CN114038798A - Substrate preparation method, substrate and display panel - Google Patents
Substrate preparation method, substrate and display panel Download PDFInfo
- Publication number
- CN114038798A CN114038798A CN202111084413.9A CN202111084413A CN114038798A CN 114038798 A CN114038798 A CN 114038798A CN 202111084413 A CN202111084413 A CN 202111084413A CN 114038798 A CN114038798 A CN 114038798A
- Authority
- CN
- China
- Prior art keywords
- signal line
- bottom plate
- substrate
- conductive paste
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 88
- 238000002360 preparation method Methods 0.000 title abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 53
- 238000012545 processing Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 58
- 239000011241 protective layer Substances 0.000 claims description 57
- 238000012546 transfer Methods 0.000 claims description 41
- 238000005553 drilling Methods 0.000 claims description 29
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 10
- 238000001039 wet etching Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 239000002002 slurry Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 6
- 238000007649 pad printing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a substrate preparation method, a substrate and a display panel. The substrate preparation method comprises providing a first base plate; processing the first bottom plate to obtain a second bottom plate, at least one first signal line and at least one second signal line; the second bottom plate comprises a first surface and a second surface which are opposite, and at least one bulge is formed on one side edge of the second bottom plate; the first signal line is positioned on the first surface of the second bottom plate and extends to the edge of the bulge; the second signal line is positioned on the second surface of the second bottom plate and extends to the edge of the bulge; and forming a conductive paste layer on the side surface of the protrusion, wherein one end of the conductive paste layer is electrically connected with the first signal line, and the other end of the conductive paste layer is electrically connected with the second signal line. The substrate is prepared in the mode, so that the side edge connecting line does not need to be aligned accurately, and the problems of dislocation, poor lap joint and the like easily caused by the conventional side edge connecting line method are effectively solved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a substrate preparation method, a substrate and a display panel.
Background
With the development of display technology, in order to enlarge the size of a display panel and improve the display effect of the display panel, seamless splicing of substrates is required.
The seamless splicing of the substrates requires that the bottom plate adopts a frameless design, signal transmission lines are required to be arranged on a first surface and a second surface which are opposite to the bottom plate, and then a connecting line is manufactured on the side edge of the bottom plate to connect and conduct the signal transmission lines on the first surface and the second surface.
Currently, side edge connection is mainly achieved by pad printing technology. However, the pad printing technology has high requirements on the alignment precision of a printing machine and the capability of an operator. Therefore, the problems of dislocation, poor lap joint and the like easily occur to the side connecting line realized by the pad printing technology.
Therefore, how to avoid the problems of misalignment, poor lap joint, etc. that easily occur in the side connecting lines is a problem that needs to be solved urgently.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present application aims to provide a method for manufacturing a substrate, a substrate and a display panel, which are intended to solve the problems of easy occurrence of misalignment and poor bonding of side connection lines.
A method of preparing a substrate, comprising:
providing a first base plate;
processing the first bottom plate to obtain a second bottom plate, at least one first signal line and at least one second signal line; the second bottom plate comprises a first surface and a second surface which are opposite, and at least one bulge is formed on one side edge of the second bottom plate; the first signal line is positioned on the first surface of the second bottom plate and extends to the edge of the bulge; the second signal line is positioned on the second surface of the second bottom plate and extends to the edge of the bulge;
and forming a conductive paste layer on the side surface of the protrusion, wherein one end of the conductive paste layer is electrically connected with the first signal line, and the other end of the conductive paste layer is electrically connected with the second signal line.
In the invention, the first bottom plate is preprocessed to obtain the second bottom plate, at least one first signal wire and at least one second signal wire, at least one bulge is formed on one side edge of the second bottom plate, the first signal wire is positioned on the first surface of the second bottom plate, the second signal wire is positioned on the second surface of the second bottom plate, the first signal wire and the second signal wire respectively extend to the edge of the bulge, and after the conductive slurry layer is formed on the side surface of the bulge, the first signal wire and the second signal wire can be connected and conducted through the conductive slurry.
Optionally, the processing the first backplane to obtain a second backplane, at least one first signal line, and at least one second signal line includes:
forming a plurality of through holes in the first base plate, wherein the through holes are arranged at intervals along a first direction;
forming at least one first signal line on the first surface of the first substrate, wherein the first signal line is located between adjacent through holes and/or at an edge of the first surface of the first substrate, and extends from one side of the through hole to the other side of the through hole along a second direction; the second direction intersects the first direction;
forming at least one second signal line on the second surface of the first substrate, wherein the second signal line is located between adjacent through holes and/or at an edge of the second surface of the first substrate and extends from one side of the through hole to the other side of the through hole along the second direction; the second signal line is arranged corresponding to the first signal line;
and cutting the first bottom plate from the through hole along the second direction to obtain the second bottom plate with the bulge formed on one side edge.
In the invention, the plurality of through holes are formed in the first bottom plate, and the first signal line and the second signal line are arranged in the manner, so that after the first bottom plate is cut from the through holes along the second direction, the second bottom plate formed by cutting is provided with the plurality of bulges, and the first signal line and the second signal line are ensured to respectively extend to the edges of the bulges, thereby facilitating the subsequent connection and conduction of the first signal line and the second signal line by adopting conductive paste.
Optionally, the forming a plurality of through holes in the first base plate includes:
and forming a plurality of through holes in the first base plate by adopting a laser drilling process.
According to the invention, the through hole is formed in the first base plate through the laser drilling process, and the accuracy of the position and the shape of the through hole is effectively ensured due to high laser drilling precision and high cutting speed, so that the forming efficiency of the through hole is ensured, and the preparation efficiency of the substrate is favorably improved.
Optionally, the forming a plurality of through holes in the first base plate includes:
forming a protective layer on the first surface or the second surface of the first base plate;
carrying out patterning treatment on the protective layer to obtain a patterned protective layer, wherein an opening is formed in the patterned protective layer, and the shape and the position of the through hole are defined by the opening;
forming the through hole in the first base plate based on the patterned protective layer;
and removing the patterned protective layer.
According to the invention, the protective layer is formed on the first surface or the second surface of the first base plate, the protective layer is subjected to graphical processing to obtain the opening defining the shape and the position of the through hole, then the through hole is formed in the first base plate based on the opening, the accuracy of the position and the shape of the through hole is ensured, and the opening is arranged on the protective layer, so that if the shape and the position of the opening have errors, the protective layer is only required to be replaced, the opening is formed in the protective layer again, the first base plate does not need to be discarded, and the yield of the substrate preparation process is ensured.
Optionally, performing patterning processing on the protective layer by using a laser drilling process; the forming the through hole in the first base plate based on the patterned protective layer includes:
forming a plurality of blind holes in the first bottom plate by adopting a laser drilling process;
and continuously etching the blind hole by adopting a wet etching process based on the graphical protection layer to obtain the through hole.
According to the invention, the protective layer is subjected to graphical processing through a laser drilling process, so that the accuracy of the opening position and the shape is improved, when the accuracy of the opening position and the shape of the protective layer is ensured, a corresponding blind hole is further formed in the first base plate through the laser drilling process so as to ensure the accuracy of the position and the shape of the blind hole, and then the blind hole is continuously etched through a wet etching process to form a through hole, so that the through hole with the accurate position and the accurate shape is obtained; the laser drilling process has high drilling precision, and the wet etching process needs simple equipment, is easy to realize mass production, has lower cost and has good etching selection ratio; therefore, the two processes are combined, so that the accuracy of the position and the shape of the through hole is ensured, and the production efficiency is improved.
Optionally, the through-hole comprises a circular through-hole or a square through-hole.
Optionally, the forming a conductive paste layer on the side surface of the protrusion includes:
coating the conductive slurry on the surface of the transfer plate;
pressing and contacting the surface of the transfer plate coated with the conductive paste with the side of the protrusion far away from the second bottom plate to form the conductive paste layer on the side of the protrusion far away from the second bottom plate;
and evacuating the transfer plate.
In the invention, the conductive slurry is coated on the surface of the transfer plate, and then the surface of the transfer plate coated with the conductive slurry is in extrusion contact with the side surface of the protrusion far away from the second bottom plate, so that a conductive slurry layer can be formed on the side surface of the protrusion far away from the second bottom plate.
Optionally, after the surface of the transfer plate coated with the conductive paste is pressed against the side of the protrusion away from the second base plate and before the surface is removed from the transfer plate, the method further includes: and heating and curing the conductive paste.
In the invention, when the surface of the transfer plate coated with the conductive paste is in pressing contact with the side surface of the protrusion far away from the second bottom plate, the conductive paste is heated and cured, so that the conductive paste is fixed on the side surface of the protrusion far away from the second bottom plate, and the first signal line and the second signal line are stably connected and conducted.
Based on the same inventive concept, the present application further provides a substrate, which includes a second bottom plate, at least one first signal line and at least one second signal line, where the second bottom plate includes a first surface and a second surface opposite to each other, and a side of the second bottom plate is formed with at least one protrusion, the first signal line is located on the first surface of the second bottom plate and extends to an edge of the protrusion, the second signal line is located on the second surface of the second bottom plate and extends to the edge of the protrusion, a side surface of the protrusion is provided with a conductive paste layer, one end of the conductive paste layer is electrically connected to the first signal line, and the other end of the conductive paste layer is electrically connected to the second signal line.
In the invention, at least one bulge is formed on one side edge of the second bottom plate, the first signal wire is positioned on the first surface of the second bottom plate, the second signal wire is positioned on the second surface of the second bottom plate, and the first signal wire and the second signal wire respectively extend to the edges of the bulges, so that the first signal wire and the second signal wire can be connected and conducted through conductive paste after the conductive paste layer is arranged on the side surface of the bulge.
The advantages of the substrate of the present invention over the prior art are the same as the advantages of the substrate preparation method over the prior art, and are not described herein again.
Based on the same inventive concept, the application also provides a display panel, which comprises the substrate and the display module, wherein the display module is electrically connected with the substrate.
The advantages of the display panel of the present invention over the prior art are the same as the advantages of the substrate over the prior art, and are not described herein again.
