CN113977871A - Method for manufacturing bipolar plate - Google Patents
Method for manufacturing bipolar plate Download PDFInfo
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- CN113977871A CN113977871A CN202111631495.4A CN202111631495A CN113977871A CN 113977871 A CN113977871 A CN 113977871A CN 202111631495 A CN202111631495 A CN 202111631495A CN 113977871 A CN113977871 A CN 113977871A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0067—Using separating agents during or after moulding; Applying separating agents on preforms or articles, e.g. to prevent sticking to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2507/00—Use of elements other than metals as filler
- B29K2507/04—Carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3468—Batteries, accumulators or fuel cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
The technical scheme of the application discloses a manufacturing method of a bipolar plate, which comprises the following steps: providing a mould; filling conductive paste with photocuring characteristics in the mould; carrying out photocuring on the conductive slurry to form a photocuring polar plate; the light-cured polar plate is used as an anode plate or a cathode plate; and carrying out demolding treatment so that the light-cured polar plate is separated from the mold. The technical scheme of the application provides a simple and quick photo-curing bipolar plate processing mode. The preparation method is carried out at normal temperature, has low production cost and simple process, and is suitable for mass production.
Description
Technical Field
The application relates to the technical field of fuel cell manufacturing processes, in particular to a bipolar plate manufacturing method.
Background
The bipolar plate is one of the important components of the fuel cell, and plays roles of supporting, collecting current, providing a channel for a coolant, and distributing an oxidant and a reductant in the fuel cell. The bipolar plate includes oppositely disposed anode and cathode plates.
In the prior art, the bipolar plate flow channel is mainly processed by machining and die pressing. The die sinking cost is saved by the machining mode, but the manufacturing process is complex, the processing period is too long, and the cost is too high. The die pressing process has advantages in the aspect of mass preparation of the bipolar plate, but the die opening cost is high, and certain requirements on the selection of the graphite substrate are met.
Disclosure of Invention
In view of the above, the present application provides a method for manufacturing a bipolar plate, which comprises the following steps:
a method of fabricating a bipolar plate comprising an anode plate and a cathode plate disposed in opposition, the method comprising:
providing a mould;
filling conductive paste with photocuring characteristics in the mould;
carrying out photocuring on the conductive slurry to form a photocuring polar plate; the light-cured polar plate is used as an anode plate or a cathode plate;
and carrying out demolding treatment so that the light-cured polar plate is separated from the mold.
Preferably, in the above manufacturing method, the mold includes:
a support plate;
the mold plate is positioned on the surface of the support plate, a groove is formed in the surface of one side, away from the support plate, of the mold plate, and the depth of the groove is smaller than the thickness of the mold plate; the groove bottom has a groove through the mold plate for forming a flow channel of the bipolar plate.
Preferably, the above method further comprises:
and covering a cover plate on the mold plate filled with the conductive paste so that the surface of one side of the conductive paste, which faces away from the support plate, is flat.
Preferably, in the above manufacturing method, the conductive paste includes: the conductive filler, the photosensitive resin and the photoinitiator are uniformly mixed based on a set ratio.
Preferably, in the above manufacturing method, the conductive filler includes one or more of carbon black, carbon nanotubes, porous carbon, graphene, and expanded graphite.
Preferably, in the above manufacturing method, the photosensitive resin includes one or more of an epoxy resin, an acrylate, and an unsaturated polyester.
Preferably, in the above method, the photoinitiator includes one or more of benzoin and derivatives, benzils, alkylbenzophenones, and benzophenones.
Preferably, in the above manufacturing method, a mass ratio of the conductive filler, the photosensitive resin, and the photoinitiator is (8.5 to 15.5): (0.8-2.5): (0.4-1.2).
Preferably, in the above manufacturing method, before filling the conductive paste, the method further includes:
and coating a release agent on the surface of the pattern of the mold for preparing the photocuring polar plate.
Preferably, in the above manufacturing method, the method of performing photocuring includes:
and irradiating the conductive paste through an ultraviolet light system to cure the conductive paste.
As can be seen from the above description, the bipolar plate provided in the present application includes: providing a mould; filling conductive paste with photocuring characteristics in the mould; carrying out photocuring on the conductive slurry to form a photocuring polar plate; the light-cured polar plate is used as an anode plate or a cathode plate; and carrying out demolding treatment so that the light-cured polar plate is separated from the mold. The technical scheme of the application provides a simple and quick photo-curing bipolar plate processing mode. The preparation method is carried out at normal temperature, has low production cost and simple process, and is suitable for mass production.
Further, under the action of ultraviolet light, the photoinitiator in the conductive paste generates free radicals, and the resin is polymerized, so that the conductive paste is cured.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in related arts, the drawings used in the description of the embodiments or prior arts will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
The structures, proportions, and dimensions shown in the drawings and described in the specification are for illustrative purposes only and are not intended to limit the scope of the present disclosure, which is defined by the claims, but rather by the claims, it is understood that these drawings and their equivalents are merely illustrative and not intended to limit the scope of the present disclosure.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a bipolar plate according to an embodiment of the present disclosure;
FIG. 2 is a structural diagram of a mold for fabricating a light-cured bipolar plate according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram illustrating a principle of fabricating a light-cured plate according to an embodiment of the present disclosure;
fig. 4-6 are process flow diagrams of a bipolar plate manufacturing method according to an embodiment of the present disclosure.
Detailed Description
Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the application are shown, and in which it is to be understood that the embodiments described are merely illustrative of some, but not all, of the embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.
As shown in fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing a bipolar plate according to an embodiment of the present disclosure, where the bipolar plate includes an anode plate and a cathode plate that are oppositely disposed, and the bipolar plate may be used in a proton exchange membrane fuel cell.
The manufacturing method comprises the following steps:
step S11: a mold is provided.
Step S12: and filling the mold with conductive paste with photocuring characteristics.
Step S13: carrying out photocuring on the conductive slurry to form a photocuring polar plate; the light-cured polar plate is used as an anode plate or a cathode plate. The curing process is controlled by setting the wavelength, energy, distance, angle of the light source.
Step S14: and carrying out demolding treatment so that the light-cured polar plate is separated from the mold.
The technical scheme of the application provides a simple and quick photo-curing bipolar plate processing mode. The preparation method is carried out at normal temperature, has low production cost and simple process, and is suitable for mass production.
As shown in fig. 2, fig. 2 is a schematic structural diagram of a mold for manufacturing a photo-cured bipolar plate according to an embodiment of the present disclosure, where the mold includes:
a support plate 11;
a mold plate 12 positioned on the surface of the support plate 11, wherein the surface of one side of the mold plate 12 facing away from the support plate is provided with a groove 121, and the depth of the groove 121 is less than the thickness of the mold plate 12; the bottom of the groove 121 has a groove 122 extending through the mold plate 12, the groove 122 being used to form the flow channels of the bipolar plate. The three-dimensional structure area of the mold plate 12 for manufacturing the flow channel is a light-transmitting area, and the other areas are plated with light-shielding layers.
The mold plate 12 and the support plate 11 may be provided as two separate structural members to facilitate the demolding process after photocuring. The mold plate 12 may be formed by a casting process, or by etching a plate, or by a 3D printing process, or by machining. The support plate 11 is used for mold support and exposure.
In other modes, the mold plate 12 and the support plate 11 are of an integral structure and are formed by casting, etching, 3D printing or machining.
As shown in fig. 3, fig. 3 is a schematic diagram of a principle of manufacturing a photo-cured electrode plate according to an embodiment of the present application, in which after a mold is filled with a conductive paste 21, the conductive paste 21 is irradiated by ultraviolet light to realize curing of the conductive paste. In order to accelerate the curing of the conductive paste 21, the curing of the conductive paste 21 may be performed by bidirectional ultraviolet irradiation. Specifically, the supporting plate 11 is a transparent plate, the mold is horizontally placed, and the ultraviolet light irradiated towards the upper side is adopted below the supporting plate 11 to perform illumination curing on the conductive paste 21, and meanwhile, the ultraviolet light irradiated towards the lower side is adopted above the mold plate 12 to perform illumination curing on the conductive paste 21.
In this application embodiment, backup pad 11 can be glass board or plastic slab etc. can the printing opacity panel to light can see through backup pad 11 carries out the illumination solidification to conductive paste 21.
