CN114025584A - Heat exchanger for heat dissipation of electronic component and assembly method thereof - Google Patents

Abstract

The invention relates to the field of heat exchangers, in particular to a heat exchanger for heat dissipation of electronic components. This application has the advantage that improves electronic components radiating effect.

Description

Heat exchanger for heat dissipation of electronic component and assembly method thereof

Technical Field

The invention relates to the field of heat exchangers, in particular to a heat exchanger for heat dissipation of electronic components and an assembling method thereof.

Background

The heat exchanger is a device which transfers part of heat of hot fluid to cold fluid so as to cool and radiate a heating element, and plays an important role in chemical industry, petroleum industry, food industry and other industries.

Chinese patent No. CN211702842U discloses a water-cooling plate, which comprises a base plate and a cooling pipe, wherein the cooling pipe is an integrally formed structure, one end of the cooling pipe is provided with a water inlet, the other end of the cooling pipe is provided with a water outlet, and a circulation pump set is usually arranged between the water inlet and the water outlet of the cooling pipe.

Under the action of the circulating pump group, cooling water flows in the cooling pipe to absorb heat on the substrate, and further electronic components mounted on the substrate are cooled.

The process that the cooling water absorbs the heat on the above-mentioned base plate and flows is usually liquid all the time, so the absorbed heat is limited, and when the electronic components installed on the base plate are more in quantity and result in a larger calorific value, the above-mentioned water-cooling plate may be difficult to satisfy the heat dissipation requirement of the electronic components, and there is an obvious deficiency.

Disclosure of Invention

In order to improve the heat dissipation effect, the application provides a heat exchanger for heat dissipation of electronic components and an assembling method thereof.

In a first aspect, the application provides a heat exchanger for heat dissipation of electronic components, which adopts the following technical scheme:

the utility model provides a be used for radiating heat exchanger of electronic components, sets up and fills the mounting panel that has become gaseous phase change material by liquid after the heat absorption including inside cavity, one side of mounting panel is used for installing electronic components, and the opposite side is provided with inside cavity and is used for supplying gaseous phase change material radiating heating panel, the mounting panel with the intercommunication has the two-way subassembly that switches on between the heating panel.

Through adopting above-mentioned technical scheme, the heat transfer that electronic components during operation produced is to the mounting panel on, phase change material in the mounting panel absorbs heat, when rising temperature to the boiling point, phase change material is the gaseous state by liquid evaporation, then flow to the heating panel in through the bidirectional conduction subassembly, gaseous phase change material with heat transfer to the heating panel on, the heat distributes to the external world by the heating panel, with the exothermic liquefaction of gaseous phase change material in this heating panel, with this liquefaction back phase change material through the bidirectional conduction subassembly heat absorption in flowing back the mounting panel again. With this, this application realizes the heat dissipation through the evaporation effect after the phase change material heat absorption, evaporates and need absorb more heats to electronic components, consequently is favorable to improving electronic components's radiating effect.

Optionally, the bidirectional conduction assembly comprises an inner hollow part and is opposite to the mounting plate and conduction plates with openings on two sides of the heating panel respectively, the two sides of the opening of the conduction plates are connected with sealing plates, and conduction pipes are fixedly arranged between the sealing plates in a penetrating mode.

Through adopting above-mentioned technical scheme, gaseous phase change material in the mounting panel flows into the heating panel through the conduction pipe in, the heat dissipation of realization gaseous phase change material that can be comparatively simple and convenient.

Optionally, the one end of conduction pipe extends to in the heating panel and be connected with the overhead guard that is the taper type, the conduction pipe is located it has the venthole to open on the pipe shaft in the heating panel, is close to the heating panel open on the shrouding have with the communicating backward flow hole of heating panel keeps away from the heating panel be provided with on the shrouding and be used for the intercommunication the conduction board with the control valve of mounting panel, still be equipped with level sensor on the mounting panel, the control valve passes through the control system electricity and connects in level sensor.

Through adopting above-mentioned technical scheme, the phase change material after the liquefaction in the heating panel passes through the backward flow hole and flows in the conduction board to this makes phase change material dispel the heat in the conduction board, treats to reduce to the lower temperature when, and level sensor opens the control valve through control system again, in this phase change material that the conduction in-board can be quantitative flows in the mounting panel. The reflowed phase-change material dissipates heat to a relatively low temperature in the conduction plate, so that a large amount of heat can be quickly absorbed from the electronic component in a short time, and the heat dissipation effect is improved.

Optionally, fixed cover is equipped with two parting beads on the conduction pipe, the parting bead with the inside wall of conduction board is hugged closely, the conduction board with be close to the mounting panel the parting bead with form the flow distribution chamber between the shrouding, the conduction board with two form between the parting bead and prepare the chamber, the conduction board with be close to the heating panel the parting bead with form the cooling chamber between the shrouding, be close to the heating panel be equipped with on the parting bead and be used for the intercommunication the cooling chamber with prepare the first backwash valve in chamber, be close to the mounting panel be equipped with on the parting bead and be used for the intercommunication the cooling chamber with the second backwash valve in flow distribution chamber, first backwash valve with the equal electricity of second backwash valve is connected in control system.

By adopting the technical scheme, the inner cavity of the conduction plate is partitioned by the two partition strips, and partitioned heat dissipation is realized on the liquefied phase-change materials which flow back successively through the partition strips, so that the phase-change materials which flow back into the mounting plate from the flow distribution cavity can be at a lower temperature, and the heat dissipation effect is improved.

Optionally, the conduction plate, the conduction pipe, the separation strip and the sealing plate are all made of heat insulating materials.

By adopting the technical scheme, on one hand, the possibility that heat in the mounting plate and the heat dissipation plate is transferred into the conducting pipe can be reduced, and on the other hand, the possibility that the heat is transferred into the flow distribution cavity from the preparation cavity and the cooling cavity can be reduced.

Optionally, a fan is arranged on one side of the heat dissipation plate, fins are arranged outside the conduction plate and extend into the conduction plate, and the fan faces the conduction plate and the fins.

Through adopting above-mentioned technical scheme, when the heat exchanger used, start the fan, the fan can increase the velocity of flow that two-way conduction subassembly surrounding air to this realizes the heat dissipation to the heat exchanger through the mode of forced air cooling.

Optionally, the bidirectional conduction assembly is provided with a plurality of fins between the mounting plate and the heat dissipation plate, the fins on the two adjacent bidirectional conduction assemblies are arranged in a staggered manner, and a distance is reserved between the fins and the conduction plate adjacent to the bidirectional conduction assembly.

Through adopting above-mentioned technical scheme, can form crooked form runner between two adjacent two-way conduction assemblies's the fin to this flow path who has prolonged the air has further improved the heat that the air absorbs from the fin.

In a second aspect, the present application provides an assembly method for a heat exchanger for heat dissipation of an electronic component, which adopts the following technical scheme:

an assembling method of a heat exchanger for heat dissipation of electronic components comprises the following steps:

s1: assembling all parts of the bidirectional conduction assembly together, and then respectively assembling the bidirectional conduction assembly and the mounting plate, and the bidirectional conduction assembly and the heat dissipation plate;

s2: adding a sufficient amount of phase change material into the mounting plate, and then pumping the mounting plate and the heat dissipation plate into a vacuum state by a suction pump.

Through adopting above-mentioned technical scheme, the workman assembles each part of two-way conduction subassembly to together, then with two-way conduction subassembly and mounting panel, two-way conduction subassembly with the heating panel assembles respectively. And adding a sufficient amount of phase-change material into the mounting plate, and pumping the mounting plate and the heat dissipation plate into a vacuum state through an air pump, so that the phase-change material can absorb heat and evaporate in the mounting plate and liquefy and release heat in the heat dissipation plate.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the heat dissipation of the electronic components is realized through the evaporation effect of the phase-change material after absorbing heat, and more heat is required to be absorbed by evaporation, so that the heat dissipation effect of the electronic components is improved;

2. the inner cavity of the conduction plate is partitioned by the two partition strips, and partitioned heat dissipation is realized on the liquefied phase-change materials which flow back successively through the partition strips, so that the phase-change materials which flow back into the mounting plate from the flow distribution cavity can be at a lower temperature, and the heat dissipation effect is improved.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a connection relationship among a conduction plate, a sealing plate, and a mounting plate in the embodiment of the present application.

Fig. 3 is an enlarged view of a portion a in fig. 2.

Fig. 4 is a cross-sectional view showing a connection relationship among the mounting plate, the heat radiating plate, and the conduction plate in the embodiment of the present application.

Description of reference numerals: 1. mounting a plate; 2. a heat dissipation plate; 31. a conduction plate; 311. a flow distribution cavity; 312. preparing a cavity; 313. a cooling chamber; 32. closing the plate; 321. a return orifice; 33. a conduction pipe; 331. an air outlet; 4. a top cover; 5. a control valve; 6. a liquid level sensor; 7. a dividing strip; 8. a first reflux valve; 9. a second reflux valve; 10. a fan; 11. a fin; 12. a feed valve.

Detailed Description

The present application is described in further detail below with reference to figures 1-4.

The embodiment of the application discloses a heat exchanger for heat dissipation of electronic components and an assembling method thereof.

Referring to fig. 1, the heat exchanger for heat dissipation of electronic components includes a mounting plate 1 and a heat dissipation plate 2 which are arranged in a hollow manner, and a bidirectional conduction assembly for communicating the mounting plate 1 and the heat dissipation plate 2.

Referring to fig. 1, a mounting plate 1 and a heat dissipation plate 2 are both horizontally arranged, the heat dissipation plate 2 is located right above the mounting plate 1, the mounting plate 1 is parallel to the heat dissipation plate 2, the lower surface of the mounting plate 1 is used for mounting various electronic components, and when the electronic components work, heat generated by the electronic components can be transferred to the mounting plate 1.

The phase-change material is arranged in the mounting plate 1, and when the phase-change material absorbs heat on the mounting plate 1 and reaches a boiling point, the phase-change material can be changed into a gas state from a liquid state, so that the gas-state phase-change material flows into the heat dissipation plate 2 through the bidirectional conduction assembly.

Referring to fig. 1, when the gaseous phase-change material flows into the heat dissipation plate 2, the heat is transferred to the heat dissipation plate 2, and the heat dissipation plate 2 dissipates the heat to the outside, so that the gaseous phase-change material is dissipated, and the liquefied gaseous phase-change material can be changed into a liquid state again and flow back to the mounting plate 1 through the bidirectional conduction assembly to absorb heat again.

Compare with the radiating mode among the prior art, this application passes through the phase change material heat absorption and becomes the gaseous state by liquid, can follow electronic components and part and go up more heats of absorption to this radiating effect to electronic components has been improved.

Referring to fig. 1, a feed valve 12 is communicated with the heat dissipation plate 2, and when the feed valve 12 is opened, a worker can feed liquid phase change materials into the heat dissipation plate 2, and the phase change materials in the heat dissipation plate 2 can flow into the mounting plate 1 through the bidirectional conduction assembly.

Because the liquid phase-change material absorbs heat and then becomes gaseous, the volume is increased, so in order to reduce the possibility that the gaseous phase-change material bursts the mounting plate 1 or the heat dissipation plate 2 as much as possible, workers communicate the feed valve 12 with the air pump in the prior art to pump out the air in the mounting plate 1, the heat dissipation plate 2 and the bidirectional conduction assembly, so that vacuum is formed in the heat exchanger, and then close the feed valve 12.

Referring to fig. 2, 3 and 4, a plurality of bidirectional conduction modules are provided between the mounting plate 1 and the heat radiating plate 2, and the plurality of bidirectional conduction modules are provided along the longitudinal direction of the mounting plate 1.

Bidirectional conduction subassembly includes conduction board 31 of inside cavity and vertical setting, and the top and the bottom of conduction board 31 are opening respectively and equal fixedly connected with shrouding 32, and fixed wear to be equipped with many conduction pipes 33 that are parallel to each other between two shrouding 32, and the top of conduction pipe 33 communicates with each other with heating panel 2, and the bottom of conduction pipe 33 communicates with each other with mounting panel 1, and gaseous phase change material flows to heating panel 2 in through conduction pipe 33 in the mounting panel 1.

Referring to fig. 2, 3 and 4, when the phase change material in the heat exchanger is located entirely within the mounting plate 1 and evaporation of the phase change material begins to occur, the temperature of the phase change material within the mounting plate 1 is substantially the same throughout.

The phase change material in the gaseous state is liquefied in the heat dissipation plate 2 and then turns into the phase change material in the liquid state again, and although the liquefaction process may emit a certain amount of heat, the phase change material in the liquid state in the heat dissipation plate 2 may still have a higher temperature, which is only slightly lower than the boiling point.

When the liquid phase change material with higher temperature flows back into the mounting plate 1 through the flow guide pipe, although heat absorption evaporation can still be achieved, less heat is absorbed from the mounting plate 1. This just leads to the heat transfer effect when heat exchanger initial work better, in case the heat exchanger uses the long time after, the radiating effect of heat exchanger just can reduce rapidly.

Referring to fig. 2, 3 and 4, in order to improve the above-mentioned problem, the top end of the conduction pipe 33 extends into the heat sink 2 and the conical top cover 4 is fixedly connected thereto, and the maximum diameter of the bottom end of the top cover 4 is larger than the diameter of the conduction pipe 33.

The conduction pipe 33 is provided with a plurality of air outlet holes 331 on the pipe body in the heat dissipation plate 2, and a certain distance is provided between the air outlet holes 331 and the sealing plate 32 close to the heat dissipation plate 2, so that the gaseous phase change material in the conduction pipe 33 flows into the heat dissipation plate 2 through the air outlet holes 331.

The arrangement of the air outlet 331 and the top cover 4 prevents the liquefied phase change material in the heat dissipation plate 2 from flowing back into the mounting plate 1 through the conduction pipe 33, and the sealing plate 32 adjacent to the heat dissipation plate 2 is provided with a plurality of return holes 321 along the length direction thereof, so that the liquefied phase change material in the heat dissipation plate 2 flows into the conduction plate 31 through the return holes 321.

Referring to fig. 2, 3 and 4, a plurality of fins 11 parallel to each other are arranged outside the conduction plate 31, and the fins 11 extend into the conduction plate 31 and are fixedly connected with the conduction plate 31, so that before the phase change material in the mounting plate 1 is completely evaporated, the liquid phase change material in the conduction plate 31 can dissipate heat to the outside through the fins 11, and further, the heat dissipation is further realized before the liquid phase change material flows back into the mounting plate 1.

Referring to fig. 2, 3 and 4, a control valve 5 is arranged on the close sealing plate 32 close to the mounting plate 1, a liquid level sensor 6 is connected to the mounting plate 1 through a thread, a sensing end of the liquid level sensor 6 extends into the mounting plate 1, and the control valve 5 is electrically connected to the liquid level sensor 6 through a control system.

The liquid level sensor 6 can detect the amount of the liquid phase-change material in the mounting plate 1, so that when the amount of the liquid phase-change material in the mounting plate 1 is small, the control system opens the control valve 5, the liquid phase-change material in the conduction plate 31 flows into the mounting plate 1 through the control valve 5, and the liquid phase-change material in the mounting plate 1 is supplemented.

Under the control of the control system, the amount of the liquid phase-change material supplemented into the mounting plate 1 is controlled, so that the liquid phase-change material in the conduction plate 31 can have sufficient time for heat dissipation.

Because liquid phase-change material has diffused more heat before flowing into mounting panel 1 from conduction board 31, consequently back in it gets into mounting panel 1, can be fast and a large amount of heat that absorb on the mounting panel 1, and then can realize dispelling the heat fast to electronic components on the mounting panel 1.

Referring to fig. 2, 3 and 4, the sealing plate 32 and the conduction pipe 33 are made of heat insulating material, which may be polystyrene board, so as to reduce the possibility that heat in the heat dissipation plate 2, the mounting plate 1 and the conduction pipe 33 is transferred into the conduction plate 31, which may cause the temperature of the liquid phase change material in the conduction plate 31 to rise.

Referring to fig. 2, 3 and 4, since the liquefied phase change material in the heat dissipation plate 2 continuously enters the conduction plate 31, the phase change material in the conduction plate 31 can dissipate heat through the fins 11, but the overall temperature is higher than the room temperature.

Therefore, two separating strips 7 are fixedly sleeved on the conduction pipe 33, a flow distribution cavity 311 is formed between the conduction plate 31 and the separating strips 7 and the sealing plate 32 close to the mounting plate 1 by closely adhering the separating strips 7 and the inner side walls of the conduction plate 31 to the conduction plate 31, a preparation cavity 312 is formed between the conduction plate 31 and the two separating strips 7, and a cooling cavity 313 is formed between the conduction plate 31 and the separating strips 7 and the sealing plate 32 close to the heat dissipation plate 2.

Meanwhile, a first return valve 8 for communicating the cooling cavity 313 and the preparation cavity 312 is arranged on the dividing bar 7 close to the heat dissipation plate 2, a second return valve 9 for communicating the cooling cavity 313 and the distribution cavity 311 is arranged on the dividing bar 7 close to the mounting plate 1, and both the first return valve 8 and the second return valve 9 are electrically connected to a control system.

Referring to fig. 2, 3 and 4, the liquid phase change material in the heat radiating plate 2 first enters the cooling chamber 313 and then enters the preliminary chamber 312 through the first return valve 8. When a certain amount of phase change material is present in the preparation chamber 312, the first return valve 8 is closed, so that the subsequent liquid phase change material is cooled in the cooling chamber 313 first.

And the liquid phase-change material in the preparation cavity 312 is radiated to the room temperature through the fins 11, at this time, the second backflow valve 9 is opened, so that the phase-change material in the preparation cavity 312 flows into the flow distribution cavity 311, and the liquid phase-change material in the flow distribution cavity 311 can be added into the mounting plate 1 at any time through the control system. Thereafter, the liquid phase change material of the cooling chamber 313 may flow into the preliminary chamber 312 again through the first return valve 8.

Therefore, by the arrangement of the flow distribution cavity 311, the preparation cavity 312 and the cooling cavity 313, the temperature of the liquid phase-change material is controlled in a sub-region mode, and the liquid phase-change material flowing into the mounting plate 1 from the flow distribution cavity 311 is ensured to be at a low temperature, so that the liquid phase-change material can quickly absorb a large amount of heat from the mounting plate 1 in a short time.

Referring to fig. 2, 3 and 4, the separating strips 7 and the conducting plate 31 are also made of heat insulating material, such as polystyrene board, to reduce the possibility of heat in the preparation chamber 312 and the cooling chamber 313 transferring to the port chamber 311.

Referring to fig. 2, 3 and 4, a plurality of fans 10 are disposed on the same side of the heat sink 2 and the mounting plate 1 along the longitudinal direction thereof, and the air outlet ends of the plurality of fans 10 are all disposed toward the conduction plate 31 and the fins 11. The fan 10 accelerates the flow speed of air between two adjacent bidirectional conduction assemblies, thereby improving the heat dissipation effect of the phase-change material in the conduction plate 31 through the fins 11.

Referring to fig. 2, 3 and 4, the fins 11 on two adjacent bidirectional conduction assemblies are arranged in a staggered manner, and the distance is reserved between the fins 11 and the conduction plate 31 of the adjacent bidirectional conduction assemblies, so that a wavy bent flow channel can be formed, the path of air passing between the two adjacent bidirectional conduction assemblies is prolonged, the contact area between the air and the fins 11 is increased, and the improvement of the heat dissipation effect of the phase-change material in the conduction plate 31 is facilitated.

The implementation principle of the heat exchanger for heat dissipation of the electronic component in the embodiment of the application is as follows:

when the electronic component operates, the fan 10 is activated, and the fan 10 blows air onto the mounting board 1, the heat dissipation plate 2, the conduction plate 31, and the fins 11.

The heat generated by the operation of the electronic components is transferred to the mounting plate 1, the phase-change material in the mounting plate 1 absorbs heat, and when the temperature rises to the boiling point, the phase-change material is evaporated from a liquid state to a gaseous state, so that the gaseous phase-change material flows into the heat dissipation plate 2 through the conduction pipe 33 and the air outlet 331.

The gaseous phase change material is liquefied after a certain amount of heat is dissipated in the heat dissipation plate 2, and then flows into the cooling cavity 313 through the return hole 321 for heat dissipation, and then flows into the preparation cavity 312 through the control system to further dissipate heat by opening the first return valve 8.

When the phase change material in the preparation chamber 312 dissipates heat to near room temperature, the control system opens the second backflow valve 9, so that the phase change material in the preparation chamber 312 flows into the flow distribution chamber 311, and then the phase change material in the cooling chamber 313 can flow into the preparation chamber 312 instead to dissipate heat.

The liquid level sensor 6 detects the amount of the phase-change material in the mounting plate 1 in real time, so that when the amount of the phase-change material in the mounting plate 1 is too small, the control system opens the control valve 5, so that the appropriate amount of the phase-change material in the distribution cavity 311 flows back into the mounting plate 1 to absorb heat again.

The embodiment of the application also discloses an assembly method of the heat exchanger for heat dissipation of the electronic components, which comprises the following steps:

s1: fixedly sleeving the separation strips 7 on the conduction pipes 33, installing the first reflux valves 8 and the second reflux valves 9 on the corresponding separation strips 7, installing the control valves 5 on the corresponding sealing plates 32, placing the separation strips 7 in the conduction plates 31 and adhering the separation strips to the inner walls of the conduction plates, sleeving the sealing plates 32 on the conduction pipes 33, welding the sealing plates 32 and the conduction plates 31, fixedly connecting the top cover 4 to one ends of the conduction pipes 33, and finally welding the fins 11 on the conduction plates 31;

then, one end of the conduction pipe 33 fixedly connected with the top cover 4 is inserted into the heat dissipation plate 2, the sealing plate 32 is brazed with the heat dissipation plate 2, the liquid level sensor 6 is installed on the installation plate 1, and then the installation plate 1 is brazed with the sealing plate 32;

s2: the feed valve 12 is opened to thereby feed a sufficient amount of phase change material into the mounting plate 1 through the feed valve 12, then the mounting plate 1 and the heat radiating plate 2 are vacuumed by the suction pump, thereafter the feed valve 12 is closed, and finally the plurality of fans 10 are mounted to the same side of the mounting plate 1 and the heat radiating plate 2.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (8)

1. The utility model provides a be used for radiating heat exchanger of electronic components which characterized in that: set up and pack including inside cavity and become gaseous phase change material's mounting panel (1) by liquid after the heat absorption, one side of mounting panel (1) is used for installing electronic components, and the opposite side is provided with inside cavity and is used for supplying gaseous phase change material radiating heating panel (2), mounting panel (1) with the intercommunication has the two-way subassembly that switches on between heating panel (2).

2. The heat exchanger for dissipating heat of electronic components as claimed in claim 1, wherein: bidirectional conduction subassembly includes inside cavity and relative mounting panel (1) with heating panel (2) both sides difference open-ended conduction board (31), conduction board (31) open-ended both sides all are connected with shrouding (32), two fixed conduction pipe (33) of wearing to be equipped with between shrouding (32).

3. The heat exchanger for electronic component heat dissipation according to claim 2, wherein: one end of conduction pipe (33) extends to just be connected with in heating panel (2) and be top cover (4) of coniform, conduction pipe (33) are located it has venthole (331) to open on the pipe shaft in heating panel (2), is close to heating panel (2) go up open on shrouding (32) have with heating panel (2) communicating backward flow hole (321), keep away from heating panel (2) be provided with on shrouding (32) and be used for the intercommunication conduction board (31) with control valve (5) of mounting panel (1), still be equipped with level sensor (6) on mounting panel (1), control valve (5) through control system electricity connect in level sensor (6).

4. The heat exchanger for electronic component heat dissipation according to claim 3, wherein: the conduction pipe (33) is fixedly sleeved with two separation strips (7), the separation strips (7) are tightly attached to the inner side wall of the conduction plate (31), the conduction plate (31) is close to the mounting plate (1), a flow distribution cavity (311) is formed between the separation strips (7) and the sealing plates (32), a preparation cavity (312) is formed between the conduction plate (31) and the two separation strips (7), a cooling cavity (313) is formed between the conduction plate (31) and the separation strips (7) close to the cooling plate (2) and the sealing plates (32), the separation strips (7) close to the cooling plate (2) are provided with a first backflow valve (8) for communicating the cooling cavity (313) and the preparation cavity (312), the separation strips (7) close to the mounting plate (1) are provided with a second backflow valve (9) for communicating the cooling cavity (313) and the flow distribution cavity (311), the first backflow valve (8) and the second backflow valve (9) are electrically connected to a control system.

5. The heat exchanger for electronic component heat dissipation according to claim 4, wherein: the conduction plate (31), the conduction pipe (33), the separation strip (7) and the sealing plate (32) are all made of heat insulation materials.

6. The heat exchanger for electronic component heat dissipation according to claim 2, wherein: one side of the heat dissipation plate (2) is provided with a fan (10), fins (11) are arranged outside the conduction plate (31), the fins (11) extend into the conduction plate (31), and the fan (10) faces the conduction plate (31) and the fins (11).

7. The heat exchanger for electronic component heat dissipation according to claim 6, wherein: the bidirectional conduction assembly is arranged between the mounting plate (1) and the heating panel (2) in a plurality of positions, the fins (11) on the bidirectional conduction assembly are arranged in a staggered mode, and the fins (11) are adjacent to the bidirectional conduction assembly, and a distance is reserved between the conduction plates (31).

8. A method of assembling a heat exchanger for electronic component heat dissipation according to any one of claims 1 to 7, characterized in that: the method comprises the following steps:

s1: assembling all parts of the bidirectional conduction assembly together, and then respectively assembling the bidirectional conduction assembly with the mounting plate (1) and the bidirectional conduction assembly with the heat dissipation plate (2);

s2: adding a sufficient amount of phase-change material into the mounting plate (1), and then pumping the mounting plate (1) and the heat dissipation plate (2) into a vacuum state by using a suction pump.

Images