Drawings
FIG. 1 is a schematic flow chart illustrating a method for fabricating a substrate according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a first base plate cut from a through hole along a second direction according to an embodiment of the present invention;
FIG. 3 is a schematic top view of a conductive paste layer according to an embodiment of the present invention;
FIG. 4 is a schematic perspective view of a substrate fabricated by the method of fabricating a substrate according to an embodiment of the invention;
fig. 5 is a schematic flow chart illustrating a method for manufacturing a substrate according to another embodiment of the invention.
Description of reference numerals:
1-a first signal line; 2-second signal line, 3-conductive paste layer, 4-bump, 5-second bottom plate, 6-transfer plate, 7-conductive paste and 8-through hole.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
At present, the problems of dislocation, poor lap joint and the like easily occur to the side connecting line by the pad printing technology.
Therefore, how to avoid the problems of misalignment, poor lap joint, etc. that easily occur in the side connecting lines is a problem that needs to be solved urgently.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
In one embodiment, referring to fig. 1, a method for preparing a substrate is provided, including:
s102: a first backplane is provided.
Wherein the first substrate includes a main body portion of a pre-fabricated substrate, a surface of which may be provided with signal transmission lines.
S104: processing the first bottom board to obtain a second bottom board 5, at least one first signal line 1 and at least one second signal line 2; the second bottom plate 5 comprises a first surface and a second surface which are opposite, and at least one protrusion 4 is formed on one side edge of the second bottom plate 5; the first signal line 1 is positioned on the first surface of the second bottom plate 5 and extends to the edge of the bulge 4; the second signal line 2 is located on the second surface of the second substrate 5 and extends to the edge of the protrusion 4.
The number of the bumps 4, the number of the first signal lines 1, and the number of the second signal lines 2 are determined according to actual requirements, and are not particularly limited herein.
Specifically, the number of the first signal lines 1 is the same as that of the second signal lines 2, the first signal lines 1 are located on the first surface of the second substrate 5, and the second signal lines 2 are located at corresponding positions on the second surface of the second substrate 5, so that the positions of the first signal lines 1 and the positions of the second signal lines 2 are in one-to-one correspondence, and the corresponding first signal lines 1 and the corresponding second signal lines 2 extend to the edge of the same protrusion 4. When the conductive layer is formed on the side surface of the protrusion 4, the conductive layer is electrically connected to the corresponding first signal line 1 and second signal line 2, respectively, thereby electrically connecting the corresponding first signal line 1 and second signal line 2.
S106: and forming a conductive paste layer 3 on the side surface of the protrusion 4, wherein one end of the conductive paste layer 3 is electrically connected with the first signal line 1, and the other end is electrically connected with the second signal line 2.
The conductive paste 7 is a material, for example, a conductive silver paste, in which a conductive powder is uniformly added to a binder and cured to form a conductive body.
Specifically, since the conductive paste layer 3 is formed on the side surface of the bump 4, in order to avoid signal crosstalk, one end of the conductive paste layer 3 formed on the side surface of one bump 4 can be connected to only one first signal line 1, and the other end is electrically connected to one second signal line 2. Based on this, in the present embodiment, the number of the bumps 4 is not less than the number of the first signal lines 1 or the second signal lines 2.
In application, when the number of the bumps 4 is plural, the conductive paste layer 3 may be formed on the side surface of the corresponding bump 4 according to the positions of the first signal line 1 and the second signal line 2, or the conductive paste layers 3 may be formed on the side surfaces of all the bumps 4, so as to ensure that the first signal lines 1 and the second signal lines 2 can be electrically connected in a one-to-one correspondence manner.
The second bottom plate 5, at least one first signal wire 1 and at least one second signal wire 2 are obtained by preprocessing the first bottom plate, and at least one bulge 4 is formed on one side edge of the second bottom plate 5, the first signal wire 1 is located on the first surface of the second bottom plate 5, the second signal wire 2 is located on the second surface of the second bottom plate 5, and the first signal wire 1 and the second signal wire 2 extend to the edge of the bulge 4 respectively, so that after the conductive paste layer 3 is formed on the side surface of the bulge 4, the first signal wire 1 and the second signal wire 2 can be connected and conducted through the conductive paste 7.
In one embodiment, as shown in fig. 2, the processing the first backplane to obtain the second backplane 5, the at least one first signal line 1, and the at least one second signal line 2 includes:
s1041: a plurality of through holes 8 are formed in the first base plate, and the through holes 8 are arranged at intervals along a first direction.
Specifically, since punching the center of the first base plate may greatly reduce the mechanical properties of the base plate, the through-hole 8 is disposed at a position of the first base plate near the edge. Meanwhile, a plurality of through holes 8 are limited to be arranged at intervals along the first direction, so that the first bottom plate can be cut from the through holes 8 along the first direction subsequently, and the second bottom plate 5 with the protrusions 4 at the edge is formed.
S1042: forming at least one first signal line 1 on the first surface of the first substrate, wherein the first signal line 1 is located between adjacent through holes 8 and/or at an edge of the first surface of the first substrate, and extends from one side of the through hole 8 to the other side opposite to the through hole 8 along a second direction; the second direction intersects the first direction.