As shown in fig. 4-6, fig. 4-6 are process flow charts of a bipolar plate manufacturing method according to an embodiment of the present application, the method including:
first, as shown in fig. 4, a mold is filled with a conductive paste 21 having a photo-curing property. Wherein the mold may comprise a support plate 11 and a mold plate 12 as described above.
Then, as shown in fig. 5, in addition to the manufacturing method described in the above embodiment, the method further includes: a cover plate 22 is covered on the mold plate 12 filled with the conductive paste 21 so that the side of the conductive paste 21 facing away from the support plate 11 is planarized.
Finally, as shown in fig. 6, the conductive paste 21 is irradiated simultaneously by a first light source device 24 located below the supporting plate 11 and a second light source device 23 located above the cover plate 22, so that the conductive paste 21 is cured into a photo-cured plate.
In the embodiment of the application, the light source equipment can be ultraviolet light equipment, and comprises an ultraviolet light exciter and a driving device, wherein the driving device comprises a rotating prism and a rotating shaft, the ultraviolet light is emitted by the ultraviolet light exciter, the rotating prism is used for reflecting light emitted by a laser, and the rotating prism can rotate around a central shaft and can move along the direction of the central shaft; the ultraviolet light has good directivity and is not easy to disperse, the edge of the light-cured polar plate is neat after being molded, and the polishing process is reduced.
The side of the cover plate 22 facing the mould plate 12 may be provided with a raised structure adapted to the recess. Before the setting is carried out photocuring, electrically conductive thick liquids 21 with mould board 12 deviates from the distance of backup pad 11 side surface is t1, sets up t1 and is greater than 0 to avoid covering the spill over of electrically conductive thick liquids 21 before the apron 22, set up t1 simultaneously and be not more than the height of protruding structure, so that cover during the apron 22, can pass through protruding structure lower surface makes electrically conductive thick liquids 21 upper surface is level and smooth. Alternatively, a side surface of the die plate 12 facing away from the supporting plate 11 may be provided with an overflow groove communicating with the groove for recovering the conductive paste 21 overflowing while covering the cap plate 22.
In the manufacturing method according to the embodiment of the present application, the conductive paste 21 includes: the conductive filler, the photosensitive resin and the photoinitiator are uniformly mixed based on a set ratio.
In the manufacturing method, the method for performing photocuring includes: and irradiating the conductive paste through an ultraviolet light system to cure the conductive paste. The curing time is adjusted by setting parameters such as a photoinitiator, the wavelength of a light source and the irradiation angle of the light source.
Wherein the conductive filler comprises one or more of carbon black, carbon nanotubes, porous carbon, graphene and expanded graphite. The photosensitive resin comprises one or more of epoxy resin, acrylate and unsaturated polyester. The photoinitiator comprises one or more of benzoin and derivatives, benzil, alkyl benzophenones and benzophenones.
Optionally, the mass ratio of the conductive filler to the photosensitive resin to the photoinitiator is (8.5-15.5): (0.8-2.5): (0.4-1.2).
In this embodiment, in order to facilitate the demolding process after photocuring, before filling the conductive paste 21, the method further includes: and coating a release agent on the surface of the pattern of the mold for preparing the photocuring polar plate. Specifically, a release agent may be coated on the upper surface of the support plate 11, the surface of the groove 121, and the surface of the groove 122. When the cover plate 22 is used, a release agent is coated on the lower surface of the cover plate 22.
In the manufacturing method of the embodiment of the application, the release agent is coated on the surface of the three-dimensional structure of the mold, so that the mold is released after curing, and the release agent is coated on the surface of the support plate 11 for anti-adhesion pretreatment. And uniformly injecting the mixed conductive paste 21 into a mold, leveling the paste on the surface of the mold, turning on light source equipment, and fully irradiating the conductive paste 21 by using ultraviolet light until the conductive paste is cured. And after the curing is completed, demolding.
According to the above description, the manufacturing method of the embodiment of the application is a novel manufacturing process of the photo-curing bipolar plate, under the illumination effect, the photoinitiator can generate free radicals to initiate resin polymerization and curing, and the process can be carried out at normal temperature without involving a high-temperature treatment process, so that energy is saved; the production cost is low, the process is simple, and continuous large-scale production can be realized; the residual uncured slurry can be recycled and reused.
The large-size die can be arranged to manufacture the large-scale light-cured polar plate, and a plurality of anode plates or a plurality of cathode plates are formed after cutting, so that the manufacture of a plurality of disposable substrates is realized, and the production efficiency is improved.
The embodiments in the present description are described in a progressive manner, or in a parallel manner, or in a combination of a progressive manner and a parallel manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments can be referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It should be noted that in the description of the present application, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only used for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present application. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A method of fabricating a bipolar plate comprising an anode plate and a cathode plate disposed in opposition, the method comprising:
providing a mould;
filling conductive paste with photocuring characteristics in the mould;
carrying out photocuring on the conductive slurry to form a photocuring polar plate; the light-cured polar plate is used as an anode plate or a cathode plate;
and carrying out demolding treatment so that the light-cured polar plate is separated from the mold.
2. The method of manufacturing of claim 1, wherein the mold comprises:
a support plate;
the mold plate is positioned on the surface of the support plate, a groove is formed in the surface of one side, away from the support plate, of the mold plate, and the depth of the groove is smaller than the thickness of the mold plate; the groove bottom has a groove through the mold plate for forming a flow channel of the bipolar plate.
3. The method of claim 2, further comprising, before the photocuring:
and covering a cover plate on the mold plate filled with the conductive paste so that the surface of one side of the conductive paste, which faces away from the support plate, is flat.
4. The method of manufacturing according to claim 1, wherein the conductive paste includes: the conductive filler, the photosensitive resin and the photoinitiator are uniformly mixed based on a set ratio.
5. The method of manufacturing according to claim 4, wherein the conductive filler includes one or more of carbon black, carbon nanotubes, porous carbon, graphene, and expanded graphite.
6. The method according to claim 4, wherein the photosensitive resin comprises one or more of epoxy resin, acrylate and unsaturated polyester.
7. The method as claimed in claim 4, wherein the photoinitiator comprises one or more of benzoin and derivatives, benzil, alkyl benzophenones and benzophenones.
8. The method according to claim 4, wherein the mass ratio of the conductive filler to the photosensitive resin to the photoinitiator is (8.5-15.5): (0.8-2.5): (0.4-1.2).
9. The method of manufacturing according to claim 1, further comprising, before filling the conductive paste:
and coating a release agent on the surface of the pattern of the mold for preparing the photocuring polar plate.
10. The method of claim 1, wherein the step of performing photocuring comprises:
and irradiating the conductive paste through an ultraviolet light system to cure the conductive paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111631495.4A CN113977871A (en) | 2021-12-29 | 2021-12-29 | Method for manufacturing bipolar plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111631495.4A CN113977871A (en) | 2021-12-29 | 2021-12-29 | Method for manufacturing bipolar plate |
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| Publication Number | Publication Date |
|---|---|
| CN113977871A true CN113977871A (en) | 2022-01-28 |
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| CN202111631495.4A Pending CN113977871A (en) | 2021-12-29 | 2021-12-29 | Method for manufacturing bipolar plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114865037A (en) * | 2022-03-31 | 2022-08-05 | 潍柴动力股份有限公司 | Electric pile reactor core, fuel cell, vehicle and electric pile reactor core assembling method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071871A (en) * | 2007-06-05 | 2007-11-14 | 山东大学 | Composite bipolar plate for miniature fuel cell and its preparing method |
| CN105462478A (en) * | 2015-12-14 | 2016-04-06 | 天津凯华绝缘材料股份有限公司 | Ultraviolet light cured PPTC electrode slurry and preparation method thereof |
-
2021
- 2021-12-29 CN CN202111631495.4A patent/CN113977871A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101071871A (en) * | 2007-06-05 | 2007-11-14 | 山东大学 | Composite bipolar plate for miniature fuel cell and its preparing method |
| CN105462478A (en) * | 2015-12-14 | 2016-04-06 | 天津凯华绝缘材料股份有限公司 | Ultraviolet light cured PPTC electrode slurry and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 屈华昌，伍建国: "《塑件模具设计》", 30 November 1993 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114865037A (en) * | 2022-03-31 | 2022-08-05 | 潍柴动力股份有限公司 | Electric pile reactor core, fuel cell, vehicle and electric pile reactor core assembling method |
| CN114865037B (en) * | 2022-03-31 | 2023-11-17 | 潍柴动力股份有限公司 | Pile core, fuel cell, vehicle and pile core assembling method |
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