CN114029850A - Multi-magnetic-field complex curved surface chemical mechanical polishing equipment - Google Patents
Multi-magnetic-field complex curved surface chemical mechanical polishing equipment Download PDFInfo
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- CN114029850A CN114029850A CN202111396028.8A CN202111396028A CN114029850A CN 114029850 A CN114029850 A CN 114029850A CN 202111396028 A CN202111396028 A CN 202111396028A CN 114029850 A CN114029850 A CN 114029850A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/003—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor whereby the workpieces are mounted on a holder and are immersed in the abrasive material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/005—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/10—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention provides a multi-magnetic-field complex curved surface chemical mechanical polishing device which comprises a spindle system, a magnetic field system, a polishing groove and a numerical control system. During polishing, chemical polishing liquid and magnetic grinding materials are filled in the polishing grooves, the magnetic field intensity in the polishing grooves can be changed by changing the speed of each turntable and changing the distance between the turntables on the two sides and the polishing grooves in the polishing process, the motion trail and the motion form of the magnetic grinding materials in the polishing grooves are further changed, the magnetic grinding materials can reach any surface of the curved surface part by combining the change of the rotating speed and the deflection angle of the main shaft and the axial ultrasonic vibration effect of the main shaft, and a softening film formed by the chemical polishing liquid on the surface of the complex curved surface part is removed by strong and uniform mechanical grinding acting force.
Description
Technical Field
The invention relates to the technical field of machining equipment, in particular to multi-magnetic-field chemical mechanical polishing equipment for a complex curved surface.
Background
The complex curved surface part is usually milled by adopting five-axis linkage, or manufactured by adopting a material increasing and decreasing manufacturing process. The surface roughness Ra of the machined surface is more than or equal to 3.2um after ordinary five-axis linkage milling, and the surface roughness Ra of the machined surface is more than or equal to 8um after material addition and subtraction manufacturing. Therefore, under the condition of the prior art, in order to further improve the surface quality of the complex curved surface part, further processing is required to be carried out by a grinding machine and polishing equipment so as to meet the service requirement. The existing polishing modes, such as soft abrasive belt polishing, magnetorheological abrasive flow polishing, robot polishing and other traditional mechanical polishing methods, have the polishing mode of removing materials by stress, processing knife lines are inevitably left in the polishing process, damage sources are generated, the residual damage layer is thick after processing, the processing efficiency is low, and the level of chemical mechanical polishing cannot be reached.
The chemical mechanical polishing process is widely applied to plane polishing, and the process flow can be simply summarized as adopting a chemical reagent to corrode or oxidize a workpiece to form a layer of uniform softening film on the surface of the workpiece, then removing the softening film on the surface of the workpiece through an abrasive and a polishing pad under the action of normal pressure, and realizing surface planarization in the chemical film forming and mechanical film removing processes which are continuously and alternately carried out. Chemical mechanical polishing is currently the most effective method for achieving global planarization and is widely used in integrated circuit manufacturing. But the chemical mechanical polishing applied to the complex curved surface part is difficult to realize at present, and the main reasons are that the uniform mechanical acting force is difficult to apply on the complex curved surface, and the softening film on the surface of the complex curved surface workpiece is difficult to remove through the uniform mechanical acting force. Therefore, designing equipment capable of applying uniform mechanical force on the surface has great significance for chemical mechanical polishing of complex curved surfaces.
Disclosure of Invention
According to the technical problems, the chemical mechanical polishing equipment for the multi-magnetic field complex curved surface is provided, and the chemical mechanical polishing of any curved surface can be realized. The problems that the surface roughness of the complex curved surface is high after the existing five-axis linkage milling processing and material increase and decrease manufacturing, the polishing precision of the existing complex curved surface is low, and the damage layer thickness is thick after polishing are solved. The technical means adopted by the invention are as follows:
the spindle system comprises a movable spindle and a clamp connected to the spindle, the clamp is used for clamping a piece to be polished, the spindle is used for adjusting the space pose of the clamp, the piece to be polished enters a preset position of the polishing groove, chemical polishing liquid and magnetic abrasive are contained in the polishing groove, the numerical control system is connected with the spindle system and the magnetic field system, the magnetic field system comprises a rotatable permanent magnet arranged outside the polishing groove, the distance between the rotatable permanent magnet and the polishing groove is adjustable, the numerical control system is used for adjusting the position relation between the permanent magnet and the polishing groove, the motion trail and the motion form of the magnetic abrasive in the polishing groove are further changed, and polishing of the piece to be polished is completed.
Further, the spindle system comprises a clamp, an ultrasonic transducer, a spindle and a spindle box installed on the machine tool body, the spindle box is installed on the machine tool body through a slide rail, the spindle box is used for providing a Z-direction translational degree of freedom for the spindle, the spindle is installed on the spindle box, can rotate around a Y axis by taking the spindle box as a circle center, can rotate forward and backward, and has a Z-axis rotational degree of freedom, the ultrasonic transducer is installed on the spindle and is used for providing Z-direction ultrasonic vibration for the spindle, the clamp is installed at the bottom of the spindle through a quick connector, and the clamp is resistant to acid and alkali corrosion.
Further, the magnetic field system comprises a turntable, a permanent magnet, a turntable motor and a turntable base movably mounted on the lathe bed, the turntable is of a disc-shaped structure, mounting grooves which are uniformly distributed are formed in the side face facing the polishing groove, the other side face is free of the mounting grooves and is mounted on a motor shaft of the turntable motor, the turntable is made of a non-magnetized material, and the permanent magnet is mounted in the mounting grooves.
Further, the turntable motor is mounted on the turntable base and used for providing power for the turntable, the turntable base is mounted on the lathe bed through the sliding rail and can move in a translation mode along the X axis, and when the turntable base is closest to the polishing groove, the permanent magnet mounted in the turntable cannot be in contact with the polishing groove.
Furthermore, the turntable, the permanent magnet, the turntable motor and the turntable seat are arranged in two sets, the two turntable seats are oppositely arranged on two side faces of the polishing groove, the distance between the permanent magnet and the polishing groove is adjusted by adjusting the position of the turntable seat to control the magnetic field intensity in the polishing groove, the magnetic field intensity in the polishing groove is reduced when the turntable seat is far away from the polishing groove, and the magnetic field intensity in the polishing groove is enhanced when the turntable seat is close to the polishing groove.
Further, still include bottom carousel motor, bottom carousel motor fixed mounting is equipped with carousel and permanent magnet on the lathe bed under the polishing groove, the carousel is disc structure, and the mounting groove of evenly distributed is seted up towards the side of polishing groove to the carousel, and another side does not have the mounting groove and installs on the motor shaft of carousel motor, the carousel material is non-magnetized material, the permanent magnet is installed in the mounting groove, and the installation back permanent magnet has the distance of predetermineeing apart from the polishing groove.
Furthermore, the numerical control system integrally controls the Z-direction translational motion of the spindle box, the deflection direction and deflection angle of the spindle around the Y axis, the rotation direction and rotation speed of the spindle, the rotation direction and rotation speed of the 3 turntables respectively, and the translation distances between the turntable bases on two sides and the polishing groove in the X axis direction respectively.
Further, the polishing groove is of a cubic structure with an open top, supporting columns are arranged on the periphery of the bottom of the polishing groove and are installed on the lathe bed, a polishing solution discharge port is formed in the polishing groove, chemical polishing solution and magnetic abrasive are contained in the polishing groove during polishing, and the polishing groove is made of non-magnetic acid-base corrosion-resistant materials.
Furthermore, the wall thickness of the left side wall and the wall thickness of the right side wall of the polishing groove are smaller than 10mm, and the wall thickness of the front side wall and the wall thickness of the rear side wall are larger than the wall thickness of the left side wall and the wall thickness of the right side wall of the polishing groove.
Further, the surfaces of the machine body and the internal mechanism, which can be splashed by the polishing liquid in the polishing groove, are coated with hydrophobic, oleophobic and corrosion-resistant coatings or provided with shielding objects.
The invention has the following advantages:
the invention provides a multi-magnetic-field complex curved surface chemical mechanical polishing device, which can realize the chemical mechanical polishing of complex curved surface parts through multi-degree-of-freedom linkage operation and solve the problem that the surface precision of the current complex curved surface parts is difficult to improve after the complex curved surface parts are polished only by a traditional polishing mode of removing materials through stress. The equipment can be suitable for polishing complex curved surface parts of different types and different materials, has strong universality, good surface consistency of the complex curved surface parts after polishing and high surface quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a three-dimensional assembly structure of the device in the embodiment of the present invention.
Fig. 2 is a schematic view illustrating an installation of the turntable and the permanent magnet according to an embodiment of the present invention.
In the figure: 1. a bed body; 2. an ultrasonic transducer; 3. a main shaft; 4. a main spindle box; 5. a clamp; 6. a numerical control system; 7. a polishing tank; 8. a turntable; 9. a bottom turntable motor; 10. a permanent magnet; 11. a turntable motor; 12. a turntable seat.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in figure 1, the invention discloses a multi-magnetic-field chemical mechanical polishing device for a complex curved surface, which is of a vertical structure and can realize chemical mechanical polishing of the complex curved surface. The polishing device comprises a spindle system, a magnetic field system, a polishing groove and a numerical control system, wherein the spindle system comprises a movable spindle and a clamp connected to the spindle, the clamp is used for clamping a piece to be polished, the spindle is used for adjusting the space pose of the clamp, the piece to be polished enters the preset position of the polishing groove, chemical polishing liquid and magnetic abrasive materials are contained in the polishing groove, the numerical control system is connected with the spindle system and the magnetic field system, the magnetic field system comprises a rotatable permanent magnet arranged outside the polishing groove, the distance between the rotatable permanent magnet and the polishing groove is adjustable, the numerical control system is used for adjusting the position relation between the permanent magnet and the polishing groove, the motion track and the motion form of the magnetic abrasive materials in the polishing groove are further changed, and polishing of the piece to be polished is completed.
The spindle system comprises a clamp 5, an ultrasonic transducer 2, a spindle 3 and a spindle box 4 arranged on a lathe bed 1. The ultrasonic vibration machining device is characterized in that the spindle box 4 is mounted on the machine tool body 1 through a sliding rail, the spindle box 4 can move in a translational mode along a Z axis to provide a translational degree of freedom in the Z direction for the spindle 3, the spindle 3 is mounted on the spindle box 4 and can rotate +/-60 degrees around the Y axis by taking the spindle box 4 as a circle center, the ultrasonic vibration machining device can rotate forwards and backwards and has a Z-axis rotational degree of freedom, the ultrasonic transducer 2 is mounted on the spindle 3 to provide Z-direction ultrasonic vibration for the spindle 3, the clamp 5 is mounted at the bottom of the spindle 3 through a quick connector and used for clamping a workpiece, and the clamp 5 is resistant to acid and alkali corrosion.
The magnetic field system comprises a turntable 8, a permanent magnet 10, a turntable motor 11, a bottom turntable motor 9 and a turntable seat 12, wherein the bottom turntable motor 9 and the turntable seat are installed on the lathe bed 1. The turntable 8 is of a disc-shaped structure, one side surface of the turntable 8 is provided with disc-shaped mounting grooves which are uniformly distributed, the side surface faces the polishing groove 7, the other side surface of the turntable 10 is provided with no mounting groove and is mounted on the shaft of a turntable motor 11 and made of non-magnetized materials, the structure is shown in figure 2, the permanent magnet 10 is of a disc-shaped structure and made of a permanent magnet and is correspondingly mounted in the disc-shaped mounting groove on the turntable 8, the turntable motor 11 is mounted on a turntable base 12 and provides power for the turntable 8, the turntable base 12 is mounted on the machine body 1 through a slide rail and can move in a translation mode along the X axis, the two turntable bases 12 are oppositely arranged on two side surfaces of the polishing groove 7, the distance between the permanent magnet 10 and the polishing groove 7 can be adjusted by adjusting the position of the turntable base 12 so as to control the magnetic field intensity in the polishing groove 7, and the magnetic field intensity in the polishing groove 7 can be reduced when the turntable base 12 is far away from the polishing groove 7, the magnetic field intensity in the polishing groove 7 can be enhanced when the turntable base 12 is close to the polishing groove 7, when the turntable base 12 is closest to the polishing groove 7, the permanent magnet 10 installed in the turntable 8 cannot contact with the polishing groove 7, the bottom turntable motor 9 is fixedly installed on the lathe bed 1 right below the polishing groove 7, the turntable 8 and the permanent magnet 10 are also installed on the bottom turntable motor 9, the structure of the turntable 8 and the permanent magnet 10 is consistent with that of the turntable 8 and the permanent magnet 10 arranged on the two side faces of the polishing groove 7, one side face with the permanent magnet 10 faces the polishing groove 7, and the distance between the permanent magnet 10 and the polishing groove 7 is 1mm after installation.
The numerical control system 6 integrally controls the Z-direction translational motion of the spindle box 4, the deflection direction and deflection angle of the spindle 3 around the Y axis, the rotation direction and rotation speed of the spindle 3, the rotation direction and rotation speed of the 3 turntables 8 respectively, and the translation distances between the turntable bases 12 on two sides and the polishing groove 7 in the X axis direction respectively.
The bed is also provided with an opening and closing door which is closed during operation, and the surfaces of the bed and the internal mechanism which can be splashed by the polishing liquid in the polishing tank 7 are coated with a hydrophobic, oleophobic and corrosion-resistant coating or a covering.
During polishing, chemical polishing liquid and magnetic grinding materials are filled in the polishing tank 7, a fixture 5 arranged on the spindle 3 clamps a workpiece, and the numerical control system 6 controls the spindle box 4 to move towards the negative direction of the Z axis until the workpiece is contacted with the chemical polishing liquid and the magnetic grinding materials in the polishing tank 7 or the workpiece is immersed in the chemical polishing liquid and the magnetic grinding materials. The rotation angle of the spindle 3 around the Y axis is adjusted in real time according to the processing requirements of workpieces, the forward and reverse rotation direction and rotation speed of the spindle 3, the vibration frequency and amplitude generated by the ultrasonic transducer 2 are adjusted, the distance between the turntables 8 at the two sides of the polishing groove 7 and the polishing groove 7 is adjusted, and the rotation direction and rotation speed of the turntables 8 at the two sides and the bottom are adjusted. The magnetic grinding materials with different grain diameters and different shapes can be replaced according to the actual processing requirement in the polishing process.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A multi-magnetic field complex curved surface chemical mechanical polishing device is characterized by comprising a main shaft system, a magnetic field system, a polishing groove and a numerical control system, the spindle system comprises a movable spindle and a clamp connected to the spindle, the clamp is used for clamping a piece to be polished, the main shaft is used for adjusting the space pose of the clamp so that the piece to be polished enters the preset position of the polishing groove, the polishing groove is filled with chemical polishing liquid and magnetic grinding materials, the numerical control system is connected with the main shaft system and the magnetic field system, the magnetic field system comprises a rotatable permanent magnet arranged outside the polishing groove, the distance between the rotatable permanent magnet and the polishing groove is adjustable, the numerical control system is used for adjusting the position relation between the permanent magnet and the polishing groove, and further changing the motion trail and the motion form of the magnetic abrasive in the polishing groove to finish the polishing of the piece to be polished.
2. The multi-magnetic-field complex curved surface chemical mechanical polishing device of claim 1, wherein the spindle system comprises a clamp, an ultrasonic transducer, a spindle and a spindle box installed on the machine tool body, the spindle box is installed on the machine tool body through a slide rail, the spindle box is used for providing Z-direction translational freedom degree for the spindle, the spindle is installed on the spindle box, can rotate around a Y axis with the spindle box as a circle center and can rotate forwards and backwards, and has Z-axis rotational freedom degree, the ultrasonic transducer is installed on the spindle and is used for providing Z-direction ultrasonic vibration for the spindle, the clamp is installed at the bottom of the spindle through a quick connector, and the clamp is resistant to acid and alkali corrosion.
3. The chemical mechanical polishing equipment for the multi-magnetic field complex curved surface according to claim 1, wherein the magnetic field system comprises a turntable, a permanent magnet, a turntable motor and a turntable base movably mounted on the bed, the turntable is of a disc-shaped structure, the side surface facing the polishing groove is provided with uniformly distributed mounting grooves, the other side surface is provided with no mounting groove and is mounted on a motor shaft of the turntable motor, the turntable is made of a non-magnetized material, and the permanent magnet is mounted in the mounting grooves.
4. The multi-magnetic-field complex curved surface chemical mechanical polishing device as claimed in claim 3, wherein the turntable motor is mounted on a turntable base for providing power for the turntable, the turntable base is mounted on the bed through a slide rail and can move in a translational manner along the X axis, and when the turntable base is closest to the polishing groove, the permanent magnet mounted in the turntable does not contact with the polishing groove.
5. The chemical mechanical polishing equipment for the multi-magnetic field complex curved surface according to claim 3 or 4, wherein the number of the rotating disc, the permanent magnet, the rotating disc motor and the rotating disc seat is two, the two rotating disc seats are oppositely arranged on two side surfaces of the polishing groove, the distance between the permanent magnet and the polishing groove is adjusted by adjusting the position of the rotating disc seat so as to control the magnetic field intensity in the polishing groove, the magnetic field intensity in the polishing groove is reduced when the rotating disc seat is far away from the polishing groove, and the magnetic field intensity in the polishing groove is enhanced when the rotating disc seat is close to the polishing groove.
6. The chemical mechanical polishing equipment for the multi-magnetic field complex curved surface according to claim 5, further comprising a bottom turntable motor, wherein the bottom turntable motor is fixedly installed on a bed body right below the polishing groove, a turntable and a permanent magnet are installed on the bottom turntable motor, the turntable is of a disc-shaped structure, the side surface facing the polishing groove is provided with uniformly distributed installation grooves, the other side surface is provided with no installation groove and is installed on a motor shaft of the turntable motor, the turntable is made of a non-magnetized material, the permanent magnet is installed in the installation groove, and the permanent magnet is a preset distance away from the polishing groove after installation.
7. The multi-magnetic-field chemical mechanical polishing equipment for the complex curved surfaces according to claim 6, wherein the numerical control system integrally controls the translational motion of the spindle box in the Z direction, the deflection direction and deflection angle of the spindle around the Y axis, the rotation direction and rotation speed of the spindle, the rotation direction and rotation speed of the 3 rotating discs respectively, and the translation distance between the two rotating disc seats and the polishing groove in the X axis direction respectively.
8. The chemical mechanical polishing device for the multi-magnetic field complex curved surface according to claim 1, wherein the polishing trough is of a cubic structure with an open top, supporting columns are arranged on the periphery of the bottom of the polishing trough and are installed on the bed, the polishing trough is provided with a polishing liquid discharge port, chemical polishing liquid and magnetic abrasive materials are contained in the polishing trough during polishing, and the polishing trough is made of non-magnetic acid-base corrosion resistant materials.
9. The chemical mechanical polishing equipment for the multi-magnetic field complex curved surface as claimed in claim 1, wherein the wall thickness of the left and right side walls of the polishing trough is less than 10mm, and the wall thickness of the front and rear side walls is greater than that of the left and right side walls.
10. The multi-magnetic field complex curved surface chemical mechanical polishing device of claim 1, wherein the surfaces of the lathe bed and the internal mechanism, which can be splashed by the polishing liquid in the polishing groove, are coated with a hydrophobic, oleophobic and corrosion resistant coating or provided with a shade.
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| CN202111396028.8A CN114029850B (en) | 2021-11-23 | 2021-11-23 | Multi-magnetic-field complex curved surface chemical mechanical polishing equipment |
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| CN202111396028.8A CN114029850B (en) | 2021-11-23 | 2021-11-23 | Multi-magnetic-field complex curved surface chemical mechanical polishing equipment |
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| CN114029850A true CN114029850A (en) | 2022-02-11 |
| CN114029850B CN114029850B (en) | 2023-03-14 |
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| CN114571374A (en) * | 2022-03-14 | 2022-06-03 | 陕西捷特智能科技有限公司 | Vortex magnetic guide jet flow based 3D complex part inner flow passage cleaning device and method |
| CN114589636A (en) * | 2022-03-14 | 2022-06-07 | 陕西捷特智能科技有限公司 | Device and method for cleaning inner flow channel of pneumatic reciprocating jet 3D complex part based on magnetic guidance |
| CN114986373A (en) * | 2022-08-04 | 2022-09-02 | 太原理工大学 | Polishing and grinding system for magnetic field assisted electrochemical mechanical machining |
| CN115256208A (en) * | 2022-08-09 | 2022-11-01 | 大连理工大学 | Cobalt-chromium-molybdenum alloy denture polishing device and polishing process thereof |
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| CN114571374A (en) * | 2022-03-14 | 2022-06-03 | 陕西捷特智能科技有限公司 | Vortex magnetic guide jet flow based 3D complex part inner flow passage cleaning device and method |
| CN114589636A (en) * | 2022-03-14 | 2022-06-07 | 陕西捷特智能科技有限公司 | Device and method for cleaning inner flow channel of pneumatic reciprocating jet 3D complex part based on magnetic guidance |
| CN114589636B (en) * | 2022-03-14 | 2023-02-17 | 陕西捷特智能科技有限公司 | Device and method for cleaning inner flow channel of 3D complex part based on magnetic guiding pneumatic reciprocating jet flow |
| CN114986373A (en) * | 2022-08-04 | 2022-09-02 | 太原理工大学 | Polishing and grinding system for magnetic field assisted electrochemical mechanical machining |
| CN114986373B (en) * | 2022-08-04 | 2022-10-14 | 太原理工大学 | Polishing and grinding system for magnetic field assisted electrochemical mechanical machining |
| CN115256208A (en) * | 2022-08-09 | 2022-11-01 | 大连理工大学 | Cobalt-chromium-molybdenum alloy denture polishing device and polishing process thereof |
| CN115256208B (en) * | 2022-08-09 | 2023-08-29 | 大连理工大学 | Cobalt-chromium-molybdenum alloy denture polishing device and polishing process thereof |
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