CN114007328A - Circuit board assembly and electronic device - Google Patents

Abstract

The application provides a circuit board assembly and electronic equipment, this circuit board assembly includes: a first circuit board; a second circuit board stacked with the first circuit board; the first end of any first pin in the first pins is electrically connected with the first circuit board, and the first pins are arranged in at least one row; the first groove body is arranged on the surface of the second circuit board facing the first circuit board, and the second ends of the first pins are inserted into the first groove body and electrically connected with the second circuit board.

Description

Circuit board assembly and electronic device

Technical Field

The application relates to the technical field of semiconductors, in particular to a circuit board assembly and electronic equipment.

Background

With the continuous development of electronic equipment, the function of the electronic equipment needs to be gradually improved by users, and in order to meet the function requirements, the number of functional devices needing to be distributed on a circuit board is more and more.

In the related art, in order to lay out more functional devices on a circuit board assembly, circuit boards are generally stacked to make full use of the space in the thickness direction of the circuit board assembly. However, after the circuit boards are stacked, the thickness of the circuit board assembly is increased, and thus the thickness of the electronic device using the circuit board assembly is correspondingly increased, which cannot meet the increasingly thinner design requirement of the electronic device.

Disclosure of Invention

The present application is directed to solving one of the technical problems of the prior art or the related art.

The application aims at providing a circuit board assembly and electronic equipment, when solving the circuit board at least and piling up the setting, the problem that the circuit board assembly thickness that leads to increases.

In a first aspect, an embodiment of the present application provides a circuit board assembly, including: the first circuit board, second circuit board, a plurality of first pins and set up the first cell body on the second circuit board. The first circuit board and the second circuit board are arranged in a stacked mode, the first end of any one of the first pins is electrically connected with the first circuit board, and the first pins are arranged in at least one row; the first groove body is arranged on the surface of the second circuit board facing the first circuit board, and the second ends of the first pins are inserted into the first groove body and electrically connected with the second circuit board.

In a second aspect, an embodiment of the present application provides an electronic device, including: such as the circuit board assembly of the first aspect.

In an embodiment of the present application, a circuit board assembly includes a first circuit board, a second circuit board, a plurality of first pins, and a first slot. The first circuit board and the second circuit board are arranged oppositely and in a stacked mode, an accommodating space is formed after the first circuit board and the second circuit board are buckled, the first pins are located in the accommodating space, the first end of any one of the first pins is electrically connected with the first circuit board, the second end of any one of the first pins is electrically connected with the second circuit board through the first groove body, and the first pins are arranged in at least one row. The first ends of the first pins are electrically connected with the first circuit board, the second ends of the first pins are inserted into the first groove body of the second circuit board, on one hand, the electric connection function between the first circuit board and the second circuit board is realized through the first pins, and further, functional devices electrically connected with the first circuit board are connected with the second circuit board through the first pins to realize the transmission of electric signals, on the other hand, the second ends of the first pins are inserted into the second circuit board through the first groove body and are electrically connected with the second circuit board, so that a connector base body used for electrically connecting the first circuit board and the second circuit board in the prior art is omitted, the integral thickness of the circuit board assembly is reduced, and the thinning requirement of electronic equipment using the circuit board assembly is met. Under the condition that the first circuit board is buckled on the second circuit board, namely under the condition that the first pins are inserted into the first groove body, the side parts of the first pins are supported by the first groove body, and the contact reliability of the first pins and the second circuit board can be further improved.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a first supporting seat in a circuit board assembly according to an embodiment of the present disclosure;

fig. 3 is a second schematic structural diagram of a circuit board assembly according to an embodiment of the present disclosure;

fig. 4 is a third schematic structural diagram of a circuit board assembly according to an embodiment of the present application;

fig. 5 is a fourth schematic structural diagram of a circuit board assembly according to an embodiment of the present application;

fig. 6 is a fifth schematic structural diagram of a circuit board assembly according to an embodiment of the present application;

fig. 7 is a sixth schematic structural view of a circuit board assembly according to an embodiment of the present application;

fig. 8 is a second schematic structural view of a first supporting seat in a circuit board assembly according to an embodiment of the present disclosure;

fig. 9 is a schematic structural diagram of a second support base in a circuit board assembly according to an embodiment of the present disclosure;

fig. 10 is a second schematic structural view of a second support base in the circuit board assembly according to the present disclosure;

fig. 11 is a seventh schematic structural diagram of a circuit board assembly according to an embodiment of the present application;

fig. 12 is an eighth schematic structural diagram of a circuit board assembly according to an embodiment of the present application;

fig. 13 is a third schematic structural view illustrating a second support seat in a circuit board assembly according to an embodiment of the present disclosure;

wherein, the correspondence between the reference numbers and the component names in fig. 1 to 13 is:

10 a first circuit board, 20 a second circuit board, 301 a first pin; 302 second pin, 303 third pin, 401 first trough body, 402 first metal layer, 403 shrapnel, 50 first supporting seat, 60 second supporting seat, 601 second trough body, 90 supporting plate and 100 circuit board assembly.

Detailed Description

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

In the embodiments of the present application, words such as "exemplary" or "for example" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

The circuit board assembly 100 provided by the embodiment of the application can be applied to electronic equipment, and particularly, can be applied to a scene that the circuit board assembly 100 formed by laminating at least two circuit boards is arranged in the electronic equipment.

In the related art, in a scene where two circuit boards are stacked, the two circuit boards may be connected by a Board To Board (BTB) connector, where one of the circuit boards may be a circuit Board electrically connected to a display screen, a camera, and other functional devices, and the other circuit Board may be a motherboard. The BTB connector is generally connected by inserting a male socket and a female socket, and the male socket and the female socket have a certain thickness, so that the thickness of the circuit board assembly stacked cannot be effectively reduced.

The circuit board assembly 100 and the electronic device provided in the embodiments of the present application are described in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.

Fig. 1 shows a schematic diagram of a possible structure of a circuit board assembly 100 provided in an embodiment of the present application, and as shown in fig. 1, the circuit board assembly 100 includes a first circuit board 10, a second circuit board 20, a plurality of first pins 301, and a first slot 401 opened on the second circuit board 20. The first circuit board 10 and the second circuit board 20 are oppositely and stacked, the first circuit board 10 and the second circuit board 20 form an accommodating space after being buckled, the plurality of first pins 301 are located in the accommodating space, a first end of any one of the plurality of first pins 301 is electrically connected with the first circuit board 10, a second end of any one of the plurality of first pins 301 is electrically connected with the second circuit board 20 through the first groove body 401, and the plurality of first pins 301 are arranged in at least one row.

Specifically, the first circuit board 10 and the second circuit board 20 may be stacked and disposed oppositely, an accommodating space is formed between the first circuit board 10 and the second circuit board 20, the plurality of first pins 301 are disposed in the accommodating space, a first end of each first pin 301 of the plurality of first pins 301 is electrically connected to the first circuit board 10, and a second end of each first pin 301 is electrically connected to the second circuit board 20 through the first slot 401, so that functional devices (e.g., a camera module, a speaker module, and a microphone module) electrically connected to the first circuit board 10 are electrically connected to the second circuit board 20 through the first pins 301, and further, transmission of electrical signals is completed.

For example, the first Circuit Board 10 may be a PCB (Printed Circuit Board), and the second Circuit Board 20 may be a FPC (Flexible Printed Circuit).

Understandably, the plurality of first pins 301 are arranged in at least one row, the plurality of first pins 301 in the one row are arranged to extend along the length direction of the circuit board assembly 100, and the front and rear rows of the plurality of rows of first pins 301 are arranged along the width direction of the circuit board assembly 100. Specifically, the plurality of first pins 301 may be a row of first pins 301, the row of first pins 301 includes the plurality of first pins 301, the plurality of first pins 301 may also include a plurality of rows of first pins 301, and each row of first pins 301 includes the plurality of first pins 301.

It should be noted that, in the case that the plurality of first pins 301 are arranged in multiple rows, the space in the width direction of the circuit board assembly 100 can be more fully utilized, and the number of the first pins 301 is increased without lengthening the circuit board assembly 100, so that the number of functional devices that can be electrically connected to the first pins 301 is increased, and the functionality of the circuit board assembly 100 is improved.

Illustratively, as shown in fig. 1 to 4, the direction along the arrow in fig. 1 is the width direction of the circuit board assembly 100. In this direction, two rows of first pins 301 are disposed between the first circuit board 10 and the second circuit board 20. Therefore, the space in the width direction of the circuit board assembly 100 is fully utilized, and under the condition that the length of the circuit board assembly 100 is not changed, a greater number of first pins 301 are distributed, so that the circuit board assembly 100 is ensured to support more functional devices to work. Since the length of the circuit board assembly 100 does not need to be further increased, and the width of the electronic device provided with the circuit board assembly 100 does not need to be further widened (the length direction of the circuit board assembly 100 is the same as the width direction of the electronic device), the electronic device has good grip.

Specifically, the first pin 301 may be a metal part, and the metal part can ensure stable impedance and can stably transmit an electrical signal.

For example, the first slot 401 may be disposed on the second circuit board 20, and the first slot 401 may process the second circuit board 20 through a Cavity (partial recess) process to remove a portion of the substrate on the second circuit board 20 to obtain the first slot 401. In this way, the base (generally, the female base disposed on the PCB, which can be understood as omitting the female base on the second circuit board 20) in the connector for connecting two circuit boards in the related art can be omitted, so as to reduce the overall thickness of the circuit board assembly 100.

It can be understood that the first slot 401 is opened on the surface of the second circuit board 20 facing the first circuit board 10, and since a part of the first pin 301 extends into the first slot 401, the thickness between the first circuit board 10 and the second circuit board 20 can be further reduced without the connector housing.

It should be noted that, under the condition that the first circuit board 10 is fastened to the second circuit board 20, that is, under the condition that the first pin 301 is inserted into the first slot 401, the side portion of the first pin 301 is supported by the first slot 401, that is, the first slot 401 not only can enable the first pin 301 to be electrically connected with the second circuit board, but also can structurally support the first pin 301, so as to improve the contact reliability between the first pin 301 and the second circuit board 20.

Further alternatively, the first circuit board may also be provided with a groove or an avoiding section, and thus, the first end of the first pin 301 may also be electrically connected to the first circuit board 10 through the groove or the avoiding section, so that a seat (generally, a male seat is disposed on the FPC board, and here, it may be understood that the male seat on the first circuit board 10 is omitted) in a connector connecting the first circuit board 10 and the second circuit board 20 in the related art can be further omitted.

Further alternatively, the first pin 301 may be directly soldered to the first circuit board 10 by a solder having a conductive property. Specifically, the solder may be a tin bead. In the circuit board assembly 100 provided in the embodiment of the present application, the first ends of the first pins 301 are electrically connected to the first circuit board 10, and the second ends of the first pins 301 are electrically connected to the second circuit board 20 through the first slot 401, so that on one hand, the first pins 301 achieve the electrical connection function between the first circuit board 10 and the second circuit board 20, thereby allowing the functional device electrically connected to the first circuit board 10 to be connected to the second circuit board 20 through the first pin 301 to thereby realize transmission of an electrical signal, and on the other hand, since the second end of the first pin 301 is connected to the second circuit board 20 through the first slot 401, a connector seat for electrically connecting the first circuit board 10 and the second circuit board 20 in the prior art is omitted, the overall thickness of the circuit board assembly 100 is reduced, and the thinning requirement of the electronic device using the circuit board assembly 100 is met. Further, multiple rows of first pins 301 may be further disposed along the width direction of the circuit board assembly 100, so as to ensure that the circuit board assembly 100 is laid out with a greater number of first pins 301 while the length of the circuit board assembly 100 remains unchanged, and ensure that the circuit board assembly 100 can support more functional devices to operate.

Optionally, the circuit board assembly 100 provided in the embodiment of the present application further includes a first metal layer 402. The first metal layer 402 is disposed on the inner surface of the first groove 401 between the first lead 301 and the first groove 401.

Specifically, the first slot 401 may include a first slot 401 opened on the second circuit board 20, and a first metal layer 402 disposed in the first slot 401, where the first metal layer 402 is used for contacting and electrically connecting with the first pin 301, and thus, the first pin 301 is electrically connected with the second circuit board 20 through the first slot 401 and realizes signal transmission.

Further, in order to ensure stability of the electrical connection, the first metal layer 402 may be a noble metal layer, and the first metal layer 402 may be a copper plating layer.

In this way, the first metal layer 402 is disposed in the first groove 401, so that the stability of the electrical connection between the first pin 301 and the second circuit board 20 is improved, and therefore, the electronic device provided with the circuit board assembly 100 has more stable performance and longer service life.

Optionally, the first grooves 401 in the circuit board assembly 100 provided in this embodiment of the application are arranged in at least one row, and the number and the arrangement manner of the first grooves 401 are the same as those of the plurality of first pins 301.

Illustratively, as shown in fig. 3, the plurality of first pins 301 are arranged in two rows in the width direction of the circuit board assembly 100, and correspondingly, the first slots 401 for connecting each row of first pins 301 to the second circuit board 20 are also arranged in two rows.

It can be understood that not only the number of rows of the first pins 301 is equal to the number of rows of the first grooves 401, but also the arrangement of the first pins 301 and the first grooves 401 is the same, that is, when the first pins 301 are in a row, the length of the first grooves 401 is the same as the length of the first pins 301 in the row; in the case where the first pins 301 are arranged in a plurality of rows, the pitch between the first pins 301 in each row is the same as the pitch between the first grooves 401 in each row.

Therefore, the first groove 401 and the first pins 301 are correspondingly arranged, so that each row of the first pins 301 can be ensured to be in contact with the corresponding first groove 401, each row of the first pins 301 can be ensured to be electrically connected with the second circuit board 20, and the stability of electrical connection is maintained.

Optionally, the circuit board assembly 100 in the embodiment of the present application further includes a first supporting seat 50, the first supporting seat 50 is disposed on a surface of the first circuit board 10 opposite to the second circuit board 20, and at least a portion of the first pin 301 is disposed on the first supporting seat 50.

Specifically, the first supporting seat 50 may be disposed on a surface of the first circuit board 10 opposite to the second circuit board 20, for providing structural support for the first pin 301 electrically connected to the first circuit board 10.

For example, as shown in fig. 1 to 4, the first supporting seat 50 may be configured in a plate shape, and a plurality of narrow first receiving grooves may be formed in the first supporting seat 50, each of the first receiving grooves being configured to receive at least a portion of one of the first leads 301, so as to structurally support the plurality of first leads 301, so that the first leads 301 are stably and electrically connected to the first circuit board 10.

It can be understood that after the plurality of first pins 301 are fixed on the first supporting seat 50, and then the first supporting seat 50 is welded or screwed on the first circuit board 10, the plurality of first pins 301 can be aligned to the preset positions of the first circuit board 10 where the welding parts are arranged more accurately and more efficiently, and the assembly efficiency of the circuit board assembly 100 is improved.

Further alternatively, the first supporting seat 50 may be made of an insulating material, such as: ceramics, plastics, etc.

It should be noted that, in order to ensure the overall thickness of the circuit board assembly 100, the thickness of the first supporting seat 50 may be controlled within a proper range, so as to further reduce the problem of increased thickness caused when the circuit board assembly 100 is provided with the first supporting seat 50, and ensure the structural strength of the first pins 301.

Further alternatively, the first end of the first pin 301 may be disposed on the first supporting seat 50, and the second end of the first pin 301 may also be electrically connected to the second circuit board through the elastic sheet 403 disposed on the second circuit board without being inserted into the second circuit board through the first slot 401, which also can omit a seat body of a connector for connecting two circuit boards in the related art. For example, as shown in fig. 5 to 10, the second circuit board 20 is provided with an elastic sheet 403 for connecting with the first pin 301, the elastic sheet 403 is a metal elastic sheet, and the elastic sheet 403 is welded to the second circuit board by a welding process, which is simple in process. In this way, the first pins 301 are connected to the elastic pieces 403 disposed on the second circuit board, so that a seat (generally a female seat) in a connector for connecting two circuit boards in the related art can be omitted, thereby reducing the overall thickness of the circuit board assembly 100.

In this way, by disposing the first supporting seat 50 on the first circuit board 10 to support the plurality of first pins 301, the structural stability of the circuit board assembly 100 as a whole and the functional stability of the electronic device in which the circuit board assembly 100 is disposed can be further improved.

Optionally, the circuit board assembly 100 provided in the embodiment of the present application further includes a plurality of second pins 302 and third pins 303. The plurality of second pins 302 are electrically connected to the first circuit board 10, and at least a portion of any second pin 302 of the plurality of second pins 302 is disposed on the first supporting base 50; the plurality of third pins 303 are electrically connected to the second circuit board 20, and any one of the plurality of third pins 303 is disposed corresponding to a corresponding one of the plurality of second pins 302, which is disposed in the second circuit board 302.

Specifically, the third pins 303 are disposed on the surface of the second circuit board 20 opposite to the first circuit board 10, and are disposed in one-to-one correspondence with the second pins 302, and the second pins 302 are in contact with the third pins 303 to achieve electrical connection with the second circuit board 20. It can be seen that the second lead 302 differs from the first lead 301 in that: the first pin 301 is inserted into the second circuit board 20 through the first slot 401 and electrically connected to the second circuit board 20, and the second pin 302 is electrically connected to the second circuit board 20 through the third pin 303.

Illustratively, the third pin 303 may be configured as a hook shape capable of being slightly deformed, and the second pin 302 may be configured as a narrow plate shape capable of being engaged with the hook shape, so that when the second pin 302 contacts with the third pin 303, stable contact performance of the second pin 302 and the third pin 303 can be ensured, and in the case that the length of the circuit board assembly 100 is kept unchanged, since the third pin 303 and the second pin 302 are configured as small-sized structural members, a larger number of more dense second pins 302 and third pins 303 can be arranged on the circuit board assembly 100.

For example, as shown in fig. 7 to 9, a plurality of narrow second receiving grooves may be formed in the first supporting seat 50, and each second receiving groove is used for receiving at least a portion of one second lead 302, so as to provide structural support for the plurality of second leads 302, so that the second leads 302 can be stably and electrically connected to the first circuit board 10.

Further alternatively, the third pin 303 may be a metal contact soldered on the second circuit board 20, so that the overall thickness of the circuit board assembly 100 may be further reduced.

Further alternatively, the second pin 302 may be directly soldered to the first circuit board 10 by a solder having a conductive property. The third pin 303 may be directly soldered to the second circuit board 20 by a solder having a conductive property. Specifically, the solder may be a tin bead.

Further alternatively, the second pin 302 and the third pin 303 may be metal parts, and the metal parts can ensure stable impedance and can stably transmit electrical signals.

Optionally, the plurality of second pins 302 in the circuit board assembly 100 in the embodiment of the present application are arranged in at least two rows, and the at least two rows of second pins 302 are distributed on two sides of the plurality of first pins 301.

Specifically, in the embodiment of the present application, the second pins 302 and the first pins 301 are disposed on the first circuit board 10 through the first supporting seat 50, and the plurality of second pins 302 are arranged in at least two rows and distributed on two sides of the plurality of first pins 301, so that a greater number of pins can be distributed on the circuit board assembly 100 under the condition that the length of the circuit board assembly 100 is not changed, and the circuit board assembly 100 is ensured to support more functional devices to work.

For example, as shown in fig. 7 to 9 and 11 to 13, the second receiving grooves for receiving the second pins 302 on the first supporting seat 50 are disposed on two sides of the first mounting seat, and the first receiving grooves for receiving the first pins 301 are disposed in the middle of the first supporting seat 50, so that the space on the first supporting seat 50 can be more fully utilized, the problem of insufficient pin number caused by the fact that the length direction of the circuit board assembly 100 cannot be further extended is solved, and the space utilization and the reasonable layout of the circuit board assembly 100 are more facilitated. In addition, since the plurality of second pins 302 need to be in contact with and electrically connected to the third pins 303, arranging the second pins 302 outside the first pins 301 also facilitates stable connection between the second pins 302 and the third pins 303.

It is understood that, since the connection form of the first pin 301 and the second pin 302 with the second circuit board 20 is different, the kind of the functional device electrically connected to the first pin 301 or the second pin 302 can be determined according to actual needs.

In this way, the second pins 302 are arranged outside the first pins 301 on the first supporting seat 50, the space in the width direction of the circuit board assembly 100 is fully utilized, the number of the first supporting seats 50 arranged between the first circuit board 10 and the second circuit board 20 can be reduced, the cost is reduced, and the layout space of the first supporting seats 50 is reasonably utilized.

Optionally, the circuit board assembly 100 in the embodiment of the present application further includes a second support base 60, the second support base 60 is disposed on a surface of the second circuit board 20 opposite to the first circuit board 10, and the third pin 303 is at least partially disposed on the second support base 60.

Specifically, the second support base 60 may be disposed on a surface of the second circuit board 20 opposite to the first circuit board 10, and is used for providing structural support for the third pins 303 electrically connected to the second circuit board 20.

For example, as shown in fig. 5, 6 and 9, the second support base 60 may be configured in a plate shape, and a plurality of narrow third receiving grooves may be formed in the second support base 60, each of the third receiving grooves being configured to receive at least a portion of one of the third pins 303, so as to structurally support the plurality of third pins 303, so that the third pins 303 are firmly and electrically connected to the second circuit board 20.

It can be understood that after the third pins 303 are fixed on the second support base 60, and then the second support base 60 is welded or screwed on the second circuit board 20, the first pins 301 can be aligned to the preset positions of the second circuit board 20 where the welding parts are arranged more accurately and more efficiently, and the assembly efficiency of the circuit board assembly 100 is improved.

Further alternatively, the second supporting seat 60 may be made of an insulating material, such as: ceramics, plastics, etc.

It should be noted that, in order to ensure the overall thickness of the circuit board assembly 100, the thickness of the second support base 60 may be controlled within a proper range, so as to further reduce the problem of increased thickness caused by the second support base 60 disposed on the circuit board assembly 100, and ensure the structural strength of the third pins 303.

Thus, by disposing the second support base 60 on the second circuit board 20 to support the plurality of third pins 303, the structural stability of the circuit board assembly 100 as a whole and the functional stability of the electronic device in which the circuit board assembly 100 is disposed can be further improved.

Optionally, the circuit board assembly 100 in this embodiment of the application further includes a second slot 601, the second slot 601 is disposed through the surface of the second support base 60 facing the first circuit board 10, and the first pin 301 passes through the second slot 601 and is inserted into the first slot 401.

Specifically, the plurality of first pins 301 are disposed in at least one row at the middle position of the first supporting seat 50, and in order to avoid the first pins 301 and enable the first pins 301 to be electrically connected to the second circuit board 20, the second supporting seat 60 needs to be provided with a second groove 601 for accommodating the first pins 301 and enabling the first pins 301 to pass through the second groove 601 to be inserted into the first groove 401 and to be electrically connected to the second circuit board 20.

Specifically, the second slot 601 penetrates through the second circuit board 20, so that the first pin 301 can penetrate through the second support base 60 and be electrically connected with the second circuit board 20.

It can be understood that the second slot 601 is disposed corresponding to the first slot 401, that is, the projection position of the second slot on the second circuit board 20 approximately corresponds to the notch position of the first slot, and the areas of the two slots also approximately tend to be the same. In this way, the first pin 301 can be directly inserted into the first slot 401 after passing through the second slot 601.

In this way, by providing the second slot 601 on the second support base 60, when the first circuit board 10 is fastened to the second circuit board 20, that is, when the first pin 301 is inserted into the second slot 601, the side of the first pin 301 is supported by the structure of the second slot 601, thereby further improving the contact reliability between the first pin 301 and the second circuit board 20. In addition, by arranging the first slot body 401 in the second slot body 601, the first pin 301 can be conveniently inserted into the first slot body 401 after being inserted into the second slot body 601, so that the stability of the electrical connection between the first pin 301 and the second circuit board 20 is improved, and the electronic device provided with the circuit board assembly 100 has more stable performance and longer service life.

Optionally, the first circuit board 10 in the circuit board assembly 100 in the embodiment of the present application is a flexible circuit board, and the circuit board assembly 100 in the embodiment of the present application further includes a supporting plate 90 disposed on a side of the first circuit board 10 away from the second circuit board 20.

Specifically, since the first circuit board 10 is a flexible circuit board and is easily bent and deformed, and the first pins 301 or the first supporting seat 50 disposed thereon may not be strongly supported, the supporting plate 90 is disposed on a side of the first circuit board 10 away from the second circuit board 20, so that the first pins 301 and the first supporting seat 50 can be effectively supported.

Thus, the alignment of the first circuit board 10 and the second circuit board 20 can be more accurate and stable.

An embodiment of the present application further provides an electronic device, where the electronic device may include: the circuit board assembly 100 in the above embodiment. The above-mentioned electronic device may further include a device body on which the circuit board assembly 100 is disposed.

Illustratively, the device body is provided with a structural member for supporting the circuit board assembly 100. The circuit board assembly 100 may be disposed on the structural member by screws or bolts to improve mounting stability between the circuit board and the device body.

It should be noted that, for the description of the structure and the operation principle of the circuit board assembly 100, reference may be specifically made to the related description in the foregoing embodiments, and in order to avoid repetition, no further description is given here.

The electronic device in the embodiment of the present application may be a mobile electronic device, and may also be a non-mobile electronic device. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a Personal Computer (PC), a Television (TV), a teller machine, a self-service machine, and the like, and the embodiments of the present application are not particularly limited.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

In this application, the term "plurality" means two or more unless explicitly defined otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A circuit board assembly, comprising:

a first circuit board;

a second circuit board stacked with the first circuit board;

the first end of any first pin in the plurality of first pins is electrically connected with the first circuit board, and the plurality of first pins are arranged in at least one row;

the first groove body is arranged on the surface of the second circuit board facing the first circuit board, and the second ends of the first pins are inserted into the first groove body and electrically connected with the second circuit board.

2. The circuit board assembly of claim 1, further comprising:

and the first metal layer is arranged on the inner surface of the first groove body and is positioned between the first pin and the first groove body.

3. The circuit board assembly of claim 1,

the first groove bodies are arranged in at least one row, and the number and the arrangement mode of the first groove bodies are the same as those of the first pins.

4. The circuit board assembly of claim 1, further comprising:

the first supporting seat is arranged on the surface of the first circuit board opposite to the second circuit board, and at least part of the first pin is arranged on the first supporting seat.

5. The circuit board assembly of claim 4, further comprising:

the second pins are electrically connected with the first circuit board, and at least part of any one of the second pins is arranged on the first supporting seat;

and the plurality of third pins are electrically connected with the second circuit board, and any one of the plurality of third pins is arranged corresponding to one corresponding second pin in the plurality of second pins.

6. The circuit board assembly of claim 5,

the plurality of second pins are arranged in at least two rows, and the at least two rows of second pins are distributed on two sides of the plurality of first pins.

7. The circuit board assembly of claim 5, further comprising:

the second supporting seat is arranged on the surface of the second circuit board opposite to the first circuit board, and at least part of the third pins are arranged on the second supporting seat.

8. The circuit board assembly of claim 7, further comprising:

the second groove body runs through the second groove body and is arranged on the surface, facing the first circuit board, of the second supporting seat, and the first pin penetrates through the second groove body and is inserted into the first groove body.

9. The circuit board assembly according to any one of claims 1 to 8, wherein the first circuit board is a flexible circuit board, the circuit board assembly further comprising:

and the supporting plate is arranged on one side of the first circuit board, which deviates from the second circuit board.

10. An electronic device, comprising:

a circuit board assembly according to any one of claims 1 to 9.

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