CN114031302A - Ultrathin glass and preparation method and application thereof - Google Patents
Ultrathin glass and preparation method and application thereof Download PDFInfo
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- CN114031302A CN114031302A CN202111398414.0A CN202111398414A CN114031302A CN 114031302 A CN114031302 A CN 114031302A CN 202111398414 A CN202111398414 A CN 202111398414A CN 114031302 A CN114031302 A CN 114031302A
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- 239000011521 glass Substances 0.000 title claims abstract description 239
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 171
- 239000000853 adhesive Substances 0.000 claims abstract description 78
- 230000001070 adhesive effect Effects 0.000 claims abstract description 78
- 238000005530 etching Methods 0.000 claims abstract description 70
- 238000004140 cleaning Methods 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 238000002791 soaking Methods 0.000 claims abstract description 11
- 239000003638 chemical reducing agent Substances 0.000 claims description 21
- 238000005096 rolling process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 238000011282 treatment Methods 0.000 abstract description 14
- 239000003292 glue Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 8
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The invention relates to ultrathin glass and a preparation method and application thereof. The preparation method of the ultrathin glass comprises the following steps: the back plate and the ultrathin glass substrate are attached through the thermal reduction adhesive, and the surface of one side of the ultrathin glass substrate, which is far away from the thermal reduction adhesive, is exposed; wherein, the edge of the ultrathin glass substrate does not protrude out of the back plate; soaking the back plate and the ultrathin glass substrate in an etching solution for lateral etching; cleaning the back plate subjected to the side etching and the ultrathin glass substrate; and taking out the cleaned back plate and the ultrathin glass substrate, heating for degumming, and separating the back plate and the ultrathin glass substrate. The method comprises the steps of attaching the ultrathin glass substrate to a back plate through a thermal reduction adhesive, soaking the ultrathin glass substrate in an etching solution for side etching, then cleaning, and finally heating for degumming to separate the ultrathin glass substrate from the back plate. In the lateral etching and cleaning treatment, the ultrathin glass substrate is attached to the back plate, so that the ultrathin glass substrate can be effectively prevented from being broken or bent, the breakage rate is reduced, the preparation process is simple, and the mass production is easy to realize.
Description
Technical Field
The invention relates to the technical field of glass products, in particular to ultrathin glass and a preparation method and application thereof.
Background
Ultra-Thin Glass (UTG for short) mainly refers to a Glass sheet with a thickness of less than 30 micrometers, and is mainly applied to display screens, folding screens and the like. The traditional ultrathin glass product is generally obtained by reducing the thickness of the ultrathin glass product to a target thickness (30-50 micrometers) through an etching process, and the difficulty of the subsequent process is greatly increased due to the extremely small thickness of the ultrathin glass. For example, the edge processing of the conventional ultra-thin glass generally adopts a lamination mode, the ultra-thin glass is clamped between two back plates through an adhesive layer such as UV glue and the like, the ultra-thin glass is soaked in HF solution for lateral etching, the adhesive layer is softened through a water bath heating soaking mode, the ultra-thin glass is separated from the back plates, and then the ultra-thin glass is cleaned independently. Because the cleaning difficulty of the ultrathin glass is high, a manual cleaning mode is generally adopted, the cleaning efficiency is low, the dirt removal rate is low, the cleaning fragment rate is high, and the mass production is difficult to realize.
Disclosure of Invention
Therefore, it is necessary to provide an ultra-thin glass with a low breakage rate and easy mass production, and a preparation method and application thereof.
In one aspect of the present invention, a method for preparing ultra-thin glass is provided, comprising the steps of:
attaching: the back plate and the ultrathin glass substrate are attached through a thermal reduction adhesive, and the surface of one side of the ultrathin glass substrate, which is far away from the thermal reduction adhesive, is exposed; wherein the edge of the ultrathin glass substrate does not protrude out of the back plate;
side etching: soaking the back plate and the ultrathin glass substrate attached to the back plate in etching solution to carry out side etching on the exposed surface and the edge of the ultrathin glass substrate;
cleaning: cleaning the back plate and the ultra-thin glass substrate which is attached to the back plate and subjected to side etching;
separation: and taking out the back plate and the cleaned ultrathin glass substrate attached to the back plate, and heating for degumming to obtain the ultrathin glass.
In some embodiments, the method of making the ultra-thin glass further comprises:
and repeating the attaching, the side etching, the cleaning and the separating steps to process the surface and the edge of the other side of the ultrathin substrate.
In some embodiments, a plurality of the ultra-thin glass substrates are attached to the back plate.
In some embodiments, the attaching step specifically includes:
one surface of the thermal reduction adhesive is attached to the back plate in a rolling or pressing mode;
and attaching the ultrathin glass substrate to the other surface of the thermal reduction adhesive.
In some of these embodiments, the cleaning step is: soaking the ultra-thin glass substrate subjected to the side etching and the back plate in a cleaning solution for cleaning;
or, the cleaning step is: and putting the ultra-thin glass substrate subjected to the side etching and the back plate into a flat plate cleaning machine for cleaning.
In some of these embodiments, the temperature for the thermal degumming is between 100 ℃ and 150 ℃.
In some of these embodiments, the ultra-thin glass substrate has a thickness of 30 to 70 microns.
In another aspect of the invention, the ultrathin glass prepared by the preparation method of the ultrathin glass is also provided.
In another aspect of the invention, the application of the ultrathin glass in preparing electronic products is also provided.
In another aspect of the present invention, an electronic product is also provided, which includes the above ultra-thin glass.
According to the preparation method of the ultrathin glass, the ultrathin glass substrate is attached to the back plate through the thermal reduction adhesive, then is soaked in the etching solution for lateral etching, then is cleaned, and finally is separated from the back plate through heating degumming. In the lateral etching and cleaning treatment, the ultrathin glass substrate is attached to the back plate, so that the ultrathin glass substrate can be effectively prevented from being broken or bent, the glass breakage rate is reduced, the preparation process is simple, and the mass production is easy to realize.
In addition, because the hot visbreaking glue is the solid adhesive film, the phenomenon of glue overflow and glue leakage can not occur in comparison with the adhesive layer used traditionally, the side surface of the ultrathin glass substrate can be ensured to be exposed, the edge treatment can be directly performed conveniently, and the side surface of the glass substrate is not required to be exposed by performing CNC (computerized numerical control) processing and other treatments on the edge. In addition, because the side of the ultrathin glass substrate far away from the thermal adhesive reducing agent is exposed, thinning treatment can be synchronously carried out in the side etching treatment, and the glass substrate with larger thickness can be used as a raw material for processing.
Drawings
FIG. 1 is a schematic flow chart of a method for producing an ultra-thin glass according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the back plate, the thermal release adhesive and the ultra-thin glass substrate in step S110 of the method for manufacturing ultra-thin glass according to the embodiment of the invention;
fig. 3 is a schematic structural diagram of the back plate, the thermal release adhesive and the ultra-thin glass substrate after step S120 in the method for manufacturing ultra-thin glass according to the embodiment of the invention;
fig. 4 is a schematic structural diagram of the back plate, the thermal release adhesive and the ultra-thin glass substrate in step S150 of the method for manufacturing ultra-thin glass according to the embodiment of the invention;
fig. 5 is a schematic structural diagram of the back plate, the thermal release adhesive and the ultra-thin glass substrate after step S160 in the method for manufacturing ultra-thin glass according to the embodiment of the invention;
fig. 6 is a schematic view of a back plate and an ultra-thin glass substrate attached to the back plate in the method for manufacturing an ultra-thin glass according to an embodiment of the present invention;
reference numerals: 100. an ultra-thin glass substrate; 110. surface A; 120. b surface; 200. thermally de-bonding the adhesive; 300. a back plate.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete. In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate orientations and positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be considered as limiting the present invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 4, an embodiment of the present invention provides a method for manufacturing an ultra-thin glass, including steps S110 to S140.
Step S110: the back plate 300 and the ultrathin glass substrate 100 are attached through the thermal adhesive reducing layer 200, and the surface of one side of the ultrathin glass substrate 100, which is far away from the thermal adhesive reducing layer 200, is exposed; wherein, the edge of the ultra-thin glass substrate 100 does not protrude from the back plate 300. The surface of the ultra-thin glass substrate 100 bonded to the thermal adhesive 200 in this step is referred to as an a-surface 110, and the surface of the ultra-thin glass substrate 100 exposed on the side away from the thermal adhesive 200 is referred to as a B-surface 120. The bonding method and structure of the ultra-thin glass substrate 100, the thermal release adhesive 200 and the back plate 300 can be seen in fig. 2.
Step S120: the back plate 300 and the ultra-thin glass substrate 100 attached to the back plate 300 are immersed in an etching solution to perform side etching on the exposed surface (B-surface 120) and the edge of the ultra-thin glass substrate 100. The ultra-thin glass substrate 100, the thermal release adhesive 200 and the back plate 300 after the side etching process in step S120 are shown in fig. 3. The side of the edge of the ultra-thin glass substrate 100 near the thermal reduction adhesive 200 (i.e., near the a-plane 110) is etched to form an arc angle (also referred to as a C-angle).
Step S130: the back plate 300 and the ultra-thin glass substrate 100 bonded to the back plate 300 and subjected to the side etching are cleaned.
Step S140: and taking out the back plate 300 and the cleaned ultrathin glass substrate 100 attached to the back plate 300, and heating for degumming to obtain the ultrathin glass.
The ultra-thin glass substrate 100 described in the present invention is an ultra-thin glass semi-finished product obtained by a process such as thinning.
The heat-reducing adhesive 200 is a film with unique characteristics, has adhesive force at normal temperature, can be adhered as a common adhesive film, can be easily peeled off only by heating to remove the adhesive force, can not damage an adherend when peeling off a tape, basically has no residual adhesive, is applied to various manufacturing procedures of electronic parts, saves manpower and simplifies the manufacturing procedure for automation.
According to the preparation method of the ultrathin glass, the ultrathin glass substrate 100 is attached to the back plate 300 through the thermal adhesive reducing agent 200, then is soaked in the etching solution for lateral etching, then is cleaned, and finally the ultrathin glass substrate 100 is separated from the back plate 300 through heating degumming. In the side etching and cleaning processes, the ultra-thin glass substrate 100 is attached to the back plate 300, so that the ultra-thin glass substrate 100 can be effectively prevented from being broken or bent, the glass breaking rate is reduced, the preparation process is simple, and mass production is easy to realize.
In addition, because the hot glue reducing layer 200 is a solid glue film, compared with a traditional glue layer, the glue overflowing and leaking phenomena can not occur, the side surface of the ultrathin glass substrate 100 can be ensured to be exposed, the edge processing can be directly performed conveniently, and the side surface of the glass substrate is not required to be exposed by performing CNC (computerized numerical control) processing and other processing on the edge. In addition, since the side of the ultra-thin glass substrate 100 away from the thermal adhesive reducing layer 200 is exposed, the thinning process can be performed simultaneously in the side etching process, and a glass substrate with a large thickness can be used as a raw material for processing.
Through the processing in the steps S110 to S140, the side of the edge of the ultra-thin glass substrate 100 close to the thermal adhesive reducing agent 200 (i.e., close to the a-plane 110) can be etched to form an arc angle (also referred to as a C-shaped angle). In order to improve the bending resistance of the ultra-thin glass, the edge of the ultra-thin glass is usually processed to form smooth curvatures (also called double-sided C-shaped angles) on both sides of the edge. In order to obtain the ultra-thin glass with the edge having the double-sided C-shaped angle, after the step S140, the method further comprises steps S150 to S180.
Step S150: the back plate 300 and the ultra-thin glass substrate 100 are bonded by the thermal reduction adhesive 200, wherein the B surface 120 of the ultra-thin glass is bonded to the thermal reduction adhesive 200, and the a surface 110 is exposed. The bonding method and structure of the ultra-thin glass substrate 100, the thermal release adhesive 200 and the back plate 300 can be seen in fig. 4.
Step S160: the back plate 300 and the ultra-thin glass substrate 100 attached to the back plate 300 are immersed in an etching solution to perform side etching on the a-surface 110 and the edge. The ultra-thin glass substrate 100, the thermal release adhesive 200 and the back plate 300 after the side etching process in step S160 can be referred to fig. 5. As can be seen from fig. 5, the edge of the ultra-thin glass substrate 100 is in a double-sided C-shaped angle.
Step S170: the back plate 300 and the ultra-thin glass substrate 100 bonded to the back plate 300 and subjected to the side etching are cleaned.
Step S180: and taking out the back plate 300 and the cleaned ultrathin glass substrate 100 attached to the back plate 300, and heating for degumming to obtain the ultrathin glass.
In some embodiments, a plurality of ultra-thin glass substrates 100 are attached to the backplane 300. It is understood that the edge of the ultra-thin glass substrate 100 does not protrude from the rear plate 300, and a plurality of ultra-thin glass substrates 100 may be attached to the rear plate 300 for increasing the yield. For example, in one embodiment, the back plate 300 and the ultra-thin glass substrate 100 attached to the back plate 300 can be seen in fig. 6.
In some embodiments, the attaching process in step S110 and/or step S150 specifically includes:
rolling and adhering one surface of the thermal reduction adhesive 200 to the back plate 300;
the ultra-thin glass substrate 100 is attached to the other side of the thermal release adhesive 200.
Specifically, the protective film on one side of the thermal release adhesive 200 is torn off, and is rolled and attached to the back plate 300; and then tearing off the protective film on the other side of the thermal adhesive reducing layer 200, and attaching the ultrathin glass substrate 100 to the thermal adhesive reducing layer 200.
In some embodiments, the undercut processing in step S120 and/or step S160 is: the ultra-thin glass substrate 100 and the backplate 300 are inserted into a basket, and then the basket is immersed in an etching solution for lateral etching.
The ultra-thin glass substrate 100 is inserted into a basket for lateral etching, so that a plurality of back plates 300 can be processed at the same time, and the lateral etching efficiency is higher. And since the size of the back plate 300 is larger than that of the ultra-thin glass substrate 100, the side teeth and the bottom teeth in the basket do not affect the side etching effect of the ultra-thin glass substrate 100.
Since the size of the back plate 300 is larger than that of the ultra-thin glass substrate 100, the side teeth and the bottom teeth of the basket do not affect the cleaning effect of the ultra-thin glass substrate 100.
In some embodiments, the cleaning process in step S130 and/or step S170 is: the ultra-thin glass substrate 100 together with the back plate 300 is immersed in a cleaning solution for cleaning.
Further, in some embodiments, the ultra-thin glass substrate 100 and the back plate 300 are inserted into a basket, and then the basket is soaked in a cleaning solution for cleaning.
The ultra-thin glass substrate 100 is inserted into a basket for cleaning, so that a plurality of back plates 300 can be processed at the same time, and the cleaning efficiency is higher. And since the size of the back plate 300 is larger than that of the ultra-thin glass substrate 100, the side teeth and the bottom teeth in the basket do not affect the cleaning effect of the ultra-thin glass substrate 100.
Further alternatively, the cleaning process in step S130 and/or step S170 is: the ultra-thin glass substrate 100 together with the back plate 300 is put into a flat plate cleaning machine for cleaning.
Adopt the flat cleaning machine to carry out abluent degree of automation height to ultra-thin glass substrate 100, the cleaning efficiency is high, helps improving ultra-thin glass's output, compares in traditional manual washing, and is lower to operating personnel's requirement.
In some of these embodiments, the temperature for heat degumming is between 100 ℃ and 150 ℃. Further, the temperature for heating degumming is 120-140 ℃. Preferably, the temperature for heat degumming is 140 ℃.
In some of these embodiments, the heat degumming time is between 3 minutes and 10 minutes. Preferably, the time for heat degumming is 5 minutes.
Since the single-side thinning of the exposed surface of the ultra-thin glass substrate 100 can be performed simultaneously during the side etching process, the ultra-thin glass substrate 100 with a larger thickness can be used as a raw material for preparation. In some of these embodiments, the ultra-thin glass substrate 100 has a thickness of 30 to 70 microns. The thickness of the finished product of ultrathin glass prepared by the preparation method of ultrathin glass is 10-50 microns.
The invention also provides the ultrathin glass prepared by the preparation method of the ultrathin glass.
The invention also provides application of the ultrathin glass in preparing electronic products.
The invention also provides an electronic product which comprises the ultrathin glass.
The following are specific examples.
Example 1:
the ultra-thin glass of this example was prepared by the following steps:
(1) the back plate and the ultrathin glass substrate (the thickness is 30 microns) are attached through the thermal adhesive reducing agent, and one side of the ultrathin glass substrate, which is far away from the thermal adhesive reducing agent, is exposed; wherein, the size of the back plate is larger than that of the ultra-thin glass substrate. The surface of the ultrathin glass substrate bonded with the thermal adhesive reducing agent in this step is referred to as an a surface, and the surface of the ultrathin glass substrate exposed on the side away from the thermal adhesive reducing agent is referred to as a B surface. The bonding method and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 2.
(2) The back plate and the ultrathin glass substrate attached to the back plate are inserted into a basket, the basket is soaked in HF etching solution (1mol/L) for lateral etching, and the etching time is 10 minutes. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be referred to fig. 3.
(3) And inserting the side-etched back plate and the ultrathin glass substrate attached to the back plate into a basket, and soaking the basket in clear water for cleaning.
(4) And taking out the cleaned back plate and the ultrathin glass substrate attached to the back plate from the basket, heating to degum for 5 minutes at 140 ℃, and separating the back plate and the ultrathin glass substrate.
(5) And (4) repeating the steps (1) to (4) to process the other surface of the ultrathin glass substrate. That is, the surface B of the ultra-thin glass substrate is bonded to the thermal release adhesive, and the bonding manner and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 4. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be seen from fig. 5.
Example 2:
the ultra-thin glass of this example was prepared by the following steps:
(1) the back plate and the ultrathin glass substrate (with the thickness of 50 microns) are attached through the thermal adhesive reducing agent, and one side of the ultrathin glass substrate, which is far away from the thermal adhesive reducing agent, is exposed; wherein, the size of the back plate is larger than that of the ultra-thin glass substrate. The surface of the ultrathin glass substrate bonded with the thermal adhesive reducing agent in this step is referred to as an a surface, and the surface of the ultrathin glass substrate exposed on the side away from the thermal adhesive reducing agent is referred to as a B surface. The bonding method and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 2.
(2) The back plate and the ultrathin glass substrate attached to the back plate are inserted into a basket, the basket is soaked in HF etching solution (1mol/L) for lateral etching, and the etching time is 10 minutes. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be referred to fig. 3.
(3) And inserting the side-etched back plate and the ultrathin glass substrate attached to the back plate into a basket, and soaking the basket in clear water for cleaning.
(4) And taking out the cleaned back plate and the ultrathin glass substrate attached to the back plate from the basket, heating to degum for 5 minutes at 140 ℃, and separating the back plate and the ultrathin glass substrate.
(5) And (4) repeating the steps (1) to (4) to process the other surface of the ultrathin glass substrate. That is, the surface B of the ultra-thin glass substrate is bonded to the thermal release adhesive, and the bonding manner and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 4. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be seen from fig. 5.
Example 3:
the ultra-thin glass of this example was prepared by the following steps:
(1) the back plate and the ultrathin glass substrate (the thickness is 70 microns) are attached through the thermal adhesive reducing agent, and one side of the ultrathin glass substrate, which is far away from the thermal adhesive reducing agent, is exposed; wherein, the size of the back plate is larger than that of the ultra-thin glass substrate. The surface of the ultrathin glass substrate bonded with the thermal adhesive reducing agent in this step is referred to as an a surface, and the surface of the ultrathin glass substrate exposed on the side away from the thermal adhesive reducing agent is referred to as a B surface. The bonding method and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 2.
(2) The back plate and the ultrathin glass substrate attached to the back plate are inserted into a basket, the basket is soaked in HF etching solution (1mol/L) for lateral etching, and the etching time is 10 minutes. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be referred to fig. 3.
(3) And inserting the side-etched back plate and the ultrathin glass substrate attached to the back plate into a basket, and soaking the basket in clear water for cleaning.
(4) And taking out the cleaned back plate and the ultrathin glass substrate attached to the back plate from the basket, heating to degum for 5 minutes at 140 ℃, and separating the back plate and the ultrathin glass substrate.
(5) And (4) repeating the steps (1) to (4) to process the other surface of the ultrathin glass substrate. That is, the surface B of the ultra-thin glass substrate is bonded to the thermal release adhesive, and the bonding manner and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 4. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be seen from fig. 5.
Example 4:
the ultra-thin glass of this example was prepared by the following steps:
(1) the back plate and the ultrathin glass substrate (with the thickness of 50 microns) are attached through the thermal adhesive reducing agent, and one side of the ultrathin glass substrate, which is far away from the thermal adhesive reducing agent, is exposed; wherein, the size of the back plate is larger than that of the ultra-thin glass substrate. The surface of the ultrathin glass substrate bonded with the thermal adhesive reducing agent in this step is referred to as an a surface, and the surface of the ultrathin glass substrate exposed on the side away from the thermal adhesive reducing agent is referred to as a B surface. The bonding method and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 2.
(2) The back plate and the ultrathin glass substrate attached to the back plate are inserted into a basket, the basket is soaked in HF etching solution (1mol/L) for lateral etching, and the etching time is 10 minutes. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be referred to fig. 3.
(3) And (4) putting the side-etched back plate and the ultrathin glass substrate attached to the back plate into a flat plate cleaning machine for cleaning.
(4) And taking out the cleaned back plate and the ultrathin glass substrate attached to the back plate from the basket, heating to degum for 5 minutes at 140 ℃, and separating the back plate and the ultrathin glass substrate.
(5) And (4) repeating the steps (1) to (4) to process the other surface of the ultrathin glass substrate. That is, the surface B of the ultra-thin glass substrate is bonded to the thermal release adhesive, and the bonding manner and structure of the ultra-thin glass substrate, the thermal release adhesive and the back plate can be seen in fig. 4. The ultra-thin glass substrate, the thermal release adhesive and the back plate structure after the side etching treatment can be seen from fig. 5.
Comparative example 1:
the ultra-thin glass of this comparative example was prepared according to the following procedure:
(1) the manufacturing method comprises the steps of rolling and attaching an ultrathin glass substrate (with the thickness of 30 micrometers) between two layers of back plates through UV high-temperature glue (liquid state) to form a back plate, a glue layer, the ultrathin glass substrate, the glue layer and the sandwich structure of the back plates which are sequentially stacked, solidifying the high-temperature glue through UV lamp irradiation to enable the ultrathin glass substrate and the back plates to be tightly bonded, edging the edge of a sandwich layer of the glass substrate through CNC (computerized numerical control) processing to remove glue overflow generated in the attaching process, exposing the edge of the glass in HF (hydrogen fluoride) etching liquid, attaching the sandwich structure to a basket inserting back plate (the edge of the basket inserting back plate protrudes out of the sandwich structure), inserting a basket of the sandwich structure into a basket through the basket inserting back plate, soaking the basket in the HF etching liquid (1mol/L), and etching for 10 min. After the etching is finished, the sandwich structure is taken out of the backboard of the insert basket, the sandwich structure is cleaned and soaked in hot water with the temperature of more than 95 ℃, the adhesive layer can be rapidly softened when meeting the hot water and loses the adhesive force, and the ultrathin glass substrate is separated from the backboard.
(2) The ultra-thin glass substrate is firstly wiped by using water and then is washed clean by a manual cleaning mode. The thickness, breakage rate and yield of the ultra-thin glass processed by the method for manufacturing the ultra-thin glass of examples 1 to 4 and comparative example 1 are shown in table 1.
TABLE 1
As can be seen from the relevant data in Table 1, the breaking rate of the methods for preparing the ultrathin glass in the embodiments 1 to 4 is low and ranges from 2% to 7%, and the larger the thickness of the ultrathin glass substrate is, the lower the breaking rate is. In addition, the yield of the method for preparing the ultra-thin glass of the embodiments 1 to 4 can reach more than 100 sheets/hour. The cleaning process in example 4 was performed using a plate washer, which was more automated and produced higher yields than example 2. In contrast, in comparative example 1, the side etching and cleaning were performed by the conventional process, and since the cleaning was performed by a manual cleaning method, the chipping rate was as high as 60%, and the yield was low, only 10 chips/hour. In addition, the ultra-thin glass substrate is exposed by glue overflow in the side etching process through CNC (computer numerical control) processing, so that the ultra-thin glass substrate is also worn to a certain extent.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, so as to understand the technical solutions of the present invention specifically and in detail, but not to be understood as the limitation of the protection scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. It should be understood that the technical solutions provided by the present invention, which are obtained by logical analysis, reasoning or limited experiments, are within the scope of the present invention as set forth in the appended claims. Therefore, the protection scope of the present invention should be subject to the content of the appended claims, and the description and the drawings can be used for explaining the content of the claims.
Claims (10)
1. The preparation method of the ultrathin glass is characterized by comprising the following steps of:
attaching: the back plate and the ultrathin glass substrate are attached through a thermal adhesive reducing agent, and the surface of one side of the ultrathin glass substrate, which is far away from the thermal adhesive reducing agent, is exposed; wherein the edge of the ultrathin glass substrate does not protrude out of the back plate;
side etching: soaking the back plate and the ultrathin glass substrate attached to the back plate in etching solution to carry out side etching on the exposed surface and the edge of the ultrathin glass substrate;
cleaning: cleaning the back plate and the ultra-thin glass substrate which is attached to the back plate and subjected to side etching;
separation: and taking out the back plate and the cleaned ultrathin glass substrate attached to the back plate, and heating for degumming to obtain the ultrathin glass.
2. The method of manufacturing ultra-thin glass as claimed in claim 1, further comprising:
and repeating the attaching, the side etching, the cleaning and the separating steps to process the surface and the edge of the other side of the ultrathin substrate.
3. The method of claim 1 or 2, wherein a plurality of the ultra-thin glass substrates are attached to the back sheet.
4. The method for manufacturing ultra-thin glass according to claim 1 or 2, wherein the attaching step is specifically:
one surface of the thermal reduction adhesive is attached to the back plate in a rolling or pressing mode;
and attaching the ultrathin glass substrate to the other surface of the thermal reduction adhesive.
5. The method of manufacturing ultra-thin glass according to claim 1, wherein the cleaning step is: soaking the ultra-thin glass substrate subjected to the side etching and the back plate in a cleaning solution for cleaning;
or, the cleaning step is: and putting the ultra-thin glass substrate subjected to the side etching and the back plate into a flat plate cleaning machine for cleaning.
6. The method of claim 1, wherein the temperature of the thermal degluing is from 100 ℃ to 150 ℃.
7. The method of manufacturing an ultra-thin glass as claimed in any one of claims 1 to 6, wherein the thickness of the ultra-thin glass substrate is 30 to 70 μm.
8. An ultrathin glass produced by the method for producing an ultrathin glass according to any one of claims 1 to 7.
9. Use of the ultra-thin glass of claim 8 in the manufacture of electronic products.
10. An electronic product comprising the ultra-thin glass of claim 8.
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