CN114039233A - Pressure welding type pin for realizing stress release, pressure welding type passive device and circuit system - Google Patents

Pressure welding type pin for realizing stress release, pressure welding type passive device and circuit system Download PDF

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Publication number
CN114039233A
CN114039233A CN202111210919.XA CN202111210919A CN114039233A CN 114039233 A CN114039233 A CN 114039233A CN 202111210919 A CN202111210919 A CN 202111210919A CN 114039233 A CN114039233 A CN 114039233A
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CN
China
Prior art keywords
pin
crimping
type
crimp
elastic
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Pending
Application number
CN202111210919.XA
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Chinese (zh)
Inventor
王民
郭园园
余辰将
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Zhixin Semiconductor Co ltd
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Zhixin Semiconductor Co ltd
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Priority to CN202111210919.XA priority Critical patent/CN114039233A/en
Publication of CN114039233A publication Critical patent/CN114039233A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
    • H01R13/17—Pins, blades or sockets having separate spring member for producing or increasing contact pressure with spring member on the pin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

The invention discloses a crimping type pin for realizing stress release, a crimping type passive device and a circuit system, and relates to the technical field of semiconductors. A crimp-style pin comprising: a pin body; the pin crimping part is arranged on the pin body and is used for being connected with the first mounting part; the pin fixing part is arranged on the pin body and is used for being connected with the second mounting part; and the elastic buffer part is arranged on the pin body, is positioned between the pin pressing part and the pin fixing part and is used for realizing the stress release of the pin body. The crimping type passive device comprises a passive device body and crimping type pins. The circuit system comprises a first mounting piece, a second mounting piece and a crimping type pin. The invention has the following advantages: in the crimping process, the effectual stress that has slowed down first installed part and second installed part and received of elastic buffer portion has avoided the impaired and easy cracked problem of welt of via hole of PCB board effectively.

Description

Pressure welding type pin for realizing stress release, pressure welding type passive device and circuit system
Technical Field
The invention relates to the technical field of semiconductors, in particular to a crimping type pin, a crimping type passive device and a circuit system for realizing stress release.
Background
In the design application of the power semiconductor module, the connection between the substrate of the semiconductor module and the external PCB is usually designed as a solder pin (solder pin) and a Press pin (Press pin). The disadvantages of the soldering type pin are: the welding is troublesome, the connection of the assembled semiconductor and the PCB is rigid connection, and the internal stress of the pins is large. The conventional crimping type pin is generally in a fish eye structure. The crimping type pin has the advantages of convenience in installation and disassembly, reliability and the like. However, the conventional crimping type pin only changes the installation mode of the pin, and the connection node of the liner plate and the external PCB is still in rigid connection after the crimping type pin is assembled. Specifically, after the bottom of crimping type pin is installed on semiconductor module's welt, when installing the PCB board again at the top of pin, need push down the PCB board, the position that leads to the bottom of crimping type pin and semiconductor module to be connected bears very big stress in short-term, easily leads to crimping type pin or semiconductor module impaired, and simultaneously, when the top of crimping type pin is connected with the PCB board, stress is also very big, is unfavorable for the assembly and easily leads to the via hole of PCB board impaired.
Disclosure of Invention
The invention aims to overcome the defects of the background technology and provide a crimping type pin, a crimping type passive device and a circuit system for realizing stress release.
In a first aspect, a crimp pin for achieving stress relief is provided, including:
a pin body;
the pin crimping part is arranged on the pin body and is used for being connected with the first mounting part;
the pin fixing part is arranged on the pin body and is used for being connected with the second mounting part; and
and the elastic buffer part is arranged on the pin body, is positioned between the pin crimping part and the pin fixing part and is used for realizing the stress release of the pin body.
Further, the elastic buffer portion includes at least one elastic member.
Furthermore, one end of the at least one elastic piece is connected with the pin fixing part, and the other end of the at least one elastic piece is connected with the pin body or the pin crimping part.
Furthermore, the elastic buffering part further comprises a supporting limiting part, the supporting limiting part is arranged in the elastic part along the deformation direction of the elastic part, a distance is kept between one end of the supporting limiting part and the pin fixing part, and the other end of the supporting limiting part is connected with the pin body or the pin crimping part.
The beneficial effects of the further scheme are as follows: through the effect that supports the locating part, not only can avoid the deformation volume of elastic component too big, can restrict the deformation direction of elastic component moreover, guarantee the installation convenience of crimping type pin.
Furthermore, the pin body is provided with a first connecting position and a second connecting position at intervals along the deformation direction of the elastic piece; one end of the at least one elastic piece is connected with the first connecting position of the pin body, and the other end of the at least one elastic piece is connected with the second connecting position of the pin body.
In one embodiment, the elastic buffer or the elastic member is a spiral structure.
In one embodiment, the pin press-connecting part is a fish-eye pin structure, one end of which is connected with the pin body, and the other end of which is provided with a pin guide part in a tip shape.
The pin guide part is arranged at one end of the pin crimping part, which is far away from the pin body, and the pin crimping part is guided into a through hole of the PCB by the pin guide part, so that the mounting efficiency and the mounting precision are improved; after entering the via hole, the fisheye pin structure is continuously extruded and then deformed to be in close contact with a metal layer on the via hole, so that the installation quality is ensured.
In one embodiment, the pin crimping portion includes an inner layer of copper, an intermediate layer of nickel, and an outer layer of tin.
The tin layer is plated on the outer part of the pin press-connection part, so that the pin press-connection part can be used as a press-connection type pin and a welding type pin.
In a second aspect, a crimping type passive device is provided, which includes a passive device body and at least two crimping type pins, wherein the passive device body is used as the second mounting part and is connected with the pin fixing parts of the at least two crimping type pins.
The crimping type pin is arranged on the passive device body, so that the passive device body can be directly crimped on a PCB (printed circuit board) and also can be directly pulled out of the PCB, and compared with the traditional welding type passive device, the mounting and dismounting efficiency is obviously improved.
In a third aspect, a circuit system is provided, which includes a first mounting part, a second mounting part and a plurality of the crimping pins, wherein the first mounting part is connected with pin crimping parts of the plurality of the crimping pins; the second mounting member is connected to the pin fixing portions of the plurality of press-fit type pins.
Compared with the prior art, the invention has the following advantages: by providing the elastic buffer portion on the pin body, and the elastic buffer portion is located between the pin crimping portion for connecting with the first mounting member (such as a PCB board) and the pin fixing portion for connecting with the second mounting member (such as a board of a semiconductor module). Consequently in the crimping in-process, the effectual stress that receives of first installed part and second installed part that has slowed down of elastic buffer portion has avoided the impaired and easy cracked problem of welt (for example ceramic welt) of via hole of PCB board effectively.
Drawings
Fig. 1 is a schematic perspective view of a crimp-type lead pin for realizing stress relief according to embodiment 1 of the present invention;
FIG. 2 is a schematic front view of the structure of FIG. 1;
fig. 3 is a schematic perspective view of a crimp-type pin for achieving stress relief according to embodiment 2 of the present invention;
fig. 4 is a schematic front view of a crimping type pin for realizing stress relief according to embodiment 3 of the present invention;
fig. 5 is a schematic front view of a crimp-type passive device corresponding to a crimp-type pin in embodiment 1 of the present invention;
fig. 6 is a schematic front view of another structure of the crimp-type passive device of fig. 5;
fig. 7 is a schematic structural diagram of a circuit system corresponding to the crimp-type pin in embodiment 1 of the present invention.
Fig. 8 is a schematic diagram of another structure of the circuit system in fig. 7.
In the figure: 10-crimp type pins; 11-a pin body; 111-a first connection location; 112-a second connection location; 12-a pin crimping portion; 13-a pin fixing part; 14-an elastic buffer; 141-an elastic member; 142-a support limit; 15-a pin guide; 20-a PCB board; 30-a lining plate; 40-a passive device body; 41-heat dissipation coating; 42-bending part.
Detailed Description
Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the specific embodiments, it will be understood that they are not intended to limit the invention to the embodiments described. On the contrary, it is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the invention as defined by the appended claims. It should be noted that the method steps described herein may be implemented by any functional block or functional arrangement, and that any functional block or functional arrangement may be implemented as a physical entity or a logical entity, or a combination of both.
In order that those skilled in the art will better understand the present invention, the following detailed description of the invention is provided in conjunction with the accompanying drawings and the detailed description of the invention.
Note that: the example to be described next is only a specific example, and does not limit the embodiments of the present invention necessarily to the following specific steps, values, conditions, data, orders, and the like. Those skilled in the art can, upon reading this specification, utilize the concepts of the present invention to construct more embodiments than those specifically described herein.
Example 1
Referring to fig. 1 and 2, an embodiment of the invention provides a crimping type pin 10 for achieving stress relief, including a pin body 11, a pin crimping part 12, a pin fixing part 13 and an elastic buffer part 14.
The pin body 11 in this embodiment is a rod-shaped structure, but may be a column-shaped structure in other embodiments.
In one embodiment, a pin crimping part 12 is provided at the top end of the pin body 11 for connection with the first mount.
In this embodiment, the first mounting member is preferably a PCB board 20, and the pin crimping parts 12 are disposed in vias of the PCB board 20. The pin press-connection part 12 is of a fish-eye pin structure and is provided with a fish-eye hole.
One end of the pin press-bonding part 12 is connected to the pin body 11, and the other end is provided with a tip-shaped pin guide part 15. The tip diameter of the pin guide 15 is smaller than the via hole diameter of the PCB board 20 so as to facilitate quick positioning and mounting of the pin press-connecting part 12 on the PCB board 20. The pin crimping part 12 is pressed and deformed in the via hole of the PCB board 20 to be interference-fitted with the via hole, thereby achieving sufficient and close contact of the pin crimping part 12 with the PCB board 20.
In one embodiment, pin crimping portion 12 includes an inner layer of copper, an intermediate layer of nickel, and an outer layer of tin. The pin crimping part 12 can be crimped with the PCB board 20 and can be soldered and fixed with the PCB board 20. Of course, the thickness of the copper layer, the nickel layer and the tin layer is not specifically limited in this embodiment, and may satisfy the use requirement.
The lead fixing portion 13 may be directly disposed at the bottom end of the lead body 11. The lead fixing portion 13 may be indirectly disposed at the bottom end of the lead body 11. For example, the bottom end of the lead body 11 is first provided with the elastic buffer 14, and the lead fixing portion 13 is then provided at the bottom end of the elastic buffer 14.
The pin fixing portion 13 is used for connection with the second mount. The second mounting member in this embodiment is preferably a backing plate 30 of the semiconductor module. The pin fixing portion 13 is welded and fixed to the second mounting member.
The elastic buffer 14 is disposed on the pin body 11 and located between the pin crimping part 12 and the pin fixing part 13 for achieving stress relief of the pin body 11.
The deformation direction of the elastic buffer 14 is the same as the mounting direction or the longitudinal direction of the pin body 11. Of course, the elastic buffer portion 14 is not limited to such a deformation direction.
In one embodiment, the pin body 11, the pin press-bonding part 12, the pin fixing part 13, and the elastic buffer part 14 are integrally formed.
In one embodiment, the crimp pin 10 includes an annealing process during the manufacturing process to relieve stress of the crimp pin 10.
In one embodiment, the elastic buffer 14 includes an elastic member 141 and a support stopper 142.
The elastic member 141 has a spiral structure, but is not limited to a double spiral structure in the present embodiment, and may have a single spiral structure, a triple spiral structure, or other spiral structures.
In one embodiment, the elastic member 141 is a spring structure or a leaf spring structure. The spring sheet structure can be an S-shaped spring sheet or a U-shaped spring sheet or other forms.
The top end of the elastic member 141 of the double-helix structure in this embodiment is connected to the bottom end of the pin body 11, and the bottom end of the elastic member 141 is connected to the pin fixing portion 13.
In one embodiment, the bottom end of the elastic member 141 is connected to the pin fixing part 13, and the top end of the elastic member 141 is connected to the pin press-contacting part 12. That is, after the elastic member 141 crosses over the pin body 11, both ends of the elastic member 141 are respectively connected to the pin fixing part 13 and the pin press-contacting part 12, and such elastic member 141 is preferably a strip-shaped spring structure, for example, when the press-contact pin 10 is subjected to a vertical pressure, the elastic member 141 crossing over the strip-shaped spring structure of the pin body 11 is subjected to a bending deformation under pressure to release the stress of the press-contact pin 10, thereby ensuring that the first mounting part and the second mounting part are not damaged.
In this embodiment, the supporting and limiting member 142 is disposed in the elastic member 141 along the deformation direction of the elastic member 141, and the supporting and limiting member 142 is also a rod-shaped structure, and the cross-sectional area thereof is smaller than that of the lead body 11.
The bottom end of the supporting and limiting member 142 keeps a distance from the pin fixing portion 13, and the top end of the supporting and limiting member 142 is connected to the pin body 11. When the press-fit type pin 10 is subjected to a vertical pressure, the elastic member 141 deforms and the supporting and limiting member 142 moves downward. The supporting and limiting member 142 not only plays a supporting role, but also plays a limiting role. Especially, when the elastic member 141 is a spiral structure, the supporting and limiting member 142 in the spiral structure can limit the horizontal displacement of the elastic member 141.
In one embodiment, the bottom end of the supporting stopper 142 is spaced apart from the pin fixing portion 13, and the top end of the supporting stopper 142 is connected to the bottom end of the pin press-fitting portion 12. The supporting and limiting member 142 in this embodiment is suitable for the embodiment in which the elastic member 141 spans the lead body 11.
In one embodiment, the side ends of the lead body 11 may be further provided with grooves spaced along the length thereof.
In one embodiment, the bottom end of the lead body 11 may be further provided with a base, and the cross-sectional area of the base is larger than that of the lead body 11. The elastic buffer 14 is disposed at an end of the base opposite to the pin body 11. The base can restrict the vertical displacement volume of PCB board 20 in the installation, avoids PCB board 20 to push down the in-process and moves down the stroke too big.
Example 2
Referring to fig. 3, the structure of a crimp-type pin 10 for realizing stress relief provided in the present embodiment 2 is substantially the same as that of the embodiment 1, except that: the crimp-type pin 10 includes a pin body 11, a pin crimping portion 12, a pin fixing portion 13, and an elastic buffer portion 14 of an integrally molded structure. Wherein the elastic buffer portion 14 includes an elastic member 141.
The structure of the crimp pin 10 from the top end to the bottom end is a pin crimping part 12, a pin body 11, an elastic buffer part 14 and a pin fixing part 13 in sequence.
Compared to embodiment 1, the elastic buffering portion 14 of the present embodiment lacks the supporting limiting member 142, and the elastic buffering effect of the elastic buffering portion 14 is better. In order to ensure sufficient supporting effect of the press-fit type pin 10, the elastic member 141 of the elastic buffer 14 of the present embodiment may have a triple-spiral structure.
Example 3
Referring to fig. 4, the present embodiment 3 provides a crimp-type pin 10 with stress relief structure substantially the same as that of embodiment 1, except that: the crimp-type pin 10 includes a pin body 11, a pin crimping portion 12, a pin fixing portion 13, and an elastic buffer portion 14 of an integrally molded structure. Wherein the elastic buffer portion 14 includes an elastic member 141.
The pin body 11 is provided with a first connection position 111 and a second connection position 112 at intervals along the deformation direction of the elastic member 141. In this embodiment, the first connection position 111 is disposed at a connection position of the pin body 11 and the pin crimping part 12. The second connection position 112 is provided at a connection of the pin body 11 and the pin fixing part 13.
The elastic member 141 is a spiral structure and spirally arranged on the pin body 11. The top end of the elastic element 141 is connected to the first connection position 111 of the lead body 11, and the bottom end of the elastic element 141 is connected to the second connection position 112 of the lead body 11 or keeps a distance.
Compared to embodiment 1, the lower portion of the lead body 11 of the present embodiment can be regarded as the supporting and limiting member 142 of the elastic buffer 14 of embodiment 1. The crimp-type pin 10 of the present embodiment is simpler in structure. Of course, it should be noted that the length of the lead body 11 can be designed and manufactured according to actual needs.
Referring to fig. 5 and 6, an embodiment of the present invention provides a crimp-type passive device, including a passive device body 40 and a crimp-type pin 10 in embodiment 1.
The crimp-type pin 10 of the present embodiment includes: the lead frame comprises a lead body 11, a lead press-bonding part 12, a lead fixing part 13 and an elastic buffer part 14. The pin crimping part 12 is arranged on the pin body 11 and is used for being connected with the first mounting part; the pin fixing part 13 is provided on the pin body 11 for connection with the second mount. The elastic buffer 14 is disposed on the pin body 11 and located between the pin crimping part 12 and the pin fixing part 13 for achieving stress relief of the pin body 11.
The passive device body 40 in the present embodiment is connected as a second mounting member to the pin fixing parts 13 of at least two crimp-type pins 10.
The elastic buffer 14 includes an elastic member 141, and the elastic member 141 has a double-spiral structure.
As shown in fig. 5, two crimp-type pins 10 are connected to the passive device body 40, but in practice, more crimp-type pins 10 may be connected to the passive device body 40.
In one embodiment shown in fig. 5, the pin fixing parts 13 of the two crimp-type pins 10 are respectively solder-fixed to the two electrodes of the passive device body 40.
In one embodiment shown in fig. 6, the lead fixing portions 13 of the two crimp-type leads 10 are provided with bent portions 42, respectively, and are fixed by soldering to the two electrodes of the passive component body 40 via the bent portions 42. It should be noted that, according to needs, one of the electrodes of the passive device body 40 may be connected to one of the crimp pins 10 through the bending portion 42, and the other electrode of the passive device body 40 is directly soldered to the other crimp pin 10, so that the two crimp pins 10 connected to the passive device body 40 are oriented in different directions, so that the two electrodes of the passive device body 40 are respectively connected to the two PCB boards 20 in different directions.
It should be noted that the passive device body 40 may be a resistor, a capacitor or an inductor, and correspondingly, the shape thereof may be a cube, a cylinder, or the like.
In order to improve the heat dissipation of the pressure bonding type passive device, a heat dissipation coating 41 may be applied to the end surface of the passive device body 40. After the press-fit type passive device is mounted on the PCB board 20, the heat dissipation coating 41 is closely attached to the PCB board 20.
The crimping type passive device solves the problem that all passive devices in the existing market can only be assembled by using a welding method. The integrated crimping passive device is creatively designed, so that the circuit board is assembled without experience enrichment, special equipment and special materials, the assembly difficulty is greatly simplified, the disassembly is also convenient, and the replacement and repair efficiency is improved. Meanwhile, high temperature is not needed, the influence on a circuit board and other components is small, the reuse rate is increased, the failure is reduced, and the method is particularly suitable for circuit design research and development and replacement and debugging of devices with different parameters.
For example, in the circuit design development process, if the effect of the resistor of 1 Ω is general, the resistor can be directly pulled out from the circuit board, and a resistor of 2 Ω is replaced and the circuit board is plugged again to replace the resistor of 1 Ω, and if the required effect cannot be achieved, the next resistor can be replaced again until the required effect is achieved. The whole process does not need welding and unsoldering, is convenient, efficient and safe, and can not cause the damage of the PCB 20.
Referring to fig. 7, the present application further provides a circuit system based on the same inventive concept. The first mounting piece is connected with the pin press-connection parts 12 of the plurality of press-connection type pins 10; the second mounting is connected to the pin fixing portions 13 of the plurality of press-fit type pins 10.
The crimp-type pin 10 includes: the lead frame comprises a lead body 11, a lead press-bonding part 12, a lead fixing part 13 and an elastic buffer part 14.
A pin crimping part 12 is provided on the pin body 11 for connection with the first mount. In the present embodiment, the PCB board 20 is used as a first mounting member, and is crimped to the pin crimping portions 12 of the plurality of crimp-type pins 10.
The pin fixing part 13 is provided on the pin body 11 for connection with the second mount. In this embodiment, the backing plate 30 of the semiconductor module is used as a second component and is fixed by soldering to the pin fixing portions 13 of the plurality of press-fit pins 10.
The elastic buffer 14 is disposed on the pin body 11 and located between the pin crimping part 12 and the pin fixing part 13 for achieving stress relief of the pin body 11.
In the circuit system of the present embodiment, the crimp-type pins 10 are first mounted at the target positions on the horizontally placed substrate 30, specifically, the pin fixing portions 13 of the crimp-type pins 10 are soldered to the substrate 30, and the crimp-type pins 10 are held in the upright state. After all the press-fit pins 10 on the lining board 30 are mounted, the PCB board 20 is mounted. Specifically, the via hole of the PCB board is aligned with the pin crimping part 12 of the crimping type pin 10, the PCB board 20 is pressed downward, the pin crimping part 12 enters the via hole of the PCB board 20, and the pin crimping part 12 is deformed and then is tightly connected and fixed with the via hole. And during the pressing down of the PCB board 20, the elastic buffer 14 is deformed to achieve stress relief of the press-fit type pin 10. The crimp-type pin 10, the PCB board 20 and the backing board 30 are not damaged. When the pressing down of the PCB board 20 is completed and no downward pressure is applied, the elastic buffer 14 is restored.
As shown in fig. 8, in one embodiment, the circuit system includes a PCB board 20 and a plurality of the crimp-type passive devices of example 2.
The PCB board 20 of the circuit system may have a plurality of pieces and include at least two directions, for example, one PCB board 20 is horizontal and the other PCB board 20 is vertical.
Taking the horizontal PCB 20 as an example, the two crimping pins 10 of the crimping type passive component are respectively crimped on the horizontal PCB 20. When some of the crimp-type passive devices need to bridge two PCB boards 20, two crimp-type pins 10 of the crimp-type passive device are respectively fixed to vias of the two PCB boards 20 by crimping. This connection is also applicable to the connection of the PCB board 20 in both directions. In order to facilitate the bridging of the crimping type passive device across the two PCB boards 20, the crimping type passive device at this position includes a passive device body 40 and two crimping type pins 10, and a pin fixing end of the crimping type pin 10 is connected with a bending portion 42, and is connected with an electrode of the passive device body 40 through the bending portion 42. The bending part 42 is preferably a copper sheet, and can be bent manually to adjust the direction and angle of the crimping type pin 10 of the crimping type passive device.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is to be noted that, in the present invention, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A crimping type pin for achieving stress relief, comprising:
a pin body;
the pin crimping part is arranged on the pin body and is used for being connected with the first mounting part;
the pin fixing part is arranged on the pin body and is used for being connected with the second mounting part; and
and the elastic buffer part is arranged on the pin body, is positioned between the pin crimping part and the pin fixing part and is used for realizing the stress release of the pin body.
2. A stress relieving crimp-type pin in accordance with claim 1 wherein the resilient buffer includes at least one resilient member.
3. The stress-relieved crimp-type pin according to claim 2, wherein one end of the at least one elastic member is connected to the pin fixing part, and the other end of the at least one elastic member is connected to the pin body or the pin crimping part.
4. The stress-relieving crimp-type pin according to claim 3, wherein the elastic buffer further comprises a support limiting member disposed in the elastic member along a deformation direction of the elastic member, one end of the support limiting member is spaced from the pin fixing portion, and the other end of the support limiting member is connected to the pin body or the pin crimping portion.
5. The stress-relieved crimp-type pin according to claim 2, wherein the pin body is provided with a first connection position and a second connection position at intervals along a deformation direction of the elastic member; one end of the at least one elastic piece is connected with the first connecting position of the pin body, and the other end of the at least one elastic piece is connected with the second connecting position of the pin body.
6. A stress relieving crimp-type pin in accordance with claim 2 wherein the resilient buffer or the resilient member is a helical structure.
7. The stress relieving crimp pin according to claim 1, wherein the pin crimping portion is a fish-eye pin structure, one end of which is connected to the pin body, and the other end of which is provided with a tip-shaped pin guide portion.
8. The stress relieving crimp-type pin of claim 1, wherein the pin crimp portion comprises an inner layer of copper, an intermediate layer of nickel, and an outer layer of tin.
9. A crimp-type passive component comprising a passive component body and the crimp-type pins according to any one of claims 1 to 8, the passive component body serving as the second mounting member being connected to pin fixing portions of at least two of the crimp-type pins.
10. A circuit system comprising a first mounting member, a second mounting member, and a plurality of crimping-type pins according to any one of claims 1 to 8, the first mounting member being connected to pin crimping portions of the plurality of crimping-type pins; the second mounting member is connected to the pin fixing portions of the plurality of press-fit type pins.
CN202111210919.XA 2021-10-18 2021-10-18 Pressure welding type pin for realizing stress release, pressure welding type passive device and circuit system Pending CN114039233A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09129797A (en) * 1995-10-27 1997-05-16 Hitachi Ltd Power semiconductor device
CN111769392A (en) * 2020-07-09 2020-10-13 深圳市深台帏翔电子有限公司 Electric connector and electronic equipment
CN112768976A (en) * 2020-12-30 2021-05-07 华芯威半导体科技(北京)有限责任公司 Lead terminal for power module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09129797A (en) * 1995-10-27 1997-05-16 Hitachi Ltd Power semiconductor device
CN111769392A (en) * 2020-07-09 2020-10-13 深圳市深台帏翔电子有限公司 Electric connector and electronic equipment
CN112768976A (en) * 2020-12-30 2021-05-07 华芯威半导体科技(北京)有限责任公司 Lead terminal for power module

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