CN114018411A - Surface-mounted pyroelectric infrared sensor - Google Patents
Surface-mounted pyroelectric infrared sensor Download PDFInfo
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- CN114018411A CN114018411A CN202111290907.2A CN202111290907A CN114018411A CN 114018411 A CN114018411 A CN 114018411A CN 202111290907 A CN202111290907 A CN 202111290907A CN 114018411 A CN114018411 A CN 114018411A
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- 239000002184 metal Substances 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 238000007789 sealing Methods 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 229920000297 Rayon Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 6
- 239000007769 metal material Substances 0.000 abstract description 5
- 230000001629 suppression Effects 0.000 abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001465754 Metazoa Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/046—Materials; Selection of thermal materials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J2005/065—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by shielding
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- Physics & Mathematics (AREA)
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- Spectroscopy & Molecular Physics (AREA)
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention relates to a surface-mounted pyroelectric infrared sensor which comprises a box-shaped shell, wherein a shielding mechanism is arranged inside the box-shaped shell, an internal element is arranged inside the shielding mechanism, the shielding mechanism comprises a bottom plate fixedly arranged on the inner bottom wall of the box-shaped shell and a side plate fixedly arranged on the inner side wall of the box-shaped shell, the internal element comprises a grounding pin fixedly arranged inside the shielding mechanism and extending to the outside of the box-shaped shell, a metal pin extending to the outside of the box-shaped shell is fixedly arranged inside the box-shaped shell, and a signal processing circuit board fixedly connected with the metal pin is fixedly arranged on the bottom wall of the box-shaped shell. The surface-mounted pyroelectric infrared sensor adopts seamless packaging of the box-shaped shell and the infrared filter of the optical filter, and the bottom plate and the side plate which are made of metal materials are arranged inside the box-shaped shell and are matched and sealed, so that the electromagnetic interference suppression capability of a product can be obviously improved, and the signal-to-noise ratio of the sensor is improved.
Description
Technical Field
The invention relates to the technical field of pyroelectric infrared sensors, in particular to a surface-mounted pyroelectric infrared sensor.
Background
The pyroelectric infrared sensor is a thermosensitive sensor which induces a thermal signal emitted by a human body or an animal with the temperature close to the temperature of the human body through an infrared sensitive element, conducts the thermal signal, filters the thermal signal through a signal processing circuit, amplifies the thermal signal and converts the thermal signal into a weak electrical signal.
At present, the traditional pyroelectric infrared sensor on the market has two defects, one is that the substrate packaging process adopted by the traditional pyroelectric infrared sensor is complex and has poor flexibility, and the subsequent integration of chips with other functions is inconvenient, and the other is that the sealing property and the reliability between the substrate and the base of the traditional pyroelectric infrared sensor are poor, so that the resistance to external interference is weak, and the reliability of the pyroelectric infrared sensor is poor, so that the invention provides the surface-mounted pyroelectric infrared sensor.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides the surface-mounted pyroelectric infrared sensor which has the advantages of low packaging cost, high flexibility, high sealing property and reliability and the like, and solves the problems of the existing equipment.
In order to realize the purposes of low packaging cost, high flexibility and high sealing performance and reliability, the invention provides the following technical scheme: the utility model provides a subsides dress pyroelectric infrared sensor, includes the box shell, the inside of box shell is provided with shielding mechanism for realize shielding effect to external disturbance, shielding mechanism's inside is provided with the inner member, shielding mechanism includes the bottom plate of fixed mounting diapire in the box shell and the curb plate of fixed mounting at the box shell inside wall, the inner member includes that fixed mounting is inside and extends to the outside ground connection foot position of box shell at shielding mechanism, the inside fixed mounting of box shell has the metal foot position that extends to the box shell outside, the diapire fixed mounting of box shell has the signal processing circuit board with metal foot position fixed connection, the side fixed mounting of signal processing circuit board has infrared sensing element.
Further, the box-type shell is a cube, a step groove is formed in the inner wall of the box-type shell, a sealing plate is fixedly mounted at the top of the step groove, and an infrared filter is fixedly mounted on the surface of the step groove.
Further, the step groove is rectangular and annular, the length and the width of the step groove are respectively equal to those of the infrared filter, the depth of the step groove is equal to that of the infrared filter, the inner wall of the box-type shell is positioned on the periphery of the step groove and provided with error-accommodating grooves, and the overlooking shape of each error-accommodating groove is arc-shaped.
Further, the front and the back of box shell just are close to the diapire of box shell and offer the export groove that corresponds with the metal foot position, and the logical groove that corresponds with the ground connection foot position is all seted up to the left and right sides of box shell.
Furthermore, the four side edges of the box-type shell are provided with clamping grooves, the height of each clamping groove is half of that of the box-type shell, and the overlooking shapes of the clamping grooves are in a shape like a Chinese character 'tu'.
Further, the box shell is made of resin materials, the bottom plate and the side plates are made of metal sheets and are rectangular, two notches are formed in the surface of the bottom plate, and the top of the side of the box shell is provided with an identification position.
Furthermore, the number of the grounding pin positions is two, the two grounding pin positions respectively protrude from the left side and the right side of the box-shaped shell, the number of the metal pin positions is eight, the eight metal pin positions are equally divided into two groups, and the two groups of metal pin positions respectively protrude from the front side or the back side of the box-shaped shell.
Furthermore, the grounding pin, the metal pin, the signal processing circuit board, the infrared sensitive element and the infrared filter are electrically connected.
Furthermore, the signal processing circuit board is a digital intelligent control circuit chip, and a signal amplifying circuit, an analog-to-digital conversion circuit, a low-pass/high-pass filter circuit, a state control circuit and a signal output unit are integrated in the signal processing circuit board.
Furthermore, the signal processing circuit board is an MCU signal processing circuit, an input signal input circuit, an ADC, a digital band-pass filter, an MCU microprocessor and an interface circuit are integrated in the MCU signal processing circuit, and the infrared filter is fixedly connected with the sealing plate through viscose.
Compared with the prior art, the invention provides a surface-mounted pyroelectric infrared sensor, which has the following beneficial effects:
the surface-mounted pyroelectric infrared sensor adopts seamless packaging of the box-shaped shell and the infrared filter of the optical filter, and the bottom plate and the side plate which are made of metal materials are arranged inside the box-shaped shell to be matched and sealed, so that the electromagnetic interference suppression capability of a product can be obviously improved, and the signal-to-noise ratio of the sensor is improved.
Drawings
FIG. 1 is a schematic disassembled view of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic circuit diagram of the present invention;
FIG. 4 is a disassembled view of the embodiment of the present invention.
In the figure: 10 shells, 11 step grooves, 12 sealing plates, 13 fault-tolerant grooves, 14 outlet grooves, 15 through grooves, 16 clamping grooves, 20 grounding pins, 21 metal pins, 22 signal processing circuit boards, 23 infrared sensitive elements, 30 bottom plates, 301 notches, 31 side plates and 32 infrared filters.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, a surface-mounted pyroelectric infrared sensor comprises a box-shaped housing 10, a shielding mechanism is disposed inside the box-shaped housing 10 for shielding external interference, an internal component is disposed inside the shielding mechanism, the shielding mechanism comprises a bottom plate 30 fixedly mounted on the inner bottom wall of the box-shaped housing 10 and a side plate 31 fixedly mounted on the inner side wall of the box-shaped housing 10, the internal component comprises a grounding pin 20 fixedly mounted inside the shielding mechanism and extending to the outside of the box-shaped housing 10, a metal pin 21 extending to the outside of the box-shaped housing 10 is fixedly mounted inside the box-shaped housing 10, a signal processing circuit board 22 fixedly connected with the metal pin 21 is fixedly mounted on the bottom wall of the box-shaped housing 10, the signal processing circuit board 22 is a digital intelligent control circuit chip or an MCU signal processing circuit, the signal processing circuit board 22 is fixed on the bottom surface of the box body through COB or SOP packaging mode, an infrared sensitive element 23 is fixedly arranged on the side edge of the signal processing circuit board 22.
In this embodiment, the box-type housing 10 is a cube, the step groove 11 has been seted up to the inner wall of box-type housing 10, the top fixed mounting of step groove 11 has sealing plate 12, the fixed surface mounting of step groove 11 has infrared filter 32, infrared filter 32 is fixed on the box-type housing surface through modes such as viscose or paster, infrared filter 32 forms a confined electromagnetic shield space with bottom plate 30 and the curb plate 31 of the metal material of box-type housing 10 inner wall, bottom plate 30, curb plate 31 realize the shielding effect with the interference of infrared filter 32 electrically conductive intercommunication back to the external environment.
In this embodiment, the stepped groove 11 is a rectangular ring, the length and the width of the stepped groove 11 are respectively equal to those of the infrared filter 32, the depth of the stepped groove 11 is equal to that of the infrared filter 32, the error-accommodating grooves 13 are formed in the inner wall of the box-shaped case 10 and around the stepped groove 11, the error-accommodating grooves 13 are arc-shaped in plan view, and the infrared filter 32 can be more easily butted into the box-shaped case 10 through the error-accommodating grooves 13.
In this embodiment, the front and back of the box-shaped casing 10 and the bottom wall close to the box-shaped casing 10 are provided with outlet grooves 14 corresponding to the metal feet 21, the left and right sides of the box-shaped casing 10 are provided with through grooves 15 corresponding to the grounding feet 20, four sides of the box-shaped casing 10 are provided with clamping grooves 16, the height of each clamping groove 16 is half of the height of the box-shaped casing 10, and the overlooking shape of each clamping groove 16 is a 'convex' shape.
In this embodiment, the box-shaped casing 10 is made of resin material, the bottom plate 30 and the side plate 31 are both made of metal sheets, the bottom plate 30 and the side plate 31 are both rectangular, two notches 301 are formed in the surface of the bottom plate 30, the top of the side of the box-shaped casing 10 is provided with an identification position, and the signal processing circuit board 22 and the infrared sensitive element 23 respectively extend to the bottom wall of the box-shaped casing 10 through the two notches 301.
In this embodiment, the number of the grounding pins 20 is four, four grounding pins 20 respectively protrude from the left and right sides of the box-shaped shell 10, the number of the metal pins 21 is six, six metal pins 21 are equally divided into two groups, and two groups of metal pins 21 respectively protrude from the front or the back of the box-shaped shell 10.
In this embodiment, the grounding pin 20, the metal pin 21, the signal processing circuit board 22, the infrared sensor 23, and the infrared filter 32 are electrically connected.
In this embodiment, the signal processing circuit board 22 is a digital intelligent control circuit chip, a signal amplifying circuit, an analog-to-digital conversion circuit, a low-pass/high-pass filter circuit, a state control circuit and a signal output unit are integrated inside the signal processing circuit board 22, the signal processing circuit board 22 is an MCU signal processing circuit, an input signal input circuit, an ADC, a digital band-pass filter, an MCU microprocessor and an interface circuit are integrated inside the MCU signal processing circuit, and the infrared filter 32 is fixedly connected to the sealing plate 12 through an adhesive.
In the present embodiment, when in use, the box-shaped case 10 and the filter infrared filter 32 are seamlessly packaged, and the bottom plate 30 and the side plate 31 made of metal materials are installed inside the box-shaped case 10, so that they are matched and sealed, thereby significantly improving the electromagnetic interference suppression capability of the product and increasing the signal-to-noise ratio of the sensor, and in addition, the signal processing circuit board 22 is installed on the bottom wall of the box-shaped case 10, so that it becomes a surface circuit design, and it is possible to easily integrate the multifunctional processing chip into the device.
The beneficial effects of the above embodiment are as follows: the surface-mounted pyroelectric infrared sensor adopts seamless packaging of the box-shaped shell 10 and the optical filter infrared filter 32, and the bottom plate 30 and the side plate 31 which are made of metal materials are installed inside the box-shaped shell 10 and are matched and sealed, so that the electromagnetic interference suppression capability of a product can be obviously improved, and the signal to noise ratio of the sensor is improved. It should be noted that the surface-mounted pyroelectric infrared sensor is also suitable for application of analog chips and analog-to-digital conversion chips.
The electrical components shown herein are electrically connected to a main controller and a power supply, the main controller can be a conventional known device controlled by a computer, and the conventional power connection technology disclosed in the prior art is not described in detail herein.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a paste dress pyroelectric infrared sensor, includes box shell (10), its characterized in that: a shielding mechanism is arranged inside the box-type shell (10) and used for shielding external interference, and an internal element is arranged inside the shielding mechanism;
the shielding mechanism comprises a bottom plate (30) fixedly arranged on the inner bottom wall of the box-type shell (10) and a side plate (31) fixedly arranged on the inner side wall of the box-type shell (10);
the inner element comprises a grounding pin (20) which is fixedly installed inside the shielding mechanism and extends to the outside of the box-type shell (10), a metal pin (21) which extends to the outside of the box-type shell (10) is fixedly installed inside the box-type shell (10), a signal processing circuit board (22) which is fixedly connected with the metal pin (21) is fixedly installed on the bottom wall of the box-type shell (10), and an infrared sensitive element (23) is fixedly installed on the side edge of the signal processing circuit board (22).
2. The pyroelectric infrared sensor as set forth in claim 1, wherein: the box-type shell (10) is a cube, a step groove (11) is formed in the inner wall of the box-type shell (10), a sealing plate (12) is fixedly mounted at the top of the step groove (11), and an infrared filter (32) is fixedly mounted on the surface of the step groove (11).
3. A surface mount pyroelectric infrared sensor as recited in claim 2, wherein: the box-type infrared filter box is characterized in that the step groove (11) is rectangular and annular, the length and the width of the step groove (11) are respectively equal to the length and the width of the infrared filter (32), the depth of the step groove (11) is equal to the thickness of the infrared filter (32), the inner wall of the box-type shell (10) is positioned on the periphery of the step groove (11) and is provided with fault-tolerant grooves (13), and the overlooking shape of each fault-tolerant groove (13) is arc-shaped.
4. A surface mount pyroelectric infrared sensor as recited in claim 3, wherein: the front and the back of the box-type shell (10) and the bottom wall close to the box-type shell (10) are provided with outlet grooves (14) corresponding to the metal foot positions (21), and the left side and the right side of the box-type shell (10) are provided with through grooves (15) corresponding to the grounding foot positions (20).
5. The pyroelectric infrared sensor as set forth in claim 4, wherein: the four sides of the box-shaped shell (10) are provided with clamping grooves (16), the height of each clamping groove (16) is half of the height of the box-shaped shell (10), and the overlooking shape of each clamping groove (16) is in a shape of a Chinese character 'tu'.
6. The pyroelectric infrared sensor as set forth in claim 5, wherein: the box-type shell (10) is made of resin materials, the bottom plate (30) and the side plates (31) are both metal sheets, the bottom plate (30) and the side plates (31) are both rectangular, two notches (301) are formed in the surface of the bottom plate (30), and identification positions are formed in the tops of the sides of the box-type shell (10).
7. The pyroelectric infrared sensor as set forth in claim 6, wherein: the number of the grounding pin positions (20) is four, the four grounding pin positions (20) respectively protrude from the left side and the right side of the box-shaped shell (10), the number of the metal pin positions (21) is six, the six metal pin positions (21) are equally divided into two groups, and the two groups of metal pin positions (21) respectively protrude from the front side or the back side of the box-shaped shell (10).
8. The pyroelectric infrared sensor as set forth in claim 7, wherein: the grounding pin (20), the metal pin (21), the signal processing circuit board (22), the infrared sensitive element (23) and the infrared filter (32) are electrically connected.
9. The pyroelectric infrared sensor as set forth in claim 8, wherein: the signal processing circuit board (22) is a digital intelligent control circuit chip, and a signal amplifying circuit, an analog-to-digital conversion circuit, a low-pass/high-pass filter circuit, a state control circuit and a signal output unit are integrated in the signal processing circuit board (22).
10. A surface mount pyroelectric infrared sensor as recited in claim 9, wherein: the signal processing circuit board (22) is an MCU signal processing circuit, an input signal input circuit, an ADC, a digital band-pass filter, an MCU microprocessor and an interface circuit are integrated in the MCU signal processing circuit, and the infrared filter (32) is fixedly connected with the sealing plate (12) through viscose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111290907.2A CN114018411A (en) | 2021-11-02 | 2021-11-02 | Surface-mounted pyroelectric infrared sensor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111290907.2A CN114018411A (en) | 2021-11-02 | 2021-11-02 | Surface-mounted pyroelectric infrared sensor |
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| CN114018411A true CN114018411A (en) | 2022-02-08 |
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| CN202111290907.2A Pending CN114018411A (en) | 2021-11-02 | 2021-11-02 | Surface-mounted pyroelectric infrared sensor |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040178344A1 (en) * | 2002-06-25 | 2004-09-16 | Ryo Taniguchi | Infrared sensor package |
| CN204405192U (en) * | 2014-12-19 | 2015-06-17 | 南阳森霸光电股份有限公司 | SMD intelligent pyroelectric infrared sensor |
| CN208270088U (en) * | 2018-05-16 | 2018-12-21 | 森霸传感科技股份有限公司 | A kind of attachment numeric type pyroelectric infrared sensor |
| CN208505478U (en) * | 2018-05-16 | 2019-02-15 | 森霸传感科技股份有限公司 | A kind of mounted type pyroelectric infrared sensor |
| CN210221305U (en) * | 2019-07-31 | 2020-03-31 | 森霸传感科技股份有限公司 | Paster type pyroelectric infrared sensor |
-
2021
- 2021-11-02 CN CN202111290907.2A patent/CN114018411A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040178344A1 (en) * | 2002-06-25 | 2004-09-16 | Ryo Taniguchi | Infrared sensor package |
| CN204405192U (en) * | 2014-12-19 | 2015-06-17 | 南阳森霸光电股份有限公司 | SMD intelligent pyroelectric infrared sensor |
| CN208270088U (en) * | 2018-05-16 | 2018-12-21 | 森霸传感科技股份有限公司 | A kind of attachment numeric type pyroelectric infrared sensor |
| CN208505478U (en) * | 2018-05-16 | 2019-02-15 | 森霸传感科技股份有限公司 | A kind of mounted type pyroelectric infrared sensor |
| CN210221305U (en) * | 2019-07-31 | 2020-03-31 | 森霸传感科技股份有限公司 | Paster type pyroelectric infrared sensor |
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Application publication date: 20220208 |