CN114029208A - Gap filling method and device for electronic product - Google Patents
Gap filling method and device for electronic product Download PDFInfo
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- CN114029208A CN114029208A CN202111262804.5A CN202111262804A CN114029208A CN 114029208 A CN114029208 A CN 114029208A CN 202111262804 A CN202111262804 A CN 202111262804A CN 114029208 A CN114029208 A CN 114029208A
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 74
- 239000000945 filler Substances 0.000 claims abstract description 61
- 238000010438 heat treatment Methods 0.000 claims abstract description 54
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims description 26
- 238000001514 detection method Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001723 curing Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 238000007599 discharging Methods 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0493—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases using vacuum
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- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a gap filling method and a gap filling device for an electronic product, which belong to the technical field of gap filling of electronic products, and comprise the steps of filling a filler in a non-welding area of the electronic product to obtain the electronic product filled with the filler; heating and curing the electronic product filled with the filler by using negative pressure vacuum generating equipment according to a preset heating temperature and a preset heating time to obtain a heated and cured electronic product; pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure intensity to obtain a pressurized electronic product; restoring the pressure in the negative pressure vacuum generating equipment to normal pressure; and detecting the pressurized electronic product according to the preset water pressure so as to judge whether the non-welding area of the pressurized electronic product is completely filled. The invention achieves the technical effects of realizing complete filling in the non-welding area of the electronic product and improving the dustproof, shockproof and waterproof performances of the electronic product.
Description
Technical Field
The invention belongs to the technical field of gap filling of electronic products, and particularly relates to a gap filling method and device for an electronic product.
Background
The electronic product is a related product based on electric energy, and in the production process of the electronic product, gaps in a non-welding area in the electronic product need to be filled, so that the dustproof, shockproof and waterproof performances of the electronic product are effectively improved.
At present, in the gap filling technology of the existing electronic product, in the production process of the electronic product, the capillary principle is usually adopted to directly fill the glue in the non-welding area of the electronic product, and after the gap in the non-welding area is filled with the glue, the glue is naturally dried, so that the dustproof, shockproof and waterproof performances of the electronic product are improved. However, when the area of the electronic product to be filled is too large, the non-welding area in the electronic product to be filled is also large, and the glue is directly filled in the non-welding area of the electronic product, so that air bubbles in the non-welding area cannot be removed in time, and incomplete filling occurs, which results in poor dust-proof, shock-proof and water-proof properties of the electronic product.
In summary, in the gap filling technology of the existing electronic product, there are technical problems that the filling in the non-welding area of the electronic product is incomplete, and the dustproof, shockproof and waterproof performance of the electronic product is poor.
Disclosure of Invention
The invention aims to solve the technical problems that the filling in a non-welding area of an electronic product is incomplete, and the dustproof, shockproof and waterproof performances of the electronic product are poor.
In order to solve the above technical problem, the present invention provides a gap filling method for an electronic product, including: filling filler in a non-welding area of the electronic product to obtain the filler-filled electronic product; heating and curing the electronic product filled with the filler by using negative pressure vacuum generating equipment according to a preset heating temperature and a preset heating time to obtain a heated and cured electronic product; pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure intensity to obtain a pressurized electronic product; restoring the pressure in the negative pressure vacuum generating equipment to normal pressure so as to take out the pressurized electronic product; detecting the pressurized electronic product according to a preset water pressure so as to judge whether a non-welding area of the pressurized electronic product is completely filled; if so, determining the pressurized electronic product as a qualified electronic product.
Further, the filler includes glue.
Further, the preset heating temperature is 120 °, and the preset heating time is 30 minutes.
Further, the preset pressure is 600 Kpa.
Further, the preset water pressure is 100 Kpa.
