CN113977121B - Device and method for adjusting welding flatness in semiconductor element welding equipment - Google Patents
Device and method for adjusting welding flatness in semiconductor element welding equipment Download PDFInfo
- Publication number
- CN113977121B CN113977121B CN202110734291.7A CN202110734291A CN113977121B CN 113977121 B CN113977121 B CN 113977121B CN 202110734291 A CN202110734291 A CN 202110734291A CN 113977121 B CN113977121 B CN 113977121B
- Authority
- CN
- China
- Prior art keywords
- inclination
- welding head
- head
- pitch
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0252—Steering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
Abstract
The embodiment of the invention provides a device and a method for adjusting welding flatness in semiconductor element welding equipment. The apparatus for adjusting soldering flatness in a semiconductor element soldering apparatus according to an embodiment of the present invention may include: a tilt adjustment table capable of adjusting tilt about a drive shaft and performing tilt adjustment of a bonding head for holding and releasing a semiconductor element by contact with a tool coupled below the bonding head; a contact pin that contacts the welding head a plurality of times in order to measure the inclination of the welding head; and a controller that determines a pitch of the welding head based on a descent distance value of the welding head for contacting the contact pin a plurality of times. According to the embodiment of the invention, the inclination of the welding head is adjusted by the inclination adjusting table which can independently and automatically adjust the inclination besides the welding table, so that the inclination of the welding head can be adjusted more quickly and precisely.
Description
Technical Field
The present invention relates to an apparatus and method for adjusting a soldering flatness in a semiconductor element soldering apparatus, and more particularly, to an apparatus and method for adjusting a soldering flatness using a separate inclination adjustment table for adjusting an inclination of a soldering head.
Background
A semiconductor (or display) manufacturing process is a process for manufacturing semiconductor elements on a substrate (e.g., a wafer), including, for example, exposure, evaporation, etching, ion implantation, cleaning, packaging, and the like. In particular, a soldering process for soldering the divided semiconductor elements on a suitable substrate (e.g., a PCB substrate) may be performed after dividing the wafer, on which the semiconductor manufacturing process is performed, into chip units.
In addition, in the packaging process, as an alternative to the technique for wire bonding between stacked chips, there is disclosed a TSV (Through Silicon Via; through-silicon via) technique of opening minute holes in the chips and inserting conductors in the corresponding holes to electrically connect the lower chip and the upper chip. As a loop of the TSV process, TSV soldering in which one or more chips are stacked on a wafer and soldered may be performed.
With the miniaturization of chips, the size and pattern of chips become finer, and thus, there is a demand for a technique for more precisely bonding semiconductor elements to a substrate. In particular, a technique of adjusting flatness so that a semiconductor element and a substrate can be accurately soldered in a state parallel to each other when the semiconductor element is soldered on the substrate becomes important.
Disclosure of Invention
Embodiments of the present invention provide devices and methods that enable more rapid and precise adjustment of the pitch of a weld head.
The solution of the present invention is not limited to the above-mentioned one, and those skilled in the art will clearly understand other solution not mentioned from the following description.
The apparatus for adjusting soldering flatness in a semiconductor element soldering apparatus according to an embodiment of the present invention may include: a pitch adjustment table capable of adjusting a pitch about a drive shaft and for performing pitch adjustment of a bonding head for bonding a semiconductor element by contact with a tool coupled below the bonding head; a contact pin that contacts the welding head a plurality of times in order to measure the inclination of the welding head; and a controller that determines a pitch of the welding head based on a descent distance value of the welding head for contacting the contact pin a plurality of times.
In an embodiment, the controller may control the bonding head to bond the semiconductor element to the substrate mounted on the bonding stage when the pitch of the bonding head is within the reference pitch range.
In one embodiment, the controller may change the inclination of the inclination adjustment table when the inclination of the welding head is out of a reference inclination range.
In one embodiment, the controller may contact the tool with a slope adjustment station that is changed the slope to readjust the slope of the welding head.
In an embodiment, the controller may change the X-axis pitch and the Y-axis pitch of the pitch adjustment stage based on the X-axis pitch and the Y-axis pitch of the welding head.
In one embodiment, the controller may position the welding head above the contact pin and lower the welding head a plurality of times until the tool contacts the contact pin, and determine the inclination of the welding head based on a lowering distance value measured when the welding head is lowered.
In one embodiment, the controller may determine the inclination of the welding head by contacting the contact pin with points corresponding to corners of the tool.
The method for adjusting the welding flatness in the semiconductor element welding device according to the embodiment of the invention may include: a step of bringing a bonding head, which bonds a semiconductor element to a substrate placed in a bonding stage, into contact with a pitch adjustment stage; a step of measuring the inclination of the welding head; a step of determining whether to readjust the inclination of the welding head based on the inclination of the welding head; a step of changing the inclination of the inclination adjustment table when the inclination of the welding head is readjusted; and readjusting the inclination of the welding head by bringing a tool coupled to the lower side of the welding head into contact with the inclination adjustment table.
In an embodiment, the step of determining whether to readjust the inclination of the welding head further comprises: and determining to bond the semiconductor element to the substrate when the pitch of the bonding head is within a reference pitch range.
In one embodiment, the step of determining whether to readjust the pitch of the weld head may comprise: and determining to change the inclination of the inclination adjustment table when the inclination of the welding head exceeds a reference inclination range.
In one embodiment, the step of changing the slope of the slope adjustment station may include: and changing the X-axis inclination and the Y-axis inclination of the inclination adjustment table based on the X-axis inclination and the Y-axis inclination of the welding head.
In one embodiment, the step of readjusting the pitch of the weld head may comprise: a step of positioning the soldering head above the contact pin; a step of lowering the welding head a plurality of times until the tool contacts the contact pin; and a step of measuring the inclination of the welding head based on a descent distance value measured when the welding head descends.
In one embodiment, the step of determining the inclination of the welding head may include: and a step of measuring the inclination of the welding head by bringing the contact pin into contact with the point corresponding to each corner of the tool.
The semiconductor element bonding apparatus according to an embodiment of the present invention includes: a bonding head for bonding the semiconductor element to the substrate; a bonding stage for supporting a substrate on which the semiconductor element is bonded by the bonding head; a driving unit for driving the welding head in a horizontal direction and a vertical direction; and a welding flatness adjusting unit for adjusting the flatness of the welding head. The welding flatness adjustment unit may include: a tilt adjustment table capable of adjusting a tilt about a drive shaft and for performing tilt adjustment of the welding head by contact with a tool coupled below the welding head; a contact pin that contacts the welding head a plurality of times in order to measure the inclination of the welding head; and a controller that determines a pitch of the welding head based on a descent distance value of the welding head for contacting the contact pin a plurality of times.
In an embodiment, the controller may control the bonding head to bond the semiconductor element to the substrate when the pitch of the bonding head is within a reference pitch range.
In one embodiment, the controller may change the inclination of the inclination adjustment table when the inclination of the welding head is out of a reference inclination range.
In one embodiment, the controller may contact the tool with a slope adjustment station that is changed the slope to readjust the slope of the welding head.
In an embodiment, the controller may change the X-axis pitch and the Y-axis pitch of the pitch adjustment stage based on the X-axis pitch and the Y-axis pitch of the welding head.
In one embodiment, the controller may position the welding head above the contact pin and lower the welding head a plurality of times until the tool contacts the contact pin, and determine the inclination of the welding head based on a lowering distance value measured when the welding head is lowered.
In one embodiment, the controller may determine the inclination of the welding head by contacting the contact pin with points corresponding to corners of the tool.
According to the embodiment of the invention, the inclination of the welding head is adjusted by the inclination adjusting table which can independently and automatically adjust the inclination besides the welding table, so that the inclination of the welding head can be adjusted more quickly and precisely.
The effects of the present invention are not limited to the above-mentioned ones, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.
Drawings
Fig. 1 and 2 show a sequence of adjusting the pitch of a bonding head at a bonding stage in a semiconductor element bonding apparatus.
Fig. 3 and 4 illustrate a sequence of adjusting the pitch of a bonding head using a pitch adjustment stage in a semiconductor element bonding apparatus according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary skill in the art to which the present invention pertains can easily implement the present invention. The present invention may be embodied in a variety of different forms and is not limited to the embodiments described herein.
For the sake of clarity of the description of the present invention, parts not related to the description are omitted, and the same or similar constituent elements are denoted by the same reference numerals throughout the specification.
In addition, in the embodiments, the same reference numerals are used to describe only the representative embodiments for constituent elements having the same structure, and only structures different from the representative embodiments are described in other embodiments.
Throughout the specification, when a portion is referred to as being "connected (or coupled)" to another portion, it includes not only the case of "directly connected (or coupled)" but also the case of placing the other portion in the middle of "indirectly connected (or coupled)". In addition, when a certain component is expressed as "including" a certain element, unless specifically stated to the contrary, it means that other elements may be included instead of excluding other elements.
All terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, unless defined differently. Terms such as terms defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Fig. 1 and 2 show a sequence of adjusting the pitch of a bonding head at a bonding stage in a semiconductor element bonding apparatus. Referring to fig. 1, in step S105, in the bonding stage 240, the bonding head 220 brings the tool 230 holding the semiconductor element into contact with the bonding stage 240, thereby performing tool face replication (Copy).
Thereafter, in step S110, measurement of the inclination of the welding head 220 is performed. The inclination of the welding head 220 may be detected by lowering the welding head 220 until the welding head 220 contacts the contact pin 245, measuring the elevation height at each point of the tool 230 coupled to the welding head 220, and comparing the elevation heights at each point.
In step S115, it is determined whether the inclination of the welding head 220 is included in the reference level range (whether the standard (Spec) is satisfied). When the inclination of the welding head 220 falls within the reference level range, welding of the welding head 220 may be performed (S120). When the inclination of the bonding head 220 exceeds the reference level range, the process returns to step S105, and the tool face replication of the bonding head 220 is re-performed. Such toolface replication and slope determination may be repeated multiple times to fall within the reference range.
As shown in fig. 2, when it is determined that the tool 230 coupled to the bonding head 220 is tilted to the left and the tool face copying is performed again in the bonding stage 240, but the tool 230 is tilted to the right, the tool face copying is performed again in the bonding stage 240. Such an operation is repeated until the criterion is satisfied. Typically, the soldering station 240 is fixed in pitch.
In the case of adjusting the inclination of the welding head 220 using the welding table 240 having a fixed inclination as in fig. 1 and 2, when the welding head 220 is inclined once, even if the inclination is adjusted again using the same welding table 240, there is a high possibility that the inclination deviation occurs again. Accordingly, embodiments of the present invention provide an apparatus and method for adjusting the inclination of a welding head 220 by a separate inclination adjustment stage capable of performing inclination adjustment by itself in consideration of the inclination of the welding head 220.
Fig. 3 and 4 illustrate a sequence of adjusting the pitch of semiconductor elements using a pitch adjustment stage in a semiconductor element bonding apparatus according to an embodiment of the present invention. Referring to fig. 3, in step S305, in the slope adjustment stage 250, the bonding head 220 brings the tool 230 holding the semiconductor element into contact with the slope adjustment stage 250, thereby performing tool face Copy (Copy).
Thereafter, in step S310, measurement of the inclination of the welding head 220 is performed. The inclination of the welding head 220 may be checked by lowering the welding head 220 until the welding head 220 contacts the contact pin 245, measuring the elevation height at each point of the tool 230 coupled to the welding head 220, and comparing the elevation heights at each point. For example, the inclination of the welding head 220 may be measured by bringing the contact pin 245 into contact with the corner of the quadrangle of the tool 230 coupled to the welding head 220 and measuring the lowering distance from the moment of bringing the contact pin 245 into contact with each point.
In step S315, it is determined whether the inclination of the welding head 220 is included in the reference level range (whether the standard (Spec) is satisfied). When the inclination of the welding head 220 falls within the reference level range, welding of the welding head 220 may be performed (S320).
When the inclination of the welding head 220 exceeds the reference level range, step S325 is performed to adjust the inclination of the inclination adjustment table 250. Here, the inclination of the inclination adjustment table 250 may be adjusted based on the inclination of the welding head 220. For example, when the welding head 220 is tilted to the left, the inclination adjustment table 250 may be tilted to the right. The tilt adjustment table 250 may adjust the tilt by rotating with reference to the X-axis direction and the Y-axis direction.
After changing the inclination of the inclination adjustment table 250, in step S305, the tool 230 coupled with the bonding head 220 may be brought into contact with the inclination adjustment table 250, thereby performing tool face Copy (Copy), and inclination inspection of the corresponding bonding head 220 may be performed. Thus, the inclination of the welding head 220 can be more rapidly adjusted by using the separate inclination adjustment table 250, which performs inclination adjustment in consideration of the inclination of the welding head 220.
Referring to fig. 4, a bonding head 220 may be provided below the bonding unit body 210, and a tool 230 for holding the semiconductor element may be provided below the bonding head 220. Tool 230 may also be referred to as a collet (collet). The slope adjustment station 250 may be provided as a separate module spaced a predetermined distance from the tool 230. The tilt adjustment table 250 may be rotated with respect to the X-axis direction or the Y-axis direction by a separate driving part to adjust the tilt. In addition, a controller may be provided that controls a driving portion for driving the bonding head 220 and driving of the bonding head 220, and determines a slope of the bonding head 220 according to driving information of the bonding head 220. In addition, the controller may adjust the slope of the slope adjustment station 250.
In the semiconductor element bonding apparatus according to the embodiment of the present invention, the means for adjusting the bonding flatness may include: a tilt adjustment table 250 for performing tilt adjustment about the drive shaft and for performing tilt adjustment of the bonding head 220 by contacting with a tool 230 for gripping and releasing the bonding head 220 of the semiconductor element; a contact pin 245 which contacts the welding head 220 a plurality of times in order to measure the inclination of the welding head 220; and a controller to determine a pitch of the welding head based on a descent distance value of the welding head 220 for contacting the contact pin 245 a plurality of times.
In one embodiment, the controller may control the soldering head 220 to solder the conductor element to the substrate mounted on the soldering stage when the pitch of the soldering head 220 is within the reference pitch range.
In one embodiment, the controller may change the pitch of the pitch adjustment stage 250 when the pitch of the welding head 220 exceeds a reference pitch range.
In one embodiment, the controller may cause the tool 230 coupled to the underside of the welding head 220 to contact the slope adjustment stage 250 that is changed in slope to readjust the slope of the welding head 220.
In one embodiment, the controller may change the X-axis pitch and the Y-axis pitch of the pitch adjustment stage 250 based on the X-axis pitch and the Y-axis pitch of the welding head 220.
In one embodiment, the controller may cause the tool 230 coupled to the underside of the welding head 220 to be positioned over the contact pin 245, lowering the welding head 220 multiple times until the tool 230 contacts the contact pin 245, and determining the slope of the welding head 220 based on the value of the lowering distance measured when the welding head 220 is lowered.
In one embodiment, the controller may determine the slope of the weld head 220 by contacting the contact pin 245 to points corresponding to each corner of the tool 230.
The method for adjusting the soldering flatness in the semiconductor element soldering apparatus may include: a step (S305) of bringing a bonding head 220, which holds a semiconductor element and bonds the semiconductor element to a substrate placed in a bonding stage, into contact with a pitch adjustment stage 250; a step (S310) of measuring the inclination of the welding head 220; a step (S315) of determining whether to readjust the inclination of the welding head 220 based on the inclination of the welding head 220; a step (S325) of changing the inclination of the inclination adjustment table 250 when the inclination of the welding head 220 is readjusted; and a step of readjusting the inclination of the welding head 220 by bringing the tool 230 coupled to the lower side of the welding head 220 into contact with the inclination adjustment table 250 (S305).
In an embodiment, the step of determining whether to readjust the pitch of the bonding head 220 (S315) may further include a step of determining to bond the semiconductor element to the substrate when the pitch of the bonding head 220 is within the reference pitch range.
In an embodiment, the step of changing the inclination of the inclination adjustment stage 250 (S325) may include the step of changing the X-axis inclination and the Y-axis inclination of the inclination adjustment stage 250 based on the X-axis inclination and the Y-axis inclination of the welding head 220.
In one embodiment, the step of readjusting the pitch of the bond head 220 (S325) includes: a step of positioning the soldering tip 220 above the contact pin 245; a step of lowering the welding head 220 a plurality of times until the tool 230 contacts the contact pin 245; and a step of measuring the inclination of the welding head 220 based on the descent distance value measured when the welding head 220 descends.
In one embodiment, the step of readjusting the inclination of the welding head 220 (S310) may include the step of determining the inclination of the welding head 220 by contacting the contact pins 245 with points corresponding to the corners of the tool 230.
The semiconductor element bonding apparatus according to an embodiment of the present invention includes: a bonding head 220 for holding the semiconductor element and bonding the semiconductor element to the substrate; a bonding stage 240 for supporting a substrate on which the semiconductor element is bonded by the bond head 220; a driving unit for driving the welding head 220 in a horizontal direction and a vertical direction; and a welding flatness adjusting unit for adjusting flatness of the welding head 220. The welding flatness adjustment unit may include: a slope adjustment table 250 capable of adjusting a slope centering on the driving shaft and for performing a slope adjustment of the welding head 220 by contacting with a tool 230 coupled below the welding head 220; a contact pin 245 which contacts the welding head 220 in order to measure the inclination of the welding head 220; and a controller extracting inclination information of the welding head 220.
In an embodiment, the controller may control the bonding head 220 to bond the semiconductor element to the substrate when the pitch of the bonding head 220 is within the reference pitch range.
In one embodiment, the slope of the slope adjustment table 250 may be changed when the slope of the welding head 220 exceeds a reference slope range.
In one embodiment, the controller may readjust the pitch of the welding head 220 by contacting the tool 230 with a pitch adjustment stage 250 that is changed in pitch.
In one embodiment, the controller may change the X-axis pitch and the Y-axis pitch of the pitch adjustment stage 250 based on the X-axis pitch and the Y-axis pitch of the welding head 220.
In one embodiment, the controller may position the welding head 220 over the contact pin 245, lowering the welding head 220 multiple times until the tool 230 contacts the contact pin, and determining the slope of the welding head 220 based on a value of the lowering distance measured when the welding head 220 is lowered.
In one embodiment, the controller may determine the slope of the weld head 220 by contacting the contact pin 245 to points corresponding to each corner of the tool 230.
The various embodiments of the present invention have been described above, and the detailed description of the invention described and illustrated in the drawings referred to so far is merely exemplary of the present invention, which is used for the purpose of illustrating the invention only, and is not intended to limit or restrict the scope of the invention described in the claims. And thus those skilled in the art will recognize that there are numerous variations and equivalents to the other embodiments described, depending upon which person skilled in the art would understand. Therefore, the true technical scope of the present invention should be determined by the technical idea of the appended claims.
Claims (15)
1. An apparatus for adjusting soldering flatness in a semiconductor component soldering apparatus, the apparatus comprising:
a pitch adjustment table capable of adjusting a pitch about a drive shaft and for performing pitch adjustment of a bonding head for bonding a semiconductor element by contact with a tool attached below the bonding head;
a contact pin that contacts the welding head a plurality of times in order to measure the inclination of the welding head; and
a controller for determining a pitch of the welding head based on a lowering distance value of the welding head for contacting the contact pin a plurality of times,
when the inclination of the welding head exceeds a reference inclination range, the controller changes the inclination of the inclination adjustment table,
the controller contacts the tool with a slope adjustment stage that is changed in the slope to readjust the slope of the welding head.
2. The apparatus of claim 1, wherein the device comprises a plurality of sensors,
the controller controls the bonding head to bond the semiconductor element to a substrate mounted on a bonding stage when a pitch of the bonding head is within a reference pitch range.
3. The apparatus of claim 1, wherein the device comprises a plurality of sensors,
the controller changes the X-axis pitch and the Y-axis pitch of the pitch adjustment stage based on the X-axis pitch and the Y-axis pitch of the welding head.
4. The apparatus of claim 1, wherein the device comprises a plurality of sensors,
the controller positions the bond head over the contact pin,
and lowering the welding head a plurality of times until the tool contacts the contact pin,
and determining a slope of the welding head based on a drop distance value determined when the welding head is dropped.
5. The apparatus of claim 1, wherein the device comprises a plurality of sensors,
the controller determines the inclination of the welding head by bringing the contact pin into contact with points corresponding to respective corners of the tool.
6. A method for adjusting solder flatness in a semiconductor component soldering apparatus, comprising:
a step of bringing a bonding head, which bonds a semiconductor element to a substrate placed in a bonding stage, into contact with a pitch adjustment stage;
a step of measuring the inclination of the welding head;
a step of determining whether to readjust the inclination of the welding head based on the inclination of the welding head;
a step of changing the inclination of the inclination adjustment table when the inclination of the welding head is readjusted; and
a step of readjusting the inclination of the welding head by bringing a tool coupled to the lower side of the welding head into contact with the inclination adjustment table,
the step of determining whether to readjust the pitch of the weld head includes:
and determining to change the inclination of the inclination adjustment table when the inclination of the welding head exceeds a reference inclination range.
7. The method of claim 6, wherein the step of providing the first layer comprises,
the step of determining whether to readjust the pitch of the weld head further comprises:
and determining to bond the semiconductor element to the substrate when the pitch of the bonding head is within a reference pitch range.
8. The method of claim 6, wherein the step of providing the first layer comprises,
the step of changing the slope of the slope adjustment station includes:
and changing the X-axis inclination and the Y-axis inclination of the inclination adjustment table based on the X-axis inclination and the Y-axis inclination of the welding head.
9. The method of claim 6, wherein the step of providing the first layer comprises,
the step of readjusting the pitch of the weld head comprises:
a step of positioning the soldering head above the contact pin;
a step of lowering the welding head a plurality of times until the tool contacts the contact pin; and
and determining the inclination of the welding head based on the descent distance value determined when the welding head descends.
10. The method of claim 6, wherein the step of providing the first layer comprises,
the step of determining the inclination of the welding head comprises:
and a step of measuring the inclination of the welding head by bringing the contact pin into contact with the point corresponding to each corner of the tool.
11. A semiconductor element bonding apparatus, characterized by comprising:
a bonding head for bonding the semiconductor element to the substrate;
a bonding stage for supporting a substrate on which the semiconductor element is bonded by the bonding head;
a driving unit for driving the welding head in a horizontal direction and a vertical direction; and
a welding flatness adjusting unit for adjusting the flatness of the welding head,
the welding flatness adjustment unit includes:
a tilt adjustment table capable of adjusting a tilt about a drive shaft and for performing tilt adjustment of the welding head by contact with a tool coupled below the welding head;
a contact pin that contacts the welding head a plurality of times in order to measure the inclination of the welding head; and
a controller for determining a pitch of the welding head based on a lowering distance value of the welding head for contacting the contact pin a plurality of times,
when the inclination of the welding head exceeds a reference inclination range, the controller changes the inclination of the inclination adjustment table,
the controller contacts the tool with a slope adjustment stage that is changed in the slope to readjust the slope of the welding head.
12. The semiconductor element bonding apparatus according to claim 11, wherein,
the controller controls the bonding head to bond the semiconductor element to the substrate when the pitch of the bonding head is within a reference pitch range.
13. The semiconductor element bonding apparatus according to claim 11, wherein,
the controller changes the X-axis pitch and the Y-axis pitch of the pitch adjustment stage based on the X-axis pitch and the Y-axis pitch of the welding head.
14. The semiconductor element bonding apparatus according to claim 11, wherein,
the controller positions the bond head over the contact pin,
and lowering the welding head a plurality of times until the tool contacts the contact pin,
and determining a slope of the welding head based on a drop distance value determined when the welding head is dropped.
15. The semiconductor element bonding apparatus according to claim 11, wherein,
the controller determines the inclination of the welding head by bringing the contact pin into contact with points corresponding to respective corners of the tool.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020200093383A KR20220014447A (en) | 2020-07-27 | 2020-07-27 | Apparatus for adjusting bonding flatness in semiconductor device bonding apparatus |
| KR10-2020-0093383 | 2020-07-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113977121A CN113977121A (en) | 2022-01-28 |
| CN113977121B true CN113977121B (en) | 2023-05-05 |
Family
ID=79735002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110734291.7A Active CN113977121B (en) | 2020-07-27 | 2021-06-30 | Device and method for adjusting welding flatness in semiconductor element welding equipment |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20220014447A (en) |
| CN (1) | CN113977121B (en) |
| TW (1) | TWI792421B (en) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3011868B2 (en) * | 1995-04-04 | 2000-02-21 | 株式会社神戸製鋼所 | Torch angle adjustment device for automatic welding equipment |
| JP3101221B2 (en) * | 1997-01-23 | 2000-10-23 | 日鐵溶接工業株式会社 | Two-electrode single-sided gas shielded arc welding method |
| SG191479A1 (en) * | 2011-12-27 | 2013-07-31 | Apic Yamada Corp | Method for resin molding and resin molding apparatus |
| JP6144425B2 (en) * | 2014-07-15 | 2017-06-07 | ブリルニクス インク | Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus |
| CN104384736A (en) * | 2014-09-19 | 2015-03-04 | 广州特种承压设备检测研究院 | Automatic high temperature chloride corrosion resisting layer surfacing device of irregular surface and surfacing method |
| CN104308347A (en) * | 2014-10-10 | 2015-01-28 | 哈尔滨工业大学 | Device for measuring and feeding back spatial attitude of welding gun relative to welding seam |
| JP6470054B2 (en) * | 2015-01-26 | 2019-02-13 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
| CN106181027B (en) * | 2016-08-27 | 2018-11-23 | 洛阳鹏起实业有限公司 | Laser welding head verticality adjusting method and laser welding head device |
| CN206677416U (en) * | 2017-04-28 | 2017-11-28 | 正兴车轮集团有限公司 | A kind of wheel synthesizes welder |
| US10879214B2 (en) * | 2017-11-01 | 2020-12-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Die stack structure and method of fabricating the same |
| CN110361569A (en) * | 2019-07-26 | 2019-10-22 | 云谷（固安）科技有限公司 | A kind of probe assembly and test device |
| CN110328477A (en) * | 2019-07-29 | 2019-10-15 | 南京涵铭置智能科技有限公司 | A kind of spot welding robot and welding method for industrial welding |
-
2020
- 2020-07-27 KR KR1020200093383A patent/KR20220014447A/en not_active Application Discontinuation
-
2021
- 2021-06-30 CN CN202110734291.7A patent/CN113977121B/en active Active
- 2021-07-15 TW TW110126109A patent/TWI792421B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220014447A (en) | 2022-02-07 |
| TWI792421B (en) | 2023-02-11 |
| CN113977121A (en) | 2022-01-28 |
| TW202204081A (en) | 2022-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7405581B2 (en) | Probing system uses a probe device including probe tips on a surface of a semiconductor die | |
| US10481200B2 (en) | Semiconductor device test apparatuses comprising at least one test site having an array of pockets | |
| JP4794624B2 (en) | Probe card manufacturing method and manufacturing apparatus | |
| JP6515007B2 (en) | Wafer inspection method and wafer inspection apparatus | |
| KR102336343B1 (en) | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements | |
| US20060169678A1 (en) | Probe positioning and bonding device and probe bonding method | |
| JPH07231018A (en) | Probe apparatus | |
| JP2008053624A (en) | Alignment apparatus | |
| US20100225345A1 (en) | Apparatus and method for testing a semiconductor device | |
| TWI638173B (en) | Detector and probe card tip grinding device | |
| CN113977121B (en) | Device and method for adjusting welding flatness in semiconductor element welding equipment | |
| JPH07130920A (en) | Burn-in socket and burn-in test method using it | |
| JP2008192861A (en) | Semiconductor inspection apparatus and method | |
| JP2006261267A (en) | Testing device and testing method, integrated circuit device and method for manufacturing the same | |
| JP5407925B2 (en) | Integrated circuit device manufacturing method and inspection device | |
| US6864697B1 (en) | Flip-over alignment station for probe needle adjustment | |
| EP1625406A2 (en) | Device probing using a matching device | |
| JP3497748B2 (en) | Inspection method for semiconductor integrated circuit | |
| JP2010219253A (en) | Probe inspection method and prober | |
| JP2007165598A (en) | Prober, probe contact method, and program for it | |
| KR102382690B1 (en) | Probe Array Bonding System and the method for bonding probe using the same | |
| KR102442065B1 (en) | Apparatus for testing semiconductor device and method thereof | |
| US20230062076A1 (en) | Probe card, apparatus and method for detecting contact force of probe card | |
| US20230326778A1 (en) | Methods of adjusting a tilt between a bonding tool assembly and a support structure assembly of a bonding system, and related bonding systems | |
| KR102107293B1 (en) | Solder ball attachment method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |