CN114023789A - OLED display panel and preparation method thereof - Google Patents
OLED display panel and preparation method thereof Download PDFInfo
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- CN114023789A CN114023789A CN202111210199.7A CN202111210199A CN114023789A CN 114023789 A CN114023789 A CN 114023789A CN 202111210199 A CN202111210199 A CN 202111210199A CN 114023789 A CN114023789 A CN 114023789A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/126—Shielding, e.g. light-blocking means over the TFTs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The embodiment of the application discloses an OLED display panel and a preparation method thereof, wherein the OLED display panel comprises an OLED device substrate, an adhesive layer and a protective structure layer; the bonding layer is arranged on the OLED device substrate; scattering particles are doped in the bonding layer; the protective structure layer is arranged on the bonding layer and used for blocking water and oxygen; the protective structure layer not only has the functions of blocking water and improving the packaging performance and the reliability of the OLED device, but also has the function of increasing the visual angle of a large-size OLED product.
Description
Technical Field
The application relates to the technical field of display, in particular to an OLED display panel and a preparation method thereof.
Background
Organic Light-Emitting Diode (OLED) devices have the characteristics of self-luminescence, high contrast, fast response speed, lightness, thinness, flexibility and the like, and have become the main trend of display technologies.
Compared with the method of manufacturing the OLED device by vacuum thermal evaporation, the inkjet printing technology has the advantages that the material utilization rate is as high as more than 98%, a fine metal mask plate is not used, a large-size OLED display device can be manufactured, and the like, and therefore the inkjet printing technology becomes a mainstream manufacturing scheme of the large-size OLED device and the display device.
The main structure of the current ink-jet printing OLED device is anode/hole injection layer/hole transport layer/light-emitting layer/electron transport layer/electron injection layer/cathode. The large-size OLED product, particularly a television, has high requirement on the viewing angle, the viewing angle of the conventional rigid OLED product can be improved by introducing an LCD color film scheme, but the viewing angle of the large-size flexible OLED product cannot reach the standard due to the fact that a color film technology of a rigid glass substrate cannot be used. The viewing angle problem is a bottleneck for large size flexible OLED products.
Disclosure of Invention
The invention provides an OLED display panel, when light rays are radiated to scattering particles, the emergent angle of the light rays is changed by the scattering particles, and the effect of increasing the visual angle is achieved.
An embodiment of the present invention provides an OLED display panel, including:
an OLED device substrate;
an adhesive layer disposed on the OLED device substrate; scattering particles are doped in the bonding layer; and
the protective structure layer is arranged on the bonding layer and used for blocking water and oxygen.
Optionally, in some embodiments of the present application, the adhesive layer is composed of an adhesive material and scattering particles, and the mass fraction of the scattering particles is 1% to 3%.
Wherein the adhesive layer includes a first portion and a second portion, the second portion being provided on a peripheral side of the first portion, a distribution density of scattering particles located in the second portion being larger than a distribution density of the scattering particles in the first portion.
Optionally, in some embodiments of the present application, a particle size of the scattering particles located in the second portion is smaller than a particle size of the scattering particles located in the first portion.
Optionally, in some embodiments of the present application, a surface of the scattering particles located in the second portion is concave-convex, and a surface of the scattering particles located in the first portion is smooth.
Optionally, in some embodiments of the present application, the protective structure layer includes a first light-transmitting layer and a second light-transmitting layer disposed on the first light-transmitting layer, where the first light-transmitting layer is disposed on the adhesive layer, and a refractive index of the first light-transmitting layer is greater than a refractive index of the second light-transmitting layer.
Optionally, in some embodiments of the present application, the refractive index of the adhesive layer is greater than the refractive index of the first light-transmitting layer.
Optionally, in some embodiments of the present application, the OLED device substrate includes an OLED device layer and an encapsulation layer, the encapsulation layer is disposed on the OLED device layer, and a refractive index of the encapsulation layer is greater than a refractive index of the bonding layer.
Correspondingly, the embodiment of the application also provides a preparation method of the OLED display panel, which comprises the following steps:
providing an OLED device substrate;
providing a protective structure layer, wherein the protective structure layer is used for blocking water and oxygen;
the OLED device substrate or the protective structure layer is provided with an adhesive layer, scattering particles are doped in the adhesive layer, and the adhesive layer is adhered between the OLED device substrate and the protective structure layer.
Optionally, in some embodiments of the present application, the step of disposing an adhesive layer on the OLED device substrate or the protective structure layer includes:
mixing the bonding material and the scattering particles according to a set mass fraction to form a mixed material; the set mass fraction of the scattering particles is 1% -3%;
and forming an adhesive layer on the protective structure layer.
The invention has the beneficial effects that: when light rays are radiated to the scattering particles, the emergent angle of the light rays is changed by the scattering particles, and the effect of increasing the visual angle is achieved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an OLED panel according to an embodiment of the present application;
FIG. 2 is a schematic structural diagram of an adhesive layer in an OLED panel according to an embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram illustrating a protective structure and an adhesive layer of an OLED panel according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a method for fabricating an OLED panel according to an embodiment of the present application;
fig. 5 is a schematic diagram of step B1 in the method for manufacturing an OLED panel according to the embodiment of the present application;
fig. 6 is a schematic diagram of step B2 in the method for manufacturing an OLED panel according to the embodiment of the present application;
fig. 7 is a schematic diagram of step B3 in the method for manufacturing an OLED panel according to the embodiment of the present application.
Description of reference numerals:
the organic light emitting diode display device comprises an OLED device substrate 10, an OLED device layer 10a, a planarization layer 11a, a TFT device layer 11, a first electrode layer 12, a pixel defining layer 12a, a hole injection layer 13, a hole transport layer 14, a light emitting layer 15, an electron transport layer 16, an electron injection layer 17, a second electrode layer 18, an encapsulation layer 19, a first portion 201, a second portion 202, an adhesive layer 20, scattering particles 20a, an adhesive material 20b, a protective structure layer 30, a first light transmitting layer 31, a second light transmitting layer 32, a flexible substrate 33 and glass 34.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application provides an OLED display panel and a preparation method thereof, which are explained in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.
Referring to fig. 1, an embodiment of the invention provides an OLED display panel 100, where the OLED display panel 100 includes an OLED device substrate 10, an adhesive layer 20, and a protective structure layer 30.
An adhesive layer 20 is disposed on the OLED device substrate 10. The adhesive layer 20 is doped with scattering particles 20 a.
The protective structure layer 30 is disposed on the adhesive layer 20. The protective structure layer 30 is used to block water and oxygen.
Referring to fig. 2, the OLED display panel 100 of the present embodiment employs scattering particles 20a doped in the adhesive layer 20; when light is radiated to the scattering particles 20a, the emergent angle of the light is changed by the scattering particles 20a, so as to achieve the effect of increasing the viewing angle.
Referring to fig. 2, in the present embodiment, the adhesive layer 20 is composed of an adhesive material 20b and scattering particles 20 a. The mass fraction of the scattering particles 20a is 1% -3%, and when the mass fraction of the scattering particles 20a is smaller than the range, more light cannot be effectively scattered due to the smaller number of the scattering particles 20 a. The uniformity of the light emission cannot be ensured. When the mass fraction of the scattering particles 20a is greater than this range, too many scattering particles 20a affect the light transmittance. The mass fraction of the scattering particles 20a in this range ensures both the light extraction rate and the uniformity of the extracted light. Alternatively, the mass fraction of the scattering particles 20a may be 1%, 2%, or 3%.
The mass fraction of the scattering particles 20a is a percentage of the mass of the scattering particles 20a to the mass of the adhesive layer 20.
The refractive index of the scattering particles 20a is different from that of the binder material 20b to break the balance of interference between the original optical uniformity and the secondary waves in the uniform medium, resulting in scattering of light.
Alternatively, the material of the scattering particles 20a may be one or a mixture of two or more materials selected from silicon oxide (SiO2), titanium dioxide (TiO2), molybdenum trioxide (MoO3), zinc oxide (ZnO), nickel oxide (NiO), and tungsten trioxide (WO 3).
The scattering particles 20a have a particle size of between 50 microns and 300 microns, which may be, for example, 50 microns, 150 microns, or 300 microns.
Referring to fig. 2, the adhesive layer 20 optionally includes a first portion 201 and a second portion 202. The second portion 202 is disposed on the peripheral side of the first portion 201. The distribution density of the scattering particles 20a located in the second portion 202 is greater than the distribution density of the scattering particles 20a in the first portion 201.
That is to say, the scattering particles 20a in the adhesive layer 20 of the scattering particles 20a can be dispersed into a plurality of regions, and the regions are divided according to the light-emitting intensity when the scattering particles 20a in the adhesive layer 20 are uniformly distributed, so that fewer scattering particles 20a are doped in the region with a large light-emitting intensity, and the purpose of compensating the region with a low light-emitting intensity is achieved, thereby making the light-emitting more uniform.
In some embodiments, the scattering particles 20a in the adhesive layer 20 are uniformly distributed.
In some embodiments of the present application, the scattering particles 20a located in the second portion 202 have a smaller particle size than the scattering particles 20a located in the first portion 201.
The scattering particles 20a in the second portion 202 having a smaller particle size than the scattering particles 20a in the first portion 201 may make the scattering particles 20a in the second portion 202 more dense and have more scattering directions. Since the light output amount of the first portion 201 is greater than that of the second portion 202, the second portion 202 has a better scattering effect, so that the display panel 100 has a uniform light output effect.
In some embodiments of the present application, the surface of the scattering particles 20a located in the second portion 202 is concave-convex, and the surface of the scattering particles 20a located in the first portion 201 is smooth.
The surface of the scattering particles 20a of the second portion 202 is concave-convex, so that the scattering particles 20a of the second portion 202 have more scattering directions. The scattering particles 20a of the first portion 201 have smooth surfaces, so that the scattering direction of the outgoing light passing through the first portion 201 can be reduced. Since the light output amount of the first portion 201 is greater than that of the second portion 202, the second portion 202 has a better scattering effect, so that the display panel 100 has a uniform light output effect.
Referring to fig. 3, in some embodiments of the present disclosure, protective structure layer 30 includes a first light-transmitting layer 31 and a second light-transmitting layer 32 disposed above first light-transmitting layer 31, where first light-transmitting layer 31 is disposed above adhesive layer 20, and a refractive index of first light-transmitting layer 31 is greater than a refractive index of second light-transmitting layer 32.
When light passes through the interface between the first light-transmitting layer 31 and the second light-transmitting layer 32, the light is refracted, and thus the effect of increasing the viewing angle is achieved.
Alternatively, SiO may be used as the material of the first light-transmitting layer 31x、SiNxAt least one of SiON and SiOC. The thickness of the first light transmitting layer 31 is between 40 nm and 60 nm, for example, it may be 40 nm, 50 nm or 60 nm.
Alternatively, SiO may be used as the material of second light-transmitting layer 32x、SiNxAt least one of SiON and SiOC. Second light transmitting layer 32 may have a thickness of between 30 nanometers and 1000 nanometers, and may, for example, be 30 nanometers, 500 nanometers, or 1000 nanometers.
In some embodiments of the present application, the refractive index of the adhesive layer 20 is greater than the refractive index of the first light transmitting layer 31.
When light passes through the interface between the first transparent layer 31 and the adhesive layer 20, the light is refracted, thereby increasing the viewing angle.
The protective structure layer 30 further includes a flexible substrate 33, and the flexible substrate 33 is disposed on the second light-transmitting layer 32.
Alternatively, the material of the flexible substrate 33 may be polyethylene terephthalate, polyimide film, or the like. The thickness of the flexible substrate 33 is between 20 microns and 100 microns, and may be 20 microns, 40 microns or 100 microns, for example.
Referring to fig. 1, in the present embodiment, the OLED device substrate 10 includes an OLED device layer 10a and an encapsulation layer 19, and the encapsulation layer 19 is disposed on the OLED device layer 10 a. The refractive index of the encapsulation layer 19 is greater than the refractive index of the adhesive layer 20.
The OLED device substrate 10 comprises a TFT device layer 11, a first electrode layer 12, a hole injection layer 13, a hole transport layer 14, a light emitting layer 15, an electron transport layer 16, an electron injection layer 17 and a second electrode layer 18. An encapsulation layer 19 is located on the second electrode layer 18.
Wherein the first electrode layer 12 may be one of an anode and a cathode and the second electrode layer 18 is the other of the anode and the cathode.
Referring to fig. 4, the present application further relates to a method for manufacturing an OLED display panel, including the following steps:
step B1, providing an OLED device substrate 10;
step B2, providing a protective structure layer 30, wherein the protective structure layer 30 is used for blocking water and oxygen;
step B3, arranging an adhesive layer 20 on the OLED device substrate 10 or the protective structure layer 30, wherein the adhesive layer 20 is doped with scattering particles 20a, and the adhesive layer 20 is adhered between the OLED device substrate 10 and the protective structure layer 30.
The adhesive layer 20 is doped with scattering particles 20 a. When light is radiated to the scattering particles 20a, the emergent angle of the light is changed by the scattering particles 20a, so as to achieve the effect of increasing the viewing angle.
It should be noted that step B1 and step B2 are not in sequence. The adhesive layer 20 may be formed on the OLED device substrate 10 or the protective structure layer 30. In the embodiment of the present application, the adhesive layer 20 may be formed on the protective structure layer 30, but is not limited thereto. The following describes a method for manufacturing the OLED display panel.
Step B1, referring to fig. 5, providing an OLED device substrate 10;
optionally, step B1 includes the following steps: manufacturing a TFT device layer 11 on a substrate; after the TFT device layer 11 is manufactured, a planarization layer 11a is manufactured, a first electrode layer 12 of the OLED device is manufactured on the planarization layer 11a, and a pixel defining layer 12a is manufactured on the first electrode layer 12.
On the pixel defining layer 12a, a hole injection layer 13, a hole transport layer 14, and a light emitting layer 15 were formed by ink jet printing.
An electron transport layer 16, an electron injection layer 17, and a second electrode layer 18 are formed on the light-emitting layer 15 by an evaporation method. An encapsulation layer 19 is fabricated on the cathode.
Wherein, the TFT device in the TFT device layer 11 can be a device made of low-temperature polysilicon, indium gallium zinc oxide and other materials,
the packaging layer 19 adopts a composite film packaging technology of alternating inorganic films and organic films, in this embodiment, the organic film adopts an acrylic resin layer, and the inorganic film adopts a SiNx layer. Optionally, the encapsulation layer 19 may also adopt an inorganic film encapsulation structure, an organic film encapsulation structure, or other structures, and further adopt a film encapsulation technology, an indium sealing technology, a frit fusion sealing technology, or other technologies in the encapsulation technology. Optionally, a desiccant may be added to the encapsulation layer 19 in order to remove residual water oxygen.
And then proceeds to step B2.
In step B2, referring to fig. 6, a protective structure layer 30 is provided, and the protective structure layer 30 is used for blocking water and oxygen.
Optionally, step B2 includes the following steps: the flexible substrate 33 is coated with a material on the glass 34, and the flexible substrate 33 is cured. Subsequently, a second light-transmitting layer 32 is fabricated by chemical vapor deposition on a flexible substrate 33. Next, the first light-transmitting layer 31 is formed over the second light-transmitting layer 32 by an atomic layer deposition method.
The first transparent layer 31 is made of aluminum oxide, and is manufactured in two steps, in this embodiment, the first manufacturing thickness is 20 nm, the second manufacturing thickness is 30 nm, and the total thickness is about 50 nm. Wherein the thickness of the first manufacturing is 10 nm-40 nm, and optionally 10 nm, 20 nm or 40 nm. The thickness of the second manufacturing is 10 nm-40 nm, and the selectable thickness is 10 nm, 30 nm or 40 nm. The total thickness of the first light-transmitting layer 31 is 40 nm to 60 nm, and optionally 40 nm, 50 nm or 60 nm;
alternatively, the material of the first light-transmitting layer 31 may be at least one of SiOx, SiNx, SiON, and SiOC. The thickness of the first light transmitting layer 31 is between 40 nm and 60 nm, for example, it may be 40 nm, 50 nm or 60 nm.
Alternatively, the material of the second light-transmitting layer 32 may be selected from at least another one of SiOx, SiNx, SiON, and SiOC. Second light transmitting layer 32 may have a thickness of between 30 nanometers and 1000 nanometers, and may, for example, be 30 nanometers, 500 nanometers, or 1000 nanometers.
And then proceeds to step B3.
In step B3, referring to fig. 7, an adhesive layer 20 is disposed on the protective structure layer 30, the scattering particles 20a are doped in the adhesive layer 20, and the adhesive layer 20 is adhered between the OLED device substrate 10 and the protective structure layer 30.
Optionally, step B3 includes the following steps:
and step B31, mixing the binding material 20B and the scattering particles 20a, and mixing the binding material 20B and the scattering particles 20a according to a set mass fraction to form a mixed material.
In step B32, the adhesive layer 20 is formed by applying the mixture material to the second light-transmitting layer 32.
Step B33, removing the substrate under the protective structure layer 30, and disposing the protective structure layer 30 on the OLED device substrate 10 through the adhesive layer 20.
Alternatively, the protective structure layer 30 is separated from the substrate by a laser glass process.
Wherein the thickness of the adhesive material 20b is between 180 microns and 220 microns, and optionally 180 microns, 200 microns, or 220 microns.
Optionally, the scattering particles 20a have a particle size in the range of 50 microns to 300 microns, optionally 50 microns, 150 microns or 300 microns.
Alternatively, the material of the scattering particles 20a may be silicon oxide (SiO)2) Titanium dioxide (TiO)2) Molybdenum trioxide (MoO)3) Zinc oxide (ZnO), nickel oxide (NiO) and tungsten trioxide (WO)3) One or a mixture of two or more of them.
Optionally, the set mass fraction of scattering particles 20a is 1% -3%, such as 1%, 2% or 3%;
in addition, in this embodiment, the method for manufacturing an OLED display panel further includes the following steps:
the adhesive layer 20 is cured.
Alternatively, the adhesive layer 20 is cured by thermal curing at a temperature of 70 ℃ to 90 ℃, such as 70, 80, and 90 ℃. The time is 0.8 to 1.5 hours, for example, 0.8 hour, 1 hour or 1.5 hours.
In the present embodiment, the adhesive material 20b used for the adhesive layer 20 is a thermosetting material, and thus is cured by a thermal conduction method. In the embodiment, any one of an infrared furnace, a hot plate and hot air can be selected. In some embodiments, the adhesive material 20b may also be a photo-curable material, and photo-curing, such as UV curing, is selected for this step.
This completes the fabrication process of the OLED display panel of the present application.
The OLED display panel and the manufacturing method provided in the embodiments of the present application are described in detail above, and specific examples are applied in the description to explain the principle and the implementation manner of the present application, and the description of the embodiments above is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. An OLED display panel, comprising:
an OLED device substrate;
an adhesive layer disposed on the OLED device substrate; scattering particles are doped in the bonding layer; and
the protective structure layer is arranged on the bonding layer and used for blocking water and oxygen.
2. The OLED display panel of claim 1, wherein the bonding layer is composed of a bonding material and scattering particles, and the mass fraction of the scattering particles is 1% -3%.
3. The OLED display panel of claim 1, wherein the adhesive layer includes a first portion and a second portion, the second portion being disposed on a peripheral side of the first portion, a distribution density of scattering particles in the second portion being greater than a distribution density of the scattering particles in the first portion.
4. The OLED display panel of claim 3, wherein the scattering particles in the second portion have a smaller particle size than the scattering particles in the first portion.
5. The OLED display panel of claim 3, wherein the scattering particles in the second portion have a concave-convex surface, and the scattering particles in the first portion have a smooth surface.
6. The OLED display panel according to claim 1, wherein the protective structure layer comprises a first light transmitting layer and a second light transmitting layer disposed on the first light transmitting layer, wherein the first light transmitting layer is disposed on the adhesive layer, and a refractive index of the first light transmitting layer is greater than a refractive index of the second light transmitting layer.
7. The OLED display panel of claim 6, wherein the refractive index of the adhesive layer is greater than the refractive index of the first light transmitting layer.
8. The OLED display panel of claim 7, wherein the OLED device substrate comprises an OLED device layer and an encapsulation layer, the encapsulation layer disposed on the OLED device layer, the encapsulation layer having a refractive index greater than a refractive index of the adhesive layer.
9. The preparation method of the OLED display panel is characterized by comprising the following steps:
providing an OLED device substrate;
providing a protective structure layer, wherein the protective structure layer is used for blocking water and oxygen;
the OLED device substrate or the protective structure layer is provided with an adhesive layer, scattering particles are doped in the adhesive layer, and the adhesive layer is adhered between the OLED device substrate and the protective structure layer.
10. The method of claim 9, wherein the step of disposing an adhesive layer on the OLED device substrate or the protective structure layer comprises:
mixing the bonding material and the scattering particles according to a set mass fraction to form a mixed material; the set mass fraction of the scattering particles is 1% -3%;
and forming an adhesive layer on the protective structure layer.
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