CN114023789B - OLED display panel and preparation method thereof - Google Patents

OLED display panel and preparation method thereof Download PDF

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Publication number
CN114023789B
CN114023789B CN202111210199.7A CN202111210199A CN114023789B CN 114023789 B CN114023789 B CN 114023789B CN 202111210199 A CN202111210199 A CN 202111210199A CN 114023789 B CN114023789 B CN 114023789B
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layer
scattering particles
light
display panel
oled
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CN114023789A (en
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汪国杰
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/126—Shielding, e.g. light-blocking means over the TFTs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Abstract

The embodiment of the application discloses an OLED display panel and a preparation method thereof, wherein the OLED display panel comprises an OLED device substrate, an adhesive layer and a protective structure layer; the bonding layer is arranged on the OLED device substrate; scattering particles are doped in the bonding layer; the protective structure layer is arranged on the bonding layer and is used for blocking water and oxygen; the protective structure layer has the functions of blocking water and improving the packaging performance and reliability of the OLED device and also has the function of increasing the visual angle of a large-size OLED product.

Description

OLED display panel and preparation method thereof
Technical Field
The application relates to the technical field of display, in particular to an OLED display panel and a preparation method thereof.
Background
An Organic Light-Emitting Diode (OLED) device has the characteristics of self-luminescence, high contrast, fast response speed, light weight, thinness, flexibility and the like, and has become a main trend of display technology.
Compared with the method of adopting vacuum thermal evaporation to manufacture the OLED device, the ink-jet printing technology has the advantages that the material utilization rate is more than 98%, a fine metal mask plate is not used, a large-size OLED display device can be manufactured, and the like, so that the ink-jet printing technology has become a mainstream manufacturing scheme of the large-size OLED device and the display device.
The main structure of the current ink-jet printing OLED device is anode/hole injection layer/hole transport layer/light emitting layer/electron transport layer/electron injection layer/cathode. The requirement on the viewing angle of large-size OLED products, especially televisions, is high, the current rigid OLED products can improve the viewing angle by introducing an LCD color film scheme, but the viewing angle of large-size flexible OLED products cannot reach the standard because the color film technology of the rigid glass substrate cannot be used. Viewing angle problems are bottlenecks in large-size flexible OLED products.
Disclosure of Invention
The invention provides an OLED display panel, when light rays are radiated to scattering particles, the emergent angle of the light rays is changed by the scattering particles, so that the effect of increasing the visual angle is achieved.
The embodiment of the invention provides an OLED display panel, which comprises:
an OLED device substrate;
the bonding layer is arranged on the OLED device substrate; scattering particles are doped in the bonding layer; and
the protective structure layer is arranged on the bonding layer and is used for blocking water and oxygen.
Optionally, in some embodiments of the present application, the adhesive layer is composed of an adhesive material and scattering particles, and the scattering particles have a mass fraction of 1% -3%.
The adhesive layer comprises a first part and a second part, wherein the second part is arranged on the periphery of the first part, and the distribution density of scattering particles positioned in the second part is larger than that of the first part.
Optionally, in some embodiments of the present application, the scattering particles located in the second portion have a smaller particle size than the scattering particles located in the first portion.
Alternatively, in some embodiments of the present application, the surface of the scattering particles located in the second portion is uneven, and the surface of the scattering particles located in the first portion is smooth.
Optionally, in some embodiments of the present application, the protective structure layer includes a first light-transmitting layer and a second light-transmitting layer disposed on the first light-transmitting layer, the first light-transmitting layer is disposed on the adhesive layer, and a refractive index of the first light-transmitting layer is greater than a refractive index of the second light-transmitting layer.
Optionally, in some embodiments of the present application, the refractive index of the adhesive layer is greater than the refractive index of the first light-transmitting layer.
Optionally, in some embodiments of the present application, the OLED device substrate includes an OLED device layer and an encapsulation layer, the encapsulation layer being disposed on the OLED device layer, the encapsulation layer having a refractive index greater than a refractive index of the adhesive layer.
Correspondingly, the embodiment of the application also provides a preparation method of the OLED display panel, which comprises the following steps:
providing an OLED device substrate;
providing a protective structure layer for blocking water oxygen;
and an adhesive layer is arranged on the OLED device substrate or the protective structure layer, scattering particles are doped in the adhesive layer, and the adhesive layer is adhered between the OLED device substrate and the protective structure layer.
