CN113981510B - Horizontal high aspect ratio circuit board micropore copper plating tinning's equipment - Google Patents
Horizontal high aspect ratio circuit board micropore copper plating tinning's equipment Download PDFInfo
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- CN113981510B CN113981510B CN202010530968.0A CN202010530968A CN113981510B CN 113981510 B CN113981510 B CN 113981510B CN 202010530968 A CN202010530968 A CN 202010530968A CN 113981510 B CN113981510 B CN 113981510B
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- clamp
- driving
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- 238000007747 plating Methods 0.000 title claims abstract description 41
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 29
- 239000010949 copper Substances 0.000 title claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 60
- 238000005406 washing Methods 0.000 claims abstract description 30
- 238000007599 discharging Methods 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000005554 pickling Methods 0.000 claims abstract description 7
- 230000008093 supporting effect Effects 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 abstract description 18
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000002253 acid Substances 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 230000009471 action Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000001035 drying Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 239000003814 drug Substances 0.000 description 3
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- XDDAORKBJWWYJS-UHFFFAOYSA-N glyphosate Chemical compound OC(=O)CNCP(O)(O)=O XDDAORKBJWWYJS-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 235000021110 pickles Nutrition 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a device for plating copper and tin on a micropore of a horizontal high aspect ratio circuit board, which comprises a machine body, a feeding device, a first washing device, a pickling device, a tinning device or a copper plating device, a second washing device and a discharging device which are sequentially arranged along the machine body, wherein the machine body is also provided with a conveying mechanism for horizontally clamping the circuit board, the conveying mechanism comprises a driving wheel, a conveying belt and a driving source for driving the driving wheel to rotate, the conveying belt is provided with clamping mechanisms for horizontally clamping the circuit board at intervals, the clamping mechanisms are electrically connected with a negative electrode, and an electrically connected positive electrode is arranged in the tinning device or the copper plating device; after the circuit board enters from the feeding device, the circuit board is sequentially subjected to primary washing, acid washing, tin plating or copper plating and secondary washing under the clamping drive of the clamping mechanism, finally discharged and dried, the circuit board is clamped in a horizontal state after the feeding device is horizontally conveyed to a designated position, discharging is realized after the circuit board is loosened after electroplating is completed, manual feeding and discharging are not needed, and the production efficiency is higher.
Description
Technical Field
The invention relates to the technical field of electroplating, in particular to a device for plating copper and tin on a micropore of a horizontal high-aspect-ratio circuit board.
Background
At present, electroplating is one of the important processes in the production and manufacturing process of a PCB board, namely, a process of depositing a plating layer on a substrate by an electrolysis method, and at present, most electroplating industries use vertical continuous electroplating equipment.
For example, chinese patent publication No. CN201801626U discloses a vertical plating line plating apparatus and a jig therefor, the operating jig for a vertical plating line comprising: the device comprises a first clamping edge, a second clamping edge, an elastic piece, a handle and a push rod; one end corresponding to the first clamping edge and the second clamping edge is a clamping end, and the other end is an operating end; the first support column and the second support column are oppositely arranged, are positioned between the clamping end and the operating end, and are arranged adjacent to the clamping end; the elastic piece is elastically connected with the first clamping edge and the second clamping edge, is positioned between the clamping end and the operating end, and is arranged adjacent to the clamping end; one end of the handle is hinged with the first clamping operation end, and the other end of the handle is hinged with one end of the push rod; the push rod is provided with a chute axially arranged on the push rod, a sliding shaft is arranged at the corresponding position of the second clamping edge, and the sliding shaft slides in the chute along the axial direction of the push rod. So that the operation can be conveniently performed on both the front and the back of the clamp.
In the production process, the circuit board can be vertically placed at the clamping end for clamping and fixing conveying, so that the circuit board needs to be fed manually after being horizontally conveyed every time, and is horizontally placed and output after being manually taken down after being electroplated, the problems of large manual workload and low efficiency exist, and the problem that the high-aspect-ratio high-order PCB is in a vertical state in the electroplating process because the PCB is in a vertical state, and poor electroplating conditions in holes exist.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a horizontal high aspect ratio circuit board micropore copper plating and tin plating device, which has the advantages of reducing the manual workload and effectively improving the production efficiency.
The above object of the present invention is achieved by the following technical solutions:
the utility model provides a high aspect ratio circuit board micropore copper-plating tinning equipment of level, includes the organism and sets gradually pan feeding device, first washing device, acid dip pickle, tinning device or copper-plating device, second washing device and discharging device along the organism, still be provided with the conveying mechanism of level centre gripping circuit board on the organism, conveying mechanism includes drive wheel, conveyer belt and drives drive wheel pivoted actuating source, the interval is provided with the fixture that is used for the level centre gripping circuit board on the drive belt, the negative pole is connected to fixture electricity, set up the positive pole of electricity connection in tinning device or the copper-plating device.
After the circuit board enters from the feeding device, the circuit board is sequentially subjected to primary washing, acid washing, tin plating or copper plating and secondary washing under the clamping drive of the clamping mechanism, and finally is discharged, the clamping mechanism is connected with the negative electrode, the machine body is provided with the positive electrode, good electroplating is completed after the circuit board passes through the electroplating liquid of the tin plating device or the copper plating device, the circuit board is directly clamped in a horizontal state after the feeding device is horizontally conveyed to a designated position, when discharging is required after the electroplating is completed, the clamping mechanism can realize discharging after releasing the circuit board, the clamping mechanism is recycled on the conveyor belt during the period, the purpose of repeatedly clamping the circuit board to realize good electroplating is realized, and feeding and discharging are not required to be performed manually one by one during the period, so that the circuit board is more convenient and labor-saving, and the production efficiency is improved to a certain extent; and simultaneously, the poor electroplating condition in the high-order plate holes with high aspect ratio is well improved.
The present invention may be further configured in a preferred example to: the clamping mechanism comprises an upper clamp and a lower clamp, the lower clamp is fixed on the conveyor belt, the upper clamp is vertically connected to the lower clamp in a sliding manner, horizontal clamping portions are arranged on the upper clamp and the lower clamp, a clamping opening for clamping a circuit board is formed between the horizontal clamping portions, and a driving piece for driving the upper clamp to lift is arranged on the upper clamp.
The space between the horizontal clamping part of the initial upper clamp and the horizontal clamping part of the lower clamp forms a clamping opening for the circuit board to horizontally enter, and after the circuit board enters the clamping opening, the driving piece drives the upper clamp to move downwards to clamp the circuit board at the edge, so that the circuit board is simple in structure and easy to realize.
The present invention may be further configured in a preferred example to: the driving piece comprises a first spring for driving the upper clamp to move downwards to clamp, a locking plate is arranged on the lower clamp, a limiting strip is horizontally connected to the upper clamp in a sliding mode, a jack for vertically moving and inserting the limiting strip is formed in the locking plate, and a second spring for driving the limiting strip to be staggered with the jack is arranged between the limiting strip and the lower clamp.
When the clamping is specifically performed, the lower clamp is driven to move downwards to achieve the clamping through the elastic force of the first spring, when the clamping is required to be loosened, the bottom of the clamping is moved out of the jack through driving the limiting strip to move upwards, the upper clamp moves upwards together at the moment, the first spring is compressed, the limiting strip moves horizontally to be staggered with the jack under the action of the second spring, the limiting plate plays a vertical limiting role on the limiting strip and the upper clamp at the moment, the clamping mechanism is always in a loosening state until the clamping mechanism moves to the feeding device through the conveying belt to perform clamping action again.
The present invention may be further configured in a preferred example to: the driving wheel comprises a driving sprocket and a driven sprocket, the conveying belt comprises a chain, the machine body is connected with a sliding frame in a sliding mode along the conveying direction, the driven sprocket is connected to the sliding frame in a rotating mode, and a counterweight mechanism for driving the sliding frame to move away from the driving sprocket is arranged in the machine body.
Adopt the mode of sprocket and chain to realize the transmission, transmission stability is ensured and the difficult circumstances that skids appear, because whole electroplated equipment is longer and then lead to chain itself length also longer, and then the circumstances that the chain pine takes off appears easily, through the setting of counter weight mechanism, can drive the balladeur train all the time and keep away from action wheel direction removal with the help of its gravity, plays good tensioning effect, lets the chain be in good user state all the time, avoids the circumstances that the chain pine takes off.
The present invention may be further configured in a preferred example to: the counterweight mechanism comprises a counterweight block, a pull rope, a fixed pulley and a movable pulley, wherein the fixed pulley is arranged on the machine body, the movable pulley is arranged on the sliding frame, one end of the pull rope is fixed on the machine body and bypasses the movable pulley and the movable pulley, and the other end of the pull rope is connected to the counterweight block.
During the use, force is applied to the sliding frame through the gravity of the balancing weight and the pull rope, the conversion of force direction is realized through the fixed pulley, and simultaneously, better pulling force effect can be achieved under the same balancing weight by means of the arrangement of the movable pulley, and the device is simple in structure and low in cost.
The present invention may be further configured in a preferred example to: the machine body is fixedly provided with a guide rail, and the lower clamp is provided with a guide block matched with the guide rail.
Firstly, by means of sliding of the guide blocks on the guide rails, good guiding effect can be achieved, the lower clamp can stably move along corresponding tracks, the situation of moving deviation is avoided, in addition, good supporting effect can be achieved on the whole clamping mechanism, and the stress of lifting the top of the clamping mechanism is relieved.
The present invention may be further configured in a preferred example to: the machine body is internally provided with conveying rollers for conveying the circuit board, the conveying rollers are arranged at intervals along the conveying direction, the conveying rollers are provided with rims at intervals along the length direction, supporting strips are arranged between the adjacent conveying rollers, and two ends of each supporting strip are detachably connected with the conveying rollers.
Can effectively improve the transport effect to the circuit board through the setting of conveying roller, the rim that the interval set up can reduce the contact surface of conveying roller and circuit board, reduces the possibility of wearing and tearing, owing to there is certain interval between two conveying rollers, can exist the circuit board end portion in practice and warp down and get into the condition that leads to carrying the trouble in this interval, can play good barrier supporting effect with the help of the support bar, well avoid carrying the condition of trouble, it is more ensured to carry stable security.
The present invention may be further configured in a preferred example to: the support bar comprises an inclined part and inserting parts at two ends, and the inclined part is inclined to the conveying direction of the circuit board.
The support bars are obliquely arranged to achieve better supporting effect, and when the width of the circuit board is smaller than the distance between adjacent support bars, the inclined part can still well support the circuit board, so that the applicability is better.
The present invention may be further configured in a preferred example to: the conveying roller comprises an upper roller and a lower roller, the upper roller and the lower roller are arranged up and down correspondingly, and the upper roller is vertically and slidably connected to the machine body.
The upper roller and the lower roller are arranged up and down correspondingly, so that the circuit board passes through the upper roller and the lower roller, the conveying stability is effectively improved, the upper roller is provided with an upward moving movable space, the upper roller is applicable to circuit boards with different board thicknesses, and the circuit board conveying device has better universality.
The present invention may be further configured in a preferred example to: the top of lower clamp is provided with hoisting part, it is connected with the gyro wheel to rotate on the hoisting part, be provided with the guide slot that supplies the gyro wheel to slide on the organism.
The lifting part can be used for lifting the clamping mechanism well from the top, so that the situation that the gravity of the clamping mechanism is applied to the chain is avoided, and the friction resistance during the movement of the lifting part is further effectively reduced through the arrangement of the roller wheels, so that the movement smoothness of the clamping mechanism is better.
In summary, the present invention includes at least one of the following beneficial technical effects:
1. the existing vertical electroplating is changed into a brand-new horizontal electroplating mode, so that the clamping mechanism can directly clamp and convey the circuit board conveyed horizontally, the circuit board is loosened after electroplating is completed, the circuit board is continuously conveyed forwards, the direction of the circuit board is not required to be manually changed during the process, the work load of workers is effectively reduced, and the production efficiency is improved.
2. Further set up the conveying roller and improve the conveying effect, set up the support bar between adjacent conveying roller, play good supporting effect, avoid the circuit board tip kickdown to lead to the condition of carrying the trouble, the slope portion of slope on the support bar can be suitable for the circuit board of different width, and the suitability is good.
3. By means of the arrangement of the counterweight mechanism, the chain can always keep a tensioning state, the unstable transmission caused by loosening of the chain is avoided, the moving stability of the chain and the clamping mechanism is effectively improved, and the clamping effect is improved.
Drawings
Fig. 1 is a schematic overall structure of embodiment 1.
Fig. 2 is a side view of the connection between the feeding device and the first water washing device in example 1.
Fig. 3 is a structural view of the clamping mechanism in embodiment 1 as seen from the feeding device direction.
Fig. 4 is a top view of example 1 at the junction of the feed device and the first water wash device.
Fig. 5 is an enlarged view at B in fig. 3.
Fig. 6 is an enlarged view at a in fig. 1.
Fig. 7 is a top view of the lower roll in example 1.
Fig. 8 is a top view of the upper roller in example 1.
Fig. 9 is an overall configuration diagram of the clamping mechanism in embodiment 2.
Reference numerals: 1. a body; 2. a feeding device; 3. a first water washing device; 4. a pickling device; 5. a tinning device; 51. a copper plating device; 6. a second water washing device; 7. a discharging device; 8. a drying device; 10. a driven sprocket; 11. a chain; 13. a clamping mechanism; 14. a carriage; 16. balancing weight; 17. a pull rope; 18. a fixed pulley; 19. a movable pulley; 20. an upper clamp; 21. a lower clamp; 22. a horizontal clamping part; 23. a clamping opening; 24. a first spring; 25. a locking plate; 26. a limit bar; 27. a jack; 28. a second spring; 29. a base; 30. a through hole; 31. a guide block; 32. a guide rail; 33. a hoisting part; 34. a roller; 35. a guide groove; 36. a conductive portion; 37. copper bars; 38. a chip receiving disc; 39. an upper roller; 40. a lower roller; 41. a rim; 42. a support bar; 43. an arc guiding strip; 44. an extension strip; 45. an upper body; 46. a lower body; 47. and (5) connecting the sleeve.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1: referring to fig. 1, the horizontal high aspect ratio circuit board micropore copper plating and tin plating equipment disclosed by the invention comprises a machine body 1, a feeding device 2, a first washing device 3, a pickling device 4, a tin plating device 5 or a copper plating device 51, a second washing device 6, a discharging device 7 and a drying device 8 which are sequentially arranged along the length direction of the machine body 1, wherein a conveying mechanism for horizontally clamping a circuit board from the tail end of the feeding device 2 is arranged on the machine body 1, the head end of the conveying mechanism is positioned between the feeding device 2 and the first washing device 3, and the tail end of the conveying mechanism is positioned between the second washing device 6 and the discharging device 7; when the circuit board is horizontally conveyed from the feeding device 2, the circuit board is horizontally clamped by the conveying mechanism, then the circuit board is sequentially subjected to the treatment of the subsequent primary water washing, acid washing, tin plating or copper plating and secondary water washing, the conveying mechanism loosens the circuit board after the secondary water washing is finished, the circuit board is continuously conveyed forwards at the discharging device 7, and finally drying is finished at the drying device 8, so that the whole electroplating process is finished.
The feeding device 2 and the discharging device 7 comprise roller bodies arranged on the machine body 1, the roller bodies are arranged at intervals and driven by a motor to rotate so as to realize conveying, the first water washing device 3 and the second water washing device 6 comprise first nozzles which are arranged in the machine body 1 and are used for spraying water, and the first nozzles are respectively positioned above and below the circuit board so as to clean the upper surface and the lower surface of the circuit board; the pickling device 4 comprises a second nozzle arranged in the machine body 1, and the second nozzle sprays corresponding liquid medicine to realize pickling on the surface of the circuit board; the tinning device 5 or the copper plating device 51 comprises a third spray head which is positioned in the machine body 1 and used for spraying tinning liquid or copper plating liquid, and also comprises an anode which is arranged in the machine body 1 and is electrically connected with the conveying mechanism, and the conveying mechanism is electrically connected with a cathode, so that the electroplating is completed after the conduction; the drying device 8 comprises an air cooler and an air heater which are arranged in the machine body 1, and the circuit board is enabled to realize good drying through the effect of cold air and hot air in sequence.
As shown in fig. 2 and 3, the conveying mechanism comprises a driving wheel, a conveying belt and a driving source for driving the driving wheel to rotate, in this embodiment, the driving wheel comprises two chain wheels, the conveying belt is a chain 11, and the driving source comprises a driving motor, so that the chain 11 is driven to circularly move when the driving motor drives the chain wheels to rotate; and be provided with the fixture 13 that is used for horizontal centre gripping circuit board on chain 11 at the interval, after the circuit board that the level was carried is held from pan feeding device 2 end like this fixture 13, carry the circuit board along organism 1 length direction constantly forward and carry, until after carrying the end to second washing device 6, loosen the circuit board and make it continuously forward carry under discharging device 7 effect, empty fixture 13 gets back to pan feeding device 2 end department again under chain 11 drives, so circulation realizes automatic feeding and unloading of circuit board, effectively reduces the manual work and improves production efficiency.
As shown in fig. 2 and 4, since the entire chain 11 is long, the loosening is liable to occur to affect the transmission stability, wherein the sprocket comprises a driving sprocket and a driven sprocket 10, the driving sprocket is connected with a driving motor through a speed reducer, a carriage 14 is slidingly connected in the machine body 1 along the conveying direction, and the driven sprocket 10 is rotatably connected to the carriage 14, so that the position of the driven sprocket 10 can be adjusted; a counterweight mechanism for driving the sliding frame 14 to move away from the driving chain wheel is arranged in the machine body 1; the counterweight mechanism comprises a counterweight 16, a pull rope 17, a fixed pulley 18 and a movable pulley 19, wherein the fixed pulley 18 is arranged on the machine body 1, the movable pulley 19 is arranged on the carriage 14, one end of the pull rope 17 is fixed with the machine body 1, the pull rope 17 sequentially bypasses the fixed pulley 18 and the movable pulley 19, and finally the end part of the pull rope 17 is fixed on the counterweight 16; therefore, the sliding frame 14 can be driven to move in the direction away from the driving chain wheel all the time by means of the gravity of the balancing weight 16, so that the aim of good tensioning is achieved, the problem that the chain 11 is loose and poor in conveying stability is avoided, and the clamping mechanism 13 arranged on the chain 11 can always keep a good conveying state.
As shown in fig. 5, the clamping mechanism 13 comprises an upper clamp 20 and a lower clamp 21 which are both L-shaped, the bottom ends of the upper clamp 20 and the lower clamp 21 are horizontal clamp parts 22, a clamp opening 23 for clamping a circuit board is formed between the horizontal clamp parts 22 of the upper clamp 20 and the horizontal clamp parts 22 of the lower clamp 21, the lower clamp 21 is fixed on the chain 11, the upper clamp 20 is vertically and slidingly connected on the lower clamp 21, and a driving piece is arranged between the lower clamp 21 and the upper clamp 20 and is used for driving the lower clamp 21 to lift so as to clamp or unclamp; the driving member in this embodiment includes a first spring 24, one end of the first spring 24 is fixed on the lower clip 21, the other end is fixed on the upper clip 20, and the elastic force of the first spring 24 drives the upper clip 20 to move down to clamp the circuit board; in addition, a locking plate 25 is arranged on the lower clamp 21, a limit bar 26 is horizontally and slidingly connected on the upper clamp 20, a jack 27 for vertically moving and inserting the limit bar 26 is arranged on the locking plate 25, and a second spring 28 for driving the limit bar 26 to be staggered with the jack 27 is arranged between the limit bar 26 and the lower clamp 21; when the upper clamp 20 is lifted up, the limiting strips 26 move out of the insertion holes 27, the limiting strips 26 horizontally move to stagger the insertion holes 27 under the action of the second springs 28, the first springs 24 are compressed at the moment, the limiting strips 26 on the upper clamp 20 cannot move downwards under the blocking of the locking plates 25, and the clamping mechanism 13 is kept in a loose state all the time, so that the structure is simple and the cost is low. The structure for driving the limit bar 26 to rise can be realized by means of the height of the slope in a manner of setting the slope on the machine body 1, and is rapid and convenient. In other embodiments the driving member may be directly a cylinder.
As shown in fig. 5, a base 29 is fixed at the bottom of the lower clamp 21, and a through hole 30 for the upper clamp 20 to vertically pass through is formed on one side of the base 29, so that the movement of the upper clamp 20 is guided, and the stability of the vertical movement of the upper clamp 20 is improved; the guide block 31 extends on one side of the seat 290 away from the upper clamp 2, and the guide rail 32 matched with the guide block 31 is fixed in the machine body 1, so that the guide block 31 stably moves along the guide rail 32 to well guide the clamping mechanism 13, and the guide rail 32 well supports the whole lower clamp 21, so that the pressure on the top of the clamping mechanism 13 is effectively relieved. The top of the lower clamp 21 is fixedly provided with a hoisting part 33, two sides of the hoisting part 33 are rotatably connected with rollers 34, and a guide groove 35 for the rollers 34 to slide is arranged at the corresponding part of the machine body 1, so that the whole clamping mechanism 13 can be hoisted through the hoisting part 33, the friction resistance of the rollers 34 can be effectively reduced, and the moving smoothness of the clamping mechanism 13 is better; the top of the hoisting part 33 is also fixed with a conductive part 36, and a copper bar 37 abutted with the conductive part 36 is arranged in the machine body 1, so that the conductive part 36 is always abutted with the surface of the copper bar 37 to keep a negatively charged state in the moving process of the clamping mechanism 13, and the normal electroplating is ensured.
As shown in fig. 6, a conveying roller for conveying a circuit board is further disposed inside the machine body 1, the conveying roller is disposed at intervals along the length direction of the machine body 1, the conveying roller includes an upper roller 39 and a lower roller 40 which are disposed up and down correspondingly, the lower roller 40 is a driving roller, the upper roller 39 is vertically slidably connected to the inner wall of the machine body 1, the upper roller 39 can rotate to be a driven roller, rims 41 (as shown in fig. 7 and 8) are disposed on the lower roller 40 and the upper roller 39, the rims 41 of the upper roller 39 and the lower roller 40 are abutted, the circuit board passes through the rims 41, and the upper roller 39 is driven to correspondingly move upwards when passing through the rims, so that the machine is applicable to circuit boards with different plate thicknesses, and the machine is better in applicability.
As shown in fig. 6 and 7, a supporting bar 42 for connecting the two is arranged between the adjacent lower rollers 40, the supporting bar 42 comprises an inclined part in the middle and inserting parts at two ends, the inserting parts are U-shaped, the lower rollers 40 can be positioned in openings of the inserting parts and can freely rotate, the structure is simple, the installation is convenient, and the detachment of the supporting bar 42 is realized; the supporting bar 42 is slightly lower than the height of the rim 41, so that the starting end part can be supported by the supporting bar 42 in the conveying process of the circuit board, the condition that conveying faults are caused by falling of the circuit board or downward tilting of the end part is avoided, and the conveying stability and the safety are more ensured; the support bars 42 are obliquely arranged, so that even when the circuit board with the width smaller than the interval between the adjacent support bars 42 is conveyed, a good supporting effect can be achieved, and the applicability is wider; in addition, an arc-shaped guide arc strip 43 is arranged at the head end lower roller 40 of each processing link, so that the conveyed circuit board can be guided, a horizontal extension strip 44 is arranged at the tail end lower roller 40 of each processing link, and the extension strip 44 can ensure the stability of the height of the circuit board entering the next processing link. In addition, the tail end of each processing link is provided with a solid roller which corresponds up and down, and the solid roller at the upper part can also move up and down, so that redundant liquid medicine or moisture on the surface of the circuit board can be scraped by the solid roller when the circuit board passes through; and if the solid roller is arranged at the inlet and the outlet of the link, the solid roller can play a role in sealing and blocking, so that the situation that the liquid medicine of the front link or the rear link is mixed is effectively prevented.
The implementation principle of the embodiment is as follows: firstly, the circuit board is continuously conveyed forwards under the action of the roller body of the feeding device 2, when the circuit board is conveyed to the head end of the first water washing device 3, the circuit board enters the clamping opening 23 of the clamping mechanism 13, the limiting strip 26 is pushed to enter the jack 27, the upper clamp 20 clamps the circuit board under the action of the first spring 24, the chain 11 moves under the action of the chain wheel, so that the circuit board is driven to sequentially enter the first water washing device 3, the pickling device 4, the tinning device 5 or the copper plating device 51 and the second water washing device 6, when the clamping mechanism 13 moves to the head end of the discharging device 7 with the circuit board, the upper clamp 20 is lifted to enable the limiting strip 26 to be separated from the jack 27 under the action of the second spring 28, at this time, the clamping mechanism 13 keeps in a loosening state, the circuit board continues to be conveyed forwards under the action of the roller body on the discharging mechanism, finally is dried at the drying device 8, and the clamping mechanism 13 kept in the loosening state returns to the position of the head end of the first water washing device 3 under the action of the chain 11, so that circulation is achieved.
Example 2: referring to fig. 9, in the horizontal high aspect ratio circuit board micro-hole copper plating and tin plating device disclosed by the invention, the difference between the device and the embodiment 1 is that the upper clamp 20 at the clamping mechanism 13 is different in structure, the upper clamp 20 in the embodiment is in an L shape and comprises a split upper body 45 and a split lower body 46, a connecting sleeve 47 for connecting the upper body 45 and the lower body 46 is arranged between the upper body 45 and the lower body 46, two ends of the connecting sleeve 47 are respectively in threaded connection with the upper body 45 and the lower body 46, one side of the connecting sleeve 47 is abutted with the lower clamp 21, so that the connecting sleeve 47 can play a certain supporting role, the vertical parallelism of the upper clamp 20 and the lower clamp 21 is kept, and the lower end of the first spring 24 is abutted with the upper end surface of the connecting sleeve 47; therefore, the elastic force condition of the first spring 24 can be realized through rotating the connecting sleeve 47, the elastic force condition can be regulated according to actual needs, the clamping mechanism 13 can keep a good clamping state, the condition that damage to a circuit board or too loose clamping is avoided, and the connecting sleeve 47 is rotated during disassembly, so that the operation is simpler and more convenient.
The embodiments of the present invention are all preferred embodiments of the present invention, and are not intended to limit the scope of the present invention in this way, therefore: all equivalent changes in structure, shape and principle of the invention should be covered in the scope of protection of the invention.
Claims (6)
1. A horizontal high aspect ratio circuit board micropore copper plating tinning's equipment, its characterized in that: the device comprises a machine body (1) and a feeding device (2), a first washing device (3), a pickling device (4), a tinning device (5) or a copper plating device (51), a second washing device (6) and a discharging device (7) which are sequentially arranged along the machine body (1), wherein the machine body (1) is also provided with a conveying mechanism for horizontally clamping a circuit board, the conveying mechanism comprises a driving wheel, a conveying belt and a driving source for driving the driving wheel to rotate, clamping mechanisms (13) for horizontally clamping the circuit board are arranged on the conveying belt at intervals, the clamping mechanisms (13) are electrically connected with a negative electrode, and an electrically connected positive electrode is arranged in the tinning device (5) or the copper plating device (51);
the clamping mechanism (13) comprises an upper clamp (20) and a lower clamp (21), the lower clamp (21) is fixed on a conveyor belt, the upper clamp (20) is vertically and slidably connected to the lower clamp (21), horizontal clamp parts (22) are arranged on the upper clamp (20) and the lower clamp (21), a clamp opening (23) for clamping a circuit board is formed between the horizontal clamp parts (22), and a driving piece for driving the upper clamp (20) to lift is arranged on the upper clamp;
the driving piece comprises a first spring (24) for driving the upper clamp (20) to move downwards and clamp, a locking plate (25) is arranged on the lower clamp (21), a limit bar (26) is horizontally and slidably connected to the upper clamp (20), a jack (27) for vertically moving and inserting the limit bar (26) is formed in the locking plate (25), and a second spring (28) for driving the limit bar (26) to be staggered with the jack (27) is arranged between the limit bar (26) and the lower clamp (21);
a guide rail (32) is fixed on the machine body (1), and a guide block (31) matched with the guide rail (32) is arranged on the lower clamp (21);
the top of lower clamp (21) is provided with hoist and mount portion (33), rotate on hoist and mount portion (33) and be connected with gyro wheel (34), be provided with on organism (1) and supply gyro wheel (34) gliding guide slot (35).
2. The apparatus for copper and tin plating of micro-holes of horizontal high aspect ratio circuit boards according to claim 1, wherein: the driving wheel comprises a driving sprocket and a driven sprocket (10), the conveying belt comprises a chain (11), a sliding frame (14) is slidably connected onto the machine body (1) along the conveying direction, the driven sprocket (10) is rotatably connected onto the sliding frame (14), and a counterweight mechanism for driving the sliding frame (14) to move away from the driving sprocket is arranged in the machine body (1).
3. The apparatus for copper and tin plating of micro-holes of horizontal high aspect ratio circuit boards according to claim 2, wherein: the counterweight mechanism comprises a counterweight block (16), a pull rope (17), a fixed pulley (18) and a movable pulley (19), wherein the fixed pulley (18) is arranged on the machine body (1), the movable pulley (19) is arranged on the sliding frame (14), one end of the pull rope (17) is fixed on the machine body (1) and bypasses the movable pulley (19) and the movable pulley (19), and the other end of the pull rope is connected to the counterweight block (16).
4. The apparatus for copper and tin plating of micro-holes of horizontal high aspect ratio circuit boards according to claim 1, wherein: the conveying device is characterized in that conveying rollers for conveying the circuit board are arranged in the machine body (1), the conveying rollers are arranged at intervals along the conveying direction, rims (41) are arranged at intervals along the length direction of the conveying rollers, supporting strips (42) are arranged between the adjacent conveying rollers, and two ends of each supporting strip (42) are detachably connected with the conveying rollers.
5. The apparatus for copper and tin plating of horizontal high aspect ratio circuit board micro-holes of claim 4, wherein: the supporting bar (42) comprises an inclined part and inserting parts at two ends, and the inclined part is inclined to the conveying direction of the circuit board.
6. The apparatus for copper and tin plating of horizontal high aspect ratio circuit board micro-holes of claim 4, wherein: the conveying roller comprises an upper roller (39) and a lower roller (40), the upper roller (39) and the lower roller (40) are arranged up and down correspondingly, and the upper roller (39) is vertically and slidingly connected to the machine body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010530968.0A CN113981510B (en) | 2020-06-11 | 2020-06-11 | Horizontal high aspect ratio circuit board micropore copper plating tinning's equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010530968.0A CN113981510B (en) | 2020-06-11 | 2020-06-11 | Horizontal high aspect ratio circuit board micropore copper plating tinning's equipment |
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| CN113981510A CN113981510A (en) | 2022-01-28 |
| CN113981510B true CN113981510B (en) | 2023-11-14 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012097345A (en) * | 2010-11-05 | 2012-05-24 | Marunaka Kogyo Kk | Device for conveying sheet-like material to be processed in surface processing device, and clamp for the same |
| CN107435163A (en) * | 2017-07-31 | 2017-12-05 | 木林森股份有限公司 | Horizontal electroplating production line of circuit board |
| CN209443095U (en) * | 2018-12-26 | 2019-09-27 | 珠海市恒天伟业电路板有限公司 | A kind of circuit board electroplating device of efficient uniform |
-
2020
- 2020-06-11 CN CN202010530968.0A patent/CN113981510B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012097345A (en) * | 2010-11-05 | 2012-05-24 | Marunaka Kogyo Kk | Device for conveying sheet-like material to be processed in surface processing device, and clamp for the same |
| CN107435163A (en) * | 2017-07-31 | 2017-12-05 | 木林森股份有限公司 | Horizontal electroplating production line of circuit board |
| CN209443095U (en) * | 2018-12-26 | 2019-09-27 | 珠海市恒天伟业电路板有限公司 | A kind of circuit board electroplating device of efficient uniform |
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| CN113981510A (en) | 2022-01-28 |
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Address after: 518104 Building 8, 2nd Floor, 1st Floor, and Building 12, 1st Floor, Blue Sky Science and Technology Park, Di Tang Road, Shasi Community, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Songbai Science and Technology Co.,Ltd. Country or region after: China Address before: 518000 2 / F, 1 / F, 12 / F, 1 / F, building 8, Lantian Science Park, Ditang Road, Shasi community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN CYPRESS INDUSTRIAL DEVELOPMENT Co.,Ltd. Country or region before: China |