CN114019879B - High-low voltage power distribution cabinet monitoring system - Google Patents

High-low voltage power distribution cabinet monitoring system Download PDF

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Publication number
CN114019879B
CN114019879B CN202111312982.4A CN202111312982A CN114019879B CN 114019879 B CN114019879 B CN 114019879B CN 202111312982 A CN202111312982 A CN 202111312982A CN 114019879 B CN114019879 B CN 114019879B
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module
thermal imaging
resistor
input end
loop current
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CN114019879A (en
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鲁建庄
尹利华
李恒
戚大臣
王鹏飞
栗志超
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Henan Digital Zhongyuan Data Co ltd
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Henan Digital Zhongyuan Data Co ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/04Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0428Safety, monitoring
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/24Pc safety
    • G05B2219/24024Safety, surveillance

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Measurement Of Current Or Voltage (AREA)
  • Radiation Pyrometers (AREA)

Abstract

The invention belongs to the technical field of high-low voltage power distribution equipment, and particularly relates to a high-low voltage power distribution cabinet monitoring system. The invention overcomes the defects of the prior art, and the thermal imaging monitoring module is used for accurately monitoring the temperature of each electrical element and each circuit. The high-low voltage power distribution cabinet monitoring system comprises a power supply module, a bus voltage detection module, an incoming line loop current acquisition module, an outgoing line loop current acquisition module, a thermal imaging monitoring module, a signal processing circuit, a communication module, a processor and a data storage module; the power module is electrically connected with the busbar voltage detection module, the incoming line loop current acquisition module, the outgoing line loop current acquisition module, the thermal imaging monitoring module, the signal processing circuit, the communication module, the processor and the data storage module respectively. According to the high-low voltage power distribution cabinet monitoring system, various parameters of the power distribution system can be accurately measured by detecting through the thermal imaging detection method carried out by the thermal imaging unit.

Description

High-low voltage power distribution cabinet monitoring system
Technical Field
The invention belongs to the technical field of high-low voltage power distribution equipment, and particularly relates to a high-low voltage power distribution cabinet monitoring system.
Background
The electric power marketing materials have the characteristics of 'few varieties, large batch' and 'multiple varieties and large batch' which are mixed, and the electric power marketing materials have the advantages of high manual management difficulty and high labor intensity. The efficiency is low in the aspects of receiving, delivering, carrying, checking and the like, and the labor with low added value is repeated manually, so that the delivering and delivering management is unclear and untimely. The most common of the existing automatic stereoscopic warehouse is a tunnel stacking crane, the device has the problems of large transformation amount, complex system structure and high input cost in the application process, and the stereoscopic warehouse is difficult to update the system and reconstruct the structure after being transformed.
Meanwhile, the existing tunnel stacking crane is mainly of a mechanical structure, does not relate to a matched monitoring system, and is inconvenient to monitor and technically reform a data center precise power supply power distribution cabinet of the tunnel stacking crane in real time.
Therefore, it is desirable to design a system that can accurately monitor a power distribution cabinet in order to solve the problems in the prior art.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a high-low voltage power distribution cabinet monitoring system which is used for accurately monitoring the temperature of each electrical element and each circuit through a thermal imaging monitoring module.
The invention further aims to provide a thermal imaging detection method by using the thermal imaging unit in the high-low voltage power distribution cabinet monitoring system.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the high-low voltage power distribution cabinet monitoring system comprises a power supply module, a bus voltage detection module, an incoming line loop current acquisition module, an outgoing line loop current acquisition module, a thermal imaging monitoring module, a signal processing circuit, a communication module, a processor and a data storage module; the power supply module is respectively and electrically connected with the bus voltage detection module, the incoming line loop current acquisition module, the outgoing line loop current acquisition module, the thermal imaging monitoring module, the signal processing circuit, the communication module, the processor and the data storage module, and supplies power to each module;
the output end of the wire-incoming loop current acquisition module is in communication connection with the input end of the signal processing circuit, and the output end of the wire-outgoing loop current acquisition module is in communication connection with the input end of the signal processing circuit; the output end of the signal processing circuit is in communication connection with the input end of the processor;
the output end of the bus voltage detection module is also in communication connection with the input end of the processor, and the output end of the processor is respectively in communication connection with the input end of the communication module and the input end of the data storage module; the bus voltage detection module is used for detecting the pressure difference between the positive bus and the negative bus;
the incoming line loop current acquisition module is used for acquiring incoming line part current and converting the incoming line part current into small current to be output to the signal processing circuit; the outgoing line loop current acquisition module is used for acquiring outgoing line part current and converting the outgoing line part current into small current to be output to the signal processing circuit;
the thermal imaging monitoring module is used for monitoring the temperature change of the whole power distribution cabinet and giving an alarm when the temperature abnormality occurs;
the signal processing circuit is used for lifting the current signals acquired by the incoming loop current acquisition module and the outgoing loop current acquisition module to the sampling lowest point of an analog-to-digital converter arranged in the processor;
the processor is used for receiving the electric signals of the bus voltage detection module and the signal processing circuit and storing the electric signals through the data storage module;
the thermal imaging monitoring module includes:
the thermal imaging unit is used for carrying out non-contact thermal imaging detection on electric elements and circuits in the power distribution cabinet;
the photographing unit is used for photographing the electrical components and the circuits detected by the thermal imaging unit to obtain thermal imaging pictures of the electrical components and the circuits; and
the analysis unit is used for receiving the thermal imaging picture output by the photographing unit, comparing the thermal imaging picture with the standard thermal imaging picture of the electrical element and the circuit when the electrical element and the circuit work normally, and judging whether the electrical element and the circuit are normal or not according to the comparison result;
the output end of the thermal imaging unit and the output end of the photographing unit are respectively in communication connection with the input end of the analysis unit.
Specifically, the power supply module supplies power to each module in a mode of multipath isolation voltage output; the power module comprises two first circuit breakers and second circuit breakers with residual current device protection, the first circuit breakers and the second circuit breakers are mutually connected in parallel, the first circuit breakers and the second circuit breakers adopt a power supply mode of mutually switching (double power supply switching) at the tail ends of double power supplies (the second circuit breakers are disconnected when the first circuit breakers are switched on, and the first circuit breakers are disconnected when the second circuit breakers are switched on), namely, the first circuit breakers and the second circuit breakers are connected in parallel and then connected to all electric appliances in the high-low voltage power distribution cabinet.
Specifically, the bus voltage detection module comprises a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor and an operational amplifier, wherein one end of the first resistor is connected with a positive bus, and the other end of the first resistor is connected with the non-inverting input end of the operational amplifier; one end of the third resistor is connected with the analog ground, and the other end of the third resistor is connected with the non-inverting input end of the operational amplifier; one end of the second resistor is connected with the negative bus, and the other end of the second resistor is connected with the inverting input end of the operational amplifier; one end of the fourth resistor is connected with the inverting input end of the operational amplifier, and the other end of the fourth resistor is connected with the output end of the operational amplifier; one end of the fifth resistor is connected with the output end of the operational amplifier, the other end of the fifth resistor is connected with the processor, positive bus voltage is input to the non-inverting input end of the operational amplifier after being subjected to voltage reduction treatment by the first resistor and the third resistor, negative bus voltage is input to the inverting input end of the operational amplifier after being subjected to voltage reduction treatment by the second resistor, and then the detection differential pressure between the positive bus and the negative bus is obtained after being subjected to operation treatment by the operational amplifier and is output to the processor as a second detection differential pressure.
Specifically, a 5A current transformer is adopted by the incoming line loop current acquisition module, and a 100A/20mA current transformer is adopted by the outgoing line loop current acquisition module.
Specifically, the communication module is an RS485 communication module.
Specifically, the analysis unit includes:
the data processing unit receives the thermal imaging picture output by the photographing unit, compares the thermal imaging picture with the standard thermal imaging picture when the electrical element and the circuit work normally, and judges whether the electrical element and the circuit are normal or not according to the comparison result;
the alarm unit is used for sending alarm information when the data processing unit judges that the electrical elements and the circuit are abnormal; and
the display unit is used for displaying alarm information and/or electrical elements and circuit normal information;
the input end of the data processing unit is in communication connection with the output end of the photographing unit, and the output end of the data processing unit is in communication connection with the input end of the alarm unit and the input end of the display unit respectively.
Furthermore, the invention also provides a thermal imaging detection method by adopting the thermal imaging unit in the high-low voltage power distribution cabinet monitoring system, which comprises the following steps:
s1: performing binarization segmentation on the image through a threshold, wherein the threshold is:
wherein (1)>For average gray value, σ I The difference between classes for each partial gray value;
then, carrying out open operation and close operation on the image subjected to binarization segmentation respectively to obtain a connected domain area value, and after calculation, only reserving the connected domain with the connected domain area larger than Amin as a candidate connected domain through a brightness segmentation result, and marking as Rt, wherein Amin=0.0025xc, r and c are the width and the height of the connected domain, and detecting an ROI (region of interest) of the distribution position of the electrical element, namely Rm;
s2: merging any intersection value among the obtained Rt and Rm values into an ROI region, and marking the ROI region as an Rf value;
s3: counting the sum of pixel values (specifically, gray values calculated according to RGB values) of each column of pixel points in Rf by using the columns as directions and forming a gray histogram, and separating a plurality of electrical elements and circuits in a region through peak values and low values of the histogram, so that a new separated ROI is marked as sRf;
s4: intercepting the height of the separated new ROI area sRf according to the average value of all the row pixels;
s5: filtering out the ROI area which is not an electrical element and a circuit;
then, thermal imaging pictures of all the electrical elements and circuits can be obtained, and the thermal imaging pictures are compared with standard thermal imaging pictures of all the electrical elements and circuits which are preset when the electrical elements and circuits work normally, so that whether all the electrical elements and circuits are normal or not can be judged.
Compared with the prior art, the invention has the following beneficial effects:
1. the high-low voltage power distribution cabinet monitoring system realizes centralized monitoring of data in the high-low voltage power distribution cabinet through remote communication. The system is suitable for single-path input, single-section output and single-point detection; double-path input, single-section output and single-point detection; a system power input mode of two-way input, single-section output and double-point detection.
2. The high-low voltage power distribution cabinet monitoring system can accurately measure various parameters of a power distribution system, including bus voltage and frequency of three-phase incoming lines, current of 2 paths of three-phase incoming lines, split-phase and total active power, reactive power, power factor, active electric energy and reactive electric energy.
3. The high-low voltage power distribution cabinet monitoring system can accurately measure the electrical parameters such as the on-off state of 36 outgoing lines (current, active power, reactive power, power factor, active electric energy, reactive electric energy and branch) and the like, and can accurately monitor the temperature of each electrical element and circuit through the thermal imaging monitoring module.
Drawings
Fig. 1 is a block diagram of connection relation between each module in the monitoring system of the high-low voltage power distribution cabinet according to embodiment 1;
fig. 2 is a circuit diagram of a bus voltage detection module in embodiment 1;
FIG. 3 is a block diagram of a thermal imaging monitoring module according to embodiment 1;
FIG. 4 is a block diagram of an analysis unit of embodiment 1;
the meaning of each reference numeral in the figures is: 1. a power module; 2. a bus voltage detection module; 3. the incoming line loop current acquisition module; 4. the outgoing line loop current acquisition module; 5. a thermal imaging monitoring module; 50. a thermal imaging unit; 51. a photographing unit; 52. an analysis unit; 520. a data processing unit; 521. an alarm unit; 522. a display unit; 6. a signal processing circuit; 7. a communication module; 8. a processor; 9. and a data storage module.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1, the monitoring system of the high-low voltage power distribution cabinet comprises a power supply module 1, a bus voltage detection module 2, an incoming line loop current acquisition module 3, an outgoing line loop current acquisition module 4, a thermal imaging monitoring module 5, a signal processing circuit 6, a communication module 7, a processor 8 and a data storage module 9. The power module 1 is respectively and electrically connected with the bus voltage detection module 2, the incoming line loop current acquisition module 3, the outgoing line loop current acquisition module 4, the thermal imaging monitoring module 5, the signal processing circuit 6, the communication module 7, the processor 8 and the data storage module 9, and supplies power to each module;
the output end of the incoming line loop current acquisition module 3 is in communication connection with the input end of the signal processing circuit 6, and the output end of the outgoing line loop current acquisition module 4 is in communication connection with the input end of the signal processing circuit 6; the output end of the signal processing circuit 6 is in communication connection with the input end of the processor 8;
the output end of the bus voltage detection module 2 is also in communication connection with the input end of the processor 8 (this connection relationship is not shown in the figure), and the output end of the processor 8 is in communication connection with the input end of the communication module 7 and the input end of the data storage module 9, respectively.
The power module 1 supplies power to each module in a multipath isolation voltage output mode; the power module 1 comprises a first breaker QF11 and a second breaker QF21 with Residual Current Device (RCD) protection, wherein the first breaker QF11 and the second breaker QF21 are mutually connected in parallel, the first breaker QF11 and the second breaker QF21 adopt a power supply mode of double-power-supply end mutual switching (double-power-supply switching) (the second breaker QF21 is disconnected when the first breaker QF11 is switched on, and the first breaker QF11 is disconnected when the second breaker QF21 is switched on), namely, the first breaker QF11 and the second breaker QF21 are connected in parallel and then connected to each electric appliance in the high-low voltage power distribution cabinet;
as shown in fig. 2, the bus voltage detection module 2 is configured to detect a voltage difference between a positive bus and a negative bus; in this embodiment: the bus voltage detection module 2 comprises a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5 and an operational amplifier A2, wherein one end of the first resistor R1 is connected with a positive bus, and the other end of the first resistor R1 is connected with the non-inverting input end of the operational amplifier A2; one end of the third resistor R3 is connected with an Analog Ground (AGND), and the other end of the third resistor R3 is connected with the non-inverting input end of the operational amplifier A2; one end of the second resistor R2 is connected with the negative bus, and the other end of the second resistor R2 is connected with the inverting input end of the operational amplifier A2; one end of the fourth resistor R4 is connected with the inverting input end of the operational amplifier A2, and the other end of the fourth resistor R4 is connected with the output end of the operational amplifier A2; one end of the fifth resistor R5 is connected with the output end of the operational amplifier A2, the other end of the fifth resistor R5 is connected with the processor 8, positive bus voltage is input to the non-inverting input end of the operational amplifier A2 after being subjected to voltage reduction treatment by the first resistor R1 and the third resistor R3, negative bus voltage is input to the inverting input end of the operational amplifier A2 after being subjected to voltage reduction treatment by the second resistor R2, and then the detection differential pressure between the positive bus and the negative bus is obtained after being subjected to operation treatment by the operational amplifier A2 and is output to the processor 8 as a second detection differential pressure.
The resistance values of the first resistor R1, the second resistor R2, the third resistor R3, the fourth resistor R4 and the fifth resistor R5 are selected according to specific application scenarios, and certainly, each resistor may also be formed by a plurality of small resistors connected in series. The operational amplifier A2 may be provided as an active operational amplifier, and the voltages at the respective input terminals may be compared and outputted.
As shown in fig. 1, the incoming line loop current collection module 3 is configured to collect incoming line part current, convert the incoming line part current into small current, and output the small current to the signal processing circuit 6; the outgoing line loop current acquisition module 4 is used for acquiring outgoing line part current, converting the outgoing line part current into small current and outputting the small current to the signal processing circuit 6. In this embodiment: the incoming line loop current acquisition module 3 adopts a 5A current transformer, and the outgoing line loop current acquisition module 4 adopts a 100A/20mA current transformer.
The thermal imaging monitoring module 5 is used for monitoring the temperature change of the whole power distribution cabinet, and giving an alarm when the temperature abnormality occurs.
The signal processing circuit 6 is used for raising the current signals collected by the incoming loop current collection module 3 and the outgoing loop current collection module 4 to the sampling lowest point of an analog-to-digital converter (ADC) arranged in the processor 8.
In the invention, the high-low voltage power distribution cabinet monitoring system is not provided with a display structure, so after the high-low voltage power distribution cabinet monitoring system is arranged in a power distribution cabinet, the display of local data is required to transmit the data from the communication module 7 to a touch screen arranged outside the power distribution cabinet through the RS-485 and Modbus RTU communication protocol, and at the moment, one communication port of the communication module 7 is occupied, so the communication module 7 is designed to be in a double communication mode.
The processor 8 is used for receiving the electric signals of the bus voltage detection module 2 and the signal processing circuit 6, storing the electric signals through the data storage module and sending the electric signals to the upper computer through the communication module 7.
In this embodiment: the signal processing circuit 6 adopts a controllable precision voltage stabilizing source (TL 431) to raise signals, the collected current signals are raised to the lowest point, the sampling processing can be performed by the ADC, the signal processing circuit 6 is provided with 42 signal paths in total (namely, the current signals are 42 in total), the 42 signal paths are divided into 7 groups, each group of 6 signal paths is subjected to signal selection through a single-ended 8-channel multi-way switch (CD 4051), the single-ended 8-channel multi-way switch is controlled by the processor 8 and is conducted in a time sharing way, and 7 current signals flow into the ADC of the processor 8 through the signal paths at the same time to perform analog-to-digital (A/D) conversion.
As shown in fig. 3, the thermal imaging monitoring module 5 includes a thermal imaging unit 50, a photographing unit 51 and an analysis unit 52, where an output end of the thermal imaging unit 50 and an output end of the photographing unit 51 are respectively connected with an input end of the analysis unit 52 in a communication manner.
The thermal imaging unit 50 is used for performing non-contact thermal imaging detection on electrical components and circuits in the power distribution cabinet; the photographing unit 51 is configured to photograph the electrical components and the circuits detected by the thermal imaging unit 50, obtain thermal imaging pictures of the electrical components and the circuits, and transmit the thermal imaging pictures obtained by photographing to the analysis unit 52; the analysis unit 52 is configured to receive the thermal imaging picture output by the photographing unit 51, compare the thermal imaging picture with a standard thermal imaging picture of an electrical component and a circuit when the electrical component and the circuit work normally, and determine whether the electrical component and the circuit are normal according to a comparison result.
As shown in fig. 4, the analysis unit 52 includes a data processing unit 520, an alarm unit 521 and a display unit 522, where an input end of the data processing unit 520 is communicatively connected to an output end of the photographing unit 51, and an output end of the data processing unit 520 is communicatively connected to an input end of the alarm unit 521 and an input end of the display unit 522, respectively.
The data processing unit 520 is configured to receive the thermal imaging picture output by the photographing unit 51, compare the thermal imaging picture with a standard thermal imaging picture of an electrical component and a circuit when the electrical component and the circuit work normally, and determine whether the electrical component and the circuit are normal according to a comparison result; an alarm unit 521 for sending out alarm information when the data processing unit 520 determines that the electrical components and the circuit are abnormal; and a display unit 522 for displaying alarm information and/or electrical components and line normal information. In an actual application scenario, the data processing unit 520 may send high-level signals to the alarm unit 521 and the display unit 522 when it is determined that the electrical components and the lines are abnormal, and the alarm unit 521 and the display unit 522 send alarm information and display alarm information according to the received high-level signals, respectively. The high-level signal may also carry specific information (including one or more of name, number, position, etc.) of the abnormal electrical components and circuits, so that the display unit 522 may correspondingly display the specific information of the abnormal electrical components and circuits, so as to facilitate maintenance.
In this embodiment: the thermal imaging detection method of the thermal imaging unit 50 is as follows:
s1: performing binarization segmentation on the image through a threshold, wherein the threshold is:
wherein (1)>For average gray value, σ I Is the inter-class difference of the gray values of each part.
In a specific test, the thermal imaging unit 50 photographs through an infrared camera to obtain a thermal imaging picture in the power distribution cabinet, and the processing modes of the thermal imaging picture include, but are not limited to, MATLAB, openCV, and other modes can be adopted to realize binary segmentation of the thermal imaging picture, and specifically, MATLAB, openCV and other processing modes adopted for the thermal imaging picture can be all adopted by a conventional method in the art. Alternatively, in the MATLAB mode, the threshold value θ is calculated TA When in use, gray scale assignment can be carried out on each pixel point in the thermal imaging picture according to the numerical value of each point in the input thermal imaging picture matrix, and then average gray scale value can be counted according to the gray scale value of each pixel pointCalculating the inter-class difference sigma I . For example, average gray value +.>187, inter-class difference sigma of gray values of each part I For 5, a threshold value θ can be calculated TA 240.
And then carrying out open operation and close operation on the image subjected to binarization segmentation respectively to obtain a connected domain area value, and after calculation, only the connected domain with the connected domain area larger than Amin is reserved as a candidate connected domain through a brightness segmentation result and is marked as Rt, wherein Amin=0.0025 r c, r and c are the width and the height of the connected domain, and the ROI (region of interest) of the distribution position of the electric element is detected and marked as Rm. Here, the detection and extraction method of the ROI area includes, but is not limited to, an image masking method, specifically, an image masking method for the ROI area may be a conventional method in the art, and is not the point of the present invention, so that the description is omitted. For example, the mask is a binary image, the mask value of the region of interest is set to 255, and the mask value of the region of non-interest is set to 0, wherein the mask can be set by invoking the Mat (Rect) setTo method by the Mat function method in OpenCV.
S2: merging any intersection value among the obtained Rt and Rm values into an ROI region, and marking the ROI region as an Rf value;
s3: counting the sum of pixel values (specifically, gray values calculated according to RGB values) of each column of pixel points in Rf by using the columns as directions and forming a gray histogram, and separating a plurality of electrical elements and circuits in a region through peak values and low values of the histogram, so that a new separated ROI is marked as sRf; wherein the gray level histogram may be created in a manner such as MATLAB, openCV.
S4: intercepting the height of the separated new ROI area sRf according to the average value of all the row pixels;
s5: regions of the ROI that are not electrical components and lines are filtered out.
The above thermal imaging detection method may be implemented by using software such as MATLAB, openCV, and the like, by a method conventional in the art.
Based on the steps, thermal imaging pictures of all the electrical elements and circuits can be obtained, and the thermal imaging pictures are compared with the standard thermal imaging pictures of all the electrical elements and circuits when the electrical elements and circuits work normally, so that whether all the electrical elements and circuits are normal or not can be judged.
When the obtained thermal imaging picture is compared with the standard thermal imaging picture, the difference value of the pixel points at the same position in the two pictures can be obtained, and whether the electrical components and the circuits are normal can be determined according to whether the difference value exceeds a preset pixel difference threshold value (equipment is carried out according to the actual working conditions of the electrical components and the circuits of different types). Here, whether the electrical components and the circuits are normal is judged according to the difference value of the pixel points at the same position of the two pictures, which is equivalent to judging whether the electrical components and the circuits are in a normal working state according to the difference value of the current temperature of the electrical components and the circuits and the standard temperature in normal working, so that accurate temperature monitoring of the electrical components and the circuits can be realized.
The monitoring system of the high-low voltage power distribution cabinet provided by the embodiment of the invention can accurately realize various parameters in the power distribution system in real time by arranging the detection modules at the positions of the bus, the incoming line loop, the outgoing line loop and the like, wherein the parameters comprise bus voltage and frequency of a three-phase incoming line, current of two paths of three-phase incoming lines, split-phase and total active power, reactive power, power factor, on-off state and electric parameters of 36 outgoing lines such as active electric energy, reactive electric energy and the like; the remote centralized monitoring of the data in the high-low voltage power distribution cabinet can be realized through remote communication; and by setting the thermal imaging monitoring module to shoot thermal imaging pictures of the electrical components and the circuits in the power distribution cabinet and comparing the thermal imaging pictures with the standard thermal imaging pictures, whether the electrical components and the circuits are in a normal running state can be judged, so that the accurate temperature monitoring of the electrical components and the circuits is realized.
Those of ordinary skill in the art will appreciate that all or a portion of the steps implementing the above embodiments may be implemented by hardware, or may be implemented by a program to instruct related hardware, and the program may be stored in a computer readable storage medium, where the above mentioned storage medium may be a read only memory, a magnetic disk or an optical disk, etc.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A thermal imaging detection method by a thermal imaging unit in a high-low voltage power distribution cabinet monitoring system is characterized in that,
the high-low voltage power distribution cabinet monitoring system comprises a power supply module, a bus voltage detection module, an incoming line loop current acquisition module, an outgoing line loop current acquisition module, a thermal imaging monitoring module, a signal processing circuit, a communication module, a processor and a data storage module; the power supply module is respectively and electrically connected with the bus voltage detection module, the incoming line loop current acquisition module, the outgoing line loop current acquisition module, the thermal imaging monitoring module, the signal processing circuit, the communication module, the processor and the data storage module, and supplies power to each module;
the output end of the wire-incoming loop current acquisition module is in communication connection with the input end of the signal processing circuit, and the output end of the wire-outgoing loop current acquisition module is in communication connection with the input end of the signal processing circuit; the output end of the signal processing circuit is in communication connection with the input end of the processor;
the output end of the bus voltage detection module is in communication connection with the input end of the processor, and the output end of the processor is respectively in communication connection with the input end of the communication module and the input end of the data storage module;
the thermal imaging monitoring module comprises a thermal imaging unit, a photographing unit and an analysis unit, wherein the output ends of the thermal imaging unit and the photographing unit are respectively in communication connection with the output end of the analysis unit;
the method comprises the following steps:
s1: performing binarization segmentation on the image through a threshold, wherein the threshold is:
wherein->For average gray value +.>The difference between classes for each partial gray value;
then, carrying out open operation and close operation on the image subjected to binarization segmentation respectively to obtain a connected domain area value, and after calculation, only reserving the connected domain with the connected domain area larger than Amin as a candidate connected domain through a brightness segmentation result, and marking as Rt, wherein Amin=0.0025xc, r and c are wide and high of the connected domain, and detecting an ROI region of a distribution position of an electrical element, namely Rm;
s2: merging any intersection value among the obtained Rt and Rm values into an ROI region, and marking the ROI region as an Rf value;
s3: counting the sum of pixel values of each column of pixel points in Rf by using columns as directions to form a gray level histogram, separating a plurality of electrical elements and circuits in a region through peak values and low values of the histogram, and marking the separated new ROI as sRf; the pixel value of each column of pixel points is a gray value calculated according to the RGB value;
s4: intercepting the height of the separated new ROI area sRf according to the average value of all the row pixels;
s5: filtering out the ROI area which is not an electrical element and a circuit;
then, thermal imaging pictures of all the electrical elements and circuits can be obtained, and the thermal imaging pictures are compared with standard thermal imaging pictures of all the electrical elements and circuits which are preset when the electrical elements and circuits work normally, so that whether all the electrical elements and circuits are normal or not can be judged.
2. The method of claim 1, wherein the power module supplies power to each module by way of multiple isolated voltage outputs; the power supply module comprises two first circuit breakers and second circuit breakers with residual current device protection, and the first circuit breakers and the second circuit breakers are mutually connected in parallel.
3. The method of claim 1, wherein the bus voltage detection module comprises a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor and an operational amplifier, wherein one end of the first resistor is connected with a positive bus, and the other end is connected with a non-inverting input end of the operational amplifier; one end of the third resistor is connected with the analog ground, and the other end of the third resistor is connected with the non-inverting input end of the operational amplifier; one end of the second resistor is connected with the negative bus, and the other end of the second resistor is connected with the inverting input end of the operational amplifier; one end of the fourth resistor is connected with the inverting input end of the operational amplifier, and the other end of the fourth resistor is connected with the output end of the operational amplifier; one end of the fifth resistor is connected with the output end of the operational amplifier, and the other end of the fifth resistor is connected with the processor.
4. The method of claim 1, wherein the incoming loop current collection module employs a 5A current transformer and the outgoing loop current collection module employs a 100A/20mA current transformer.
5. The method of claim 1, wherein the communication module is an RS485 communication module.
6. The method according to claim 1, wherein the analysis unit comprises a data processing unit, an alarm unit and a display unit;
the input end of the data processing unit is in communication connection with the output end of the photographing unit, and the output end of the data processing unit is in communication connection with the input end of the alarm unit and the input end of the display unit respectively.
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