According to yet another aspect of the present invention, there is also provided a gap filling apparatus for an electronic product, the apparatus including: the filling module is used for filling a filler in a non-welding area of the electronic product to obtain the filler-filled electronic product; the heating module is used for heating and curing the electronic product filled with the filler through negative pressure vacuum generating equipment according to a preset heating temperature and preset heating time so as to obtain the heated and cured electronic product; the pressurizing module is used for pressurizing the heated and cured electronic product through the negative pressure vacuum generating equipment according to preset pressure intensity so as to obtain the pressurized electronic product; the acquisition module is used for recovering the pressure in the negative pressure vacuum generation equipment to normal pressure so as to take out the pressurized electronic product; the detection module is used for detecting the pressurized electronic product according to preset water pressure so as to judge whether the non-welding area of the pressurized electronic product is completely filled; and the determining module is used for determining the pressurized electronic product as a qualified electronic product if the electronic product is judged to be qualified.
Further, the filler includes glue.
Further, the preset heating temperature is 120 °, and the preset heating time is 30 minutes.
Further, the preset pressure is 600 Kpa.
Further, the preset water pressure is 100 Kpa.
Has the advantages that:
the invention provides a gap filling method for an electronic product, which is characterized in that a filler is poured into a non-welding area of the electronic product to obtain the electronic product poured with the filler; heating and curing the electronic product filled with the filler by using negative pressure vacuum generating equipment according to a preset heating temperature and a preset heating time to obtain a heated and cured electronic product; pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure intensity to obtain a pressurized electronic product; restoring the pressure in the negative pressure vacuum generating equipment to normal pressure so as to take out the pressurized electronic product; detecting the pressurized electronic product according to a preset water pressure so as to judge whether a non-welding area of the pressurized electronic product is completely filled; if so, determining the pressurized electronic product as a qualified electronic product. Like this at the in-process that non-welding region filled in the electronic product, after pouring the filler into non-welding region, make the filler solidification through heating the filler, pressurize in the non-welding region simultaneously and come the air in the non-welding region of discharging, improve the mobility of filler, be favorable to the filler in timely to filling completely in the non-welding region, then can realize completely filling in the non-welding region in the electronic product, form the protective layer in non-welding region, effectively promote electronic product's dustproof, take precautions against earthquakes and waterproof performance. Therefore, the technical effects of completely filling the non-welding area of the electronic product and improving the dustproof, shockproof and waterproof performances of the electronic product are achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flowchart of a gap filling method for an electronic product according to an embodiment of the present invention;
fig. 2 is a block diagram of a gap filling apparatus for an electronic product according to an embodiment of the present invention.
Detailed Description
The invention discloses a gap filling method for an electronic product, which is characterized in that a filler is filled in a non-welding area of the electronic product to obtain the electronic product filled with the filler; heating and curing the electronic product filled with the filler by using negative pressure vacuum generating equipment according to a preset heating temperature and a preset heating time to obtain a heated and cured electronic product; pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure intensity to obtain a pressurized electronic product; restoring the pressure in the negative pressure vacuum generating equipment to normal pressure so as to take out the pressurized electronic product; detecting the pressurized electronic product according to a preset water pressure so as to judge whether a non-welding area of the pressurized electronic product is completely filled; if so, determining the pressurized electronic product as a qualified electronic product. Like this at the in-process that non-welding region filled in the electronic product, after pouring the filler into non-welding region, make the filler solidification through heating the filler, pressurize in the non-welding region simultaneously and come the air in the non-welding region of discharging, improve the mobility of filler, be favorable to the filler in timely to filling completely in the non-welding region, then can realize completely filling in the non-welding region in the electronic product, form the protective layer in non-welding region, effectively promote electronic product's dustproof, take precautions against earthquakes and waterproof performance. Therefore, the technical effects of completely filling the non-welding area of the electronic product and improving the dustproof, shockproof and waterproof performances of the electronic product are achieved.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention; the "and/or" keyword referred to in this embodiment represents sum or two cases, in other words, a and/or B mentioned in the embodiment of the present invention represents two cases of a and B, A or B, and describes three states where a and B exist, such as a and/or B, which represents: only A does not include B; only B does not include A; including A and B.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. Spatially relative terms, such as "below," "above," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "lower" would then be oriented "upper" other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Also, in embodiments of the invention where an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.
Example one
Referring to fig. 1, fig. 1 is a flowchart of a gap filling method for an electronic product according to an embodiment of the present invention, where the gap filling method for the electronic product according to the embodiment of the present invention includes the following steps:
s100, filling filler into a non-welding area of the electronic product to obtain the electronic product filled with the filler; the filler comprises glue.
Specifically, the electronic product may be an LGA-type packaged electronic product, a gap exists inside a non-bonding area of the electronic product, the glue is an intermediate for connecting two materials, and is mostly present as a water aqua, and the glue may be filled inside the non-bonding area of the electronic product, so as to provide the electronic product filled with the glue in the following step S110.
Step S110, heating and curing the electronic product filled with the filler through negative pressure vacuum generating equipment according to a preset heating temperature and preset heating time to obtain a heated and cured electronic product; the preset heating temperature is 120 °, and the preset heating time is 30 minutes.
Specifically, the negative pressure vacuum generating device is a vacuum element device capable of generating negative pressure by using a positive pressure gas source, and it can be understood by those skilled in the art that the specific selection of the negative pressure vacuum generating device in the gap filling method for electronic products provided by the embodiment of the present invention is not limited, and only a space environment capable of generating negative pressure vacuum in the negative pressure vacuum generating device needs to be realized, the space capable of negative pressure vacuum can accommodate the electronic product filled with glue in the step S100, and when the electronic product filled with glue is located in the space capable of negative pressure vacuum, the electronic product filled with glue in the step S100 can be heated by the negative pressure vacuum generating device. The electronic product filled with the glue in the step S100 is placed in a negative pressure vacuum generating device, the filler poured into the non-welding area of the electronic product is heated at a heating temperature of 120 degrees, and the heating time of the filler poured into the non-welding area of the electronic product is 30 minutes, so that the glue poured can be cured better. The electronic product after heat curing is then provided in step S120 described below.
Step S120, pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure so as to obtain a pressurized electronic product; the preset pressure is 600 Kpa.
Specifically, in the process of obtaining the heat-cured electronic product in step S110, the step S120 of pressurizing the electronic product may be performed simultaneously, that is, a negative pressure vacuum generating apparatus generates a pressure of 600Kpa inside the non-welding region of the electronic product heat-cured in step S110, so that air in the non-welding region is rapidly exhausted, the fluidity of the glue can be increased, the glue can completely fill the inside of the non-welding region of the electronic product, and thus, in the process of completely filling the inside of the non-welding region of the electronic product with the glue, the glue is heated, so that the glue is rapidly cured inside the non-welding region, and the pressurized electronic product is provided in step S130 described below. And then a protective layer is formed in the non-welding area of the electronic product, so that the dustproof, shockproof and waterproof performances of the electronic product are effectively improved.
S130, restoring the pressure in the negative pressure vacuum generating equipment to normal pressure to take out the pressurized electronic product;
specifically, after the pressurized electronic product provided in step S120 is obtained, the pressure in the negative pressure vacuum generating apparatus is returned to the normal pressure state, so that the pressurized electronic product in the negative pressure vacuum generating apparatus can be taken out conveniently. The pressurized electronic product to be tested is then provided for the following step S140.
Step S140, detecting the pressurized electronic product according to a preset water pressure so as to judge whether the non-welding area of the pressurized electronic product is completely filled;
the preset water pressure is 100 Kpa.
Specifically, the pressurized electronic product is obtained through the steps S100, S110, S120 and S130, and the pressurized electronic product is placed in a water environment with a water pressure of 100Kpa for detection, that is, the non-soldering region in the pressurized glue-filled electronic product is completely immersed in water, and the filling condition of the non-soldering region in the pressurized electronic product is detected with the water pressure of 100 Kpa.
And S150, if so, determining the pressurized electronic product as a qualified electronic product.
Specifically, the qualified electronic product is an electronic product meeting the required dustproof, shockproof and waterproof performance, and when the pressurized electronic product is detected in the step S140, if water does not intrude into the non-soldering area of the electronic product, it is reflected that the non-soldering area of the pressurized electronic product is completely filled with the glue, that is, the pressurized electronic product is a qualified electronic product. If water invades the inside of the non-welding area in the electronic product, it is reflected that the non-welding area of the pressurized electronic product is not completely filled with the glue, that is, the pressurized electronic product is an unqualified electronic product. When the pressurized electronic product is an unqualified electronic product, the unqualified electronic product is repaired, namely the unqualified electronic product is disassembled and then subjected to SMT again, and then the steps S100, S110, S120, S130 and S140 are executed, so that the electronic product which is not completely filled in a non-welding area can be completely filled, the electronic product which is not completely filled is repaired, the production efficiency is improved, and the dustproof, shockproof and waterproof performances of the electronic product are effectively improved.
The invention provides a gap filling method for an electronic product, which is characterized in that a filler is poured into a non-welding area of the electronic product to obtain the electronic product poured with the filler; heating and curing the electronic product filled with the filler by using negative pressure vacuum generating equipment according to a preset heating temperature and a preset heating time to obtain a heated and cured electronic product; pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure intensity to obtain a pressurized electronic product; restoring the pressure in the negative pressure vacuum generating equipment to normal pressure so as to take out the pressurized electronic product; detecting the pressurized electronic product according to a preset water pressure so as to judge whether a non-welding area of the pressurized electronic product is completely filled; if so, determining the pressurized electronic product as a qualified electronic product. Like this at the in-process that non-welding region filled in the electronic product, after pouring the filler into non-welding region, make the filler solidification through heating the filler, pressurize in the non-welding region simultaneously and come the air in the non-welding region of discharging, improve the mobility of filler, be favorable to the filler in timely to filling completely in the non-welding region, then can realize completely filling in the non-welding region in the electronic product, form the protective layer in non-welding region, effectively promote electronic product's dustproof, take precautions against earthquakes and waterproof performance. Therefore, the technical effects of completely filling the non-welding area of the electronic product and improving the dustproof, shockproof and waterproof performances of the electronic product are achieved.
In order to describe the gap filling apparatus for electronic products in detail, the above embodiments describe a gap filling method for electronic products in detail, and based on the same inventive concept, the present application also provides a gap filling apparatus for electronic products, which is described in detail in the second embodiment.
Example two
Referring to fig. 2, fig. 2 is a block diagram of a gap filling apparatus for an electronic product according to an embodiment of the present invention, and a second embodiment of the present invention provides a gap filling apparatus for an electronic product, including a filling module 200, a heating module 210, a pressurizing module 220, an obtaining module 230, a detecting module 240, and a determining module 250, where the filling module 200 is used for filling a filler in a non-welding area of the electronic product to obtain an electronic product filled with the filler; the filler comprises glue. The heating module 210 is configured to heat and cure the electronic product filled with the filler through a negative pressure vacuum generating device according to a preset heating temperature and a preset heating time, so as to obtain a heated and cured electronic product; the preset heating temperature is 120 °, and the preset heating time is 30 minutes. The pressurizing module 220 is configured to pressurize the heated and cured electronic product through a negative pressure vacuum generating device according to a preset pressure intensity to obtain a pressurized electronic product; the preset pressure is 600 Kpa. The obtaining module 230 is configured to restore the pressure in the negative pressure vacuum generating apparatus to a normal pressure to take out the pressurized electronic product. The detection module 240 is configured to detect the pressurized electronic product according to a preset water pressure, so as to determine whether a non-welding area of the pressurized electronic product is completely filled; the preset water pressure is 100 Kpa. The determining module 250 is configured to determine that the pressurized electronic product is a qualified electronic product if the pressurized electronic product is determined to be a qualified electronic product.
The invention provides a gap filling device for an electronic product, which is used for filling a filler in a non-welding area of the electronic product to obtain the electronic product filled with the filler; heating and curing the electronic product filled with the filler by using negative pressure vacuum generating equipment according to a preset heating temperature and a preset heating time to obtain a heated and cured electronic product; pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure intensity to obtain a pressurized electronic product; restoring the pressure in the negative pressure vacuum generating equipment to normal pressure so as to take out the pressurized electronic product; detecting the pressurized electronic product according to a preset water pressure so as to judge whether a non-welding area of the pressurized electronic product is completely filled; if so, determining the pressurized electronic product as a qualified electronic product. Like this at the in-process that non-welding region filled in the electronic product, after pouring the filler into non-welding region, make the filler solidification through heating the filler, pressurize in the non-welding region simultaneously and come the air in the non-welding region of discharging, improve the mobility of filler, be favorable to the filler in timely to filling completely in the non-welding region, then can realize completely filling in the non-welding region in the electronic product, form the protective layer in non-welding region, effectively promote electronic product's dustproof, take precautions against earthquakes and waterproof performance. Therefore, the technical effects of completely filling the non-welding area of the electronic product and improving the dustproof, shockproof and waterproof performances of the electronic product are achieved.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (10)
1. A gap filling method for an electronic product, the method comprising:
filling filler in a non-welding area of the electronic product to obtain the filler-filled electronic product;
heating and curing the electronic product filled with the filler by using negative pressure vacuum generating equipment according to a preset heating temperature and a preset heating time to obtain a heated and cured electronic product;
pressurizing the heated and cured electronic product through negative pressure vacuum generating equipment according to preset pressure intensity to obtain a pressurized electronic product;
restoring the pressure in the negative pressure vacuum generating equipment to normal pressure so as to take out the pressurized electronic product;
detecting the pressurized electronic product according to a preset water pressure so as to judge whether a non-welding area of the pressurized electronic product is completely filled;
if so, determining the pressurized electronic product as a qualified electronic product.
2. The gap filling method for electronic products according to claim 1, wherein:
the filler comprises glue.
3. The gap filling method for electronic products according to claim 1, wherein:
the preset heating temperature is 120 °, and the preset heating time is 30 minutes.
4. The gap filling method for electronic products according to claim 1, wherein:
the preset pressure is 600 Kpa.
5. The gap filling method for electronic products according to claim 1, wherein:
the preset water pressure is 100 Kpa.
6. A gap filling apparatus for an electronic product, the apparatus comprising:
the filling module is used for filling a filler in a non-welding area of the electronic product to obtain the filler-filled electronic product;
the heating module is used for heating and curing the electronic product filled with the filler through negative pressure vacuum generating equipment according to a preset heating temperature and preset heating time so as to obtain the heated and cured electronic product;
the pressurizing module is used for pressurizing the heated and cured electronic product through the negative pressure vacuum generating equipment according to preset pressure intensity so as to obtain the pressurized electronic product;
the acquisition module is used for recovering the pressure in the negative pressure vacuum generation equipment to normal pressure so as to take out the pressurized electronic product;
the detection module is used for detecting the pressurized electronic product according to preset water pressure so as to judge whether the non-welding area of the pressurized electronic product is completely filled;
and the determining module is used for determining the pressurized electronic product as a qualified electronic product if the electronic product is judged to be qualified.
7. The gap filling apparatus for electronic products as claimed in claim 6, wherein:
the filler comprises glue.
8. The gap filling apparatus for electronic products as claimed in claim 6, wherein:
the preset heating temperature is 120 °, and the preset heating time is 30 minutes.
9. The gap filling apparatus for electronic products as claimed in claim 6, wherein:
the preset pressure is 600 Kpa.
10. The gap filling apparatus for electronic products as claimed in claim 6, wherein:
the preset water pressure is 100 Kpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111262804.5A CN114029208A (en) | 2021-10-28 | 2021-10-28 | Gap filling method and device for electronic product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111262804.5A CN114029208A (en) | 2021-10-28 | 2021-10-28 | Gap filling method and device for electronic product |
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| CN114029208A true CN114029208A (en) | 2022-02-11 |
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| CN202111262804.5A Pending CN114029208A (en) | 2021-10-28 | 2021-10-28 | Gap filling method and device for electronic product |
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| US20110300673A1 (en) * | 2010-06-08 | 2011-12-08 | Texas Instruments Incorporated | Post-dispense vacuum oven for reducing underfill voids during ic assembly |
| CN105855127A (en) * | 2016-04-20 | 2016-08-17 | 广东欧珀移动通信有限公司 | Hair crack filling method for structural component, structural component and mobile terminal |
| CN111711049A (en) * | 2020-06-24 | 2020-09-25 | 安徽捷泰智能科技有限公司 | Sealing treatment method for electromagnetic valve cabin |
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2021
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Application publication date: 20220211 |