The first signal line 1 and the second signal line 2 may be disposed by the prior art, which is not limited in this embodiment.
Specifically, the first signal line 1 may be only located between the adjacent through holes 8, only located at the edge of the first surface of the first substrate, or the plurality of first signal lines 1 may be respectively located between the adjacent through holes 8 and at the edge of the first surface of the first substrate.
Specifically, by positioning the first signal line 1 between adjacent through holes 8 and/or at the edge of the first surface of the first substrate and extending from one side of the through hole 8 to the other side opposite to the through hole 8 along the second direction, the first signal line 1 is inevitably cut when the first substrate is subsequently cut from the through hole 8 along the first direction, so that the first signal line 1 extends to the edge of the protrusion 4 after the first substrate is cut.
S1043: forming at least one second signal line 2 on the second surface of the first substrate, wherein the second signal line 2 is located between adjacent through holes 8 and/or at an edge of the second surface of the first substrate, and extends from one side of the through hole 8 to the other side of the through hole 8 along the second direction; the second signal line 2 is provided corresponding to the first signal line 1.
Specifically, the second signal line 2 may be only located between the adjacent through holes 8, only located at the edge of the second surface of the first substrate, or the plurality of second signal lines 2 may be respectively located between the adjacent through holes 8 and at the edge of the second surface of the first substrate.
Also, with the above arrangement, after the first chassis is cut, the first signal line 1 extends to the edge of the bump 4.
S1044: and cutting the first bottom plate from the through hole 8 along the second direction to obtain the second bottom plate 5 with the protrusion 4 formed on one side edge.
Specifically, the first base plate is cut from the through holes 8 in the second direction so that the portions between the adjacent through holes 8 and the edge of the first base plate form the protrusions 4, thereby forming the plurality of protrusions 4 on one side of the second base plate 5.
In this embodiment, through forming a plurality of through holes 8 in the first bottom plate, and set up first signal line 1 and second signal line 2 in the above-mentioned manner, then cut the back from through hole 8 to first bottom plate along the second direction, the second bottom plate 5 that the cutting formed has a plurality of archs 4, and guaranteed that first signal line 1 and second signal line 2 extend to the edge of arch 4 respectively, thereby be convenient for follow-up adoption electrically conductive thick liquids 7 connect and switch on first signal line 1 and second signal line 2.
In one embodiment, the forming of the plurality of through holes 8 in the first base plate includes:
s10411: and forming a plurality of through holes 8 in the first base plate by adopting a laser drilling process.
Specifically, the laser drilling process may employ CO2The laser wavelength of the laser cutting machine can be 1060 and 1070nm, such as 1060nm, 1064nm, 1068nm and 1070 nm.
In this embodiment, through laser beam drilling technology in first bottom plate internal formation through-hole 8, because laser beam drilling precision is high, cutting speed is fast to effectively guarantee the accuracy of through-hole 8 position and shape, and guaranteed the formation efficiency of through-hole 8, be favorable to improving the efficiency of base plate preparation.
In one embodiment, the forming of the plurality of through holes 8 in the first base plate includes:
s10412: and forming a protective layer on the first surface or the second surface of the first base plate.
Wherein, the protective layer can be stripped from the first base plate so as to remove the protective layer subsequently. The protective layer may be a protective adhesive layer made of a material such as silicone resin or epoxy resin, or a protective film made of a material such as polypropylene, polyvinyl chloride, polyethylene terephthalate, or AR.
S10413: and carrying out patterning treatment on the protective layer to obtain a patterned protective layer, wherein an opening is formed in the patterned protective layer, and the shape and the position of the through hole 8 are defined by the opening.
Specifically, according to the position and shape of the through hole 8 to be provided on the first base plate, an opening of a corresponding shape is formed on the protective layer corresponding to the position of the through hole 8.
S10414: the through-holes 8 are formed in the first base plate based on the patterned protective layer.
Specifically, since the opening defines the shape and position of the through hole 8, the opening is used as a mark, and the corresponding through hole 8 can be formed on the first base plate according to the shape and position of the opening, thereby ensuring the accuracy of the position and shape of the through hole 8. Meanwhile, the opening is formed in the protective layer, so that if the shape and the position of the opening are in error, the protective layer is only required to be replaced, the opening is formed in the protective layer again, the first bottom plate is not required to be discarded, and the yield of the substrate preparation process is guaranteed.
S10415: and removing the patterned protective layer.
Specifically, after the through hole 8 is formed in the first bottom plate, the patterned protection layer is not needed in the subsequent process, so that the patterned protection layer can be directly removed at this time.
In one embodiment, the protective layer is subjected to patterning treatment by adopting a laser drilling process; the forming of the through hole 8 in the first base plate based on the patterned protective layer includes:
s104131: and forming a plurality of blind holes in the first bottom plate by adopting a laser drilling process.
S104132: and continuously etching the blind hole by adopting a wet etching process based on the graphical protection layer to obtain the through hole 8.
