CN113972314A - Welding integration technology and tool for medium-high temperature thermoelectric power generation device - Google Patents
Welding integration technology and tool for medium-high temperature thermoelectric power generation device Download PDFInfo
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- 238000003466 welding Methods 0.000 title claims abstract description 72
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/01—Manufacture or treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
Abstract
The invention discloses a welding integration technology and a tool for a medium-high temperature thermoelectric power generation device, and belongs to the technical field of thermoelectric power generation device integration. The welding integration technology comprises the following steps: sintering materials, surface treatment, deposition of connecting layers, cutting particles, screen printing, positioning assembly and welding. The invention adopts the screen printing technology to coat the high-temperature soldering paste on the electrode of the high-temperature thermoelectric device substrate or the electrode end face of the thermoelectric material, and combines the vacuum welding process to realize the batch integrated development of the medium and high-temperature thermoelectric device; on one hand, the high-precision self-adhesion of soldering paste can be realized, the complicated degree and the positioning difficulty of assembly are simplified, meanwhile, the soldering paste can realize the full contact between the thermoelectric block and the electrode pad and between heterogeneous materials, and the soldering quality and the dimensional precision of the whole device at high temperature are ensured; on the other hand, the integration efficiency of the medium-high temperature thermoelectric device is greatly improved.
Description
Technical Field
The invention relates to the technical field of thermoelectric power generation device integration, in particular to a welding integration technology and a tool for a medium-high temperature thermoelectric power generation device.
Background
The implementation of the current carbon neutralization and carbon peak-reaching strategy puts higher requirements on efficient recycling of energy, and the thermoelectric power generation technology based on semiconductor materials is a static energy conversion technology, has the advantages of high reliability, long service life, miniaturization and the like, and has very wide application prospect in the field of low-grade waste heat recovery.
At present, thermoelectric power generation devices are mainly divided into low-temperature devices, medium-temperature devices and high-temperature devices according to working temperature, wherein the low-temperature devices generally adopt a bismuth telluride material system, and the working temperature is below 300 ℃; the working temperature range of the high-temperature end of the medium-temperature device is 300-600 ℃, and is represented by a cobalt device, lead telluride and other systems; the working temperature of the high-temperature device is over 600 ℃, and is mainly based on half-heusler alloy, silicon germanium and other material systems. In addition, in order to improve the conversion efficiency of thermoelectric devices, a multi-stage wide temperature range structure design is generally adopted, and the structure can be divided into a gradient structure and a cascade structure according to the structure type. The cascade structure module is characterized in that a plurality of power generation modules working in different temperature ranges are mutually overlapped and used at the module level, and between two adjacent stages of modules, the cold end of a high-temperature stage module is connected with the hot end of a low-temperature stage module, so that the two stages or multi-stage modules form series connection in the heat flow direction. In the cascade structure module, the heat that high temperature level module flowed out can flow into low temperature level module once more, and heat energy is retrieved and is converted into the electric energy step by step through flowing through multistage module for whole energy conversion efficiency obtains promoting. The gradient structure module is characterized in that 2 or more than 2 thermoelectric materials with different optimal working temperature ranges are utilized to be connected in series to form a multi-section element along the heat flow direction when a single-couple element is designed, the optimal thermoelectric-to-electric conversion performance of each section of material is fully exerted, the average ZT value of the material element in the whole temperature range is improved by utilizing the multi-section gradient structure, and the maximum power generation capacity of the module in the whole temperature range is realized. Because a multi-level structure is formed at the element level, the whole module can realize the power output of a single loop, and compared with a cascade structure, the gradient structure module has very high integration, high mechanical strength and strong universality; meanwhile, the number of interface layers is small, the integral interface loss is small, and higher conversion efficiency is easy to realize.
At present, the integration of medium-high temperature thermoelectric devices still faces very large process difficulties, and the integration welding of the medium-high temperature thermoelectric devices is mainly difficult by adopting a one-step sintering diffusion welding process or adopting a solid soldering lug combined with hot-pressing diffusion welding. However, the solid diffusion welding process has high requirements on the processing and assembling precision of devices, and the too large processing tolerance of materials easily causes the too low local welding strength or the poor dimensional consistency of finished devices; meanwhile, the positioning and assembling efficiency of the solid soldering lug is very low, and the requirement of industrial mass production cannot be met. In addition, when a device with a multi-level structure is integrated, due to the great difference of the temperature endured by different materials, the simultaneous integrated welding of a multi-level heterogeneous interface cannot be simultaneously satisfied by adopting the solid-state diffusion welding process. Therefore, it is necessary to develop a novel medium-high temperature thermoelectric device integration technology which is efficient and suitable for mass production.
Aiming at the respective defects of the processes, the invention provides a method for coating high-temperature welding paste on the end faces of the substrate electrode or the thermoelectric material electrode of the high-temperature thermoelectric device by adopting a screen printing technology and realizing the batch integrated development of the medium-high thermoelectric device by combining a vacuum or atmosphere pressurization reflow welding process; the high-precision self-adhesion of the slurry can be realized by adopting screen printing, the complex assembly degree and the positioning difficulty are greatly simplified, the method is suitable for a rapid automatic process, meanwhile, the self-adaptive contact between the thermoelectric block material and the electrode pad and between heterogeneous materials can be realized by welding the slurry, the welding quality and the size of the whole device at high temperature are ensured, and the method has a very remarkable advantage for one-step welding of a multi-section device.
The integration of medium-high temperature thermoelectric devices also faces very large process difficulties: the integrated welding of the medium-high temperature thermoelectric device mostly adopts a one-step sintering diffusion welding process or adopts a solid soldering lug combined with hot-pressing diffusion welding. However, the solid diffusion welding process has high requirements on the processing and assembling precision of the device, and the excessively large processing tolerance of the material pair easily causes the excessively low local welding strength or the poor dimensional consistency of the formed device; meanwhile, the positioning and assembling efficiency of the solid soldering lug is very low, and the requirement of industrial mass production cannot be met. In addition, when a device with a multi-level structure is integrated, due to the great difference of the temperature endured by different materials, the simultaneous integrated welding of a multi-level heterogeneous interface cannot be simultaneously satisfied by adopting the solid-state diffusion welding process. Therefore, it is necessary to develop a novel medium-high temperature thermoelectric device integration technology which is efficient and suitable for mass production.
Disclosure of Invention
Aiming at the technical problems, the invention provides a method for coating high-temperature welding paste on the end face of a high-temperature thermoelectric device substrate electrode or a thermoelectric material electrode by adopting a screen printing technology and realizing batch integrated development of medium and high-temperature thermoelectric devices by combining a vacuum or atmosphere pressurization reflow welding process.
In order to achieve the purpose, the invention adopts the technical scheme that:
the invention provides a welding integration technology of a medium-high temperature thermoelectric power generation device, which comprises the following steps:
sintering an N/P type medium-high temperature thermoelectric material;
step two, surface treatment: processing the sintered N/P type medium-high temperature thermoelectric material according to the design height, polishing two sides, and then carrying out surface treatment on the polished surface;
step three, deposition of a connecting layer: depositing metal connecting layers on the upper surface and the lower surface of the material subjected to the surface treatment in the step II;
cutting the particles: cutting the material with the connecting layers deposited on the upper and lower surfaces in the step (III) into thermoelectric particles used for the thermoelectric power generation device according to the design size;
step five, silk-screen printing: uniformly coating soldering paste on an upper substrate and a lower substrate of a medium-high temperature thermoelectric power generation device by adopting a screen printing technology, wherein the uniform coating is uniformly coated on metal circuit layers of the upper substrate and the lower substrate;
step sixthly, positioning and assembling: sequentially putting a lower substrate printed with soldering paste, N/P type medium-high temperature thermoelectric material single-arm particles and an upper substrate printed with the soldering paste into a welding mould;
step (c), welding: and (4) carrying out vacuum pressure brazing to obtain the medium-high temperature thermoelectric power generation device.
In a preferred embodiment, in step (r), the N/P type medium-high temperature thermoelectric material is selected from a skutterudite-based medium-high temperature thermoelectric material, a half heusler alloy-based medium-high temperature thermoelectric material, a PbTe-based medium-high temperature thermoelectric material, and Mg2Si-based medium-high temperature thermoelectric material, Mg3Sb2Any of medium-high temperature thermoelectric materials or other thermoelectric power generation materials with an applicable temperature of 300 ℃ or higher;
preferably, the sintering can adopt spark plasma sintering or hot-press sintering;
preferably, the sintering pressure of the sintering is 50-100MPa, and the sintering time is 5-30 minutes; the sintering density is more than 95%.
In the technical scheme of the invention, the sintering temperature of the skutterudite-based high-temperature thermoelectric material is 500-650 ℃, the sintering temperature of the half-heusler alloy-based high-temperature thermoelectric material is 800-1000 ℃, the sintering temperature of the PbTe-based high-temperature thermoelectric material is 500-600 ℃, and the sintering temperature of the PbTe-based high-temperature thermoelectric material is 500-600 ℃2The sintering temperature of the Si-based medium-high temperature thermoelectric material is 550-650 ℃.
In the second step, the surface treatment is selected from one or more of sand blasting roughening, weak acid etching and plasma surface treatment.
In the technical scheme of the invention, the surface treatment is to remove a dirt layer on the surface of the sintered material and improve the bonding strength of the transition layer.
In step (c), the deposition is selected from one or more of magnetron sputtering deposition, plasma spray deposition and electrodeposition; the metal is selected from at least one of Ni, Cr, Mo and W;
preferably, the thickness of the metal connection layer is 100nm-50 μm.
Preferably, in the fifth step, the solder paste is selected from any one of CuAgZn-based solder paste, CuAgTi-based solder paste, Ni-based solder paste, Al-based solder paste, nano-Ag solder paste, and nano-Cu solder paste; the grain size of the soldering paste is 10nm-50 mu m, and the viscosity is 10K-2000 KPa.S.
Preferably, in the step (c), the welding temperature is 400-1000 ℃, the vacuum degree is less than or equal to 10Pa or under the protection of inert gas, and the pressure of the pressure brazing is 0.1-25 MPa.
The second aspect of the invention provides the application of the welding integration technology of the medium-high temperature thermoelectric power generation device in the field of electronic packaging.
The invention provides a welding tool for welding integration technology of the medium-high temperature thermoelectric power generation device, which comprises the thermoelectric power generation device and a welding mould, wherein the thermoelectric power generation device comprises an upper substrate, a lower substrate and a thermoelectric unit; the welding mould comprises an upper base and a lower base;
the upper substrate is attached to the lower surface of the upper base, the lower substrate is attached to the upper surface of the lower base, and the thermoelectric units are arranged between the upper substrate and the lower substrate.
Preferably, the thermoelectric unit is composed of the thermoelectric particles, and includes N-type thermoelectric particles and P-type thermoelectric particles, which are arranged between the upper substrate and the lower substrate at intervals in the horizontal and vertical directions.
Preferably, the sizes of the N-type thermoelectric particles and the P-type thermoelectric particles are between 0.2mm × 0.2mm × 0.5mm and 10mm × 10mm × 30 mm.
Preferably, the upper base and the lower base are both graphite bases, the sizes of the upper base and the lower base are 10mm-5000mm, and the lower base is provided with a thermocouple hole.
Preferably, the welding jig for the welding integration technology of the medium-high temperature thermoelectric power generation device further comprises a positioning unit, the positioning unit comprises a positioning hole, a positioning rod and a positioning screen plate for positioning the thermoelectric particles, the positioning hole comprises a first positioning hole arranged on the upper base, a second positioning hole arranged on the positioning screen plate and a third positioning hole arranged on the lower base, and the positioning rod fixes and assembles the upper base, the positioning screen plate and the lower base from top to bottom through the first positioning hole, the second positioning hole and the third positioning hole.
In the technical scheme of the invention, in the welding process, the upper substrate and the lower substrate are respectively attached to the upper base and the lower base, the positioning rods can assemble all the components, and the positioning screen plate is used for realizing the interval positioning of thermoelectric particles.
Preferably, the positioning net plate is made of nylon, rubber, steel or graphite.
Preferably, a solder paste is uniformly printed on the metal circuit layers of the upper substrate and the lower substrate, and the solder paste is selected from any one of CuAgZn-based solder paste, CuAgTi-based solder paste, Ni-based solder paste, Al-based solder paste, nano-Ag solder paste, and nano-Cu solder paste; the grain size of the soldering paste is 10nm-50 mu m, and the viscosity is 10K-2000 KPa.S.
Preferably, the printing is screen printing.
According to the technical scheme, the screen printing adopts a steel sheet mesh, and the thickness of the steel sheet mesh is 0.01mm-0.3 mm.
In the technical scheme of the invention, the welding jig is placed in a high-temperature brazing platform in the using process, and a heavy object pressurizing or pressurizing device is adopted to perform pressure brazing on the upper base and the lower base.
In the technical scheme of the invention, the upper substrate is used as a cold end of the thermoelectric device, and the lower substrate is used as a hot end of the thermoelectric device.
The technical scheme has the following advantages or beneficial effects:
according to the invention, the high-temperature thermoelectric power generation device is welded and integrated by adopting screen printing, on one hand, high-precision self-adhesion of slurry can be realized, the assembly complexity and the positioning difficulty are greatly simplified, and the method is suitable for a rapid automatic process; meanwhile, the high-temperature welding slurry is prepared from ultrafine powder, the high-temperature sintering diffusion activity of the high-temperature welding slurry is far higher than that of a solid soldering lug, and powder metallurgy type densification welding can be realized at the temperature lower than the melting point, so that the welding integration temperature of medium-high temperature thermoelectric devices is greatly reduced, the use temperature is basically equivalent to that of the solid soldering lug with the same component, and the high-temperature welding slurry has a very remarkable advantage for one-step welding of multi-section devices. In addition, the screen printing is combined with the vacuum brazing, so that the method is more suitable for large-scale mass production, and the integration efficiency of medium-high temperature thermoelectric devices can be greatly improved.
Drawings
Fig. 1 is a process flow diagram of a welding integration technology of a medium-high temperature thermoelectric power generation device in the present invention.
Fig. 2 is a schematic structural view of a welding jig in embodiment 1 of the present invention.
Fig. 3a is a screen structure view of a steel sheet mesh used for screen printing of a lower substrate in example 1.
Fig. 3b is a screen structure view of a steel sheet mesh for screen printing of an upper substrate in example 1.
Fig. 4 is a result of a power generation performance test of the skutterudite device in example 1.
Fig. 5 is a result of a power generation performance test of the half heusler device in example 2.
Detailed Description
The following examples are only a part of the present invention, and not all of them. Thus, the detailed description of the embodiments of the present invention provided below is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention without making creative efforts, belong to the protection scope of the invention.
Example 1:
respectively carrying out hot-pressing sintering on the N-type skutterudite material and the P-type skutterudite material at 650 ℃ and 550 ℃, wherein the pressure is 60MPa, the sintering density is 95 percent by keeping the temperature for 30 minutes; then, thinning and polishing the double-sided surface to 8mm in thickness, adopting dilute hydrochloric acid to corrode, sequentially sputtering Nb and Ni metal connecting layers under magnetron sputtering to obtain 3 microns and 5 microns in thickness, and then cutting the Nb and Ni metal connecting layers into 4mm 8mm thermoelectric particles 7; the method comprises the steps of preparing CuAgZn soldering paste to be 800Kcps in viscosity, adopting a steel sheet mesh with the thickness of 0.01mm, evenly coating the soldering paste on an alumina substrate with the size of 20mm x 20mm through screen printing to obtain an upper substrate 8 (shown in figure 3b as the steel sheet mesh used for screen printing of the upper substrate 6) and a lower substrate 6 (shown in figure 3a as the steel sheet mesh used for screen printing of the lower substrate 6), positioning thermoelectric particles 7 at intervals through a positioning screen 2, then carrying out pressure brazing at 700 ℃, wherein the pressure is 1MPa, and obtaining the medium-temperature-region skutterudite device.
The structure diagram of the welding jig in this embodiment is shown in fig. 1, and the welding jig includes a lower base 1, a positioning screen 2, a positioning rod 3, an upper base 4, and a thermocouple insertion hole 5, wherein a mesh on the positioning screen 2 is used for inserting thermoelectric particles 7 to realize positioning (not shown), and positioning grooves (not shown) are provided on the upper base 4 and the lower base 1 and used for attaching and positioning holes (not shown) of an upper substrate 8 and a lower substrate 6. During welding, evenly paint the soldering paste on the metal circuit layer of upper substrate 8, infrabasal plate 6 after, with upper substrate 8, infrabasal plate 6 respectively with last base 4 and the 1 laminating of base down, then install the location with thermoelectric granule 7 through the mesh on the positioning screen board 2, according to from top to bottom being in proper order: after the upper base 4, the upper substrate 8, the positioning screen 2 with the thermoelectric particles 7 positioned, the lower base 6 and the lower base 1 are assembled in sequence, the positioning rod 3 is inserted into positioning holes formed in the upper base 4, the upper substrate 8, the lower base 1 and the lower base 6, then a thermocouple is welded through a thermocouple jack 5 formed in the lower base 1, and in the welding process, a heavy object pressurizing or pressurizing device is adopted to apply pressure to the upper base 4 and the lower base 6. Wherein lower base 1 and upper base 2 are the graphite base, scribble the soldering paste on the metal circuit layer on infrabasal plate 6 and the upper substrate 8 and adopt the screen printing mode, and the thermoelectric device of different design specifications can be compatible simultaneously to its screen specification.
The power generation performance data of the medium-temperature-region skutterudite device prepared by the embodiment is shown in fig. 4, the current-voltage curves of the device at different temperatures are detected in the testing method, the solid line in fig. 4 is voltage U, the dotted line is power P, and it can be seen from the graph that the medium-temperature-region device prepared by the process has good power generation performance.
Table 1 is an internal resistance test table of the medium-temperature-region skutterudite device in this embodiment, which is data obtained by a 1KHz alternating current bridge test. As can be seen from the table, the deviation of the internal resistance of the medium-temperature-region skutterudite device in the embodiment is within 1%.
TABLE 1
Example 2
Adding N type Zr0.5Hf0.5NiSn0.98Sb0.02And P type Nb0.8Ti0.2The FeSb material is subjected to discharge plasma sintering at 850 ℃ and 850 ℃ respectively, the pressure is 60MPa, the heat is preserved for 15 minutes, the sintering is compact, and the sintering density is 95%; then after double-sided surface polishing and plasma treatment, electroplating a Cr/Ni connecting layer with the thickness of 2 microns and 5 microns respectively, and then cutting into thermoelectric particles with the thickness of 4mm 12 mm; and (3) preparing the CuAgTi soldering paste to the viscosity of 1600Kcps, printing the CuAgTi soldering paste on an aluminum nitride substrate with the size of 20mm x 20mm by adopting a steel sheet net with the thickness of 0.3mm, positioning thermoelectric particles, and then carrying out pressure brazing at 850 ℃ under the pressure of 5MPa to obtain the high-temperature region half-heusler power generation device.
The welding jig structure and installation in this embodiment are the same as those in embodiment 1.
The power generation performance data of the half-heusler power generation device in the high-temperature region prepared in the embodiment is shown in fig. 5, the test detects a current-voltage curve of the device at different temperatures, a solid line is voltage U, and a dotted line is power P in fig. 5, so that it can be seen that the power output of the thermoelectric device in the embodiment has good stability.
Table 2 is an internal resistance test table of the half-heusler power generation device in the high temperature region in this embodiment, which is data obtained by the 1KHz ac bridge test. It can be seen from the graph that the high-temperature device in the present embodiment has good dimensional internal resistance uniformity (standard deviation of internal resistance of 1.02%)
TABLE 2
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent modifications made by the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A welding integration technology of a medium-high temperature thermoelectric power generation device is characterized by comprising the following steps:
sintering an N/P type medium-high temperature thermoelectric material;
step two, surface treatment: processing the sintered N/P type medium-high temperature thermoelectric material according to the design height, polishing two sides, and then carrying out surface treatment on the polished surface;
step three, deposition of a connecting layer: depositing metal connecting layers on the upper surface and the lower surface of the material subjected to the surface treatment in the step II;
cutting the particles: cutting the material with the connecting layers deposited on the upper and lower surfaces in the step (III) into thermoelectric particles used for the thermoelectric power generation device according to the design size;
step five, silk-screen printing: uniformly coating soldering paste on an upper substrate and a lower substrate of a medium-high temperature thermoelectric power generation device by adopting a screen printing technology, wherein the uniform coating is uniformly coated on metal circuit layers of the upper substrate and the lower substrate;
step sixthly, positioning and assembling: sequentially putting a lower substrate printed with soldering paste, N/P type medium-high temperature thermoelectric material single-arm particles and an upper substrate printed with the soldering paste into a welding mould;
step (c), welding: and (4) carrying out vacuum pressure brazing to obtain the medium-high temperature thermoelectric power generation device.
2. The welding integration technology of claim 1, wherein in step (r), the N/P type medium-high temperature thermoelectric material is a thermoelectric material with an applicable temperature above 300 ℃;
preferably, the N/P type medium-high temperature thermoelectric material is selected from skutterudite-based medium-high temperature thermoelectric material, half heusler alloy-based medium-high temperature thermoelectric material, PbTe-based medium-high temperature thermoelectric material, Mg2Si-based medium-high temperature thermoelectric material, Mg3Sb2Any of medium-high temperature thermoelectric materials;
preferably, the sintering can adopt spark plasma sintering or hot-press sintering;
preferably, the sintering pressure of the sintering is 50-100MPa, and the sintering time is 5-30 minutes; the sintering density is more than 95%.
3. The welding integration technique of claim 1, wherein the surface treatment in step (ii) is selected from one or more of grit blasting roughening, weak acid etching, and plasma surface treatment.
4. The welding integration technique of claim 1, wherein in step (c), the deposition is selected from one or more of magnetron sputtering deposition, plasma spray deposition and electrodeposition, and the metal is selected from at least one of Ni, Cr, Mo and W;
preferably, the thickness of the metal connection layer is 100nm-50 μm.
5. The soldering integration technique according to claim 1, wherein in step (v), the solder paste is selected from any one of CuAgZn-based solder paste, CuAgTi-based solder paste, Ni-based solder paste, Al-based solder paste, nano-Ag solder paste, and nano-Cu solder paste; the grain size of the soldering paste is 10nm-50 mu m, and the viscosity is 10K-2000 KPa.S.
6. The welding integration technology as claimed in claim 1, wherein in step (c), the welding temperature is 400 ℃ and the vacuum degree is less than or equal to 10Pa or under the protection of inert gas, and the pressure of the pressure brazing is 0.1-25 MPa.
7. Use of the integrated technology of welding of medium-high temperature thermoelectric power generation devices according to any of claims 1 to 6 in the field of electronic packaging.
8. A welding jig for welding integration technology of medium-high temperature thermoelectric power generation devices, characterized in that the welding integration technology for medium-high temperature thermoelectric power generation devices of any one of claims 1 to 6 comprises a thermoelectric power generation device and a welding mold, wherein the thermoelectric power generation device comprises an upper substrate, a lower substrate and a thermoelectric unit; the welding mould comprises an upper base and a lower base;
the upper substrate is attached to the lower surface of the upper base, the lower substrate is attached to the upper surface of the lower base, and the thermoelectric units are arranged between the upper substrate and the lower substrate.
9. The welding jig of welding integration technology of medium-high temperature thermoelectric power generation device according to claim 8, wherein the thermoelectric unit is composed of the thermoelectric particles as set forth in claim 1, comprising N-type thermoelectric particles and P-type thermoelectric particles, which are arranged between the upper and lower substrates at intervals in a lateral and vertical direction;
preferably, the sizes of the N-type thermoelectric particles and the P-type thermoelectric particles are between 0.2mm multiplied by 0.5mm and 10mm multiplied by 30 mm;
preferably, the upper base and the lower base are both graphite bases, the sizes of the upper base and the lower base are 10mm-5000mm, and the lower base is provided with a thermocouple hole.
10. The welding jig of the welding integration technology of the medium-high temperature thermoelectric power generation device according to claim 8, further comprising a positioning unit, wherein the positioning unit comprises a positioning hole, a positioning rod and a positioning mesh plate for positioning the thermoelectric particles, the positioning hole comprises a first positioning hole arranged on the upper base, a second positioning hole arranged on the positioning mesh plate and a third positioning hole arranged on the lower base, and the positioning rod fixedly assembles the upper base, the positioning mesh plate and the lower base from top to bottom through the first positioning hole, the second positioning hole and the third positioning hole;
preferably, a solder paste is uniformly printed on the metal circuit layers of the upper substrate and the lower substrate, and the solder paste is selected from any one of CuAgZn-based solder paste, CuAgTi-based solder paste, Ni-based solder paste, Al-based solder paste, nano-Ag solder paste, and nano-Cu solder paste; the grain size of the soldering paste is 10nm-50 mu m, and the viscosity is 10K-2000 KPa.S.
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| US20040042181A1 (en) * | 2002-06-26 | 2004-03-04 | Kyocera Corporation | Thermoelectric module and process for producing the same |
| CN104766922A (en) * | 2015-04-15 | 2015-07-08 | 中国科学院福建物质结构研究所 | Manufacturing method of flexible thermo-electric device and manufactured flexible thermo-electric device |
| WO2017066261A2 (en) * | 2015-10-13 | 2017-04-20 | Alphabet Energy, Inc. | Oxidation and sublimation prevention for thermoelectric devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040042181A1 (en) * | 2002-06-26 | 2004-03-04 | Kyocera Corporation | Thermoelectric module and process for producing the same |
| CN104766922A (en) * | 2015-04-15 | 2015-07-08 | 中国科学院福建物质结构研究所 | Manufacturing method of flexible thermo-electric device and manufactured flexible thermo-electric device |
| WO2017066261A2 (en) * | 2015-10-13 | 2017-04-20 | Alphabet Energy, Inc. | Oxidation and sublimation prevention for thermoelectric devices |
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