CN113966072A - Structure of bendable aluminum-based printed circuit board, design method, LED lamp and application - Google Patents
Structure of bendable aluminum-based printed circuit board, design method, LED lamp and application Download PDFInfo
- Publication number
- CN113966072A CN113966072A CN202111257145.6A CN202111257145A CN113966072A CN 113966072 A CN113966072 A CN 113966072A CN 202111257145 A CN202111257145 A CN 202111257145A CN 113966072 A CN113966072 A CN 113966072A
- Authority
- CN
- China
- Prior art keywords
- thickness
- aluminum
- blind groove
- stage
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 84
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000013461 design Methods 0.000 title claims abstract description 19
- 238000005452 bending Methods 0.000 claims abstract description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000004642 Polyimide Substances 0.000 claims abstract description 11
- 229920001721 polyimide Polymers 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 8
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000007639 printing Methods 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000006244 Medium Thermal Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000000547 structure data Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention discloses a structure of a bendable aluminum-based printed circuit board, a design method, an LED lamp and application, and relates to the technical field of printed circuit board manufacturing. Selecting a single-sided aluminum substrate with a polyimide structure as a general structure of a printed circuit board structure; on the obtained general structure, a blind slot is designed in a bending area, and the total thickness of aluminum thickness, insulating medium thickness, copper foil thickness and ink thickness at the position of the blind slot is 0.20-0.50 mm. The total thickness of the invention is adjusted according to different bending radiuses, the minimum bending radius can be calculated and designed according to 2 times of the bending thickness, and the blind slot is divided into two or more stages. The material adopts a single-sided aluminum substrate with a polyimide structure. Compared with the prior art, the invention can meet the design requirement of high heat conductivity coefficient and can carry out three-dimensional assembly. The processing of the product is more simplified.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a structure of a bendable aluminum-based printed circuit board, a design method, an LED lamp and application.
Background
At present, with the continuous development and evolution of the LED technology, the LED lamp has better lighting effect than the halogen lamp, low energy consumption, and increasingly wider application in the automobile field, and the high-power lamp often needs a heat dissipation design, so the metal-based printed circuit board is one of the main structures of the car lamp circuit board product. The aluminum-based printed circuit board of present car light has following several in industry structure:
1) single-sided aluminum-based printed circuit board: the number of the LEDs mounted on the product is small, even only one LED is mounted on the product, the single LED cannot be mounted in a three-dimensional mode, the thickness of the product is uniform, and the product cannot be bent.
2) Single-sided flexible board + aluminum-based reinforced printed circuit board: often install a plurality of LED lamps on this type of product, the reinforcement position is for supporting LED's the diversification that realizes the product through the mode of three-dimensional installation, and the product passes through the pressfitting and realizes the product structure, and the thickness of reinforcement position board is thick.
Through the above analysis, the problems and defects of the prior art are as follows:
(1) the conventional single-sided aluminum substrate cannot be bent; the bending can be realized only by reinforcing the soft plate, the pure glue and the aluminum base, and the manufacturing cost is high and the manufacturing process difficulty is high.
(2) The conventional aluminum-based printed circuit board for three-dimensional installation is bent by adopting the pressing of a soft board, pure glue and aluminum-based reinforcement, the manufacturing process is complex, the cost is high, and the heat conductivity coefficient of the soft board and the pure glue is lower, generally 0.2-0.4 (W/(m.K), and the structural design of a product with higher heat conductivity coefficient cannot be met.
The difficulty in solving the above problems and defects is:
the reason that the conventional aluminum substrate cannot be bent is that the conventional aluminum substrate is large in thickness, so that metal is pulled to crack when the conventional aluminum substrate is bent with a small bending radius, and meanwhile, a resin medium is broken; therefore, the problems of metal pulling crack and resin fracture when the bending radius is smaller need to be solved at present.
The significance of solving the problems and the defects is as follows:
the single-sided aluminum-based printed circuit board reinforced by the non-soft board, the pure glue and the aluminum base can realize three-dimensional assembly.