In particular, as already described above, the perforation by laser has a high precision and a high speed. Therefore, the protective layer is subjected to graphical processing through the laser drilling process, the accuracy of the opening position and the shape can be effectively improved, and when the opening position and the shape of the protective layer are ensured to be accurate, the corresponding blind holes are further formed in the first base plate through the laser drilling process, so that the accuracy of the position and the shape of the blind holes is further ensured. And then, continuously etching the blind hole by adopting a wet etching process to form the through hole 8, thereby obtaining the through hole 8 with accurate position and shape. The laser drilling process has high drilling precision, and the wet etching process needs simple equipment, is easy to realize mass production, has lower cost and has good etching selection ratio; therefore, the two processes are combined, so that the accuracy of the position and the shape of the through hole 8 is ensured, and the production efficiency is improved.
In one embodiment, the through-holes 8 include circular through-holes 8 or square through-holes 8.
Specifically, the through-hole 8 is provided to form the second base plate 5 having the protrusion 4 at the side after cutting the first base plate. Therefore, the shape of the through-hole 8 is not particularly limited, and the through-hole 8 may include a circular through-hole 8, a square through-hole 8, or a polygonal through-hole 8.
In one embodiment, the processing the first backplane to obtain the second backplane 5, the at least one first signal line 1, and the at least one second signal line 2 includes:
s1045: at least one groove is formed along one side edge of the first bottom plate in the second direction.
Specifically, it can be understood that when a plurality of protrusions 4 are formed on one side of the second bottom plate 5, a groove is formed between adjacent protrusions 4, and the groove can be directly formed on the edge of the first bottom plate to form the protrusion 4.
S1046: the first signal line 1 is extended to an edge of the first backplane along a second direction at a first surface of the first backplane, and the second signal line 2 is extended to an edge of the first backplane along the second direction at a second surface of the first backplane, wherein the first direction intersects the second direction, the first surface is opposite to the second surface, and the first signal line 1 and the second signal line 2 are disposed between the grooves and/or at the edge of the first backplane.
Specifically, by extending the first signal line 1 to the edge of the first base plate in the second direction, the second signal line 2 is extended to the edge of the first base plate in the second direction on the second surface of the first base plate, so that when the conductive paste layer 3 is provided on the side surface of the protrusion 4, one end of the conductive paste layer 3 is electrically connected to the first signal line 1, and the other end is electrically connected to the second signal line 2.
The grooves may be formed in the same manner as the through-holes 8 described above.
In one embodiment, the forming of at least one groove along one side edge of the first bottom plate in the second direction includes:
s10451: and forming at least one groove on one side edge of the first bottom plate in the second direction by adopting a laser drilling process.
Specifically, the groove is formed in the first bottom plate through a laser drilling process, and due to the fact that laser drilling precision is high and cutting speed is high, the accuracy of the position and the shape of the groove is effectively guaranteed, and therefore the interval between every two adjacent protrusions 4 meets the requirement.
In one embodiment, the forming of at least one groove along one side edge of the first bottom plate in the second direction includes:
s10452: and forming a protective layer on the first surface or the second surface of the first base plate.
S10453: and carrying out patterning treatment on the protective layer to obtain a patterned protective layer, wherein an opening is formed in the patterned protective layer, and the shape and the position of the groove are defined by the opening.
S10454: forming the groove in the first base plate based on the patterned protective layer.
Specifically, when the first bottom plate is directly provided with the groove, if the position or the shape of the provided groove has a large deviation, the first bottom plate may be scrapped, resulting in a large waste of resources. And set up the opening on the protective layer, even the deviation appears in the position or the shape of opening on the protective layer, also only need change the protective layer, can not lead to first bottom plate to scrap. Therefore, the opening is formed in the protective layer, and then the groove is formed in the first bottom plate based on the opening in the protective layer, so that the yield of substrate preparation can be effectively improved.
In one embodiment, the protective layer is subjected to patterning treatment by adopting a laser drilling process; the forming the groove in the first base plate based on the patterned protective layer includes:
s104541: forming a plurality of blind holes in the first bottom plate by adopting a laser drilling process;
s104542: and continuously etching the blind hole by adopting a wet etching process based on the graphical protection layer to obtain the groove.
In one embodiment, as shown in fig. 3, the forming of the conductive paste layer 3 on the side of the protrusion 4 includes:
s1061: the conductive paste 7 is applied to the surface of the transfer plate 6.
Specifically, if the conductive paste 7 coated on the surface of the transfer plate 6 is thin, the conductive paste layer 3 formed on the side of the protrusion 4 away from the second base plate 5 through the subsequent steps is also thin, and the conductive effect of the conductive paste layer 3 may be affected; on the other hand, if the conductive paste 7 applied to the surface of the transfer plate 6 is thick, a large amount of the conductive paste 7 is required, which leads to an increase in the production cost of the substrate. Therefore, in the present embodiment, the thickness of the conductive paste 7 coated on the surface of the transfer plate 6 is 5 to 15um, for example, 5um, 6um, 8um, 10um, 12um, 14um, 15 um.
S1062: the surface of the transfer plate 6 coated with the conductive paste 7 is brought into press contact with the side of the protrusions 4 remote from the second base plate 5 to form the conductive paste layer 3 on the side of the protrusions 4 remote from the second base plate 5.
Besides the side of the protrusion 4 far from the second bottom plate 5, the other two sides of the protrusion 4 may also be provided with the conductive paste layer 3, but the other two sides of the protrusion 4 are difficult to form the conductive paste layer 3 in the above manner. Therefore, in the present embodiment, the conductive paste layer 3 is formed on the side of the bump 4 away from the second base plate 5.
Specifically, the conductive paste layer 3 is formed on the side of the bumps 4 away from the second base plate 5 by pressing the surface of the transfer plate 6 coated with the conductive paste 7 into contact with the side of the bumps 4 away from the second base plate 5, thereby attaching the conductive paste 7 on the transfer plate 6 to the side of the bumps 4 away from the second base plate 5.
In use, in order to form the conductive paste layer 3 on all the sides of the bumps 4 away from the second base plate 5 at the same time, the length of the transfer plate 6 should be greater than the length of the side of the second base plate 5 on which the bumps 4 are formed.
S1063: the transfer plate 6 is evacuated.
Specifically, after the conductive paste layer 3 is formed on the side of the projection 4 away from the second base plate 5, it is removed from the transfer plate 6. At this point the substrate preparation is complete and the resulting substrate is shown in fig. 4.
The transfer plate 6 may include a transfer plate having a heat curing function.
The above process can be realized by a manipulator, that is, the manipulator clamps the second base plate 5, and presses and contacts the corresponding side of the second base plate 5 with the side of the transfer plate 6 coated with the conductive paste 7, and the transfer plate 6 can be fixed at the corresponding position in advance. Or a robot grips the transfer plate 6 and presses the side of the transfer plate 6 coated with the conductive paste 7 into contact with the side corresponding to the second substrate 5.
In one embodiment, it is also possible to determine the bumps 4 whose side surfaces are required to form the conductive paste layer 3 according to the positions where the first signal line 1 and the second signal line 2 are disposed, and then directly apply the conductive paste 7 on the side surfaces of the respective bumps 4 by an applying device for applying the conductive paste 7.
In this embodiment, the conductive paste layer 3 can be formed on the side of the protrusion 4 away from the second bottom plate 5 by coating the conductive paste 7 on the surface of the transfer plate 6 and then pressing and contacting the surface of the transfer plate 6 coated with the conductive paste 7 with the side of the protrusion 4 away from the second bottom plate 5.
In one embodiment, after the surface of the transfer plate 6 coated with the conductive paste 7 is pressed against the side of the protrusions 4 away from the second base plate 5 and before the surface is removed from the transfer plate 6, the method further includes: and heating and curing the conductive paste 7.
Wherein the transfer plate 6 includes a heating device for heating a surface of the transfer plate 6 for applying the conductive paste 7 to heat the conductive paste 7 applied on the surface.
Specifically, the surface of the transfer plate 6 coated with the conductive paste 7 is directly in pressing contact with the side of the protrusion 4 away from the second base plate 5, and the conductive paste 7 may not be firmly attached to the side of the protrusion 4 away from the second base plate 5, so that after the surface of the transfer plate 6 coated with the conductive paste 7 is pressed against the side of the protrusion 4 away from the second base plate 5, the conductive paste 7 is heated to melt and attach the conductive paste 7 to the side of the protrusion 4 away from the second base plate 5, and when the conductive paste 7 attached to the side of the protrusion 4 away from the second base plate 5 is cooled, the conductive paste 7 is firmly attached to the side of the second base plate 5, which is beneficial to prolonging the service life of the conductive paste layer 3 and further prolonging the service life of the substrate manufactured by the above method.
In the application, the conductive paste 7 is heated and cured for not less than 15s, such as 15-25s, and further such as 15s, 18s, 20s, 22s, 24s, 25s, and other times.
In one embodiment, a substrate manufacturing method is provided, which includes, on the basis of the above embodiments, as shown in fig. 5:
s502, providing a first bottom plate;
s504, forming a protective layer on the first surface or the second surface of the first base plate;
s506, carrying out patterning treatment on the protective layer by adopting a laser drilling process to obtain a patterned protective layer, wherein an opening is formed in the patterned protective layer, and the shape and the position of the through hole 8 are defined by the opening;
s508, forming a plurality of blind holes in the first bottom plate by adopting a laser drilling process, arranging the blind holes at intervals along a first direction, and continuously etching the blind holes by adopting a wet etching process based on the graphical protective layer to obtain the through holes 8;
s510, removing the graphical protection layer;
s512, forming at least one first signal line 1 on the first surface of the first substrate, where the first signal line 1 is located between adjacent through holes 8 and/or at an edge of the first surface of the first substrate, and extends from one side of the through hole 8 to the other side of the through hole 8 along a second direction; the second direction intersects the first direction;
s514, forming at least one second signal line 2 on the second surface of the first substrate, where the second signal line 2 is located between adjacent through holes 8 and/or at an edge of the second surface of the first substrate, and extends from one side of the through hole 8 to the other side of the through hole 8 along the second direction; the second signal line 2 is arranged corresponding to the first signal line 1;
s516, cutting the first bottom plate from the through hole 8 along the second direction to obtain the second bottom plate 5 with the protrusion 4 formed on one side edge;
s518, coating the conductive paste 7 on the surface of the transfer plate 6;
s520, the surface of the transfer plate 6 coated with the conductive paste 7 is in pressing contact with the side surface of the protrusion 4 far away from the second bottom plate 5, and the conductive paste 7 is heated and cured to form the conductive paste layer 3 on the side surface of the protrusion 4 far away from the second bottom plate 5;
s522, the transfer board 6 is evacuated.
Based on the same inventive concept, as shown in fig. 4, the present application further provides a substrate, which includes a second substrate 5, at least one first signal line 1, and at least one second signal line 2, where the second substrate 5 includes a first surface and a second surface opposite to each other, and a side of the second substrate 5 is formed with at least one protrusion 4, the first signal line 1 is located on the first surface of the second substrate 5 and extends to an edge of the protrusion 4, the second signal line 2 is located on the second surface of the second substrate 5 and extends to an edge of the protrusion 4, a side of the protrusion 4 is provided with a conductive paste layer 3, one end of the conductive paste layer 3 is electrically connected to the first signal line 1, and the other end of the conductive paste layer is electrically connected to the second signal line 2.
The substrate can be prepared by the substrate preparation method.
In this embodiment, at least one protrusion 4 is formed on one side of the second bottom plate 5, and the first signal line 1 is located on the first surface of the second bottom plate 5, the second signal line 2 is located on the second surface of the second bottom plate 5, and the first signal line 1 and the second signal line 2 extend to the edge of the protrusion 4 respectively, so that the first signal line 1 and the second signal line 2 can be connected and conducted through the conductive paste layer 3 after the conductive paste layer 3 is disposed on the side surface of the protrusion 4.
Based on the same inventive concept, the application also provides a display panel, which comprises the substrate and the display module, wherein the display module is electrically connected with the substrate.
The display module includes conventional devices constituting a display panel, such as a backlight module, a polarizer, and the like.
The advantages of the display panel described in this embodiment over the prior art are the same as the advantages of the substrate over the prior art, and are not described herein again.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (10)
1. A method of preparing a substrate, comprising:
providing a first base plate;
processing the first bottom plate to obtain a second bottom plate, at least one first signal line and at least one second signal line; the second bottom plate comprises a first surface and a second surface which are opposite, and at least one bulge is formed on one side edge of the second bottom plate; the first signal line is positioned on the first surface of the second bottom plate and extends to the edge of the bulge; the second signal line is positioned on the second surface of the second bottom plate and extends to the edge of the bulge;
and forming a conductive paste layer on the side surface of the protrusion, wherein one end of the conductive paste layer is electrically connected with the first signal line, and the other end of the conductive paste layer is electrically connected with the second signal line.
2. The method for preparing a substrate according to claim 1, wherein the processing the first substrate to obtain a second substrate, at least one first signal line and at least one second signal line comprises:
forming a plurality of through holes in the first base plate, wherein the through holes are arranged at intervals along a first direction;
forming at least one first signal line on the first surface of the first substrate, wherein the first signal line is located between adjacent through holes and/or at an edge of the first surface of the first substrate, and extends from one side of the through hole to the other side of the through hole along a second direction; the second direction intersects the first direction;
forming at least one second signal line on the second surface of the first substrate, wherein the second signal line is located between adjacent through holes and/or at an edge of the second surface of the first substrate and extends from one side of the through hole to the other side of the through hole along the second direction; the second signal line is arranged corresponding to the first signal line;
and cutting the first bottom plate from the through hole along the second direction to obtain the second bottom plate with the bulge formed on one side edge.
3. The method of preparing a substrate according to claim 2, wherein the forming a plurality of through holes in the first base plate comprises:
and forming a plurality of through holes in the first base plate by adopting a laser drilling process.
4. The method of preparing a substrate according to claim 2, wherein the forming a plurality of through holes in the first base plate comprises:
forming a protective layer on the first surface or the second surface of the first base plate;
carrying out patterning treatment on the protective layer to obtain a patterned protective layer, wherein an opening is formed in the patterned protective layer, and the shape and the position of the through hole are defined by the opening;
forming the through hole in the first base plate based on the patterned protective layer;
and removing the patterned protective layer.
5. The method for preparing a substrate according to claim 4, wherein the protective layer is patterned by a laser drilling process; the forming the through hole in the first base plate based on the patterned protective layer includes:
forming a plurality of blind holes in the first bottom plate by adopting a laser drilling process;
and continuously etching the blind hole by adopting a wet etching process based on the graphical protection layer to obtain the through hole.
6. The method for preparing a substrate according to claim 2, wherein the through-hole comprises a circular through-hole or a square through-hole.
7. The method for manufacturing a substrate according to any one of claims 1 to 6, wherein the forming of the conductive paste layer on the side of the protrusion comprises:
coating the conductive slurry on the surface of the transfer plate;
pressing and contacting the surface of the transfer plate coated with the conductive paste with the side of the protrusion far away from the second bottom plate to form the conductive paste layer on the side of the protrusion far away from the second bottom plate;
and evacuating the transfer plate.
8. The method for manufacturing a substrate according to claim 7, wherein after the pressing of the surface of the transfer plate coated with the conductive paste against the side of the projection away from the second base plate and before the removing of the transfer plate, further comprising: and heating and curing the conductive paste.
9. A substrate is characterized by comprising a second bottom plate, at least one first signal line and at least one second signal line, wherein the second bottom plate comprises a first surface and a second surface which are opposite to each other, at least one bulge is formed on one side edge of the second bottom plate, the first signal line is located on the first surface of the second bottom plate and extends to the edge of the bulge, the second signal line is located on the second surface of the second bottom plate and extends to the edge of the bulge, a conductive paste layer is arranged on the side face of the bulge, one end of the conductive paste layer is electrically connected with the first signal line, and the other end of the conductive paste layer is electrically connected with the second signal line.
10. A display panel comprising the substrate of claim 9 and a display module, the display module being electrically connected to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111084413.9A CN114038798A (en) | 2021-09-16 | 2021-09-16 | Substrate preparation method, substrate and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111084413.9A CN114038798A (en) | 2021-09-16 | 2021-09-16 | Substrate preparation method, substrate and display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114038798A true CN114038798A (en) | 2022-02-11 |
Family
ID=80134405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111084413.9A Pending CN114038798A (en) | 2021-09-16 | 2021-09-16 | Substrate preparation method, substrate and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114038798A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108267903A (en) * | 2016-12-30 | 2018-07-10 | 乐金显示有限公司 | Display device, multiscreen display apparatus and its manufacturing method using it |
| US10090334B2 (en) * | 2016-06-08 | 2018-10-02 | Samsung Display Co., Ltd. | Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same |
| KR20210108526A (en) * | 2020-02-25 | 2021-09-03 | 삼성디스플레이 주식회사 | Display device |
-
2021
- 2021-09-16 CN CN202111084413.9A patent/CN114038798A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10090334B2 (en) * | 2016-06-08 | 2018-10-02 | Samsung Display Co., Ltd. | Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same |
| CN108267903A (en) * | 2016-12-30 | 2018-07-10 | 乐金显示有限公司 | Display device, multiscreen display apparatus and its manufacturing method using it |
| US10935828B2 (en) * | 2016-12-30 | 2021-03-02 | Lg Display Co., Ltd. | Display device, multi-screen display device using the same and method for manufacturing the same |
| KR20210108526A (en) * | 2020-02-25 | 2021-09-03 | 삼성디스플레이 주식회사 | Display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6872436B2 (en) | Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel | |
| JP2006032590A (en) | Connection structure of circuit board and its manufacturing method | |
| TWI497535B (en) | Micro-resistive device with soft material layer and manufacture method for the same | |
| WO2019146253A1 (en) | Substrate bonding structure | |
| CN114038798A (en) | Substrate preparation method, substrate and display panel | |
| CN101111131A (en) | Manufacturing method of multi-layer flexible circuit board | |
| WO2015089947A1 (en) | Manufacturing process for welded electronic part made from poorly weldable material | |
| CN111246656A (en) | Thermoelectric separation copper-based circuit board for LED and preparation method thereof | |
| US9739942B2 (en) | Method for manufacturing optical circuit board | |
| WO2019086014A1 (en) | Circuit board fabrication method by compositing metal foil circuit and wire circuit | |
| JP4887751B2 (en) | Thermocompression bonding equipment for flexible wiring boards | |
| TWI739160B (en) | Flexible and rigid composite circuit board | |
| US6007729A (en) | Carrier tape and manufacturing method of said carrier tape | |
| CN211492875U (en) | Integrated device manufacturing die | |
| JP6278850B2 (en) | Waveguide connection structure and manufacturing method thereof | |
| CN210109384U (en) | Optical transmission device and optical transmission system | |
| JP4596053B2 (en) | Semiconductor device manufacturing method and semiconductor structure assembly | |
| CN113811077A (en) | Flexible circuit board and windowing method thereof | |
| JP2002031646A (en) | Conductive sheet for electric inspection and its manufacturing method | |
| JPH08320498A (en) | Terminal connecting structure of liquid crystal display panel | |
| JP6649076B2 (en) | Manufacturing method of optical circuit board | |
| JP5056429B2 (en) | Manufacturing method of semiconductor device | |
| CN110290644A (en) | A kind of production method of staged golden finger wiring board | |
| CN113871526B (en) | Display panel manufacturing method and display panel | |
| JP7500616B2 (en) | Method for manufacturing a circuit for a display device substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 402760 No.69, Wushan Road, Biquan street, Bishan District, Chongqing Applicant after: Chongqing Kangjia Optoelectronic Technology Co.,Ltd. Address before: 402760 No.69, Wushan Road, Biquan street, Bishan District, Chongqing Applicant before: Chongqing Kangjia Photoelectric Technology Research Institute Co.,Ltd. |