Optionally, in some embodiments of the present application, the step of disposing an adhesive layer on the OLED device substrate or the protective structure layer includes:
mixing the adhesive material and the scattering particles according to a set mass fraction to form a mixed material; the set mass fraction of the scattering particles is 1% -3%;
and forming an adhesive layer on the protective structure layer.
The invention has the beneficial effects that: when light is radiated to the scattering particles, the emergent angle of the light is changed by the scattering particles, so that the effect of increasing the visual angle is achieved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural diagram of an OLED panel according to an embodiment of the present application;
FIG. 2 is a schematic structural view of an adhesive layer in an OLED panel according to an embodiment of the present application;
FIG. 3 is a schematic illustration of the protective structure of an OLED panel and the bonding layer of the embodiments of the present application;
FIG. 4 is a schematic diagram of a method for fabricating an OLED panel according to an embodiment of the present application;
FIG. 5 is a schematic diagram of step B1 in the method for manufacturing an OLED panel according to an embodiment of the present application;
FIG. 6 is a schematic diagram of step B2 in the method for manufacturing an OLED panel according to an embodiment of the present application;
fig. 7 is a schematic diagram of step B3 in the method for manufacturing an OLED panel according to an embodiment of the present application.
Reference numerals illustrate:
the OLED device substrate 10, the OLED device layer 10a, the planarization layer 11a, the TFT device layer 11, the first electrode layer 12, the pixel defining layer 12a, the hole injection layer 13, the hole transport layer 14, the light emitting layer 15, the electron transport layer 16, the electron injection layer 17, the second electrode layer 18, the encapsulation layer 19, the first portion 201, the second portion 202, the adhesive layer 20, the scattering particles 20a, the adhesive material 20b, the protective structure layer 30, the first light transmitting layer 31, the second light transmitting layer 32, the flexible substrate 33, and the glass 34.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application. Furthermore, it should be understood that the detailed description is presented herein for purposes of illustration and explanation only and is not intended to limit the present application. In this application, unless otherwise indicated, terms of orientation such as "upper" and "lower" are used to generally refer to the upper and lower positions of the device in actual use or operation, and specifically the orientation of the drawing figures; while "inner" and "outer" are for the outline of the device.
The embodiment of the application provides an OLED display panel and a preparation method thereof, and the preparation method is described in detail below. The following description of the embodiments is not intended to limit the preferred embodiments.
Referring to fig. 1, an OLED display panel 100 is provided in an embodiment of the present invention, and the OLED display panel 100 includes an OLED device substrate 10, an adhesive layer 20 and a protective structure layer 30.
The adhesive layer 20 is disposed on the OLED device substrate 10. The adhesive layer 20 is doped with scattering particles 20a.
The protective structure layer 30 is disposed on the adhesive layer 20. The protective structure layer 30 serves to block water oxygen.
Referring to fig. 2, the OLED display panel 100 of the present embodiment employs doping scattering particles 20a in the adhesive layer 20; when light is radiated to the scattering particles 20a, the outgoing angle of the light is changed by the scattering particles 20a, and the effect of increasing the viewing angle is achieved.
Referring to fig. 2, in the present embodiment, the adhesive layer 20 is composed of an adhesive material 20b and scattering particles 20a. The mass fraction of the scattering particles 20a is 1% -3%, and in this numerical range, the scattering particles 20a cannot effectively scatter more light when the mass fraction of the scattering particles 20a is smaller than this range, because the number of the scattering particles 20a is smaller. Uniformity of light output cannot be ensured. When the mass fraction of the scattering particles 20a is greater than this range, too many scattering particles 20a affect the light transmittance. The mass fraction of scattering particles 20a in this range of values ensures both the light extraction and the uniformity of the light extraction. Alternatively, the mass fraction of scattering particles 20a may be 1%, 2% or 3%.
The mass fraction of the scattering particles 20a is a percentage of the mass of the scattering particles 20a to the mass of the adhesive layer 20.
The refractive index of the scattering particles 20a is different from that of the adhesive material 20b to break the balance of the original optical uniformity and interference between the sub-waves in the uniform medium, resulting in scattering of light.
Alternatively, the material of the scattering particles 20a may be selected from one or a mixture of two or more of silicon oxide (SiO 2), titanium oxide (TiO 2), molybdenum trioxide (MoO 3), zinc oxide (ZnO), nickel oxide (NiO), and tungsten trioxide (WO 3).
The scattering particles 20a have a particle size between 50 microns and 300 microns, such as 50 microns, 150 microns or 300 microns.
