CN114018449A - Flexible printed circuit board pressure sensor module and preparation method and application thereof - Google Patents
Flexible printed circuit board pressure sensor module and preparation method and application thereof Download PDFInfo
- Publication number
- CN114018449A CN114018449A CN202111259975.2A CN202111259975A CN114018449A CN 114018449 A CN114018449 A CN 114018449A CN 202111259975 A CN202111259975 A CN 202111259975A CN 114018449 A CN114018449 A CN 114018449A
- Authority
- CN
- China
- Prior art keywords
- sensor module
- printed circuit
- temperature
- flexible
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 239000011540 sensing material Substances 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000000465 moulding Methods 0.000 claims abstract description 3
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000003351 stiffener Substances 0.000 claims 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000003292 glue Substances 0.000 description 3
- 229910052723 transition metal Inorganic materials 0.000 description 3
- -1 transition metal chalcogenide compound Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- NGTSQWJVGHUNSS-UHFFFAOYSA-N bis(sulfanylidene)vanadium Chemical compound S=[V]=S NGTSQWJVGHUNSS-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Structure Of Printed Boards (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention provides a flexible printed circuit board pressure sensor module and a preparation method and application thereof, and relates to the technical field of flexible pressure sensors. The preparation method comprises the following steps: printing: dividing a pressure sensing area on the surface of a flexible substrate, printing a two-dimensional sensitive material in the pressure sensing area, and forming a pressure sensing material layer on the surface of the flexible substrate; and (3) low-temperature packaging: packaging the electronic device on the flexible substrate in a low-temperature packaging manner, wherein the low-temperature packaging temperature is below 200 ℃; and (3) laminating: coating adhesive on the surface of the reinforcing plate, and pressing the reinforcing plate on the pressure sensing material layer; molding: and cutting the appearance to obtain the flexible printed circuit board pressure sensor module. The pressure sensor module of the flexible printed circuit board has the characteristics of flexible film and high sensitivity, and can meet the requirements of flexible electronic equipment or wearable electronic equipment.
Description
Technical Field
The invention relates to the technical field of flexible pressure sensors, in particular to a flexible printed circuit board pressure sensor module and a preparation method and application thereof.
Background
With the rapid development of the mobile internet, people have higher and higher requirements on the demand and functionality of electronic consumer products, and the development and application of flexible electronic equipment and wearable electronic equipment have wide market prospects. Pressure touch sensors are commonly used in electronic products, but are still challenging to apply to flexible electronic devices, which need to be folded or bent during use, and the sensing performance of the sensors may change or degrade due to mechanical pressure and deformation during the bending and folding processes, resulting in poor pressure sensing effect. Therefore, a new pressure sensor module is required to be developed to meet the application requirements of the flexible electronic device.
Disclosure of Invention
Therefore, in order to solve the above problems, it is necessary to provide a method for manufacturing a flexible printed circuit board pressure sensor module, which has the characteristics of flexible film and high sensitivity.
The invention discloses a preparation method of a flexible printed circuit board pressure sensor module, which comprises the following steps:
printing: dividing a pressure sensing area on the surface of a flexible substrate, printing a two-dimensional sensitive material in the pressure sensing area, and forming a pressure sensing material layer on the surface of the flexible substrate;
and (3) low-temperature packaging: packaging the electronic device on the flexible substrate in a low-temperature packaging manner, wherein the low-temperature packaging temperature is below 200 ℃;
and (3) laminating: coating adhesive on the surface of the reinforcing plate, and pressing the reinforcing plate on the pressure sensing material layer;
molding: and cutting the appearance to obtain the flexible printed circuit board pressure sensor module.
In the preparation method, because the resistance value of the two-dimensional sensitive material is obviously changed when the two-dimensional sensitive material is stressed to stretch or contract, and the heat resistance is insufficient, the two-dimensional sensitive material is packaged at a low temperature below 200 ℃, the material is ensured not to be influenced by high temperature, and the prepared flexible printed circuit board pressure sensor module has the advantages of flexible film and high sensitivity, and can meet the requirements of flexible electronic equipment or wearable electronic equipment.
In one embodiment, in the printing step, the two-dimensional sensitive material is an existing pressure sensitive material, for example, a pressure sensitive material whose main raw materials are graphene and a transition metal chalcogenide compound, and the transition metal chalcogenide compound is molybdenum disulfide and/or vanadium disulfide.
In one embodiment, in the printing step, the tolerance of the width and the length of the pressure sensitive material layer during printing meets the requirement of +/-0.05 mm, and the tolerance of the thickness meets the requirement of +0.02/-0.15 mm.
In one embodiment, in the low-temperature encapsulation step, the temperature of the low-temperature encapsulation is 150-200 ℃, the transmission speed of the encapsulation is 2-5m/min, and the encapsulation time is 1-3 min.
In one embodiment, in the pressing step, the pressing pressure is 140-.
The invention also provides a flexible printed circuit board pressure sensor module obtained by the preparation method.
The flexible printed circuit board pressure sensor module has the characteristics of flexible film, high sensitivity and the like.
In one embodiment, the flexible printed circuit board pressure sensor module comprises a flexible substrate, a pressure sensing material layer, an electronic device, a bonding glue and a reinforcing plate, wherein the pressure sensing material layer is laid on a pressure sensing area on the flexible substrate, the electronic device is fixed on the flexible substrate, and the reinforcing plate is bonded and fixed on the pressure sensing material layer through the bonding glue.
The invention also provides application of the flexible printed circuit board pressure sensor module in preparation of flexible electronic equipment or wearable equipment.
Compared with the prior art, the invention has the following beneficial effects:
the preparation method provided by the invention is based on the property of the two-dimensional sensitive material, the two-dimensional sensitive material is packaged at a low temperature of below 200 ℃, the two-dimensional sensitive material is not influenced by high temperature, and the prepared flexible printed circuit board pressure sensor module has the advantages of flexible film and high sensitivity, and can meet the requirements of flexible electronic equipment or wearable electronic equipment.
Drawings
Fig. 1 is a schematic structural diagram of a pressure sensor module in an embodiment.
In the figure, 1, FPC, 2, pressure sensitive material layer, 3, adhesive glue, 4 and steel sheet.
Detailed Description
To facilitate an understanding of the invention, a more complete description of the invention will be given below in terms of preferred embodiments. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1
A flexible printed circuit board pressure sensor module, as shown in FIG. 1, comprises an FPC 1, a pressure sensitive material layer 2, an electronic device (not shown), an adhesive 3 and a steel sheet 4. The pressure sensitive material layer 2 is laid on the pressure sensitive area of the FPC 1, the pressure sensitive material layer 2 has a pressure sensitive function, and electronic devices such as resistors, capacitors, chips, and the like are fixed on the FPC 1. The adhesive 3 is filled on the electronic device and the pressure sensing material layer 2, the steel sheet 4 is attached to the surface of the adhesive 3, and the steel sheet 4 is used for protecting the pressure sensing material layer 2 and the electronic device.
The flexible printed circuit board pressure sensor module is prepared by the following method:
(1) printing two-dimensional sensitive materials
A piece of FPC board is taken, each functional area including a pressure-sensitive area is divided, and the flexible substrate is processed according to the existing common processing method of the flexible substrate.
Printing a two-dimensional sensitive material in a pressure sensitive area of the FPC board, wherein the two-dimensional sensitive material is a commercially available pressure sensitive material containing graphene and transition metal chalcogenide, and forming a pressure sensitive material layer on the surface of the FPC board. When the two-dimensional sensitive material is stretched or contracted under stress, the resistance value of the two-dimensional sensitive material can be obviously changed, so that the pressure sensing effect is achieved. The width tolerance of the pressure sensing area during printing meets +/-0.05 mm, and the thickness of the pressure sensing area meets the tolerance requirement of +0.02/-0.15 mm.
(2) Low-temperature packaging process
Because the two-dimensional sensitive material has relatively poor high temperature resistance, the two-dimensional sensitive material needs to be packaged at a lower temperature, and particularly, electronic devices such as a resistor, a capacitor, a chip and the like are installed on an FPC (flexible printed circuit) board at 180 ℃ so as to realize corresponding functions. The transmission speed during packaging is 2-5m/min, and the packaging time is 1-3 min.
(3) Reinforcing plate for press-fit module
Because the electronic device and the two-dimensional sensitive material are packaged, in order to protect the reliability of the electronic device and the two-dimensional sensitive material, a reinforcing plate (namely a steel plate) is pressed on the reverse side packaged with the device. Specifically, the pressing is carried out at 180 deg.C, the steel plate coated with the adhesive is pressed on the packaged semi-finished product under 150psi, and the peel strength after pressing is more than 1.0N/m2And good binding force is ensured. The steel plate can protect the two-dimensional sensitive material and the electronic device and ensure the sensitivity of the two-dimensional sensitive material and the corresponding function of the electronic device.
(4) Pressure sensor module forming
And cutting the appearance as required to obtain the flexible printed circuit board pressure sensor module.
(5) Functional testing
And (3) carrying out performance test on the formed pressure sensor module, wherein the test items comprise tolerance measurement, a water drop angle test (a water drop angle tester) and a voltage test (a voltage variation tester).
The test results are: the shape tolerance of the pressure sensing material layer is less than +/-0.05 mm; the water drop angle test meets the requirement of 10-60 degrees; the pressure sensitive adhesive test voltage variation value is less than 20 MV.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. A preparation method of a flexible printed circuit board pressure sensor module is characterized by comprising the following steps:
printing: dividing a pressure sensing area on the surface of a flexible substrate, printing a two-dimensional sensitive material in the pressure sensing area, and forming a pressure sensing material layer on the surface of the flexible substrate;
and (3) low-temperature packaging: packaging the electronic device on the flexible substrate in a low-temperature packaging manner, wherein the low-temperature packaging temperature is below 200 ℃;
and (3) laminating: coating adhesive on the surface of the reinforcing plate, and pressing the reinforcing plate on the pressure sensing material layer;
molding: and cutting the appearance to obtain the flexible printed circuit board pressure sensor module.
2. The manufacturing method according to claim 1, wherein in the printing step, the tolerance of the width and the length of the pressure sensitive material layer at the time of printing satisfies the requirement of ± 0.05mm, and the tolerance of the thickness satisfies the requirement of +0.02/-0.15 mm.
3. The method as claimed in claim 1, wherein in the step of low-temperature encapsulation, the temperature of low-temperature encapsulation is 150 ℃ to 200 ℃, the transmission speed of encapsulation is 2-5m/min, and the encapsulation time is 1-3 min.
4. The method as claimed in claim 3, wherein in the pressing step, the pressing pressure is 140-160psi and the pressing temperature is 150-180 ℃.
5. A flexible printed circuit board pressure sensor module obtained by the manufacturing method according to any one of claims 1 to 4.
6. The FPCB pressure sensor module of claim 5, including a flexible substrate, a pressure sensitive material layer, electronics, a bonding adhesive and a stiffener, said pressure sensitive material layer being laid over a pressure sensitive area on the flexible substrate, the electronics being secured to the flexible substrate, the bonding adhesive adhesively securing said stiffener to said pressure sensitive material layer.
7. Use of the flexible printed circuit board pressure sensor module of claim 5 or 6 in the manufacture of a flexible electronic device or a wearable device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111259975.2A CN114018449B (en) | 2021-10-28 | 2021-10-28 | Flexible printed circuit board pressure sensor module, and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111259975.2A CN114018449B (en) | 2021-10-28 | 2021-10-28 | Flexible printed circuit board pressure sensor module, and preparation method and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114018449A true CN114018449A (en) | 2022-02-08 |
| CN114018449B CN114018449B (en) | 2024-05-03 |
Family
ID=80058254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111259975.2A Active CN114018449B (en) | 2021-10-28 | 2021-10-28 | Flexible printed circuit board pressure sensor module, and preparation method and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114018449B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103108499A (en) * | 2013-01-17 | 2013-05-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | Packaging method and packaging device of flexible electronic circuit |
| CN105319241A (en) * | 2014-07-04 | 2016-02-10 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flexible gas-sensitive sensor and making method thereof |
| CN106092386A (en) * | 2016-07-28 | 2016-11-09 | 国网山西省电力公司忻州供电公司 | Pliable pressure sensor |
| CN106197772A (en) * | 2016-07-06 | 2016-12-07 | 无锡格菲电子薄膜科技有限公司 | A kind of pliable pressure sensor and preparation method thereof |
| CN205845026U (en) * | 2016-05-27 | 2016-12-28 | 联想(北京)有限公司 | Pressure sensitive module and electronic equipment |
| CN108267248A (en) * | 2016-12-30 | 2018-07-10 | 香港科技大学深圳研究院 | For monitoring the pliable pressure sensor of physiology signal and its manufacturing method |
| CN108801516A (en) * | 2018-06-14 | 2018-11-13 | 杭州电子科技大学 | A kind of preparation method of large area flexible sensor array |
| CN109945999A (en) * | 2019-03-15 | 2019-06-28 | 电子科技大学 | A kind of preparation method of fexible film pressure sensor |
| CN110068404A (en) * | 2019-05-17 | 2019-07-30 | 深圳市航天新材科技有限公司 | A kind of resistance-type pliable pressure senser element and preparation method thereof, sensor array |
| CN110823085A (en) * | 2019-11-19 | 2020-02-21 | 合肥工业大学 | Flexible strain sensor with regular crack structure and manufacturing method thereof |
| CN112781757A (en) * | 2020-12-26 | 2021-05-11 | 重庆华知光环保科技有限责任公司 | Flexible capacitive pressure sensor based on graphene and preparation method thereof |
| CN214256750U (en) * | 2021-01-12 | 2021-09-21 | 深圳市新宇腾跃电子有限公司 | 5G applied pressure-sensitive FPC structure |
| CN113465796A (en) * | 2021-07-01 | 2021-10-01 | 西北工业大学 | Flexible integrated array pressure sensor and preparation method thereof |
-
2021
- 2021-10-28 CN CN202111259975.2A patent/CN114018449B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103108499A (en) * | 2013-01-17 | 2013-05-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | Packaging method and packaging device of flexible electronic circuit |
| CN105319241A (en) * | 2014-07-04 | 2016-02-10 | 中国科学院苏州纳米技术与纳米仿生研究所 | Flexible gas-sensitive sensor and making method thereof |
| CN205845026U (en) * | 2016-05-27 | 2016-12-28 | 联想(北京)有限公司 | Pressure sensitive module and electronic equipment |
| CN106197772A (en) * | 2016-07-06 | 2016-12-07 | 无锡格菲电子薄膜科技有限公司 | A kind of pliable pressure sensor and preparation method thereof |
| CN106092386A (en) * | 2016-07-28 | 2016-11-09 | 国网山西省电力公司忻州供电公司 | Pliable pressure sensor |
| CN108267248A (en) * | 2016-12-30 | 2018-07-10 | 香港科技大学深圳研究院 | For monitoring the pliable pressure sensor of physiology signal and its manufacturing method |
| CN108801516A (en) * | 2018-06-14 | 2018-11-13 | 杭州电子科技大学 | A kind of preparation method of large area flexible sensor array |
| CN109945999A (en) * | 2019-03-15 | 2019-06-28 | 电子科技大学 | A kind of preparation method of fexible film pressure sensor |
| CN110068404A (en) * | 2019-05-17 | 2019-07-30 | 深圳市航天新材科技有限公司 | A kind of resistance-type pliable pressure senser element and preparation method thereof, sensor array |
| CN110823085A (en) * | 2019-11-19 | 2020-02-21 | 合肥工业大学 | Flexible strain sensor with regular crack structure and manufacturing method thereof |
| CN112781757A (en) * | 2020-12-26 | 2021-05-11 | 重庆华知光环保科技有限责任公司 | Flexible capacitive pressure sensor based on graphene and preparation method thereof |
| CN214256750U (en) * | 2021-01-12 | 2021-09-21 | 深圳市新宇腾跃电子有限公司 | 5G applied pressure-sensitive FPC structure |
| CN113465796A (en) * | 2021-07-01 | 2021-10-01 | 西北工业大学 | Flexible integrated array pressure sensor and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114018449B (en) | 2024-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Van Den Brand et al. | Flexible and stretchable electronics for wearable health devices | |
| Briand et al. | Why going towards plastic and flexible sensors? | |
| JP5013114B2 (en) | Electrical device, connection method and adhesive film | |
| JP5111071B2 (en) | Piezoelectric sensor | |
| WO2015158952A1 (en) | An apparatus and method for sensing | |
| US20180321092A1 (en) | Digital sensor | |
| US20230141257A1 (en) | Strain sensing film, pressure sensor and strain sensing system | |
| EP3922086A1 (en) | Adhesive circuit patterning process | |
| US20220330433A1 (en) | Electronic component on flexible substrate | |
| CN111998976B (en) | Pressure sensor and electronic device | |
| CN114018449B (en) | Flexible printed circuit board pressure sensor module, and preparation method and application thereof | |
| Zulfiqar et al. | Tunable and foldable paper-based passive electronic components and filter circuits | |
| CN112930378B (en) | Electromagnetic wave shielding film, method for manufacturing electromagnetic wave shielding film, and method for manufacturing shielded printed wiring board | |
| Salo et al. | Enhanced stretchable electronics made by fused-filament fabrication | |
| CN102137542A (en) | Flexible substrate and manufacturing method thereof | |
| TWI728345B (en) | Flexible sensor | |
| Frisk et al. | Effect of substrate material and thickness on reliability of ACA bonded flip chip joints | |
| CN201422195Y (en) | Protective film for rigid-flexible printed circuit boards | |
| CN202401010U (en) | Anti-solder tape | |
| CN220606110U (en) | Heating plate of film type integrated temperature sensor | |
| Ronay et al. | Construction and Testing of a Functional Multilayer Demonstration Circuit Made with Gallium Indium Tin Metal Gel and Non-Silicone Stretchable Thermosetting Film | |
| TWI732662B (en) | A positioning laminated structure | |
| CN216860887U (en) | Thickening type metal foil laminated plate manufacturing equipment | |
| CN210405762U (en) | Hole sealing glue-blocking film applied to circuit board production | |
| WO2022092206A1 (en) | Strain sensor module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |