CN113966111B - Manufacturing method of hardware decorative rear cover with grounding function - Google Patents
Manufacturing method of hardware decorative rear cover with grounding function Download PDFInfo
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- CN113966111B CN113966111B CN202111095992.7A CN202111095992A CN113966111B CN 113966111 B CN113966111 B CN 113966111B CN 202111095992 A CN202111095992 A CN 202111095992A CN 113966111 B CN113966111 B CN 113966111B
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- grounding
- rear cover
- tft screen
- hardware
- instrument
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05F—STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- H05F3/00—Carrying-off electrostatic charges
- H05F3/02—Carrying-off electrostatic charges by means of earthing connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0064—Earth or grounding circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Elimination Of Static Electricity (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a manufacturing method of a hardware decorative rear cover with a grounding function, which belongs to the technical field of hardware decorative rear covers, and comprises the following steps of: step 1: pretreatment; step 2: copper exposure treatment; step 3: electrophoresis; step 4: laser; step 5: drying; step 6: assembling; step 1 includes step 11 and step 12; step 11: a PCB assembly, a conductive foam, a TFT screen and a TFT screen hardware rear cover are provided. The part which can be seen by a user through the hardware rear cover is made black, the part which needs to be grounded to the internal structure (the part which can not be seen by the user) is made into a conductive area, the purpose of laser etching is to remove the surface insulating layer after electrophoresis by adopting a laser etching process, and the purpose of grounding the part of the internal structure is achieved by laser etching in the whole insulating local area according to the actual design requirement of the product.
Description
Technical Field
The invention relates to the technical field of hardware decorative rear covers, in particular to a manufacturing method of a hardware decorative rear cover with a grounding function.
Background
Hardware: the traditional hardware, also called as 'small hardware', historically goes into the modern industrial society, the metal-hardware industry is rapidly developed, the hardware industry plays an immeasurable role in national economy development, and the hardware also becomes an industrial link indispensable for industrial manufacturing. But as a kit for industrial manufacture, a semi-finished product, a tool for a production process, etc. Only a small portion of the daily hardware products are tool-type consumer products which are necessary for life of people, and the related products in the classification of metal products in the manufacturing industry, general parts in the general equipment manufacturing, and the like form the 'hardware in the general sense'. It follows that' hardware is not an existing industry category, but a cross-over combination of several metal products-hardware products. Throughout the manufacturing industry, the 'hardware' has the responsibility of providing the manufacturing enterprise with parts and manufacturing tools, rather than as end-use, industry-specific equipment.
Along with the development of the era, the field of hardware application is also more and more, more and more vehicles now adopt double screen design, because double screen products need to be installed on the IP center console, need design mounting structure, a plurality of mounting structure lug on the back lid surpasss touch display screen appearance edge, just so can lock the attaching screw at the hole on the mounting lug, then the host computer factory can install the apron, to the structure of apron and touch display screen concatenation, owing to design upper cover plate and touch screen need keep suitable clearance, generally at 0.5 ~ 2.0mm, this must necessarily lead to back lid mounting lug local exposure, seen by the user.
At present, the rear cover is made of hardware materials such as SECC (Steel Electrodeposition Cold Common acronym, namely electrogalvanized cold-rolled steel plate) which can be classified into Common grade Common, stamping grade Draw and deep-drawing grade electrode due to higher stress caused by vibration and impact tests. The surface of the SECC material is already provided with a galvanized layer, the surface has a protective effect and conductive performance, but the color of the SECC material is silvery white, so that the SECC material is in very clear contrast with the black contrast of a touch screen on the front surface, and uncomfortable feeling can be caused when the SECC material is seen by a user. On the other hand, as OEM delivers the double-screen product to the host factory, the whole outer side surface of the rear cover is exposed because the rear cover structure is not mounted on the vehicle, and the color contrast difference between the black touch screen and the silvery white rear cover is large, so that the grade of the double-screen product is reduced.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a manufacturing method of a hardware decorative rear cover with a grounding function, which has the characteristics of playing a role in decoration and simultaneously playing a role in conducting an internal structure.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the manufacturing method of the hardware decorative rear cover with the grounding function comprises the following steps of:
step 1: pretreatment;
step 2: copper exposure treatment;
step 3: electrophoresis;
step 4: laser;
step 5: drying;
step 6: assembling;
step 1 includes step 11 and step 12;
step 11: providing a PCB assembly, a conductive foam, a TFT screen and a TFT screen hardware rear cover;
step 111: attaching a plurality of grounding foam on the PCB assembly;
step 112: coating conductive cloth outside the conductive foam;
step 113: a plurality of grounding foam is attached to the PCB assembly, conductive cloth is coated outside the conductive foam, and the conductive foam is contacted and conducted with the TFT screen hardware rear cover at the back of the screen to form a grounding loop;
step 12: providing an instrument PCB assembly, an instrument TFT screen and an instrument TFT screen hardware rear cover;
step 121: a plurality of grounding spring plates are attached to the instrument PCB assembly;
step 122: a plurality of grounding spring plates are attached to the instrument PCB assembly and are contacted and conducted with the instrument TFT screen hardware rear cover at the back of the instrument TFT screen to form a grounding loop;
the copper exposure treatment specifically comprises the following steps: the PCB assembly is attached with a plurality of grounding foam, the meter PCB assembly is attached with a plurality of grounding spring plates, the meter PCB back to the TFT screen is provided with a plurality of metal copper exposure grounding areas, and the meter PCB back to the meter TFT screen is also provided with a plurality of metal copper exposure grounding areas for copper exposure treatment.
Further, the PCB board subassembly is last to attach a plurality of ground connection bubble cotton, the outside cladding conductive cloth of conductive bubble is contacted with TFT screen five metals back lid at TFT screen back and is switched on and form the ground circuit, the instrument PCB board subassembly is last to attach a plurality of ground connection shell fragment and the contact of instrument TFT screen five metals back lid at instrument TFT screen back and is switched on and form the ground circuit, PCB board is facing away from TFT screen and is had a plurality of metal copper exposure ground areas with instrument PCB board is facing away from instrument TFT screen and is also had a plurality of metal copper exposure ground areas, and these metal copper exposure areas contact with the lid behind the five metals and form the ground circuit.
Further, a plurality of instrument side conductive foam and side conductive foam one end all contact with the TFT screen, and the other end all contacts with the metal decoration back lid. .
Further, the exposed visual areas of the rear hardware decorative cover are black, the rear hardware decorative cover is made of cold-rolled steel plates, the rear hardware decorative cover is processed through an electrophoresis process, and the rear hardware decorative cover is made of a SPCC, SPCD, SPCE substrate.
Further, the grounding invisible part parts such as the hardware decorative rear cover, the internal structure part TFT screen, the instrument TFT screen, the PCB assembly and the instrument PCB assembly are all made of a laser etching process.
Further, the assembly is specifically divided into the following steps:
step S1: the touch screen component and the TFT screen can be fully attached or framed to form a touch display module;
step S2: the touch display module and the panel assembly can be connected into a whole by using adhesive tape or glue;
step S3: the PCB assembly and the instrument PCB assembly are pre-fixed to the panel through buckles, and the rear cover is finally assembled.
In summary, the invention has the following beneficial effects:
1. the device comprises a PCB assembly, a plurality of grounding foam pieces, conductive foam pieces, a plurality of grounding spring pieces, a plurality of metal copper exposure grounding areas, a plurality of grounding foam pieces and a plurality of grounding foam pieces, wherein the grounding foam pieces are attached to the PCB assembly, the conductive foam pieces are externally coated with conductive cloth and are in contact conduction with a TFT screen hardware rear cover on the back of a TFT screen to form a grounding loop, the grounding spring pieces are attached to the PCB assembly and are in contact conduction with the TFT screen hardware rear cover on the back of the TFT screen to form a grounding loop, and the metal copper exposure grounding areas are also attached to the PCB assembly and are in contact conduction with the TFT screen hardware rear cover on the back of the TFT screen to form a grounding loop.
2. The part which can be seen by a user through the hardware rear cover is made black, the part which needs to be grounded to the internal structure (the part which can not be seen by the user) is made into a conductive area, the purpose of laser etching is to remove the surface insulating layer after electrophoresis by adopting a laser etching process, and the purpose of grounding the part of the internal structure is achieved by laser etching in the whole insulating local area according to the actual design requirement of the product.
Drawings
FIG. 1 is a schematic flow chart of the process of the present invention;
FIG. 2 is a schematic diagram of a pretreatment process according to the present invention;
FIG. 3 is a schematic diagram of a circuit for grounding a PCB assembly according to the present invention;
FIG. 4 is a schematic diagram of a ground loop of an instrument PCB assembly according to the present invention;
FIG. 5 is a schematic diagram of a flow of a copper exposure process and a local ground circuit according to the present invention;
FIG. 6 is a schematic diagram of a laser process according to the present invention.
Detailed Description
Examples:
the invention is described in further detail below with reference to fig. 1-6.
Referring to fig. 1-6, the present invention provides a technical solution: the manufacturing method of the hardware decorative rear cover with the grounding function comprises the following steps of:
step 1: pretreatment;
step 2: copper exposure treatment;
step 3: electrophoresis;
step 4: laser;
step 5: drying;
step 6: assembling;
step 1 includes step 11 and step 12;
step 11: providing a PCB assembly, a conductive foam, a TFT screen and a TFT screen hardware rear cover;
step 111: attaching a plurality of grounding foam on the PCB assembly;
step 112: coating conductive cloth outside the conductive foam;
step 113: a plurality of grounding foam is attached to the PCB assembly, conductive cloth is coated outside the conductive foam, and the conductive foam is contacted and conducted with the TFT screen hardware rear cover at the back of the screen to form a grounding loop;
step 12: providing an instrument PCB assembly, an instrument TFT screen and an instrument TFT screen hardware rear cover;
step 121: a plurality of grounding spring plates are attached to the instrument PCB assembly;
step 122: a plurality of grounding spring plates are attached to the instrument PCB assembly and are contacted and conducted with the instrument TFT screen hardware rear cover at the back of the instrument TFT screen to form a grounding loop;
the copper exposure treatment specifically comprises the following steps: the PCB assembly is attached with a plurality of grounding foam and the instrument PCB assembly is attached with a plurality of grounding spring plates, a plurality of metal copper-exposed grounding areas are arranged on the back surface of the PCB and the TFT screen, and a plurality of metal copper-exposed grounding areas are arranged on the back surface of the instrument PCB and the TFT screen.
The PCB assembly is attached with a plurality of grounding foam pieces, the conductive foam pieces are coated with conductive cloth outside and are contacted and conducted with the TFT screen hardware rear cover at the back of the TFT screen to form a grounding loop, the meter PCB assembly is attached with a plurality of grounding spring pieces and contacted and conducted with the meter TFT screen hardware rear cover at the back of the meter TFT screen to form a grounding loop, the PCB back to the TFT screen is provided with a plurality of metal copper-exposed grounding areas, and the meter PCB back to the meter TFT screen is also provided with a plurality of metal copper-exposed grounding areas, and the metal copper-exposed areas are contacted with the hardware rear cover to form a grounding loop.
One ends of the instrument side conductive foam and the side conductive foam are contacted with the TFT screen, and the other ends are contacted with the hardware decorative rear cover. The method comprises the steps of carrying out a first treatment on the surface of the
In design, the compressible quantity is reserved in the initial state before conductive compression, the hardware decorative rear cover is assembled and fixed, and the conductive foam is compressed, so that the hardware decorative rear cover and the TFT screen are communicated to form a grounding loop;
further, static electricity generated by the TFT screen, the instrument TFT screen, the PCB assembly and the instrument PCB assembly is conducted to the hardware decoration rear cover, so that an effective grounding loop is formed.
The exposed visual areas of the rear cover for hardware decoration are black, the rear cover for hardware decoration is made of a cold-rolled steel plate, the rear cover for hardware decoration is processed through an electrophoresis process, the material of the rear cover for hardware decoration is a SPCC, SPCD, SPCE substrate, the surface of the cold-rolled steel plate has good electric conductivity, the rear cover for hardware decoration is insulated as a whole after the electrophoresis process, the surface impedance is very high, the electric conductivity cannot be achieved, electrophoresis is used for stainless steel, aluminum alloy and the like, various colors can be presented to products, metallic luster is kept, meanwhile, the surface performance is enhanced, and the rear cover for hardware decoration has good anti-corrosion performance.
The metal decorating rear cover and the internal structure part TFT screen, the instrument TFT screen, the PCB assembly, the instrument PCB assembly and the like are grounded, the invisible part of the metal decorating rear cover is visually grounded, the invisible part is made of a laser etching process, the purpose of laser etching is to remove a surface insulating layer after electrophoresis, laser etching is performed in a whole insulating part area according to actual design requirements of products, and the purpose of grounding with the internal structure part is achieved.
The assembly comprises the following steps:
step S1: the touch screen component and the TFT screen can be fully attached or framed to form a touch display module;
step S2: the touch display module and the panel assembly can be connected into a whole by using adhesive tape or glue;
step S3: the PCB assembly and the instrument PCB assembly are pre-fixed to the panel through buckles, and the rear cover is finally assembled.
Working principle: when manufacturing a hardware decorative rear cover with a grounding function, firstly, preprocessing a PCB assembly, conductive foam, a TFT screen hardware rear cover, an instrument PCB assembly, an instrument TFT screen and an instrument TFT screen hardware rear cover;
specifically, a plurality of grounding foam is attached to a PCB assembly, conductive cloth is coated outside the conductive foam, and a plurality of grounding spring plates are attached to the instrument PCB assembly;
and secondly, copper exposure treatment: attaching a plurality of grounding foam on the PCB assembly, attaching a plurality of grounding spring plates on the meter PCB assembly, wherein a plurality of metal copper-exposed grounding areas are arranged on the back surface of the PCB and the TFT screen of the meter PCB, and the metal copper-exposed grounding areas are also arranged on the back surface of the meter TFT screen for copper exposure treatment;
the third step of electrophoresis treatment, namely, the exposed visual area of the metal decorative rear cover is black, the metal decorative rear cover is made of a cold-rolled steel plate, the metal decorative rear cover is made of a SPCC, SPCD, SPCE substrate, the surface of the cold-rolled steel plate has good electric conduction performance, the metal decorative rear cover is insulated as a whole after the electrophoresis process, the surface impedance is very high, the electric conduction function cannot be realized, and electrophoresis is used for stainless steel, aluminum alloy and the like, so that the product can be in various colors, the metal luster is kept, the surface performance is enhanced, and the good anticorrosion performance is realized;
fourthly, performing laser, wherein grounding invisible part positions of the hardware decorative rear cover, the internal structure part TFT screen, the instrument TFT screen, the PCB assembly, the instrument PCB assembly and the like are all subjected to laser etching by adopting a laser etching process, the purpose of laser etching is to remove an electrophoresis rear surface insulating layer, and laser etching is performed in an integral insulation part area according to the actual design requirement of a product, so that the purpose of grounding with the internal structure part is achieved;
fifthly, drying all the parts;
a plurality of grounding foam is attached to the PCB assembly, conductive cloth is coated outside the conductive foam and is contacted and conducted with a TFT screen hardware rear cover at the back of the TFT screen to form a grounding loop, a plurality of grounding spring plates are attached to the meter PCB assembly and are contacted and conducted with the meter TFT screen hardware rear cover at the back of the meter TFT screen to form a grounding loop, a plurality of metal copper-exposed grounding areas are arranged on the PCB back to the TFT screen, and a plurality of metal copper-exposed grounding areas are also arranged on the meter PCB back to the meter TFT screen, and the metal copper-exposed areas are contacted with the hardware rear cover to form a grounding loop; the instrument side conductive foam and the side conductive foam are respectively arranged, one end of each conductive foam is contacted with the TFT screen, and the other end of each conductive foam is contacted with the rear cover of the hardware decoration; in design, the compressible quantity is reserved in the initial state before conductive compression, the hardware decorative rear cover is assembled and fixed, and the conductive foam is compressed, so that the hardware decorative rear cover and the TFT screen are communicated to form a grounding loop; the static generated by the TFT screen, the instrument TFT screen, the PCB assembly and the instrument PCB assembly is conducted to the hardware decoration rear cover to form an effective grounding loop;
seventh, assembling, wherein the touch screen component and the TFT screen can be fully attached or framed to form a touch display module; the touch display module and the panel assembly can be connected into a whole by using adhesive tape or glue; the PCB assembly and the instrument PCB assembly are pre-fixed to the panel through buckles, the rear cover is finally assembled, and the locking screws are used for connecting the PCB assembly, the panel assembly and the display module to form a double-screen product.
The present embodiment is only for explanation of the present invention and is not to be construed as limiting the present invention, and modifications to the present embodiment, which may not creatively contribute to the present invention as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present invention.
Claims (1)
1. The manufacturing method of the hardware decorative rear cover with the grounding function is characterized by comprising the following steps of: the method comprises the following steps:
step 1: pretreatment;
step 2: copper exposure treatment;
the copper exposure treatment is as follows: attaching a plurality of grounding foam on the PCB assembly, attaching a plurality of grounding spring plates on the meter PCB assembly, wherein a plurality of metal copper-exposed grounding areas are arranged on the back surface of the PCB and the TFT screen of the meter PCB, and the metal copper-exposed grounding areas are also arranged on the back surface of the meter TFT screen for copper exposure treatment;
step 3: electrophoresis;
step 4: laser;
the hardware decorative rear cover and the internal structural parts, namely a TFT screen, an instrument TFT screen, a PCB assembly and an instrument PCB assembly, are grounded and are not visible in a visual way, and a laser etching process is adopted;
step 5: drying;
step 6: assembling;
the hardware decorative rear cover assembly comprises the following steps:
step S1: the touch screen component and the TFT screen can be fully attached or framed to form a touch display module;
step S2: the touch display module and the panel assembly can be connected into a whole by using adhesive tape or glue;
step S3: the PCB assembly and the instrument PCB assembly are pre-fixed on the panel through buckles, and the rear cover is finally assembled;
step 1 includes step 11 and step 12;
step 11: providing a PCB assembly, a conductive foam, a TFT screen and a TFT screen hardware rear cover; step 111: attaching a plurality of grounding foam on the PCB assembly;
step 112: coating conductive cloth outside the conductive foam;
step 113: the PCB assembly is attached with a plurality of grounding foam pieces, the conductive foam pieces are coated with conductive cloth outside and are contacted and conducted with the TFT screen hardware rear cover at the back of the TFT screen to form a grounding loop, the meter PCB assembly is attached with a plurality of grounding spring pieces and contacted and conducted with the meter TFT screen hardware rear cover at the back of the meter TFT screen to form a grounding loop, the PCB is provided with a plurality of metal copper-exposed grounding areas on the back of the TFT screen and a plurality of metal copper-exposed grounding areas on the back of the meter PCB, and the metal copper-exposed areas are contacted with the hardware rear cover to form a grounding loop;
step 12: providing an instrument PCB assembly, an instrument TFT screen and an instrument TFT screen hardware rear cover;
step 121: a plurality of grounding spring plates are attached to the instrument PCB assembly;
step 122: a plurality of grounding spring plates are attached to the instrument PCB assembly and are contacted and conducted with the instrument TFT screen hardware rear cover at the back of the instrument TFT screen to form a grounding loop;
and one ends of the instrument side conductive foam and the side conductive foam are contacted with the TFT screen, and the other ends of the instrument side conductive foam and the side conductive foam are contacted with the hardware decorative rear cover.
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| CN202111095992.7A CN113966111B (en) | 2021-09-17 | 2021-09-17 | Manufacturing method of hardware decorative rear cover with grounding function |
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| CN202111095992.7A CN113966111B (en) | 2021-09-17 | 2021-09-17 | Manufacturing method of hardware decorative rear cover with grounding function |
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| CN113966111B true CN113966111B (en) | 2023-04-28 |
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| CN113966111A (en) | 2022-01-21 |
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