CN113997174A - Automatic polishing robot for circuit board and polishing method thereof - Google Patents

Automatic polishing robot for circuit board and polishing method thereof Download PDF

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Publication number
CN113997174A
CN113997174A CN202111093472.2A CN202111093472A CN113997174A CN 113997174 A CN113997174 A CN 113997174A CN 202111093472 A CN202111093472 A CN 202111093472A CN 113997174 A CN113997174 A CN 113997174A
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CN
China
Prior art keywords
circuit board
water
polishing
fixedly connected
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202111093472.2A
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Chinese (zh)
Inventor
张�浩
江巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Tongliang Technology Co ltd
Original Assignee
Nanjing Tongliang Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Tongliang Technology Co ltd filed Critical Nanjing Tongliang Technology Co ltd
Priority to CN202111093472.2A priority Critical patent/CN113997174A/en
Publication of CN113997174A publication Critical patent/CN113997174A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0046—Column grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention relates to an automatic polishing robot for a circuit board and a polishing method thereof. The water washing component is arranged in the water washing machine, so that the circuit board can be polished in water, the damage of dust to a human body when the circuit board is polished is avoided, and the secondary pollution to the circuit board caused by the fact that the dust falls back to the surface of the circuit board again in the polishing process is also avoided. The water washing component can also directly wash the polished circuit board, so that the surface of the polished circuit board is smooth and clean.

Description

Automatic polishing robot for circuit board and polishing method thereof
Technical Field
The invention relates to the field of mechanical polishing, in particular to an automatic polishing robot for a circuit board and a polishing method thereof.
Background
With the continuous development of scientific and technological life, information communication technology is rapidly developing, and the circuit board is an essential element of many electronic technology products. With the wide application of circuit boards, the automatic production and processing of circuits is a necessary trend of technological development, and the production processes of circuit boards are complex and various, and the production requirements of circuit boards are more and more diversified. The polishing of the circuit copper plate after the cutting is an essential important step in the production and processing process, and the smooth and impurity-free polished circuit copper plate can not only provide a good foundation for subsequent processes, but also improve the production efficiency of the circuit board.
Traditional circuit board polisher is carrying out the in-process of polishing to the circuit copper and is easily producing the dust, not only can cause the injury to operating personnel's health, still easily takes place the dust and falls back to the copper surface, causes secondary pollution's phenomenon.
Disclosure of Invention
The purpose of the invention is as follows: the automatic polishing robot for the circuit board is provided, and a polishing method based on the automatic polishing robot for the circuit board is further provided, so that the problems in the prior art are solved.
The technical scheme is as follows: an automatic grinding robot for a circuit board comprises a conveying assembly, a grinding assembly and a water washing assembly.
The conveying assembly comprises a base and a conveying crawler, wherein the base is used for supporting the whole conveying assembly, and the conveying crawler is fixed on the surface of a working surface of the base;
the grinding assembly comprises a supporting plate fixedly connected with the base and arranged at one side of the conveying crawler; the polishing mechanism is fixedly connected with the lifting mechanism; the lifting mechanism is used for adjusting and positioning the whole height of the polishing mechanism;
the water washing assembly comprises a water grinding mechanism which is used for grinding the circuit board in water, is fixedly connected with the base and is arranged on the surface of the working surface of the base; and the cleaning mechanism is used for cleaning the circuit board polished by the water mill mechanism, is adjacent to the water mill mechanism, is arranged on the surface of the working surface of the base and is fixedly connected with the substrate.
In a further embodiment, the lifting assembly comprises three components, namely a base plate, a support post and a sliding plate. The base plate is fixedly connected with the supporting plate, is arranged on the surface of the working surface of the supporting plate and is used for positioning and fixing the whole lifting mechanism; one end of the strut is fixedly connected with the base plate, is arranged on the surface of the working surface of the base plate and is used for providing an operating platform for the integral height adjustment of the polishing mechanism; the sliding plate is arranged on the surface of the working surface of the support column, one surface of the sliding plate is in sliding connection with the support column and has the flexibility of performing reciprocating sliding along the working direction of the support column, and the other surface of the sliding plate is fixedly connected with the polishing mechanism; in the later polishing operation process, the whole height position of the polishing mechanism can be further driven to be adjusted by adjusting the height position of the sliding plate.
In a further embodiment, the sharpening mechanism comprises two components, a sharpening pad and a sharpening wheel. The polishing wheel is fixedly connected with the sliding plate and moves along with the movement of the sliding plate so as to drive the whole polishing mechanism to move, and therefore the position of the polishing mechanism is adjusted; the polishing wheel is fixedly connected with the polishing pad in a shaft joint mode, so that the polishing wheel has flexibility in rotating around the central shaft of the polishing pad in all directions.
In a further embodiment, the conveying tracks are distributed on the surface of the base working surface in a segmented mode, the water grinding mechanism and the water washing mechanism penetrate through the conveying tracks in a parallel mode, and therefore flexible conveying of circuit boards can be achieved among the water grinding mechanism, the water washing mechanism and the conveying tracks; and the transmission crawler and the base are mutually communicated and fixed through the support frame, so that a preset height difference is generated between the transmission crawler and the base, and the transmission crawler can conveniently transmit the circuit board to the water mill mechanism and the washing mechanism in the later operation process.
In a further embodiment, the water mill mechanism comprises two components of a water mill tank and a moving device. The water grinding groove is fixedly connected with the base, is arranged between the conveying tracks and is provided with an open concave cavity with preset accommodation, and in the later operation process, the concave cavity of the water grinding groove can be used for storing clean water so as to facilitate the water grinding operation of the circuit board; the mobile device is arranged in the concave cavity of the water grinding groove and is in sliding connection with the inner wall of the concave cavity of the water grinding groove, the flexibility of reciprocating sliding of the inner wall of the concave cavity of the water grinding groove and the horizontal direction of the conveying crawler belt is achieved, the circuit board after water grinding operation is completed can be conveniently conveyed, and therefore the circuit board can be subjected to follow-up flow.
In a further embodiment, the water washing mechanism comprises two components of a water washing tank and a receiving device. The rinsing bath is fixedly connected with the base, is arranged between the conveying tracks and is provided with a concave cavity with preset accommodation, and the concave cavity of the rinsing bath can be used for storing clear water in the later operation process so as to be convenient for secondary cleaning of the circuit board after water grinding; the receiving device is arranged in the concave cavity of the rinsing bath and is in sliding connection with the frontal concave cavity inner wall of the rinsing bath, the concave cavity inner wall of the rinsing bath and the flexibility of the horizontal direction of the conveying track in reciprocating sliding are arranged, the circuit board after the rinsing operation is completed can be conveniently conveyed, and the circuit board can be subjected to subsequent processes.
In a further embodiment, the moving device comprises two components of a lifting platform and a bearing plate. One end of the lifting platform is connected with the inner wall of the concave cavity of the water grinding groove in a sliding mode, and the lifting platform has the flexibility of sliding back and forth along the horizontal direction of the inner wall of the concave cavity of the water grinding groove and the conveying track; the bearing plate is fixedly connected with the other end of the lifting platform and is used for receiving and moving the circuit board transmitted by the transmission crawler; and the surface of the bearing plate working surface is connected with a plurality of corner fixing clamps in a sliding way, the corner fixing clamps are symmetrically distributed at four corners of the surface of the bearing plate working surface, and the flexibility of gathering the bearing plate from the surface of the bearing plate to the center of the bearing plate is realized. In the later working process, the clamping and fixing work of the circuit board can be completed by adjusting the position of the corner fixing clamp.
In a further embodiment, the receiving device comprises two components, namely a second lifting platform and a second bearing plate. One end of the second lifting platform is connected with the inner wall of the concave cavity of the rinsing bath in a sliding manner, and the second lifting platform has the flexibility of sliding back and forth along the horizontal direction of the inner wall of the concave cavity of the rinsing bath and the conveying crawler; the second bearing plate is fixedly connected with the other end of the second lifting platform and is used for receiving and moving the circuit board transmitted by the bearing plate; and the surface of the working surface of the second bearing plate is connected with second corner fixing clamps in a sliding way, and the second corner fixing clamps are symmetrically distributed at four corners of the surface of the working surface of the second bearing plate and have flexibility ratio of gathering the second bearing plate along the surface of the second bearing plate towards the center of the second bearing plate. In the later working process, the clamping and fixing work of the circuit board can be completed by adjusting the position of the second corner fixing clamp.
In a further embodiment, the polishing wheel is fixed to the polishing pad in a sliding connection mode through a transmission wheel, the other end of the strut is fixedly connected with a polishing motor, a starting wheel is connected to the side face, in the same direction as the transmission wheel, of the polishing motor in a shaft connection mode, the starting wheel and the transmission wheel are communicated with each other through a telescopic crawler, and therefore when the polishing motor is started, the starting wheel drives the transmission wheel to rotate through the telescopic crawler, and the polishing wheel is driven to rotate.
A polishing method of an automatic polishing robot for a circuit board comprises the following steps:
s1, injecting water into the water grinding tank and the rinsing tank, and stopping injecting water when the water level reaches a preset position; manually placing the circuit boards to be polished on a conveying track in sequence, starting the transmission assembly, and conveying the circuit boards;
s2, moving the circuit board to the position of the water mill mechanism, receiving the circuit board by the supporting plate, and moving the corner fixing clamp to fix the circuit board; the lifting platform begins to descend to submerge the circuit board in accumulated water of the water mill groove, the sliding plate moves towards the direction close to the water mill groove, the polishing wheel is close to the circuit board, and polishing operation is carried out on the circuit board;
s3, after polishing, the lifting platform rises to enable the circuit board to be exposed out of the water surface, the lifting platform slides along the inner wall of the water polishing groove, and the circuit board is transferred to the washing mechanism;
s4, the second supporting plate receives the polished circuit board, and the second corner fixing clamp is moved to fix the circuit board; the second lifting platform begins to descend, so that the polished circuit board is submerged in the accumulated water of the rinsing bath, and the circuit board is cleaned;
s5, after the circuit board is cleaned, the second lifting platform rises to enable the circuit board to be exposed out of the water surface, slides along the inner wall of the rinsing bath, and returns the circuit board to the conveying track;
and S6, repeating the operations from S1 to S5 in sequence by analogy until the circuit boards to be polished are all polished.
Has the advantages that: the invention relates to an automatic polishing robot for a circuit board and a polishing method thereof. In a further embodiment, the water washing component is arranged, so that the circuit board can be polished in water, the damage of dust to a human body when the circuit board is polished is avoided, and the secondary pollution to the circuit board caused by the fact that the dust falls back to the surface of the circuit board again in the polishing process is also avoided. The water washing component can also directly wash the polished circuit board, so that the surface of the polished circuit board is smooth and clean.
Drawings
Fig. 1 is a schematic view of the present invention as a whole.
Fig. 2 is a schematic view of the lifting mechanism of the present invention.
Fig. 3 is a schematic view of the grinding mechanism of the present invention.
Figure 4 is an overall schematic view of the sanding assembly of the present invention.
The figures are numbered: the device comprises a base 1, a conveying crawler 2, a supporting plate 3, an elevating mechanism 4, a polishing mechanism 5, a supporting frame 6, a water milling groove 7, a rinsing groove 8, an elevating platform 9, a supporting plate 10, a corner fixing clamp 11, a second elevating platform 12, a second supporting plate 13, a second corner fixing clamp 14, a fixing plate 15, a third corner fixing clamp 16, a base plate 401, a support column 402, a sliding plate 403, a sliding motor 404, a sliding rod 405, a polishing pad 501, a polishing wheel 502, a protective cover 503, a polishing motor 17, a transmission wheel 18, a starting wheel 19 and a telescopic crawler 20.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
The applicant believes that the conventional circuit board grinding machine is easy to generate dust in the process of grinding the circuit copper plate, not only can hurt the body of an operator, but also is easy to generate the phenomenon that the dust falls back to the surface of the copper plate to cause secondary pollution.
Therefore, the applicant designs an automatic polishing robot for the circuit board and a polishing method thereof, the industrial robot replaces manual work to polish the circuit board, and the manual work only needs to fix the circuit board to be polished on the conveying assembly, so that the production efficiency of the circuit board can be improved.
The invention relates to an automatic grinding robot for a circuit board. Wherein the conveying assembly comprises a base 1 and a conveying crawler 2; the base 1 is used for supporting the whole conveying assembly, and the conveying crawler 2 is fixed on the surface of the working surface of the base 1 and used for conveying a circuit board to be polished; the polishing assembly comprises a supporting plate 3, a lifting mechanism 4 and a polishing mechanism 5; the supporting plate 3 is fixedly connected with the base 1, is arranged at one side of the conveying crawler 2 and is used for positioning and fixing the whole grinding assembly; the lifting mechanism 4 is fixedly connected with the supporting plate 3, and the polishing mechanism 5 is fixedly connected with the lifting mechanism 4; the lifting mechanism 4 is used for adjusting and positioning the overall height of the polishing mechanism 5, and the polishing mechanism 5 is used for polishing the circuit board; the water washing assembly comprises a water grinding mechanism and a washing mechanism; polishing a circuit board in water, wherein the water polishing mechanism is fixedly connected with the base 1 and is arranged on the surface of the working surface of the base 1 and used for polishing the circuit board in water; the cleaning mechanism is adjacent to the water mill mechanism, arranged on the surface of the working surface of the base 1, fixedly connected with the substrate 401 and used for cleaning the circuit board polished by the water mill mechanism.
In a further preferred embodiment, the lifting assembly comprises three components, namely a base plate 401, a support column 402 and a sliding plate 403. The base plate 401 is fixedly connected with the supporting plate 3, is arranged on the surface of the working surface of the supporting plate 3, and is used for positioning and fixing the whole lifting mechanism 4; one end of the support column 402 is fixedly connected with the substrate 401, is arranged on the surface of the working surface of the substrate 401, and is used for providing an operation platform for adjusting the overall height of the polishing mechanism 5; the sliding plate 403 is arranged on the surface of the working surface of the pillar 402, one surface of the sliding plate is connected with the pillar 402 in a sliding manner, the sliding plate has the flexibility of sliding back and forth along the working direction of the pillar 402, and the other surface of the sliding plate 403 is fixedly connected with the grinding mechanism 5; in the later polishing operation, the height position of the sliding plate 403 can be adjusted to further drive the overall height position adjustment of the polishing mechanism 5. Considering that the circuit board to be polished has a predetermined area, the position of the whole device needs to be adjusted to perform a full polishing operation on the circuit board, the working surface of the base plate 401 is provided with a sliding rod 405, and the support column 402 is fixedly connected with the base plate 401 through the sliding rod 405 and has flexibility of sliding back and forth along the sliding. And the pillar 402 is fixedly connected with a sliding motor 404, in the later operation process, the sliding motor 404 is started, the pillar 402 is driven by the sliding motor 404 to slide along the sliding rod 405, so that the lifting mechanism 4 is driven to slide, the polishing mechanism 5 is driven to slide integrally, and the position of the polishing mechanism 5 is adjusted, so that the circuit board is polished comprehensively.
In a further preferred embodiment, the grinding mechanism 5 comprises two components, a grinding pad 501 and a grinding wheel 502. The polishing wheel 502 is fixedly connected with the sliding plate 403 and moves along with the movement of the sliding plate 403, so as to drive the overall height of the polishing mechanism 5 to move, thereby completing the position adjustment of the polishing mechanism 5; the grinding wheel 502 is fixed to the grinding pad 501 by means of a shaft joint, so that the grinding wheel 502 has flexibility to rotate around the central axis of the grinding pad 501 in all directions. And the surface of the grinding wheel 502 is covered with a protective cover 503, so that the damage to the human body caused by the rotating grinding wheel 502 is avoided in the working process of the grinding wheel 502, and the protective cover 503 is provided with a drainage hole, so that splash splashed by the rotation of the grinding wheel 502 in the water grinding operation process can flow out through the drainage hole, the influence on the grinding wheel 502 caused by the splashed splash is avoided, and the grinding operation cannot be smoothly carried out.
In a further preferred embodiment, the conveying tracks 2 are distributed on the surface of the working surface of the base 1 in a segmented manner, and the water grinding mechanism and the water washing mechanism penetrate through the conveying tracks 2 in a parallel manner, so that flexible conveying of circuit boards can be realized among the water grinding mechanism, the water washing mechanism and the conveying tracks 2; and the transmission crawler belt and the base 1 are mutually communicated and fixed through a support frame 6, so that a preset height difference is generated between the transmission crawler belt 2 and the base 1, and the transmission crawler belt 2 can conveniently transmit the circuit board to the water mill mechanism and the water washing mechanism in the later operation process.
In a further preferred embodiment, the water milling mechanism comprises two parts, namely a water milling groove 7 and a moving device. The water grinding tank 7 is fixedly connected with the base 1, is arranged between the conveying tracks 2, and is provided with an open concave cavity with preset accommodation, and in the later operation process, the concave cavity of the water grinding tank 7 can be used for storing clean water so as to facilitate the water grinding operation of the circuit board; the mobile device is arranged in the concave cavity of the water grinding groove 7 and is in sliding connection with the inner wall of the concave cavity of the water grinding groove 7, the inner wall of the concave cavity of the water grinding groove 7 and the horizontal direction of the conveying crawler belt 2 have flexibility for sliding in a reciprocating mode, a circuit board after water grinding operation is completed can be conveniently conveyed, and the circuit board can be subjected to subsequent processes. Meanwhile, the position height adjustment of the circuit board can be completed by adjusting the mobile device, so that the mobile device is matched with the water grinding mechanism to complete the grinding work of the circuit board.
In a further preferred embodiment, the water washing mechanism comprises two components of a water washing tank 8 and a receiving device. The rinsing bath 8 is fixedly connected with the base 1, is arranged between the conveying tracks 2 and is provided with a concave cavity with preset accommodation, and in the later operation process, the concave cavity of the rinsing bath 8 can be used for storing clear water so as to facilitate secondary cleaning of the circuit board after water grinding; receiving arrangement arranges in wash bowl 8's concave type cavity, and with wash bowl 8 forehead concave type cavity inner wall sliding connection has the edge wash bowl 8's concave type cavity inner wall with the flexibility ratio that 2 horizontal directions of conveying track carried out reciprocating sliding is convenient for convey the circuit board after the washing operation is accomplished for the circuit board can carry out follow-up flow.
In a further preferred embodiment, the moving means comprises two components, namely a lifting platform 9 and a support plate 10. One end of the lifting platform 9 is connected with the inner wall of the concave cavity of the water grinding groove 7 in a sliding manner, and the lifting platform has the flexibility of sliding back and forth along the horizontal direction between the inner wall of the concave cavity of the water grinding groove 7 and the conveying crawler 2; the bearing plate 10 is fixedly connected with the other end of the lifting platform 9 and is used for receiving and moving the circuit board transmitted by the transmission crawler 2; and the surface of the working surface of the bearing plate 10 is slidably connected with a plurality of corner fixing clamps 11, the corner fixing clamps 11 are symmetrically distributed at four corners of the surface of the working surface of the bearing plate 10, and the corner fixing clamps 11 have flexibility of gathering towards the center of the bearing plate 10 along the surface of the bearing plate 10. In the later working process, when the circuit board is completely moved to the surface of the working surface of the bearing plate 10, the corner fixing clips 11 begin to gather towards the center of the bearing plate 10 to clamp and fix the circuit board; after the corresponding operation is completed, the corner fixing clip 11 starts to move in the direction away from the center of the supporting plate 10, so that the clamped circuit board is loosened, and the circuit board can be conveniently moved to the subsequent process.
In a further preferred embodiment, the receiving device comprises two components, namely a second lifting platform 12 and a second supporting plate 13. One end of the second lifting platform 12 is connected with the inner wall of the concave cavity of the rinsing bath 8 in a sliding manner, and the second lifting platform has the flexibility of sliding back and forth along the horizontal direction between the inner wall of the concave cavity of the rinsing bath 8 and the conveying crawler 2; the second supporting plate 13 is fixedly connected with the other end of the second lifting platform 12 and is used for receiving and moving the circuit board transmitted by the supporting plate 10; and the surface of the working surface of the second bearing plate 13 is slidably connected with second corner fixing clamps 14, symmetrically distributed at four corners of the surface of the working surface of the second bearing plate 13, and has flexibility of gathering towards the center of the second bearing plate 13 along the surface of the second bearing plate 13. In the later working process, when the circuit board is completely moved to the surface of the working surface of the second supporting plate 13, the second corner fixing clamp 14 starts to gather to the center of the supporting plate 10, and the circuit board is clamped and fixed; after the corresponding operation is completed, the second corner fixing clip 14 starts to move in a direction away from the center of the second supporting plate 13, so that the clamped circuit board is loosened, and the circuit board can be conveniently moved to the subsequent process.
In a further preferred embodiment, the polishing wheel 502 is fixed to the polishing pad 501 by a transmission wheel 18 in a sliding manner, the other end of the pillar 402 is fixedly connected to a polishing motor 17, a starting wheel 19 is coupled to a side surface of the polishing motor 17 in the same direction as the transmission wheel 18, the starting wheel 19 is communicated with the transmission wheel 18 by a telescopic crawler 20, so that when the polishing motor 17 is started, the polishing motor 17 drives the starting wheel 19 to rotate, the starting wheel 19 drives the transmission wheel 18 to rotate by the telescopic crawler 20, and further drives the polishing wheel 502 to rotate, so that the polishing wheel 502 can polish the circuit board.
In a further preferred embodiment, considering that the circuit board is easy to shift or fall under the influence of inertia during the process of conveying the circuit board by the conveying crawler 2, a fixing plate 15 is arranged on the surface of the working surface of the conveying crawler 2 at predetermined intervals, and a third edge fixing clamp 16 is arranged on the surface of the fixing plate 15; the third corner fixing clips 16 are multiple and symmetrically distributed on the surface of the working surface of the fixing plate 15; the third corner fixing clip 16 is slidably connected to the fixing plate 15, and has flexibility to gather toward the center of the fixing plate 15 along the surface of the fixing plate 15. Meanwhile, after the washing tank 8 finishes the washing operation of the circuit board, the surface of the circuit board is in a wet state, a drying box is arranged at the position adjacent to the washing mechanism and covers the surface of the conveying crawler 2 connected with the washing mechanism, and when the circuit board is conveyed to the washing mechanism, the circuit board is dried through the drying box and then conveyed continuously. The surfaces of the working surfaces of the fixing plate 15, the bearing plate 10 and the second bearing plate 13 are all provided with telescopic push rods, when the circuit board needs to be subjected to position exchange movement, the telescopic push rods are unfolded to push out the circuit board and then are retracted in a telescopic mode, and therefore the circuit board in the operation process is prevented from being affected.
On the basis of the automatic polishing robot for the circuit board, the invention provides a polishing method of the automatic polishing robot for the circuit board, which comprises the following specific steps:
firstly, manually injecting water into the water grinding tank 7 and the rinsing tank 8, and stopping injecting water after the water level reaches a preset position; manually placing circuit boards to be polished on the fixing plates 15 on the surfaces of the conveying tracks 2 in sequence, and gathering the third edge fixing clamps 16 towards the centers of the fixing plates 15 to clamp the circuit boards; the drive assembly is then actuated to transfer the circuit board.
Then, the circuit board moves to the edge of the water mill groove 7, the supporting plate 10 moves to the joint with the fixing plate 15, the third edge fixing clamp 16 moves towards the direction far away from the center of the fixing plate 15 to loosen the circuit board, then the telescopic push rod on the surface of the fixing plate 15 pops up to push the circuit board to the supporting plate 10, and the supporting plate 10 receives the circuit board; the corner fixing clips 11 gather towards the center of the supporting plate 10 to clamp and fix the circuit board; then, the lifting platform 9 starts to descend to submerge the circuit board in the accumulated water of the water grinding groove 7, the sliding plate 403 moves towards the direction close to the water grinding groove 7, the grinding wheel 502 is close to the circuit board, and the circuit board is ground.
After polishing, the lifting platform 9 rises to enable the circuit board to be exposed out of the water surface, and the lifting platform 9 slides along the inner wall of the water grinding tank 7 to the direction close to the rinsing tank 8; when the supporting plate 10 is moved to be connected with the second supporting plate 13, the corner fixing clamp 11 moves towards the direction far away from the center of the supporting plate 10 to loosen the circuit board, and then the telescopic push rod on the surface of the supporting plate 10 pops up to push the circuit board to the second supporting plate 13; the second corner fixing clamp 14 gathers close to the center of the second supporting plate 13 to clamp and fix the circuit board; then, the second supporting plate 13 moves the polished circuit board to the center of the concave cavity of the rinsing bath 8; the second lifting platform 12 begins to descend to enable the polished circuit board to be submerged in accumulated water of the rinsing bath 8, and then the second lifting platform 12 shakes at a preset frequency and a preset distance along the inner wall of the concave cavity of the rinsing bath 8 to clean the circuit board.
Finally, after the circuit board is cleaned, the second lifting platform 12 rises to enable the circuit board to be exposed out of the water surface, the second lifting platform 12 slides along the inner wall of the concave cavity of the rinsing bath 8, when the circuit board is moved to a joint with the fixing plate 15 on the surface of the conveying crawler 2, the second corner clamp moves towards a position far away from the center of the second bearing plate 13 to loosen the circuit board, and the telescopic push rod on the surface of the second bearing plate 13 pops up to push the circuit board to the fixing surface; then the third corner fixing clip 16 gathers close to the center of the fixing plate 15, and clamps and fixes the circuit board again. The circuit board is conveyed along the conveying crawler 2 after being dried by the drying box.
Repeating the above actions in sequence by analogy until the circuit board to be polished is completely polished.
As noted above, while the present invention has been shown and described with reference to certain preferred embodiments, it is not to be construed as limited thereto. Various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. The utility model provides a circuit board is with automatic machine people that polishes, characterized by includes:
the conveying assembly comprises a base for supporting the whole conveying assembly; a conveyor track secured to a surface of the base work surface;
the polishing assembly comprises a supporting plate fixedly connected with the base and arranged at one side of the conveying crawler; the lifting mechanism is fixedly connected with the supporting plate and is used for adjusting and positioning the overall height of the polishing mechanism fixedly connected with the lifting mechanism;
the washing assembly comprises a water grinding mechanism which is fixedly connected with the base and is arranged on the surface of the working surface of the base, and the water grinding mechanism is used for grinding the circuit board in water; and the cleaning mechanism is adjacent to the water mill mechanism and fixedly connected with the base and is used for cleaning the circuit board polished by the water mill mechanism.
2. An automated grinding robot for circuit boards as claimed in claim 1, wherein the lifting mechanism comprises:
the base plate is fixedly connected with the supporting plate, is arranged on the surface of the working surface of the supporting plate and is used for positioning and fixing the whole lifting mechanism;
one end of the support column is arranged on the surface of the working surface of the substrate, is fixedly connected with the substrate and is used for providing an operating platform for the integral height adjustment of the polishing mechanism;
the sliding plate is arranged on the surface of the working surface of the support column, one surface of the sliding plate is connected with the support column in a sliding mode, and the sliding plate has the flexibility of sliding back and forth along the working direction of the support column; the other side of the sliding plate is fixedly connected with the polishing mechanism.
3. An automated grinding robot for circuit boards according to claim 2, wherein the grinding mechanism comprises:
the polishing pad is fixedly connected with the sliding plate and moves along with the movement of the sliding plate so as to drive the polishing mechanism to integrally move;
and the polishing wheel is fixedly connected with the polishing pad in a shaft joint mode and has flexibility for performing omnibearing rotation around the central shaft of the polishing pad.
4. The automated grinding robot for circuit boards of claim 1, wherein:
the conveying crawler is distributed on the surface of the working surface of the base in a segmented mode, the water mill mechanism and the washing mechanism penetrate through the conveying crawler in parallel, and the conveying crawler and the base are communicated and fixed with each other through the supporting frame, so that a preset height difference is generated between the conveying crawler and the base, and the conveying crawler can convey a circuit board to the water mill mechanism and the washing mechanism conveniently.
5. The automated grinding robot for circuit boards as claimed in claim 4, wherein the watermill mechanism comprises:
the water grinding groove is fixedly connected with the base, is arranged between the conveying tracks and is provided with an open concave cavity with preset accommodation;
and the moving device is arranged in the concave cavity of the water grinding groove, is in sliding connection with the inner wall of the concave cavity of the water grinding groove, and has the flexibility of reciprocating sliding along the inner wall of the concave cavity of the water grinding groove and the horizontal direction of the conveying crawler belt.
6. An automated grinding robot for circuit boards as claimed in claim 4, wherein the water washing mechanism comprises:
the rinsing bath is fixedly connected with the base, is arranged between the conveying tracks and is provided with a concave cavity with preset accommodation;
the receiving device is arranged in the concave cavity of the rinsing bath, is connected with the inner wall of the concave cavity of the rinsing bath in a sliding manner, and has the flexibility that the inner wall of the concave cavity of the rinsing bath and the horizontal direction of the conveying track slide in a reciprocating manner.
7. An automated grinding robot for circuit boards as claimed in claim 5, wherein the moving means comprises:
one end of the lifting platform is connected with the inner wall of the concave cavity of the water grinding groove in a sliding mode, and the lifting platform has the flexibility of sliding back and forth along the horizontal direction of the inner wall of the concave cavity of the water grinding groove and the conveying track;
the bearing plate is fixedly connected with the other end of the lifting platform and is used for receiving and moving the circuit board conveyed by the conveying crawler;
the corner fixing clamps are distributed at four corners of the surface of the bearing plate working surface symmetrically, and flexibility of gathering the bearing plate from the surface of the bearing plate to the center of the bearing plate is achieved.
8. An automated grinding robot for circuit boards as claimed in claim 6, wherein the receiving means comprises:
one end of the second lifting platform is connected with the inner wall of the concave cavity of the rinsing bath in a sliding manner, and the second lifting platform has the flexibility of sliding back and forth along the horizontal direction of the inner wall of the concave cavity of the rinsing bath and the conveying crawler;
the second bearing plate is fixedly connected with the other end of the second lifting platform and used for receiving and moving the circuit board transmitted by the bearing plate;
the surface of the working surface of the second bearing plate is slidably connected with a plurality of second corner fixing clamps, the second corner fixing clamps are symmetrically distributed at four corners of the surface of the working surface of the second bearing plate, and the flexibility of gathering the second bearing plate along the surface of the second bearing plate towards the center of the second bearing plate is achieved.
9. An automated grinding robot for circuit boards according to claim 3, characterized in that:
the polishing wheel is connected with the polishing pad in a sliding mode through a driving wheel, the other end of the supporting column is fixedly connected with a polishing motor, the side face of the polishing motor in the same direction as the driving wheel is connected with a starting wheel in a shaft mode, the starting wheel is communicated with the driving wheel through a telescopic crawler, and the starting wheel drives the driving wheel to rotate through the telescopic crawler, so that the polishing wheel is driven to rotate.
10. A grinding method of an automated grinding robot for circuit boards according to any one of claims 1 to 9, characterized by comprising the steps of:
s1, injecting water into the water grinding tank and the rinsing tank, and stopping injecting water when the water level reaches a preset position; manually placing circuit boards to be polished on a conveying track in sequence, starting a transmission assembly, and conveying the circuit boards;
s2, moving the circuit board to the position of the water mill mechanism, receiving the circuit board by the supporting plate, and moving the corner fixing clamp to fix the circuit board; the lifting platform begins to descend to submerge the circuit board in accumulated water of the water mill groove, the sliding plate moves towards the direction close to the water mill groove, the polishing wheel is close to the circuit board, and polishing operation is carried out on the circuit board;
s3, after polishing, the lifting platform rises to enable the circuit board to be exposed out of the water surface, the lifting platform slides along the inner wall of the water polishing groove, and the circuit board is transferred to the washing mechanism;
s4, the second supporting plate receives the polished circuit board, and the second corner fixing clamp is moved to fix the circuit board; the second lifting platform begins to descend, so that the polished circuit board is submerged in the accumulated water of the rinsing bath, and the circuit board is cleaned;
s5, after the circuit board is cleaned, the second lifting platform rises to enable the circuit board to be exposed out of the water surface, slides along the inner wall of the rinsing bath, and returns the circuit board to the conveying track;
and S6, repeating the operations from S1 to S5 in sequence by analogy until the circuit boards to be polished are all polished.
CN202111093472.2A 2021-09-17 2021-09-17 Automatic polishing robot for circuit board and polishing method thereof Withdrawn CN113997174A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111093472.2A CN113997174A (en) 2021-09-17 2021-09-17 Automatic polishing robot for circuit board and polishing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111093472.2A CN113997174A (en) 2021-09-17 2021-09-17 Automatic polishing robot for circuit board and polishing method thereof

Publications (1)

Publication Number Publication Date
CN113997174A true CN113997174A (en) 2022-02-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111093472.2A Withdrawn CN113997174A (en) 2021-09-17 2021-09-17 Automatic polishing robot for circuit board and polishing method thereof

Country Status (1)

Country Link
CN (1) CN113997174A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117140230A (en) * 2023-10-24 2023-12-01 江苏华芯智造半导体有限公司 Circuit board processing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117140230A (en) * 2023-10-24 2023-12-01 江苏华芯智造半导体有限公司 Circuit board processing device

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