Referring to fig. 2, the adhesive layer 20 may optionally include a first portion 201 and a second portion 202. The second portion 202 is provided on the peripheral side of the first portion 201. The distribution density of the scattering particles 20a located in the second portion 202 is greater than the distribution density of the scattering particles 20a of the first portion 201.
That is, the scattering particles 20a in the adhesive layer 20 of the scattering particles 20a can be dispersed in a plurality of regions, and the regions are divided according to the light output intensity when the scattering particles 20a in the adhesive layer 20 are uniformly distributed, and the regions with high light output intensity are doped with less scattering particles 20a, so as to achieve the purpose of compensating the regions with low light output intensity, thereby making the light output more uniform.
In some embodiments, the scattering particles 20a in the adhesive layer 20 are uniformly distributed.
In some embodiments of the present application, the particle size of the scattering particles 20a located in the second portion 202 is smaller than the particle size of the scattering particles 20a located in the first portion 201.
Wherein the particle size of the scattering particles 20a located in the second portion 202 is smaller than the particle size of the scattering particles 20a located in the first portion 201, so that the scattering particles 20a in the second portion 202 can be more dense and have more scattering directions. Since the light output of the first portion 201 is greater than that of the second portion 202, the second portion 202 has a better scattering effect, so that the display panel 100 has a uniform light output effect.
In some embodiments of the present application, the surface of the scattering particles 20a located in the second portion 202 is uneven, and the surface of the scattering particles 20a located in the first portion 201 is smooth.
Wherein, the surface of the scattering particles 20a of the second portion 202 is in an uneven shape, so that the scattering particles 20a of the second portion 202 can have more scattering directions. The surface of the scattering particles 20a of the first portion 201 is smooth, so that the scattering direction of the outgoing light passing through the first portion 201 is less. Since the light output of the first portion 201 is greater than that of the second portion 202, the second portion 202 has a better scattering effect, so that the display panel 100 has a uniform light output effect.
Referring to fig. 3, in some embodiments of the present application, the protective structure layer 30 includes a first light-transmitting layer 31 and a second light-transmitting layer 32 disposed on the first light-transmitting layer 31, the first light-transmitting layer 31 is disposed on the adhesive layer 20, and the refractive index of the first light-transmitting layer 31 is greater than the refractive index of the second light-transmitting layer 32.
When light passes through the interface between the first light-transmitting layer 31 and the second light-transmitting layer 32, the light is refracted, and the effect of increasing the viewing angle is further achieved.
Alternatively, the material of the first light-transmitting layer 31 may be SiO x 、SiN x At least one of SiON and SiOC. The thickness of the first light-transmitting layer 31 is between 40 nm and 60 nm,for example, 40 nm, 50 nm or 60 nm.
Alternatively, the material of the second light-transmitting layer 32 may be SiO x 、SiN x At least one of SiON and SiOC. The thickness of the second light-transmitting layer 32 is between 30 nm and 1000 nm, for example, 30 nm, 500 nm or 1000 nm.
In some embodiments of the present application, the refractive index of the adhesive layer 20 is greater than the refractive index of the first light-transmitting layer 31.
When light passes through the interface between the first light-transmitting layer 31 and the adhesive layer 20, the light is refracted, thereby increasing the viewing angle.
The protective structure layer 30 further includes a flexible substrate 33, the flexible substrate 33 being disposed on the second light-transmitting layer 32.
Alternatively, the material of the flexible substrate 33 may be polyethylene terephthalate, polyimide film, or the like. The thickness of the flexible substrate 33 is between 20 microns and 100 microns, such as may be 20 microns, 40 microns or 100 microns.
Referring to fig. 1, in the present embodiment, an OLED device substrate 10 includes an OLED device layer 10a and an encapsulation layer 19, and the encapsulation layer 19 is disposed on the OLED device layer 10 a. The refractive index of the encapsulation layer 19 is greater than the refractive index of the adhesive layer 20.
The OLED device substrate 10 includes a TFT device layer 11, a first electrode layer 12, a hole injection layer 13, a hole transport layer 14, a light emitting layer 15, an electron transport layer 16, an electron injection layer 17, and a second electrode layer 18. The encapsulation layer 19 is located on the second electrode layer 18.
Wherein the first electrode layer 12 may be one of an anode and a cathode, and the second electrode layer 18 is the other of the anode and the cathode.
Referring to fig. 4, the present application further relates to a method for preparing an OLED display panel, including the following steps:
step B1, providing an OLED device substrate 10;
step B2, providing a protective structure layer 30, wherein the protective structure layer 30 is used for blocking water and oxygen;
in step B3, an adhesive layer 20 is disposed on the OLED device substrate 10 or the protective structure layer 30, the adhesive layer 20 is doped with scattering particles 20a, and the adhesive layer 20 is adhered between the OLED device substrate 10 and the protective structure layer 30.
The adhesive layer 20 is doped with scattering particles 20a. When light is radiated to the scattering particles 20a, the outgoing angle of the light is changed by the scattering particles 20a, and the effect of increasing the viewing angle is achieved.
It should be noted that, step B1 and step B2 are not separated in sequence. The adhesive layer 20 may be formed on the OLED device substrate 10 or the protective structure layer 30. The embodiment of the present application is described taking an example in which the adhesive layer 20 may be formed on the protective structure layer 30, but is not limited thereto. The method of manufacturing the OLED display panel is described below.
Step B1, please refer to FIG. 5, an OLED device substrate 10 is provided;
optionally, step B1 includes the steps of: manufacturing a TFT device layer 11 on a substrate; after the TFT device layer 11 is fabricated, a planarization layer 11a is fabricated, an OLED device first electrode layer 12 is fabricated on the planarization layer 11a, and a pixel defining layer 12a is fabricated on the first electrode layer 12.
On the pixel defining layer 12a, a hole injecting layer 13, a hole transporting layer 14, and a light emitting layer 15 are formed by inkjet printing.
An electron transport layer 16, an electron injection layer 17, and a second electrode layer 18 are formed on the light-emitting layer 15 by a vapor deposition method. An encapsulation layer 19 is fabricated over the cathode.
Wherein, the TFT device in the TFT device layer 11 can be a device made of low-temperature polysilicon, indium gallium zinc oxide and other materials,
the encapsulation layer 19 adopts a composite film encapsulation technique in which an inorganic film and an organic film are alternately used, and in this embodiment, an acryl resin layer is used as the organic film and a SiNx layer is used as the inorganic film. Optionally, the packaging layer 19 may also adopt an inorganic film packaging structure, an organic film packaging structure, and other technologies such as film packaging, indium sealing, frit fusion sealing, and the like. Optionally, a desiccant may be added to the encapsulation layer 19 in order to remove residual water oxygen.
And then proceeds to step B2.
In step B2, referring to fig. 6, a protective structure layer 30 is provided, and the protective structure layer 30 is used for blocking water and oxygen.
Optionally, step B2 includes the steps of: the flexible substrate 33 is coated on the glass 34, and the flexible substrate 33 is manufactured by curing. Subsequently, the second light-transmitting layer 32 is fabricated by chemical vapor deposition on the flexible substrate 33. Next, the first transparent layer 31 is fabricated on the second transparent layer 32 by atomic layer deposition.
The material of the first transparent layer 31 is alumina, and is manufactured in two steps, in this embodiment, the thickness of the first step is 20 nm, the thickness of the second step is 30 nm, and the total thickness is about 50 nm. Wherein the thickness of the first fabrication is 10 nm-40 nm, alternatively 10 nm, 20 nm or 40 nm. The thickness of the second fabrication is 10 nm-40 nm, alternatively 10 nm, 30 nm or 40 nm. The total thickness of the first light-transmitting layer 31 is 40 nm to 60 nm, alternatively 40 nm, 50 nm or 60 nm;
alternatively, at least one of SiOx, siNx, siON and SiOC may be used as the material of the first light-transmitting layer 31. The thickness of the first light-transmitting layer 31 is between 40 nm and 60 nm, for example, 40 nm, 50 nm or 60 nm.
Alternatively, the material of the second light-transmitting layer 32 may be selected from at least one of SiOx, siNx, siON and SiOC. The thickness of the second light-transmitting layer 32 is between 30 nm and 1000 nm, for example, 30 nm, 500 nm or 1000 nm.
And then goes to step B3.
In step B3, referring to fig. 7, an adhesive layer 20 is disposed on the protective structure layer 30, the adhesive layer 20 is doped with scattering particles 20a, and the adhesive layer 20 is adhered between the OLED device substrate 10 and the protective structure layer 30.
Optionally, step B3 includes the steps of:
and step B31, mixing the adhesive material 20B and the scattering particles 20a, and mixing the adhesive material 20B and the scattering particles 20a according to a set mass fraction to form a mixed material.
And step B32, coating the mixed material on the second light-transmitting layer 32 to form the adhesive layer 20.
And step B33, removing the substrate under the protective structure layer 30, and arranging the protective structure layer 30 on the OLED device substrate 10 through the bonding layer 20.
Alternatively, the protective structure layer 30 is separated from the substrate by a laser glass method.
Wherein the thickness of the adhesive material 20b is between 180 microns and 220 microns, alternatively 180 microns, 200 microns or 220 microns.
Alternatively, the scattering particles 20a have a particle size of 50 microns to 300 microns, alternatively 50 microns, 150 microns or 300 microns.
Alternatively, the material of the scattering particles 20a may be selected from silicon oxide (SiO 2 ) Titanium dioxide (TiO) 2 ) Molybdenum trioxide (MoO) 3 ) Zinc oxide (ZnO), nickel oxide (NiO), and tungsten trioxide (WO) 3 ) One or two or more materials of the materials are mixed.
Optionally, the scattering particles 20a are set to 1% -3% by mass, such as 1%, 2% or 3%;
in addition, in this embodiment, the method for manufacturing an OLED display panel further includes the following steps:
the adhesive layer 20 is cured.
Alternatively, the adhesive layer 20 is cured by thermal curing at a temperature of 70-90 degrees celsius, such as 70, 80, and 90 degrees celsius. The time is 0.8-1.5 hours, such as 0.8 hours, 1 hour or 1.5 hours.
In the present embodiment, the adhesive material 20b of the adhesive layer 20 is a thermosetting material, and thus is cured by heat conduction. In the embodiment, any one of an infrared furnace, a hot plate and hot air can be selected. In some embodiments, the adhesive material 20b may also be a photo-curable material, and in this step, a photo-curable curing means, such as ultraviolet curing, is selected.
Thus, the preparation process of the OLED display panel is completed.
The above description is made in detail on an OLED display panel and a manufacturing method provided by the embodiments of the present application, and specific examples are applied herein to illustrate principles and implementations of the present application, where the above description of the embodiments is only for helping to understand the method and core ideas of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims (9)

1. An OLED display panel, comprising:
an OLED device substrate;
the bonding layer is arranged on the OLED device substrate; scattering particles are doped in the bonding layer; and
the protective structure layer is arranged on the bonding layer and is used for blocking water and oxygen;
the adhesive layer comprises a first part and a second part, wherein the second part is arranged on the periphery of the first part, and the distribution density of scattering particles positioned in the second part is larger than that of the first part.
2. The OLED display panel according to claim 1, wherein the adhesive layer is composed of an adhesive material and scattering particles, and the mass fraction of the scattering particles is 1% -3%.
3. The OLED display panel of claim 1, wherein the scattering particles in the second portion have a smaller particle size than the scattering particles in the first portion.
4. The OLED display panel according to claim 1, wherein the surface of the scattering particles in the second portion is uneven and the surface of the scattering particles in the first portion is smooth.
5. The OLED display panel according to claim 1, wherein the protective structure layer includes a first light-transmitting layer and a second light-transmitting layer disposed on the first light-transmitting layer, the first light-transmitting layer being disposed on the adhesive layer, the first light-transmitting layer having a refractive index greater than a refractive index of the second light-transmitting layer.
6. The OLED display panel of claim 5, wherein the adhesive layer has a refractive index greater than the refractive index of the first light-transmissive layer.
7. The OLED display panel of claim 6, wherein the OLED device substrate includes an OLED device layer and an encapsulation layer disposed on the OLED device layer, the encapsulation layer having a refractive index greater than a refractive index of the adhesive layer.
8. The preparation method of the OLED display panel is characterized by comprising the following steps of:
providing an OLED device substrate;
providing a protective structure layer for blocking water oxygen;
an adhesive layer is arranged on the OLED device substrate or the protective structure layer, scattering particles are doped in the adhesive layer, and the adhesive layer is adhered between the OLED device substrate and the protective structure layer;
the adhesive layer comprises a first part and a second part, wherein the second part is arranged on the periphery of the first part, and the distribution density of scattering particles positioned in the second part is larger than that of the first part.
9. The method of manufacturing an OLED display panel as claimed in claim 8, wherein the step of disposing an adhesive layer on the OLED device substrate or the protective structure layer includes:
mixing the adhesive material and the scattering particles according to a set mass fraction to form a mixed material; the set mass fraction of the scattering particles is 1% -3%;
and forming an adhesive layer on the protective structure layer.
CN202111210199.7A 2021-10-18 2021-10-18 OLED display panel and preparation method thereof Active CN114023789B (en)

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