CN113992182A - Bulk acoustic wave resonator with temperature compensation layer - Google Patents
Bulk acoustic wave resonator with temperature compensation layer Download PDFInfo
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- CN113992182A CN113992182A CN202111614738.3A CN202111614738A CN113992182A CN 113992182 A CN113992182 A CN 113992182A CN 202111614738 A CN202111614738 A CN 202111614738A CN 113992182 A CN113992182 A CN 113992182A
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- temperature compensation
- bulk acoustic
- acoustic wave
- base plate
- wave resonator
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02047—Treatment of substrates
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
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- Acoustics & Sound (AREA)
- Soundproofing, Sound Blocking, And Sound Damping (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention discloses a bulk acoustic wave resonator with a temperature compensation layer, which comprises: the base plate is connected with the covering shell in an embedded mode, fixing holes are formed in the tops of the base plate and the covering shell, and fixing nails are connected with the inner sides of the fixing holes in a threaded mode; the bottom of the base plate is provided with a plurality of connecting nails, the bottom of the base plate is connected with a sticking adhesive tape, and the sticking adhesive tape is positioned on the inner side of the connecting nails; the top of the cover shell is provided with a horizontal scale, and the horizontal scale is located on the inner side of the fixing hole. The invention provides a bulk acoustic wave resonator with a temperature compensation layer, wherein the device is provided with a connecting nail and a pasting adhesive tape, when the device needs to be fixed, a shielding strip can be taken down through external force, so that the pasting adhesive tape covers the top of a circuit board, the mounting accuracy is improved, and dislocation is avoided; meanwhile, the connecting nail is inserted into the circuit board, and then the electric connection and the fixation of the device are completed by welding, so that the convenience of the device is improved.
Description
Technical Field
The invention relates to the technical field of bulk acoustic wave resonators, in particular to a bulk acoustic wave resonator with a temperature compensation layer.
Background
Application number 201310270304.2 discloses a method for manufacturing a film bulk acoustic resonator structure and a film bulk acoustic resonator structure, and the invention relates to a method for manufacturing a film bulk acoustic resonator structure and a film bulk acoustic resonator structure. The manufacturing method of the film bulk acoustic resonator structure comprises the following steps: forming a film bulk acoustic resonator on a slide; forming a cavity on a substrate; carrying a film bulk acoustic resonator in the cavity; and forming an electrical connection layer of the electrode of the film bulk acoustic resonator. The manufacturing method of the film bulk acoustic resonator structure and the film bulk acoustic resonator structure do not need sacrificial materials and sacrificial layer film release processes mentioned in the prior art, so that the process is simplified, Q value deterioration caused by residual sacrificial layer materials is avoided, and simple manufacturing of the high-Q value film bulk acoustic resonator structure is realized. In addition, the manufacturing method of the film bulk acoustic resonator structure and the production cost of the film bulk acoustic resonator structure are low ", and the film bulk acoustic resonator structure is easy to generate dislocation due to the lack of a fixing auxiliary component, so that the use convenience of the device is influenced. Therefore, there is a need for a bulk acoustic wave resonator having a temperature compensation layer to at least partially solve the problems of the prior art.
Disclosure of Invention
In this summary, concepts in a simplified form are introduced that are further described in the detailed description. This summary of the invention is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
To at least partially solve the above problems, the present invention provides a bulk acoustic wave resonator having a temperature compensation layer, comprising: the base plate is connected with the covering shell in an embedded mode, fixing holes are formed in the tops of the base plate and the covering shell, fixing nails are arranged on the inner sides of the fixing holes, a plurality of connecting nails are arranged at the bottom of the base plate, a pasting rubber strip is connected to the bottom of the base plate and located on the inner sides of the connecting nails, a horizontal scale is arranged on the top of the covering shell and located on the inner side of the fixing holes.
According to the bulk acoustic wave resonator with the temperature compensation layer, the top of the base plate is provided with the support plate, the support plate is located on the inner side of the covering shell, one side of the support plate is covered with the bottom electrode, the bottom electrode covers the top of the support plate, the bottom electrode is electrically connected with the connecting nail, the top of the bottom electrode is provided with the piezoelectric film, the other side of the support plate is provided with the top electrode, the bottom of the top electrode covers the top of the piezoelectric film, and the top electrode is electrically connected with the connecting nail.
According to the bulk acoustic wave resonator with the temperature compensation layer, the top of the supporting plate is provided with the temperature compensation shell, the top of the temperature compensation shell is connected to the top end of the top electrode, the top of the temperature compensation shell is provided with the heat insulation layer, the inner wall of the covering shell is internally provided with the wrapping layer, the inner part of the wrapping layer is provided with the drying layer, the inner wall of the bottom of the covering shell is provided with a plurality of ventilation holes in a penetrating mode, and the top ends of the ventilation holes are connected to the outer surface of the wrapping layer.
According to the bulk acoustic wave resonator with the temperature compensation layer, the interlayer is arranged inside the inner wall of the base plate, the inner side of the interlayer is provided with the plurality of inner supporting framework mechanisms and the filling layer, and the inner supporting framework mechanisms are arranged in the filling layer.
According to the bulk acoustic wave resonator with the temperature compensation layer, the air cavity is formed in the support plate.
According to the bulk acoustic wave resonator with the temperature compensation layer, the shielding strip is connected to the bottom of the adhesive tape.
According to the bulk acoustic wave resonator with the temperature compensation layer, two groups of moving auxiliary magnets are arranged at the top of the covering shell and are positioned on two sides of the horizontal scale.
According to the bulk acoustic wave resonator with the temperature compensation layer, the filling layer is internally provided with a placing space corresponding to the inner supporting framework mechanism, the inner supporting framework mechanism comprises two side vertical rods, two transverse bearing assemblies and a plurality of vertical energy absorption mechanisms, the two side vertical rods are respectively arranged on two opposite inner walls of the interlayer, the end parts of the transverse bearing assemblies are movably connected with the side vertical rods, the plurality of vertical energy absorption mechanisms are arranged between the two transverse bearing assemblies, each transverse bearing assembly comprises a first hinge seat, a transverse rod and an energy absorption pipe mechanism, the transverse rods and the energy absorption pipe mechanisms are respectively provided with a plurality of transverse rods, the energy absorption pipe mechanisms are arranged between the two transverse rods, the transverse rods are hinged with the first hinge seats, and the vertical energy absorption mechanisms are movably arranged between the upper transverse rods and the lower transverse rods, the energy absorbing pipe mechanism comprises an upper pipe fitting, a lower pipe fitting, two first tensioning springs and two tensioning short rods, wherein two first inner connecting pipes are arranged in the lower pipe fitting, two second inner connecting pipes are arranged in the upper pipe fitting, the first inner connecting pipes are connected with the second inner connecting pipes in an inserting mode, the inner ends of the first tensioning springs are connected with the first inner connecting pipes, the outer ends of the first tensioning springs are connected with the inner ends of the tensioning short rods, and the outer ends of the tensioning short rods are connected with the transverse rods.
According to the bulk acoustic wave resonator with the temperature compensation layer, the vertical energy absorption mechanism comprises a flexible rod piece and a plurality of energy absorption blocks, the energy absorption blocks are arranged on the flexible rod piece, the flexible rod piece comprises a second tensioning spring, a flexible pipe, a second hinging seat and a pull-down seat, the second hinging seat is arranged on the transverse rod above, the pull-down seat is arranged on the transverse rod below, a hinging rod is arranged on the second hinging seat, a pull-down rod is arranged in the pull-down seat, the second tensioning spring is arranged in the flexible pipe, the lower end of the flexible pipe penetrates through the transverse rod above, the upper end of the second tensioning spring is connected with the hinging rod, the lower end of the second tensioning spring is connected with the upper end of the pull-down rod, and the energy absorption blocks are arranged outside the flexible pipe.
Compared with the prior art, the invention at least comprises the following beneficial effects:
1. the invention provides a bulk acoustic wave resonator with a temperature compensation layer, which is characterized in that a connecting nail and a pasting adhesive tape are arranged, when the device needs to be fixed, a shielding strip can be taken down through external force, and the pasting adhesive tape covers the top of a circuit board, so that the mounting accuracy is improved, and the dislocation is avoided; meanwhile, the connecting nail is inserted into the circuit board, and then the electric connection and the fixation of the device are completed by welding, so that the convenience of the device is improved.
2. The invention provides a bulk acoustic wave resonator with a temperature compensation layer, which is provided with a temperature compensation shell and a heat insulation layer, wherein the temperature compensation shell is made of silicon dioxide and covers the top of a support plate, so that the influence of the temperature of the external environment on parts at the top of the support plate is prevented, the temperature drift characteristic of the device is improved, the heat insulation layer is made of heat insulation cotton, the heat insulation layer is arranged at the top of the temperature compensation shell, the influence of the temperature of the external environment on the parts at the top of the support plate is further prevented, and the use effect of the device is improved.
3. The invention provides a bulk acoustic wave resonator with a temperature compensation layer, which is provided with a wrapping layer, a drying layer and ventilation holes, wherein the drying layer is filled with montmorillonite materials and has good hydrophilicity, and when water vapor in an external environment enters the inside of a covering shell, montmorillonite particles in the drying layer can absorb the water vapor in the covering shell through the wrapping layer and the ventilation holes, so that the short circuit of a device caused by the water vapor is prevented, and the safety of the device is improved.
4. The invention provides a bulk acoustic wave resonator with a temperature compensation layer, which is provided with an interlayer, an inner supporting framework mechanism and an air cavity, wherein the interlayer is filled with a silicon body and has good damping property, when vibration generated by an external environment is transmitted to the inside of a base plate, the interlayer can primarily absorb impact and vibration, the inner supporting framework mechanism is arranged inside the interlayer, when the impact is transmitted to the inside of the interlayer, the inner supporting framework mechanism can rock under the impact action to further absorb the vibration transmitted to the inside of the base plate, the air cavity is formed to the bottom of a supporting plate, and because the air has higher impedance, when the impact is transmitted to the inside of the supporting plate, the air cavity can absorb the generated vibration and prevent the vibration from being transmitted to the inside of a bottom electrode and a top electrode through the base plate to cause conduction errors.
Additional advantages, objects, and features of the bulk acoustic wave resonator with temperature compensated layers of the present invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a structural cross-sectional view of the present invention
FIG. 3 is a partial sectional view of the covering shell according to the present invention;
FIG. 4 is a schematic view of the top connection portion of the base plate according to the present invention;
FIG. 5 is a schematic view showing the structure of the top connection part of the support plate according to the present invention;
FIG. 6 is a sectional view of a part of the temperature compensating shell according to the present invention;
FIG. 7 is a partial sectional view of the bottom of the base plate according to the present invention;
FIG. 8 is a schematic structural view of the inner bracing frame mechanism according to the present invention;
FIG. 9 is an enlarged view of portion A of FIG. 8 according to the present invention;
FIG. 10 is a schematic structural view of an energy absorbing tube mechanism according to the present invention;
FIG. 11 is an enlarged view of the structure of portion B of FIG. 8 according to the present invention;
FIG. 12 is a schematic view of the internal structure of the vertical energy absorbing mechanism of the present invention.
Detailed Description
The present invention is further described in detail below with reference to the drawings and examples so that those skilled in the art can practice the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
Example one
Referring to fig. 1-7, an embodiment of the present invention is shown: a bulk acoustic wave resonator with a temperature compensation layer comprises a base plate 1 and a cover shell 2, the base plate 1 is connected with the cover shell 2 in an embedded mode, the base plate 1 is used for providing fixing points for the cover shell 2, fixing holes 3, connecting nails 5, adhesive tapes 6, a supporting plate 8 and an interlayer 17 which are installed on the inner surface and the outer surface of the base plate 1, meanwhile, after the device is fixed, supporting force conducted to the interior of the device through the external environment provides support for the whole device, the cover shell 2 is installed on the top of the base plate 1 and provides fixing points for the fixing holes 3, a horizontal scale 7, a wrapping layer 14, ventilating holes 16 and auxiliary magnets 21 which are installed on the inner surface and the outer surface of the device, meanwhile, shielding is provided for the supporting plate 8 and a top connecting mechanism of the supporting plate, the fixing holes 3 are formed in the tops of the base plate 1 and the cover shell 2 and provide connection points for fixing nails 4 which are connected through threads on the inner side of the base plate 1 and the cover shell 2, the inner side of the fixing hole 3 is in threaded connection with a fixing nail 4, the fixing nail is in threaded connection with the inside of the fixing hole 3, the base plate 1 and the covering shell 2 are fixed, and when the covering shell 2 needs to be disassembled, the fixing nail 4 can be rotated through an external component, and the fixing nail 4 is taken out;
a horizontal scale 7 is arranged at the top of the covering shell 2, the horizontal scale 7 is positioned on the inner side of the fixing hole 3 and is installed at the top of the covering shell 2, and after the device is installed, a user can check whether the whole installation of the device is smooth or not through air bubbles in the horizontal scale 7;
the top of the substrate plate 1 is provided with a support plate 8, the support plate 8 is positioned at the inner side of the covering shell 2, the support plate 8 is installed at the top of the substrate plate 1 and provides fixing points for a bottom electrode 9, a top electrode 11 and a temperature compensation shell 12 which are installed at the top of the substrate plate, one side of the support plate 8 is covered with the bottom electrode 9, the bottom electrode 9 is covered to the top of the support plate 8, the bottom electrode 9 is electrically connected with the connecting nail 5, when a sound wave signal is transmitted to the inside of the bottom electrode 9 through a piezoelectric film 10, the sound wave signal is converted into an electric signal resonance by the bottom electrode 9 and transmitted to the inside of the connecting nail 5, the top of the bottom electrode 9 is provided with the piezoelectric film 10, when an electric signal is transmitted to the inside of the piezoelectric film 10 through an external circuit board, the piezoelectric film 10 vibrates and transmits the sound wave signal to the inside of the bottom electrode 9 and the top electrode 11, the other side of the support plate 8 is provided with the top electrode 11, the bottom of the top electrode 11 covers the top of the piezoelectric film 10, and the top electrode 11 is electrically connected to the connecting pin 5, when the acoustic signal is conducted to the inside of the top electrode 11 through the piezoelectric film 10, the top electrode 11 converts the sound wave signal into an electric signal for resonance, transmits the electric signal to the inside of the connecting nail 5, the bottom of the adhesive tape 6 is connected with a shielding strip 20 and is arranged at the bottom of the adhesive tape 6, in the transportation process, the adhesive tape 6 is prevented from being adhered to an object in the external environment in a contact way, two groups of movable auxiliary magnets 21 are arranged at the top of the covering shell 2, and the movement auxiliary magnets 21 are positioned at both sides of the horizontal scale 7 and mounted to the top of the cover case 2, and when the fixing nails 4 are completely removed, can be close to the top of supplementary magnetite 21 with the iron object, supplementary magnetite 21 produces suction to the iron object, drives the removal that covers shell 2, accomplishes to cover shell 2.
Example two
As shown in fig. 6, a bulk acoustic wave resonator with a temperature compensation layer comprises a base plate 1 and connecting pins 5, wherein the bottom of the base plate 1 is provided with a plurality of connecting pins 5, and when electric signal harmonics are conducted to the inside of the connecting pins 5 through a bottom electrode 9 and a top electrode 11, the connecting pins 5 transmit the electric signal harmonics to the inside of a circuit board to complete signal output; the bottom of the base plate 1 is connected with the adhesive tape 6, the adhesive tape 6 is positioned on the inner side of the connecting nail 5, when the device needs to be fixed, the shielding strip 20 can be taken down through external force, so that the adhesive tape 6 covers the top of the circuit board, the mounting accuracy is improved, and dislocation is avoided; meanwhile, the connecting nail 5 is inserted into the circuit board, and then the electric connection and the fixation of the device are completed by welding, so that the convenience of the device is improved.
EXAMPLE III
As shown in fig. 3 and 4, a bulk acoustic wave resonator with temperature compensation layer, including backup pad 8 and temperature compensation shell 12, the top of backup pad 8 is provided with temperature compensation shell 12, and the top of temperature compensation shell 12 is connected to the top of top electrode 11, temperature compensation shell 12 adopts the silica material to make, and cover to the top of backup pad 8, prevent that the temperature of external environment from leading to the fact the influence to the part at backup pad 8 top, improve the temperature drift characteristic of device, the top of temperature compensation shell 12 is provided with heat preservation 13, heat preservation 13 adopts thermal-insulated cotton material to make, install to the top of temperature compensation shell 12 and further prevent that the temperature of external environment from leading to the fact the influence to the part at backup pad 8 top, improve the device result of use.
Example four
As shown in fig. 2, a bulk acoustic wave resonator with a temperature compensation layer comprises a covering shell 2 and a wrapping layer 14, the wrapping layer 14 is arranged inside the inner wall of the covering shell 2, and is installed inside the inner wall of the covering shell 2 to provide a containing space for a drying layer 15 arranged inside the covering shell to prevent particles in the drying layer 15 from spilling out, the drying layer 15 is arranged inside the wrapping layer 14, the drying layer 15 is filled with a montmorillonite material and has good hydrophilicity, when water vapor of an external environment enters the covering shell 2, the montmorillonite particles inside the drying layer 15 can absorb the water vapor inside the covering shell 2 through the wrapping layer 14 and ventilation holes 16, so as to prevent the water vapor from causing short circuit of the device and improve the safety of the device, the inner wall of the bottom of the covering shell 2 is provided with a plurality of ventilation holes 16 in a penetrating manner, and the top ends of the ventilation holes 16 are connected to the outer surface of the wrapping layer 14 and are provided to the inner side of the covering shell 2, providing space for the desiccant bed 15 to communicate with the air inside the device.
EXAMPLE five
As shown in fig. 5 and 6, a bulk acoustic wave resonator with a temperature compensation layer comprises a base plate 1 and an interlayer 17, wherein the interlayer 17 is arranged inside the inner wall of the base plate 1, the interlayer 17 is filled with colloidal silica and has good damping performance, when vibration generated by an external environment is transmitted to the inside of the base plate 1, the interlayer 17 primarily absorbs the impact and the vibration, a plurality of inner supporting framework mechanisms 18 are arranged on the inner side of the interlayer 17, the inner supporting framework mechanisms 18 are arranged inside the interlayer 17, when the impact is transmitted to the inside of the interlayer 17, the inner supporting framework mechanisms 18 can rock under the impact action to further absorb the vibration transmitted to the inside of the base plate 1, an air cavity 19 is arranged inside the support plate 8 and is arranged to the bottom of the support plate 8, because the impedance of air is high, when the impact is transmitted to the inside of the support plate 8, the air cavity 19 can absorb the generated vibration, vibration is prevented from being transmitted to the inside of the bottom electrode 9 and the top electrode 11 via the base plate 1 to cause transmission errors.
EXAMPLE six
As shown in fig. 8-12, a bulk acoustic wave resonator with a temperature compensation layer, in which a placement space corresponding to an inner supporting framework mechanism 18 is provided in a filling layer 170, the inner supporting framework mechanism 18 comprises two side vertical rods 181, two transverse bearing components and a plurality of vertical energy absorbing mechanisms 183, the two side vertical rods 181 are respectively provided on two opposite inner walls of an interlayer 17, ends of the transverse bearing components are movably connected with the side vertical rods 181, the plurality of vertical energy absorbing mechanisms 183 are provided between the two transverse bearing components, the transverse bearing components comprise a first hinge seat 184, a transverse rod 185 and an energy absorbing pipe mechanism 186, the transverse rod 185 and the energy absorbing pipe mechanism 186 are provided in plurality, the energy absorbing pipe mechanism 186 is provided between the two transverse rods 185, the transverse rod 185 is hinged with the first hinge seat 184, and the vertical energy absorbing mechanisms 183 are movably provided between the upper and lower transverse rods 185, the energy absorbing tube mechanism 186 includes an upper tube 187, a lower tube 188, two first tensioning springs 189, two tensioning stubs 190, two first inner tubes 191 disposed in the lower tube 188, two second inner tubes 192 disposed in the upper tube 187, the first inner tubes 191 being inserted into the second inner tubes 192, the inner ends of the first tensioning springs 189 being connected to the first inner tubes 191, the outer ends of the first tensioning springs 189 being connected to the inner ends of the tensioning stubs 190, and the outer ends of the tensioning stubs 190 being connected to the cross bars 185.
Specifically, in order to install the inner supporting frame mechanism 18, a placing space (not shown) corresponding to the inner supporting frame mechanism 18 is provided in the filling layer 170, the inner supporting frame mechanism 18 is installed in the placing space, the inner bracing frame mechanism 18 comprises two side vertical rods 181, two transverse load bearing assemblies and a plurality of vertical energy absorbing mechanisms 183, here two lateral vertical bars 181 are mounted on two opposite inner walls of the sandwich 17 respectively, the end parts of the transverse bearing components are movably connected with the side vertical rods 181, the plurality of vertical energy absorbing mechanisms 183 are arranged between the two transverse bearing components, the two transverse bearing components bear the plurality of vertical energy absorbing mechanisms 183, when the vibration is transmitted to the inside of the base plate 1, the inner supporting skeleton mechanism 18 in the interlayer 17 primarily absorbs the impact and the vibration, here too, the transverse bearing assembly in the inner bracing framework 18 provides primary absorption of shocks and vibrations;
the transverse bearing assembly comprises a plurality of first hinge seats 184, transverse rods 185 and energy-absorbing pipe mechanisms 186, wherein the transverse rods 185 and the energy-absorbing pipe mechanisms 186 are respectively arranged, specifically, the energy-absorbing pipe mechanisms 186 are arranged between the two transverse rods 185, the first hinge seats 184 are arranged on the side vertical rods 181, and the transverse rods 185 are hinged with the first hinge seats 184, so that when vibration is transmitted to the inside of the base plate 1, the transverse rods 185 can drive the vertical energy-absorbing mechanisms 183 to shake horizontally or vertically to absorb the impact; the energy absorbing tube mechanism 186 comprises an upper tube 187, a lower tube 188, two first tensioning springs 189, two tensioning stubs 190, two first inner tubes 191 mounted in the lower tube 188, two second inner tubes 192 mounted in the upper tube 187, such that the upper tube 187 can be mounted on the lower tube 188, the first inner tubes 191 and the second inner tubes 192 can be screwed together, wherein the inner ends of the first tensioning springs 189 are connected to the first inner tubes 191, the outer ends of the first tensioning springs 189 are connected to the inner ends of the tensioning stubs 190, and the outer ends of the tensioning stubs 190 are connected to the transverse bars 185, such that the tensioning stubs 190 can be pulled by the first tensioning springs 189 to move between the upper tube 187 and the lower tube 188, such that the energy absorbing tube mechanism 186 absorbs impacts.
EXAMPLE six
As shown in fig. 8 to 12, a bulk acoustic wave resonator with a temperature compensation layer, wherein a vertical energy absorbing mechanism 183 in the bulk acoustic wave resonator with the temperature compensation layer comprises a flexible rod member and a plurality of energy absorbing blocks 193, the plurality of energy absorbing blocks 193 are arranged on the flexible rod member, the flexible rod member comprises a second tension spring 194, a flexible pipe 195, a second hinged seat 196 and a lower pull seat 197, the second hinged seat 196 is arranged on the upper transverse rod 185, the lower pull seat 197 is arranged on the lower transverse rod 185, a hinged rod is arranged on the second hinged seat 196, a lower pull rod 199 is arranged in the lower pull seat 197, the second tension spring 194 is arranged in the flexible pipe 195, the lower end of the flexible pipe 195 passes through the upper transverse rod 185, the upper end of the second tension spring 194 is connected with the hinged rod, the lower end of the second tension spring is connected with the upper end of the lower pull rod 199, and the plurality of energy absorbing blocks are arranged outside the flexible pipe 195.
Specifically, in order to facilitate the vertical energy absorbing mechanism 183 to swing horizontally or vertically to absorb the impact, the vertical energy absorbing mechanism 183 includes a flexible rod member, a plurality of energy absorbing blocks 193, the plurality of energy absorbing blocks 193 are mounted on the flexible rod member, the plurality of energy absorbing blocks 193 can swing horizontally left and right or up and down on the flexible rod member when the vibration is transmitted to the inside of the base plate 1, and specifically, the flexible rod member includes a second tension spring 194, a flexible pipe 195, a second hinge seat 196, and a lower tension seat 197, the second hinge seat 196 is mounted on the upper transverse rod 185, the lower tension seat 197 is mounted on the lower transverse rod 185, a hinge rod is mounted on the second hinge seat 196, a lower tension rod 199 is mounted in the lower tension seat 197, the second tension spring 194 is mounted in the flexible pipe 195, the lower end of the flexible pipe 195 passes through the lower transverse rod 185, and the upper end of the second tension spring 194 is connected to the hinge rod, the lower end is connected with the upper end of the lower pull rod 199, and the plurality of energy absorption blocks 193 are installed outside the flexible pipe 195, so when the plurality of energy absorption blocks 193 horizontally shake left and right, the flexible pipe 195 is shaken left and right by the energy absorption blocks 193, and further the second tensioning spring 194 shakes, and impact is absorbed by the shaking of the energy absorption blocks 193.
The working principle is as follows: the shielding strip 20 is taken down through external force, the pasting adhesive tape 6 is covered to the top of the circuit board, meanwhile, the connecting nail 5 is inserted into the circuit board through the external force, the electric connection of the device is completed, when an electric signal is transmitted to the inside of the piezoelectric film 10 through the external circuit board, the piezoelectric film 10 vibrates, a sound wave signal is transmitted to the inside of the bottom electrode 9 and the top electrode 11, when the sound wave signal is transmitted to the inside of the bottom electrode 9 and the top electrode 11 through the piezoelectric film 10, the sound wave signal is converted into electric signal resonance through the bottom electrode 9 and the top electrode 11 and is transmitted to the inside of the connecting nail 5, the connecting nail 5 transmits electric signal harmonic waves to the inside of the circuit board, and the output of the signal is completed.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
While embodiments of the invention have been disclosed above, it is not limited to the applications set forth in the description and the embodiments, which are fully applicable in various fields of endeavor to which the invention pertains, and further modifications may readily be made by those skilled in the art, it being understood that the invention is not limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (9)
1. A bulk acoustic wave resonator having a temperature compensated layer, comprising: the base plate comprises a base plate (1) and a covering shell (2), the covering shell (2) is connected with the base plate (1) in an embedded mode, fixing holes (3) are formed in the tops of the base plate (1) and the covering shell (2), fixing nails (4) are arranged on the inner sides of the fixing holes (3), a plurality of connecting nails (5) are arranged at the bottom of the base plate (1), a pasting adhesive tape (6) is connected to the bottom of the base plate (1), the pasting adhesive tape (6) is located on the inner sides of the connecting nails (5), a horizontal scale (7) is arranged on the top of the covering shell (2), and the horizontal scale (7) is located on the inner side of the fixing holes (3).
2. The bulk acoustic wave resonator with the temperature compensation layer according to claim 1, characterized in that a support plate (8) is disposed on the top of the base plate (1), the support plate (8) is located inside the cover case (2), a bottom electrode (9) is disposed on one side of the support plate (8) in a covering manner, the bottom electrode (9) is covered to the top of the support plate (8), the bottom electrode (9) is electrically connected to the connection pin (5), a piezoelectric film (10) is disposed on the top of the bottom electrode (9), a top electrode (11) is disposed on the other side of the support plate (8), the bottom of the top electrode (11) is covered to the top of the piezoelectric film (10), and the top electrode (11) is electrically connected to the connection pin (5).
3. The bulk acoustic wave resonator with the temperature compensation layer according to claim 2, wherein a temperature compensation shell (12) is arranged on the top of the supporting plate (8), the top of the temperature compensation shell (12) is connected to the top end of the top electrode (11), a heat insulation layer (13) is arranged on the top of the temperature compensation shell (12), a wrapping layer (14) is arranged inside the inner wall of the covering shell (2), a drying layer (15) is arranged inside the wrapping layer (14), a plurality of ventilation holes (16) are formed through the inner wall of the bottom of the covering shell (2), and the top ends of the ventilation holes (16) are connected to the outer surface of the wrapping layer (14).
4. The bulk acoustic wave resonator with the temperature compensation layer according to claim 1, characterized in that an interlayer (17) is disposed inside the inner wall of the base plate (1), a plurality of inner supporting framework mechanisms (18) and a filling layer (170) are disposed inside the interlayer (17), and the inner supporting framework mechanisms (18) are disposed inside the filling layer (170).
5. The bulk acoustic wave resonator with a temperature compensation layer according to claim 2, characterized in that an air cavity (19) is opened inside the support plate (8).
6. The bulk acoustic wave resonator with temperature compensation layer according to claim 1, characterized in that a shielding strip (20) is attached to the bottom of the adhesive strip (6).
7. The bulk acoustic wave resonator with temperature compensation layer according to claim 1, characterized in that two sets of moving auxiliary magnets (21) are provided on the top of the cover case (2), the moving auxiliary magnets (21) being located on both sides of the horizontal scale (7).
8. The bulk acoustic wave resonator with the temperature compensation layer according to claim 4, wherein a placement space corresponding to the inner supporting framework mechanism (18) is provided in the filling layer (170), the inner supporting framework mechanism (18) comprises two side vertical rods (181), two transverse bearing components and a plurality of vertical energy absorbing mechanisms (183), the two side vertical rods (181) are respectively provided on two opposite inner walls of the interlayer (17), the ends of the transverse bearing components are movably connected with the side vertical rods (181), the plurality of vertical energy absorbing mechanisms (183) are provided between the two transverse bearing components, the transverse bearing components comprise a first hinge seat (184), a transverse rod (185) and an energy absorbing pipe mechanism (186), the plurality of transverse rods (185) and the plurality of energy absorbing pipe mechanisms (186) are provided, the energy absorbing pipe mechanism (186) is arranged between two transverse rods (185), the transverse rods (185) are hinged with the first hinge seats (184), and the vertical energy absorbing mechanism (183) is movably arranged between the upper and the lower transverse rods (185), the energy absorption pipe mechanism (186) comprises an upper pipe fitting (187), a lower pipe fitting (188), two first tensioning springs (189) and two tensioning short rods (190), two first inner tubes (191) are arranged in the lower pipe fitting (188), two second inner tubes (192) are arranged in the upper pipe fitting (187), the first inner tube (191) is inserted into the second inner tube (192), the inner end of the first tension spring (189) is connected to the first inner tube (191), the outer end of the first tensioning spring (189) is connected with the inner end of the tensioning short rod (190), and the outer end of the short tensioning bar (190) is connected with the transverse bar (185).
9. The bulk acoustic wave resonator with the temperature compensation layer according to claim 8, characterized in that the vertical energy absorbing mechanism (183) comprises a flexible rod, a plurality of energy absorbing blocks (193), the plurality of energy absorbing blocks (193) are arranged on the flexible rod, the flexible rod comprises a second tension spring (194), a flexible tube (195), a second hinged seat (196), a lower pull seat (197), the second hinged seat (196) is arranged on the upper transverse rod (185), the lower pull seat (197) is arranged on the lower transverse rod (185), the second hinged seat (196) is provided with a hinged rod, a lower pull rod (199) is arranged in the lower pull seat (197), the second tension spring (194) is arranged in the flexible tube (195), and the lower end of the flexible tube (195) passes through the lower transverse rod (185), and the upper end of the second tensioning spring (194) is connected with the hinged rod, the lower end of the second tensioning spring is connected with the upper end of the lower pull rod (199), and the energy absorption blocks (193) are arranged outside the flexible pipe (195).
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| CN113992182B CN113992182B (en) | 2022-03-11 |
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| CN106067780A (en) * | 2015-04-23 | 2016-11-02 | 三星电机株式会社 | Bulk acoustic wave resonator and manufacture method thereof |
| CN111010130A (en) * | 2019-12-19 | 2020-04-14 | 诺思(天津)微系统有限责任公司 | Bulk acoustic wave resonator with temperature compensation layer and electrical layer, filter and electronic equipment |
| CN111555731A (en) * | 2020-05-09 | 2020-08-18 | 北京超材信息科技有限公司 | Wideband surface acoustic wave filter for transmission |
| CN112511129A (en) * | 2020-12-02 | 2021-03-16 | 赛莱克斯微系统科技（北京）有限公司 | Airtight packaging structure of film bulk acoustic resonator and preparation method thereof |
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2021
- 2021-12-28 CN CN202111614738.3A patent/CN113992182B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20120240419A1 (en) * | 2011-03-22 | 2012-09-27 | Peter Paul George Wagner | Razor Blade Tape Measure Multi-tool |
| CN106067780A (en) * | 2015-04-23 | 2016-11-02 | 三星电机株式会社 | Bulk acoustic wave resonator and manufacture method thereof |
| CN204615781U (en) * | 2015-04-27 | 2015-09-02 | 唐志强 | A kind of quartz-crystal resonator |
| CN111010130A (en) * | 2019-12-19 | 2020-04-14 | 诺思(天津)微系统有限责任公司 | Bulk acoustic wave resonator with temperature compensation layer and electrical layer, filter and electronic equipment |
| CN111555731A (en) * | 2020-05-09 | 2020-08-18 | 北京超材信息科技有限公司 | Wideband surface acoustic wave filter for transmission |
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| CN113992182B (en) | 2022-03-11 |
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