Disclosure of Invention
In order to overcome the problems in the related art, the disclosed embodiment of the invention provides a structure of a bendable aluminum-based printed circuit board, a design method, an LED lamp and application. The technical scheme is as follows:
according to a first aspect of the disclosed embodiments of the present invention, there is provided a design method of a bendable aluminum-based printed circuit board structure, including:
selecting a single-sided aluminum substrate with a polyimide structure as a general structure of a printed circuit board structure;
on the obtained general structure, a blind slot is designed in the bending area, and the sum of the thickness of aluminum, the thickness of an insulating medium, the thickness of copper foil and the thickness of ink at the position of the blind slot is 0.20-0.50 mm.
In a preferred embodiment of the invention, the total thickness of the aluminum thickness plus the dielectric thickness plus the copper foil thickness plus the ink thickness is adjusted according to different bending radii, and the minimum bending radius is calculated as 2 times the bending thickness.
In a preferred embodiment of the present invention, the blind groove is a two-stage blind groove or a multi-stage blind groove.
In a preferred embodiment of the present invention, when the blind groove is a two-stage blind groove, the size of the second-stage blind groove is 0.5mm smaller than that of the first-stage blind groove, and the depth of the second-stage blind groove is 0.1-0.2mm deeper than that of the first-stage blind groove.
In a preferred embodiment of the invention, when the blind grooves are multistage blind grooves, the size of the second-stage blind groove is 0.5mm smaller than that of the first-stage blind groove, and the depth of the second-stage blind groove is 0.1-0.2mm deeper than that of the first-stage blind groove; the third-stage blind groove is smaller than the second-stage blind groove in size and single side by 0.5mm, and the depth is 0.1-0.2mm deeper than the second-stage blind groove, and so on.
In a preferred embodiment of the invention, the thickness of the insulating medium is 0.025-0.075mm, and the thickness of the aluminum plate is adjusted according to actual requirements;
when the thickness of the non-bending area is less than or equal to 1.0mm, the aluminum plate does not select European-state aluminum.
According to a second aspect of the disclosed embodiments of the present invention, there is provided a bendable aluminum-based printed circuit board structure, which is manufactured by pressing from top to bottom: the printing ink layer, the copper foil, the insulating medium and the aluminum plate, wherein the aluminum plate is provided with blind grooves by adopting a blind groove routing process;
the sum of the thickness of the aluminum, the thickness of the insulating medium, the thickness of the copper foil and the thickness of the printing ink at the blind groove position is 0.2-0.5 mm.
In a preferred embodiment of the present invention, the blind groove is a two-stage blind groove or a multi-stage blind groove; the size of the second-stage blind groove is 0.5mm smaller than that of the first-stage blind groove on one side, and the depth of the second-stage blind groove is 0.1-0.2mm deeper than that of the first-stage blind groove;
the third-stage blind groove is smaller than the second-stage blind groove in size and single side by 0.5mm, and the depth is 0.1-0.2mm deeper than the depth of the second-stage blind groove, and so on;
the thickness of the insulating medium is 0.025-0.075 mm;
when the thickness of the non-bending area is less than or equal to 1.0mm, the aluminum plate is non-Europe aluminum;
the insulating medium is made of polyimide materials.
According to a third aspect of the disclosed embodiments of the present invention, there is provided an LED lamp having the bendable aluminum-based printed circuit board structure mounted thereon.
According to a fourth aspect of the disclosed embodiments of the present invention, there is provided a use of the LED lamp in the manufacture of a vehicle lamp.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
the invention reduces the bending difficulty by reducing the thickness of the bending area on the structural data, namely, a blind slot is designed in the bending area, the sum of the aluminum thickness, the medium thickness, the copper thickness and the ink thickness at the position of the blind slot is preferably controlled to be 0.20-0.50mm, the total thickness is adjusted according to different bending radiuses, the minimum bending radius can be calculated and designed according to 2 times of the bending thickness, the blind slot is divided into two or more stages, and the bending with the bending angle of 180 degrees and the bending radius of more than 1.0mm can be realized.
The material adopts a single-sided aluminum substrate with a polyimide structure, and the aluminum plate can not select European-state aluminum, so that the aluminum system is prevented from deforming when being installed softer; the medium thermal conductivity coefficient of the material is commonly 0.6 (W/(m.K)/0.8 (W/(m.K)/1.0 (W/(m.K)), and the thermal conductivity coefficient is far higher than that of a structure designed by a soft plate, pure rubber and aluminum base reinforcement.
Compared with the prior art, the invention can meet the design requirement of high heat conductivity coefficient and can carry out three-dimensional assembly. The processing of the product is more simplified.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention as disclosed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a flowchart of a design method for providing a bendable aluminum-based printed circuit board structure according to an embodiment of the invention.
Fig. 2 is a schematic diagram of a bendable aluminum-based printed circuit board structure according to an embodiment of the invention.
In fig. 2: 1. an ink layer; 2. copper foil; 3. an insulating medium; 4. an aluminum plate; 5. a blind groove.
Fig. 3 is a physical diagram of a structure of a blind slot 5 according to an embodiment of the present invention.
In the figure: 5-1, a first-stage blind groove; 5-2, second-stage blind grooves.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
As shown in fig. 1, the design method of the bendable aluminum-based printed circuit board structure provided by the invention comprises the following steps:
s101, selecting a single-sided aluminum substrate with a polyimide structure as a general structure of the printed circuit board structure.
S102, designing a blind groove in the bending area on the obtained general structure, wherein the sum of the thickness of aluminum, the thickness of an insulating medium, the thickness of copper foil and the thickness of ink at the position of the blind groove is 0.20-0.50 mm.
S103, the bendable aluminum-based printed circuit board structure obtained in the step S102 is assembled in a three-dimensional mode.
As shown in fig. 2, the bendable aluminum-based printed circuit board structure provided by the embodiment of the disclosure of the present invention is manufactured by pressing from top to bottom: the ink layer 1, the copper foil 2, the insulating medium 3 and the aluminum plate 4, wherein the aluminum plate 4 is provided with blind grooves 5 by adopting a blind groove milling process;
the sum of the thickness of the aluminum, the thickness of the insulating medium, the thickness of the copper foil and the thickness of the printing ink at the position of the blind groove 5 is 0.2-0.5 mm.
In a preferred embodiment of the present invention, the blind groove 5 is a two-stage blind groove or a multi-stage blind groove; the second-stage blind groove 5-2 has a size and a single side smaller than that of the first-stage blind groove 5-1 by 0.5mm, and has a depth deeper than that of the first-stage blind groove 5-1 by 0.1-0.2 mm;
the third-stage blind groove is 5-2 smaller in size and single side by 0.5mm than the second-stage blind groove, and the depth is 0.1-0.2mm deeper than the second-stage blind groove, and the rest is done in the same way;
the thickness of the insulating medium 3 is 0.025-0.075 mm;
when the thickness of the non-bending area is less than or equal to 1.0mm, the aluminum plate 5 is non-Europe aluminum;
the insulating medium 3 is made of polyimide.
The technical solution of the present invention is further described below with reference to specific examples.
The design method of the bendable aluminum-based printed circuit board structure provided by the embodiment of the invention comprises the following steps:
(1) the general structure adopts a single-sided aluminum-based printed circuit board structure.
(2) The structure data adopts the design of blind grooves on the aluminum surface of the bending area, the sum of the aluminum thickness, the dielectric thickness, the copper thickness and the ink thickness at the positions of the blind grooves is controlled to be 0.2-0.5mm (as shown in figure 2, the blind grooves comprise an ink layer 1, a copper foil 2, an insulating medium 3, an aluminum plate 4 and a blind groove 5 from top to bottom), and the processing adopts the conventional blind groove routing process.
(3) The total thickness is adjusted according to different bending radiuses, the thickness is designed to be 0.2-0.5mm, and the requirements that the bending angle is 180 degrees, and the bending radius is larger than or equal to 1.0mm can be met.
(4) The blind grooves 5 are divided into two stages and more than two stages, the second stage blind groove 5-2 is 0.5mm smaller than the first stage blind groove 5-1 in size and single side, the depth is 0.1-0.2mm deeper than the first stage blind groove 5-1 in depth, the third stage blind groove is 0.5mm smaller than the second stage blind groove 5-2 in size and single side, and the depth is 0.1-0.2mm deeper than the second stage blind groove in depth, and the rest is done in the same way. (as shown in fig. 3).
(5) The material selects a single-face aluminum substrate with a polyimide structure, the thickness of the insulating medium is 0.025-0.075mm, the thickness of the aluminum plate meets the requirements of customers, the problem of substrate breakage can occur when no polyimide structure is bent, and the bending design requirement cannot be met.
(6) The aluminum plate material can be selected from non-Europe aluminum 1 series to 6 series, when the thickness of the non-bending area is less than or equal to 1.0mm, Europe aluminum is not selected, and the aluminum plate material is soft and easy to bend during installation, so that the irradiation direction of a light source is influenced.
In a preferred embodiment of the present invention, the bendable aluminum-based printed circuit board structure designed by the design method of the present invention is used for three-dimensional assembly.
The experimental data and conclusions are as follows:
through the bending experiment of the finished product, when the bending thickness is designed to be 0.20-0.50mm, the bending angle of 180 degrees and the bending radius of 1.0mm can be met, and after the finished product is restored to be flat, the finished product is bent for 5 times, and no obvious crack is found; however, the Europe-style aluminum in the prior art is easy to deform during assembly, and cracks appear when the bending radius is 0.5 mm.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure should be limited only by the attached claims.
Claims (10)
1. The design method of the bendable aluminum-based printed circuit board structure is characterized by comprising the following steps of:
selecting a single-sided aluminum substrate with a polyimide structure as a general structure of a printed circuit board structure;
on the obtained general structure, a blind slot is designed in a bending area, and the total thickness of aluminum thickness, insulating medium thickness, copper foil thickness and ink thickness at the position of the blind slot is 0.20-0.50 mm.
2. The method of claim 1 wherein the total thickness of aluminum plus dielectric plus copper foil plus ink is adjusted for different bend radii, the minimum bend radius being calculated as 2 times the bend thickness.
3. The method of claim 1 wherein the blind grooves are two-stage blind grooves or multi-stage blind grooves.
4. The method as claimed in claim 3, wherein the blind grooves are two-stage blind grooves, the second-stage blind groove is 0.5mm smaller than the first-stage blind groove in size and on one side, and the depth is 0.1-0.2mm deeper than the first-stage blind groove.
5. The method for designing a bendable aluminum-based printed circuit board structure according to claim 3, wherein when the blind grooves are multi-stage blind grooves, the second-stage blind groove is 0.5mm smaller than the first-stage blind groove in size and on one side and 0.1-0.2mm deeper than the first-stage blind groove; the third-stage blind groove is smaller than the second-stage blind groove in size and single side by 0.5mm, and the depth is 0.1-0.2mm deeper than the second-stage blind groove, and so on.
6. The design method of the bendable aluminum-based printed circuit board structure as claimed in claim 3, wherein the thickness of the insulating medium is 0.025-0.075mm, and the thickness of the aluminum plate is adjusted according to actual requirements;
when the thickness of the non-bending area is less than or equal to 1.0mm, the aluminum plate does not select European-state aluminum.
7. A bendable aluminum-based printed circuit board structure designed according to the design method of the bendable aluminum-based printed circuit board structure as claimed in any one of claims 1 to 6, wherein the structure is manufactured by pressing from top to bottom: the printing ink layer, the copper foil, the insulating medium and the aluminum plate are characterized in that blind grooves are formed in the aluminum plate by adopting a blind groove routing process;
the sum of the thickness of the aluminum, the thickness of the insulating medium, the thickness of the copper foil and the thickness of the printing ink at the blind groove position is 0.2-0.5 mm.
8. The bendable aluminum-based printed circuit board structure according to claim 7, wherein the blind grooves are two-stage blind grooves or multi-stage blind grooves; the size of the second-stage blind groove is 0.5mm smaller than that of the first-stage blind groove on one side, and the depth of the second-stage blind groove is 0.1-0.2mm deeper than that of the first-stage blind groove;
the third-stage blind groove is smaller than the second-stage blind groove in size and single side by 0.5mm, and the depth is 0.1-0.2mm deeper than the depth of the second-stage blind groove, and so on;
the thickness of the insulating medium is 0.025-0.075 mm;
when the thickness of the non-bending area is less than or equal to 1.0mm, the aluminum plate is non-Europe aluminum;
the insulating medium is made of polyimide materials.
9. An LED lamp comprising the bendable aluminum-based printed circuit board structure according to any one of claims 7 to 8.
10. Use of the LED lamp according to claim 9 in the manufacture of a vehicle lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111257145.6A CN113966072A (en) | 2021-10-27 | 2021-10-27 | Structure of bendable aluminum-based printed circuit board, design method, LED lamp and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111257145.6A CN113966072A (en) | 2021-10-27 | 2021-10-27 | Structure of bendable aluminum-based printed circuit board, design method, LED lamp and application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113966072A true CN113966072A (en) | 2022-01-21 |
Family
ID=79467676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111257145.6A Pending CN113966072A (en) | 2021-10-27 | 2021-10-27 | Structure of bendable aluminum-based printed circuit board, design method, LED lamp and application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113966072A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203131524U (en) * | 2013-03-06 | 2013-08-14 | 乐健科技（珠海）有限公司 | Bendable light-emitting diode (LED) light source module |
| CN204669718U (en) * | 2015-05-29 | 2015-09-23 | 广州杰赛科技股份有限公司 | A kind of bent printed wiring board |
| CN205793611U (en) * | 2016-05-27 | 2016-12-07 | 深圳前海德旺通科技有限公司 | A kind of bent aluminium base |
| CN209731701U (en) * | 2019-03-04 | 2019-12-03 | 深圳市龙辉腾科技有限公司 | A kind of bent aluminum substrate |
| CN112702834A (en) * | 2020-12-17 | 2021-04-23 | 万奔电子科技股份有限公司 | Flexible rigid circuit board and preparation method thereof |
-
2021
- 2021-10-27 CN CN202111257145.6A patent/CN113966072A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203131524U (en) * | 2013-03-06 | 2013-08-14 | 乐健科技（珠海）有限公司 | Bendable light-emitting diode (LED) light source module |
| CN204669718U (en) * | 2015-05-29 | 2015-09-23 | 广州杰赛科技股份有限公司 | A kind of bent printed wiring board |
| CN205793611U (en) * | 2016-05-27 | 2016-12-07 | 深圳前海德旺通科技有限公司 | A kind of bent aluminium base |
| CN209731701U (en) * | 2019-03-04 | 2019-12-03 | 深圳市龙辉腾科技有限公司 | A kind of bent aluminum substrate |
| CN112702834A (en) * | 2020-12-17 | 2021-04-23 | 万奔电子科技股份有限公司 | Flexible rigid circuit board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4327774B2 (en) | Printed wiring board and manufacturing method thereof | |
| US20140063794A1 (en) | Curved printed circuit boards, light modules, and methods for curving a printed circuit board | |
| CN103133915A (en) | Light source assembly and light source module thereof | |
| CN202118669U (en) | Integrated backlight module with good soaking effect and radiation effect | |
| CN103188890A (en) | Manufacturing method for printed circuit board (PCB) and PCB | |
| CN106879167B (en) | Double-sided aluminum substrate with high precision and embedded ultrahigh heat conduction ceramic blocks and manufacturing method thereof | |
| CN113966072A (en) | Structure of bendable aluminum-based printed circuit board, design method, LED lamp and application | |
| JP7399849B2 (en) | flexible light strip | |
| US8840271B2 (en) | In-plane bent printed circuit boards | |
| CN1694600A (en) | Two-sided flexible printed circuit board | |
| CN2517112Y (en) | High power light-emitting diode | |
| CN215818755U (en) | High-strength aluminum alloy substrate structure for manufacturing backlight plate | |
| CN202494051U (en) | Light-emitting diode (LED) circuit board with bending metal matrix | |
| CN201063960Y (en) | LED unit and the composed LED module group thereof | |
| CN214413125U (en) | Multilayer soft and hard combined plate structure | |
| CN113966083A (en) | LED lamp, bendable aluminum-based printed circuit board, manufacturing method and application | |
| CN101769522B (en) | Plug-in type radiator | |
| CN209731701U (en) | A kind of bent aluminum substrate | |
| US20200049329A1 (en) | Led strip that can be bent in three-dimensional space | |
| CN206807858U (en) | A kind of corrosion-resistant circuit board of novel fire resistant | |
| CN202371650U (en) | Back frame and backlight system | |
| CN204408748U (en) | Three-dimensional cooling circuit board | |
| CN219351973U (en) | Reinforced flexible circuit board of new energy automobile LED head-light | |
| CN213783693U (en) | Heat dissipation type LED lamp FPC circuit board | |
| CN214481461U (en) | Continuous infinite circulation wave-shaped circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |