit design process, the circuit for impedance matching is designed according to the whole circuit structure, the requirements on the circuit impedance are different, and the circuit structure for impedance matching and the adjusted impedance value are not limited in the application.
Further, a front end debugging unit 13 is provided between the front end matching module 10 and the low noise amplifier. Fig. 7 is a schematic structural diagram of another dual-band processing circuit provided in the present application, as shown in fig. 7, an input end of a front-end debugging unit 13 is connected to an output end of a front-end matching module 10, and an output end of the front-end debugging unit 13 is connected to an input end of a low noise amplifier; and a front end debugging unit 13 for adjusting the input impedance of the low noise amplifier. Optionally, the front-end debugging unit 13 adjusts the input impedance of the low noise amplifier to be conjugate matching, so as to obtain the maximum signal output power of the signal source.
On the basis of the above example, fig. 8 is a circuit diagram of a front-end debugging unit provided by the present application. As shown in fig. 8, the front-end debugging unit 13 includes: a third inductance L103; a first end of the third inductor L103 is connected to the output end of the front-end matching module 10, and a second end of the third inductor L103 is connected to the input end of the low-noise amplifier.
In an actual electronic circuit, the input impedance and the output impedance are widely present in various levels of electronic circuits, various measuring instruments and various electronic components. When the signal source and the amplifying circuit or the amplifying circuit and the load are not equal in impedance, they cannot be directly connected. The key to impedance matching is that the output impedance of the front stage is equal to the output impedance of the rear stage. Since the inductor device is not easy to integrate with the chip, an inductor is connected in series at the front end of the low noise amplifier to adjust the input impedance.
Further, the low noise amplifier receives and amplifies the signal output from the front end debug unit 13, and generates an amplified signal of L1+ L5. The low noise amplifier will be described below.
Fig. 9 is a circuit diagram of a low noise amplifier according to the present application, and as shown in fig. 9, the low noise amplifier 20 includes: the low-noise amplifier comprises a low-noise amplification chip, a power supply filtering module and an impedance element; wherein, the signal input pin of the low noise amplification chip is used as the input end of the low noise amplifier 20; a signal output pin of the low noise amplifier chip is used as an output end of the low noise amplifier 20; the power input pin of the low noise amplifier 20 is connected to a power supply through a power filter module; the power supply is used for providing a power supply signal; the power supply filtering module is used for filtering noise in the power supply signal; the enable pin of the low noise amplifier 20 is connected to an enable signal via an impedance element.
Specifically, as shown in fig. 9, the LNA chip has 6 pins, wherein the input pin is an RFIN pin, which is used as an input terminal of the low noise amplifier 20 and receives a signal output by the front end circuit; the output pin is an RFOUT pin, which serves as an output terminal of the low noise amplifier 20 and outputs a signal to a back-end circuit.
The power input pin is a VDD pin and is connected with a power supply through a power filtering module. The power supply filtering module is used for filtering power supply noise and stabilizing power supply voltage, and the performance reduction of an LNA (low-noise amplifier) caused by power supply noise and unstable power supply voltage of an LNA chip is avoided. In an alternative power filter circuit structure, as shown in fig. 9, a first end of a fifth capacitor C105 is connected between a power supply and a VDD pin, and a first end of the fifth capacitor C105 is grounded.
The enable pin is an EN pin and is connected with an enable signal through an impedance element. The impedance element is used for filtering noise and current limiting of the enable signal, and the enable signal is prevented from being influenced by interference signals and pin damage caused by transient pulse. In an alternative switched-in impedance element circuit configuration, as shown in fig. 9, a fourth inductor L104 is connected in series between the EN pin and the enable signal.
In actual electronic circuit design, the selection of the low noise amplifier 20 is not limited in the present application as long as the low noise amplifier can support dual frequency signals of L1 and L5. Of course, the lower the noise figure of the low noise amplifier 20, the higher the gain achieved for the circuit function.
Further, the L1+ L5 dual-frequency amplified signal generated by the low noise amplifier 20 is input into the frequency dividing module 30, so as to obtain the L1 frequency band signal and the L5 frequency band signal, respectively. The frequency-dividing module 30 will be described below.
Illustratively, fig. 10 is a circuit diagram of a frequency-division module provided in the present application. As shown in fig. 10, the frequency dividing module 30 includes a binaural watch filter; wherein, the signal input pin of the double acoustic surface filter is used as the input end of the frequency dividing module 30; the first signal output pin and the second signal output pin of the dual acoustic meter filter are used as output ends of the frequency dividing module 30 to output the positioning signal of the first frequency band and the positioning signal of the second frequency band, respectively.
Specifically, as shown in fig. 10, the double acoustic surface filter, i.e., the double SAW filter, has 10 pins. The input pin is an ANT pin and receives a signal output by the front-end circuit. The output pins are a P _ Lch pin and a P _ Hch pin, and respectively output an L1 frequency band signal and an L5 frequency band signal. The other pins are grounded.
In actual electronic circuit design, the double SAW filter is not limited in choice, as long as the mixed signal can be split. Of course, the higher the isolation between the two output ports of the double SAW filter is, the better the out-of-band rejection effect is, the lower the insertion loss is, the higher the gain of the circuit function is.
In consideration of the matching problem between the output impedance of the previous stage and the output impedance of the subsequent stage, a second matching module 40 is provided between the low noise amplifier 20 and the frequency dividing module 30. The second matching module 40 is described below.
Fig. 11 is a schematic structural diagram of another dual-band processing circuit provided in the present application, as shown in fig. 11, an input terminal of a second matching module 40 is connected to an output terminal of the low noise amplifier 20, and an output terminal of the second matching module 40 is connected to an input terminal of the frequency dividing module 30; the second matching module 40 is used to adjust the insertion loss between the output of the low noise amplifier 20 and the input of the frequency dividing module 30.
Fig. 12 is a circuit diagram of a second matching module provided in the present application, and as shown in fig. 12, the second matching module 40 includes: a sixth capacitor C106, a seventh capacitor C107, and an eighth capacitor C108; a first end of the sixth capacitor C106 is connected to the output end of the low noise amplifier 20 and a first end of the seventh capacitor C107, and a second end of the sixth capacitor C106 is grounded; a second end of the seventh capacitor C107 is connected to a first end of the eighth capacitor C108 and the input end of the frequency dividing module 30; a second terminal of the eighth capacitor C108 is grounded.
Specifically, the sixth capacitor C106, the seventh capacitor C107, and the eighth capacitor C108 form a pi-type matching network, or form a pi-type matching network by inductors, and are used to adjust insertion loss between the output terminal of the low noise amplifier 20 and the input port of the dual SAW filter.
Fig. 13 is a circuit diagram of a dual band processing circuit according to the present application. Inputting an L1+ L5 dual-frequency-band signal, and sequentially carrying out filtering processing, signal amplification processing and frequency division processing. Compared with the conventional dual-band signal processing circuit structure shown in fig. 1, the circuit structure shown in fig. 13 reduces the number of LNAs used, and simultaneously correspondingly reduces the circuit structure of the front end of the LNA for adjusting the circuit impedance and the input impedance, which is beneficial to further reducing the area of the PCB board. And because the use amount of LNA reduces, the total power consumption of LNA is half of the original power consumption when GPS positioning, greatly reducing the power consumption when GPS positioning.
Further, the dual-band processing circuit provided by the application has lower front-end insertion loss. The GPS signal out-of-band low-frequency interference and high-frequency interference are filtered out by adopting the first frequency band filter circuit and the second frequency band filter circuit respectively. The front-end matching module 10 of the present application has a smaller insertion loss and a wider bandwidth than the conventionally used pre-acoustic surface filter. Simulation experiments show that the insertion loss of the front-end matching module 10 is about 0.1dB and is smaller than the insertion loss of an acoustic surface filter of about 1dB, the simulation result of the front-end matching module 10 is shown in FIG. 14, the horizontal axis is frequency, the vertical axis is loss, m1 corresponds to an L5 frequency band, and the loss is 0.099 dB; m2 corresponds to the L1 band with a loss of 0.119 dB. Lower front-end insertion loss is beneficial to stronger GPS signal intensity received by equipment, and the positioning precision of the GPS is improved.
In addition, the rear double SAW filter isolates L1 and L5 frequency bands, so that signals of an L1 frequency band and signals of an L5 frequency band are not influenced by each other; on the other hand, the rear double SAW filter further filters out-of-band interference of signals in the L1 frequency band and signals in the L5 frequency band, and stability of receiving performance is guaranteed.
Fig. 15 is a schematic structural diagram of a positioning apparatus provided in the present application, including the dual-band processing circuit and the positioning processing module; the dual-frequency band processing circuit is connected with the positioning processing module and outputs a positioning signal of a first frequency band and a positioning signal of a second frequency band based on a received mixed positioning signal of the dual-frequency band; the positioning processing module obtains a positioning result based on the positioning signal of the first frequency band and the positioning signal of the second frequency band. The positioning device can be any product or device needing positioning, such as a child positioning watch, a smartphone with a positioning function, and the like.
In summary, the dual band processing circuit and the positioning apparatus provided in the present application include a front end matching module 10, a low noise amplifier 20 and a frequency dividing module 30; the front end matching module 10 is used for receiving the mixed positioning signals of the double frequency bands, filtering the mixed positioning signals and outputting the filtered mixed positioning signals; a low noise amplifier 20, an input end of which is connected to an output end of the front end matching module 10, and is configured to amplify and output a signal output by the front end matching module 10; and a frequency dividing module 30, an input end of which is connected to the output end of the low noise amplifier 20, and is configured to perform frequency dividing processing on the signal output by the low noise amplifier 20, and output a positioning signal of the first frequency band and a positioning signal of the second frequency band. According to the method, the dual-frequency mixed signal is subjected to filtering processing and signal amplification processing firstly and then subjected to frequency division processing, so that two independent frequency band positioning signals are obtained. The dual-band processing circuit reduces the number of the low-noise amplifiers 20, effectively reduces energy consumption during positioning, and is beneficial to further reducing the area of the circuit board. In addition, the front-end matching module 10 reduces the front-end insertion loss; the rear double SAW filter filters the positioning signal again, and the stability of the receiving performance is ensured.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
Claims (12)
1. A dual-band processing circuit is characterized in that the processing circuit comprises a front end matching module, a low noise amplifier and a frequency dividing module;
the front end matching module is used for receiving the mixed positioning signals of the double frequency bands, filtering the mixed positioning signals and outputting the filtered mixed positioning signals;
the input end of the low-noise amplifier is connected with the output end of the front-end matching module, and the low-noise amplifier is used for amplifying and outputting the signal output by the front-end matching module;
and the input end of the frequency division module is connected with the output end of the low-noise amplifier, and the frequency division module is used for carrying out frequency division processing on the signal output by the low-noise amplifier and outputting a positioning signal of a first frequency band and a positioning signal of a second frequency band.
2. The circuit of claim 1, wherein the front-end matching module comprises: the device comprises a filtering module and a first matching module; wherein the content of the first and second substances,
the input end of the filter module is used as the input end of the front end matching module and is used for receiving a mixed positioning signal of double frequency bands; the filtering module is used for filtering the mixed positioning signal;
the input end of the first matching module is connected with the output end of the filtering module, and the output end of the first matching module is used as the output end of the front-end matching module; the first matching module is used for adjusting matching impedance.
3. The circuit of claim 2, wherein the filtering module comprises: a first frequency band filter circuit and a second frequency band filter circuit; wherein the content of the first and second substances,
the first frequency band filter circuit is connected with the second frequency band filter circuit in series, the first frequency band filter circuit is used for filtering out high-frequency out-of-band interference, and the second frequency band filter circuit is used for filtering out low-frequency out-of-band interference.
4. The circuit of claim 3,
the first frequency band filter circuit comprises a first inductor and a first capacitor; the first end of the first inductor is connected with the first end of the first capacitor and serves as the input end of the filtering module; a second end of the first inductor is connected with a second end of the first capacitor and serves as an output end of the first frequency band filter circuit;
the second frequency band filter circuit comprises a second inductor and a second capacitor; the first end of the second capacitor is connected with the output end of the first frequency band filter circuit and serves as the output end of the filter module; and the second end of the second capacitor is connected with the first end of the second inductor, and the second end of the second inductor is grounded.
5. The circuit of claim 2, wherein the first matching module comprises: a third capacitor and a fourth capacitor; wherein the content of the first and second substances,
the first end of the third capacitor is connected with the output end of the filtering module and serves as the input end of the first matching module; the second end of the third capacitor is connected with the first end of the fourth capacitor and serves as the output end of the first matching module; and the second end of the fourth capacitor is grounded.
6. The circuit of claim 1, wherein a front end debugging unit is arranged between the front end matching module and the low noise amplifier; wherein the content of the first and second substances,
the input end of the front end debugging unit is connected with the output end of the front end matching module, and the output end of the front end debugging unit is connected with the input end of the low noise amplifier; the front end debugging unit is used for adjusting the input impedance of the low noise amplifier.
7. The circuit of claim 6, wherein the front-end debug unit comprises: a third inductor; wherein the content of the first and second substances,
and the first end of the third inductor is connected with the output end of the front end matching module, and the second end of the third inductor is connected with the input end of the low noise amplifier.
8. The circuit of any of claims 1-7, wherein the low noise amplifier comprises: the low-noise amplifier comprises a low-noise amplification chip, a power supply filtering module and an impedance element; wherein the content of the first and second substances,
a signal input pin of the low noise amplification chip is used as an input end of the low noise amplifier; a signal output pin of the low noise amplification chip is used as an output end of the low noise amplifier;
the power input pin of the low-noise amplifier is connected to a power supply through a power filtering module; the power supply is used for providing a power supply signal; the power supply filtering module is used for filtering noise in the power supply signal; the enable pin of the low noise amplifier is connected with an enable signal through an impedance element.
9. The circuit of any of claims 1-7, wherein the frequency division module comprises a binaural watch filter; wherein the content of the first and second substances,
a signal input pin of the double-sound-meter filter is used as an input end of the frequency division module; and a first signal output pin and a second signal output pin of the double-sound-meter filter are used as output ends of the frequency division module to respectively output a positioning signal of a first frequency band and a positioning signal of a second frequency band.
10. The circuit according to any one of claims 1-7, wherein a second matching module is disposed between the low noise amplifier and the frequency dividing module;
the input end of the second matching module is connected with the output end of the low noise amplifier, and the output end of the second matching module is connected with the input end of the frequency dividing module; the second matching module is used for adjusting the insertion loss between the output end of the low noise amplifier and the input end of the frequency dividing module.
11. The circuit of claim 10, wherein the second matching module comprises: a sixth capacitor, a seventh capacitor and an eighth capacitor;
the first end of the sixth capacitor is connected with the output end of the low noise amplifier and the first end of the seventh capacitor, and the second end of the sixth capacitor is grounded; the second end of the seventh capacitor is connected with the first end of the eighth capacitor and the input end of the frequency dividing module; and the second end of the eighth capacitor is grounded.
12. A positioning device comprising the dual band processing circuit of any of claims 1-10, and a positioning processing module; wherein the content of the first and second substances,
the dual-frequency band processing circuit is connected with the positioning processing module and outputs a positioning signal of a first frequency band and a positioning signal of a second frequency band based on a received mixed positioning signal of the dual-frequency band; and the positioning processing module obtains a positioning result based on the positioning signal of the first frequency band and the positioning signal of the second frequency band.
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