CN113965094A - Power module - Google Patents
Power module Download PDFInfo
- Publication number
- CN113965094A CN113965094A CN202111373927.6A CN202111373927A CN113965094A CN 113965094 A CN113965094 A CN 113965094A CN 202111373927 A CN202111373927 A CN 202111373927A CN 113965094 A CN113965094 A CN 113965094A
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- Prior art keywords
- igbt
- busbar
- power module
- insulating
- composite busbar
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- 239000002131 composite material Substances 0.000 claims abstract description 73
- 238000007789 sealing Methods 0.000 claims abstract description 64
- 239000003292 glue Substances 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims description 22
- 238000001816 cooling Methods 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 238000010292 electrical insulation Methods 0.000 description 8
- 239000004568 cement Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000003137 locomotive effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 210000003141 lower extremity Anatomy 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
- H02M1/088—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/44—Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
- H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
- H02M7/12—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/21—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/217—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M7/219—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only in a bridge configuration
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
- H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
- H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/53—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M7/537—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
- H02M7/5387—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Thermal Sciences (AREA)
- Inverter Devices (AREA)
Abstract
The embodiment of the invention discloses a power module, which comprises: the IGBT device comprises an IGBT component and a composite busbar arranged on the upper part of the IGBT component; a sealing box structure is arranged between the composite busbar and the IGBT assembly; insulating glue is filled and sealed in a sealing cavity in the sealing box structure, so that all terminals on the lower surface of the composite busbar are electrically isolated through the insulating glue, and all terminals of the IGBT in the IGBT assembly are electrically isolated through the insulating glue. The invention provides a power module capable of meeting the use requirement of high altitude.
Description
Technical Field
The invention belongs to the technical field of railway vehicles, and particularly relates to a power module.
Background
In recent years, the high-power alternating-current transmission locomotive or the power-dispersed high-speed motor train unit generally operates below the elevation of 1500 meters, and the maximum elevation of the locomotive does not exceed 2500 meters. Due to the influence of special climate conditions at high altitude, the requirements on electrical products are high, and are at least several times greater than those at low altitude in terms of electrical clearance and creepage distance, for example, when the rated voltage is DC3600V, the electrical clearance is 13mm at 1500 m altitude, and the creepage distance is about 30 mm; and the electrical clearance is required to be 42mm at the altitude of 5000 meters, and the minimum creepage distance is 60 mm.
However, the designed electrical clearance of high-voltage high-power electrical elements such as IGBTs and diodes used on the power module is small, for example, the electrical clearance of the IGBT with the model number FZ750R65KE3 is 26mm, the creepage distance is 56mm, and the use requirement of high altitude cannot be met.
Disclosure of Invention
In order to solve the technical problem that the existing power module cannot meet the use requirement of high altitude, the invention provides a power module, which comprises: the IGBT device comprises an IGBT component and a composite busbar arranged on the upper part of the IGBT component; a sealing box structure is arranged between the composite busbar and the IGBT assembly; insulating glue is filled and sealed in a sealing cavity in the sealing box structure, so that all terminals on the lower surface of the composite busbar are electrically isolated through the insulating glue, and all terminals of the IGBT in the IGBT assembly are electrically isolated through the insulating glue.
Optionally, the sealing box structure includes: a first sealed box portion and a second sealed box portion, the first sealed box portion and the second sealed box portion being connected; the first sealing box part is fixed on the lower surface of the composite busbar, and the second sealing box part is fixedly connected with the IGBT assembly.
Optionally, the power module further includes: water-cooling the substrate; the IGBT assembly is fixed on the water-cooling substrate;
the seal box structure includes: a first sealed box portion and a second sealed box portion, the first sealed box portion and the second sealed box portion being connected; the first sealing box part is fixed on the lower surface of the composite busbar, the second sealing box part is fixed on the water-cooling substrate, and the IGBT assembly is located inside the second sealing box part.
Optionally, an insulating strip for separating terminals with different polarities is disposed on the upper surface of the composite busbar.
Optionally, each terminal on the upper surface of the composite busbar is provided with a circular insulating column.
Optionally, an insulating strip for separating terminals with different polarities is disposed on the lower surface of the composite busbar.
Optionally, each terminal on the lower surface of the composite busbar is provided with a circular insulating column.
Optionally, an insulating protective layer is sprayed on the non-contact surface of each terminal on the lower surface of the composite busbar.
Optionally, the insulating strip is an E-shaped insulating strip.
Optionally, the composite busbar includes: the direct current positive busbar, the direct current negative busbar and the alternating current end busbar are arranged on the bus bar; the IGBT assembly comprises one or more single-phase bridges, each single-phase bridge consists of an upper bridge arm and a lower bridge arm, and the upper bridge arm and/or the lower bridge arm can consist of an IGBT or a plurality of IGBTs connected in parallel.
The invention has the beneficial effects that:
according to the power module, the sealing box structure is arranged between the composite busbar and the IGBT assembly, and the insulating glue is filled and sealed in the sealing cavity in the sealing box structure, so that all terminals on the lower surface of the composite busbar are electrically isolated through the insulating glue, and all terminals of the IGBT in the IGBT assembly are electrically isolated through the insulating glue.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts. In the drawings:
fig. 1 is a schematic view of a lower surface of a composite busbar according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an IGBT assembly according to an embodiment of the invention;
FIG. 3 is an exploded view of a power module according to an embodiment of the present invention;
fig. 4 is a first schematic view of an upper surface of a composite busbar according to an embodiment of the invention;
fig. 5 is a second schematic view of an upper surface of a composite busbar according to an embodiment of the invention;
FIG. 6 is a schematic diagram of a combination of a composite busbar and an IGBT assembly according to an embodiment of the invention;
FIG. 7 is a schematic view of section A-A in FIG. 6;
fig. 8 is an overall schematic diagram of a power module according to an embodiment of the invention.
[ Mark Specification ]
1: water-cooling the substrate;
11: a water joint 1;
12: a water joint 2;
2: an IGBT assembly;
21：IGBT；
22: a second seal box portion;
3: a composite busbar;
31: an alternating-current end busbar;
32: a direct current positive busbar;
33: a direct current negative electrode bus bar;
34: a first seal box portion;
35: an insulating structure;
4: a busbar cover;
5: a high voltage plug connector;
6: a drive circuit board;
61: a signal input interface of the driving circuit board;
62: a power input interface of the driving circuit board;
7: a pulse distribution plate;
71: a signal input interface of the pulse distribution board;
72: a power input interface of the pulse distribution board;
73: signal interface with the driving circuit board;
74: a power interface with the driving circuit board;
8: a distribution plate cover;
9: a drive plate cover;
10: insulating glue;
101: a handle;
102: a connecting seat.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is to be understood that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of the invention and the above-described drawings are intended to cover non-exclusive inclusions.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
The present invention provides a power module that satisfies the requirement of high-altitude electrical performance by improving the structure of an existing power module.
The present invention provides a power module, comprising: the IGBT device comprises an IGBT component 2 and a composite busbar 3 arranged on the upper part of the IGBT component 2. Compound female 3 arranging with be provided with the seal box structure between the IGBT subassembly 2, the embedment has insulating cement 10 in the sealed cavity in the seal box structure, so that pass through between each terminal of compound female 3's the lower surface insulating cement 10 carries out electrical isolation, and pass through between each terminal of IGBT21 in the IGBT subassembly 2 insulating cement carries out electrical isolation.
It should be noted that the sealing box structure of the present invention may be one or more.
In one embodiment of the present invention, the sealing box structure comprises: a first sealing cassette part 34 and a second sealing cassette part 22, said first sealing cassette part 34 and said second sealing cassette part 22 being connected. Specifically, the lower end of the first sealing box portion 34 is provided with a groove, and the second sealing box portion 22 is inserted into the groove at the lower end of the first sealing box portion 34 to be connected with the first sealing box portion 34.
In an embodiment of the present invention, the first sealing box portion 34 is fixed on the lower surface of the composite busbar 3, and all the terminals on the lower surface of the composite busbar 3 are located in the first sealing box portion 34. The lower portion of the second sealing box portion 22 is connected to the side portion of the IGBT module 2 and surrounds the IGBT module 2, whereby all the terminals of each IGBT on the upper surface of the IGBT module 2 are located inside the second sealing box portion 22, and the upper portion of the second sealing box portion 22 is connected to the lower portion of the first sealing box portion 34. In this embodiment, the inner side surface of the first sealing box part 34, the inner side surface of the second sealing box part 22, the lower surface of the composite busbar 3 and the upper surface of the IGBT component 2 together form a sealed cavity, and the insulating glue 10 is filled in the sealed cavity.
As shown in fig. 1 and 2, in another embodiment of the present invention, an IGBT module 2 is fixed on a water-cooled substrate 1, and the sealing box structure includes: the first sealing box part 34 is connected with the second sealing box part 22, the first sealing box part 34 is fixed on the lower surface of the composite busbar 3, and all terminals on the lower surface of the composite busbar 3 are located in the first sealing box part 34. The second sealing box part 22 is fixed on the water-cooled substrate 1, and the IGBT module 2 is located inside the second sealing box part 22, so that all the terminals of the IGBTs on the upper surface of the IGBT module 2 are located inside the second sealing box part 22. In this embodiment, the inner side surface of the first sealing box part 34, the inner side surface of the second sealing box part 22, the lower surface of the composite busbar 3, part of the upper surface of the water-cooled substrate 1, and the upper surface of the IGBT component 2 together form a sealed cavity, and the insulating glue 10 is filled in the sealed cavity.
In one embodiment of the present invention, in order to further meet the requirement of electrical insulation at high altitude, the present invention provides an insulating strip for separating terminals with different polarities on the upper surface of the composite busbar 3, as shown by an insulating structure 35 in fig. 4. According to the invention, the electrical gaps among the terminals on the upper surface of the composite busbar 3 can be increased through the insulating strips, so that the requirement of the electrical gaps among the terminals on the busbar is met, and the whole structure meets the requirement of the electrical insulating property of equipment.
In an embodiment of the present invention, in order to further meet the requirement of electrical insulation at high altitude, the present invention may further provide a circular insulating column on each terminal on the upper surface of the composite busbar 3, as shown by the insulating structure 35 in fig. 5. According to the invention, the annular insulating column is arranged on each terminal, so that the electric gap between the terminals on the upper surface of the composite busbar 3 can be increased, and the requirement of the electric gap between the terminals on the busbar is met, therefore, the whole structure meets the requirement of the electric insulating property of equipment.
According to the embodiment, the sealing box structure is formed between the IGBT component 2 and the composite busbar 3, the insulating glue 10 is encapsulated, and the insulating structure (the insulating strip and the circular insulating column) is additionally arranged on the upper surface of the composite busbar, so that the electric gap and the creepage distance of the power module can be increased, and the use requirement of the power module at high altitude can be met.
Further, if the insulating glue in the sealing box structure is not filled in the mounting process or the insulating glue in the sealing box structure is reduced in the using process, the insulation between the terminals on the lower surface of the composite busbar 3 can be damaged, and the high-altitude use requirement can not be met. In order to solve the above problems, in an embodiment of the present invention, referring to the structure of the upper surface of the composite busbar 3, the insulating strips are added between the terminals with different polarities on the lower surface of the composite busbar, and the height of the insulating strips should be ensured to be deep into the insulating glue, so that the problem of non-ideal electrical insulation between the terminals on the lower surface of the composite busbar due to incomplete filling or reduction of the insulating glue in the sealing box structure is prevented, and the power module is further ensured to meet the use requirement of high altitude.
In order to solve the above problems, in an embodiment of the present invention, referring to the structure of the upper surface of the composite busbar 3, each terminal of the lower surface of the composite busbar 3 is provided with a circular insulating column, and the height of the circular insulating column should be ensured to be deep into the insulating glue 10, so that the problem of non-ideal electrical insulation between the terminals on the lower surface of the composite busbar due to incomplete filling or reduction of the insulating glue in the sealing box structure is prevented, and the power module is further ensured to meet the use requirement of high altitude.
In order to solve the above problems, in an embodiment of the present invention, an insulating protection layer may be sprayed on a non-contact surface of each terminal on the lower surface of the composite busbar 3, and the height of the insulating protection layer should be ensured to be deep into the insulating glue 10, so as to prevent the problem of non-ideal electrical insulation between terminals on the lower surface of the composite busbar due to incomplete filling or reduction of the insulating glue in the sealing box structure, and further ensure that the power module can meet the use requirement at high altitude.
In an embodiment of the present invention, in order to further improve the electrical insulation between the terminals of the composite busbar, the insulating strip in the above embodiment of the present invention may be an E-shaped insulating strip.
In one embodiment of the present invention, the composite busbar includes: the direct current positive busbar, the direct current negative busbar and the alternating current end busbar are arranged on the bus bar; the IGBT assembly comprises one or more single-phase bridges, each single-phase bridge consists of an upper bridge arm and a lower bridge arm, and the upper bridge arm and/or the lower bridge arm can consist of an IGBT or a plurality of IGBTs connected in parallel.
Fig. 3 is an exploded view of a power module according to an embodiment of the present invention, fig. 8 is an overall schematic diagram of the power module according to the embodiment of the present invention, as shown in fig. 3 and fig. 8, in an embodiment of the present invention, the power module specifically includes: the device comprises a water-cooling substrate 1, an IGBT assembly 2, a composite busbar 3, a driving circuit board 6, a pulse distribution plate 7, a busbar cover 4, a high-voltage plug-in connector 5 and the like.
The IGBT assembly 2 comprises one or more single-phase bridges or a part of the single-phase bridge, namely an upper bridge arm/lower bridge arm formed by one or more parallel IGBTs, and a single-phase bridge formed by the upper bridge arm and the lower bridge arm and used as a basic power unit for alternating current-direct current conversion, and the IGBT assembly 2 is installed on the water-cooling substrate 1.
A flow channel is arranged in the water-cooled substrate 1, the surface of the water-cooled substrate 1 is provided with a water joint 1 and a water joint 2 which are used as an inlet and an outlet of cooling liquid, the water-cooled substrate 1 is mainly used for fixing the IGBT assembly 2 and taking away heat generated in the working process of the IGBT in time, the temperature of a semiconductor device in the IGBT is reduced, and the normal work of the IGBT is ensured; can also be used for mounting the high-voltage plug connector 5.
The composite busbar 3 is composed of a direct current positive busbar, a negative busbar, an alternating current end busbar, an insulating plate and the like, the busbar adopts a film-coated structure, wherein the positive and negative electrodes are respectively connected to the positive and negative electrodes of the high-voltage plug-in connector 5, the alternating current end busbar can be fixed on the water-cooling substrate 1 through an insulator, and the composite busbar 3 is used as an electrical external interface of the power module and is connected with the IGBT assembly 2 and the high-voltage plug-in connector 5; the insulating plate electrically isolates the positive busbar, the negative busbar and the alternating current busbar.
The high-voltage plug-in connector 5 is fixed on the water-cooling substrate 1 and comprises a direct-current positive electrode, a negative electrode connector and an electrical isolation structural member, and has the main functions that the positive and negative electrodes of a busbar are connected on one side of the positive and negative electrodes of the plug-in connector, the other side of the positive and negative electrodes serves as an external interface, and reliable electrical connection is carried out between the plug-in device and a middle direct-current busbar assembly in a box body.
The output end of the pulse distribution board 7 is connected with the driving circuit board 6, power and control signals are provided for the driving circuit board 6, the input end of the pulse distribution board is connected with the traction control device, the traction control device provides working power and working signals of the traction control device, the signals are processed and then sent to the driving circuit board 6, the driving circuit board 6 is used for controlling the on-off state of the IGBTs, and therefore the on-off state control of the IGBTs of the upper bridge arm group and the lower bridge arm group can be achieved.
The busbar cover 4 is made of insulating materials, is buckled on the composite busbar 3, can be fixed on the water-cooling base plate 1 through the bottom, and also can be fixed on the high-voltage plug-in connector 5 through the top, and the pulse distribution plate 7 and the driving circuit board 6 are installed on the busbar cover 4. The busbar cover 4 electrically separates high voltage and low voltage of an electrical appliance system, and electromagnetic interference on low-voltage equipment such as a driving plate and a pulse distribution plate during switching of the IGBT is prevented.
There is the seal box structure between 3 lower surfaces of female row of compound and IGBT subassembly 2, and the embedment insulating cement 10 in the seal box gets rid of the air, arranges the main terminal like this to and insulating cement carries out electrical isolation between each terminal of IGBT. Because the electrical insulation performance of the insulating cement is far stronger than that of air, the requirement for electrical insulation at high altitude can be met, and the electrical clearance between each terminal is increased by adopting structures such as an E-shaped insulating strip and a circular groove insulating column on the upper surface of the busbar so as to meet the requirement for the electrical clearance between each terminal on the busbar, so that the whole structure meets the requirement for the insulation performance of equipment and electrical appliances.
Further, in the installation process, or the insulating cement in the sealing box reduces in the use, and the insulation between female arranging lower limb terminal is destroyed promptly, does not satisfy high altitude operation requirement promptly. In order to solve the above problems, the structure of the upper surface of the busbar may be referred to, that is, an insulating strip and a circular insulating column structure are added between the terminals with different polarities on the lower surface of the busbar, or an insulating protective layer is directly sprayed on the non-contact surface of the terminals, and the height of the insulating strip (or the circular insulating column or the insulating protective layer) is ensured to be deep into the insulating glue.
In an embodiment of the invention, the front end of the water-cooled substrate 1 is provided with a water joint 1 and a water joint 2, the IGBT component is a single-phase bridge circuit formed by connecting 2 IGBTs in parallel with an upper bridge arm and a lower bridge arm, and the water joint 1 and the water joint 2 in fig. 3 are generally quick-plugging joints and are matched with a female head of a quick plug in a box body for use. In addition, the two sides of the water-cooling base plate 1 and the guide rail in the case form a slide block guide rail structure, so that the modules can be conveniently and rapidly installed and replaced.
The composite busbar 3 is provided with a high-voltage terminal which is electrically connected with the C electrode and the E electrode of the IGBT component 2; the composite busbar 3 is simple and compact in structure, small in stray inductance, capable of realizing large current and electric connection between high-voltage components and reducing peak voltage in the IGBT switching process.
The high-voltage plug-in connector 5 is arranged at the rear end of the water-cooling substrate 1, the positive and negative poles at the front end of the high-voltage plug-in connector 5 are respectively connected with the direct current positive and negative poles of the composite busbar 3, the positive and negative poles at the rear end are matched and electrically connected with the positive and negative forks corresponding to the busbars in the box body, the high-voltage plug-in connector 5 is simple in structure and reliable in connection, the power module is convenient to install, and the modules can be installed and replaced quickly.
Set up female cover 4 of arranging on compound female 3, female cover 4 of arranging sets up mounting nut and is used for fixed drive circuit board 6 and pulse distribution board 7, female cover 4 bottom and water-cooling base plate 1 mechanical connection of arranging, female cover 4 main function of arranging covers high-voltage device, keeps apart high pressure and low pressure, has reduced the electromagnetic interference of IGBT switch to low voltage circuit to other parts in the protection box are avoided destroying if take place high pressure damage (for example IGBT explodes and splits, female short circuit).
The driving circuit board 6 is electrically connected with the IGBT assembly 2, and the pulse distribution board 7 is electrically connected with the driving circuit board 6 by adopting optical electricity or electricity; the signal input to the pulse distribution board 7 can be transmitted in an optical/electrical manner.
In order to meet the requirements of high-altitude electrical performance, as shown in fig. 1, fig. 2, fig. 4, fig. 5, fig. 6 and fig. 7, the structure of the power module is improved, the insulating glue is encapsulated and filled in the high-voltage connecting part by adopting a sealing structure to ensure the insulating performance of an electrical appliance, and an enhanced insulating structure is adopted between high-voltage terminal systems on the upper part of a busbar to increase the electrical clearance and creepage distance, so that the improved power module can be suitable for high-altitude environments.
Fig. 1 and fig. 2 are schematic diagrams of a sealing structure formed between a composite busbar and an IGBT component, each terminal of the composite busbar 3 is fastened to a corresponding IGBT terminal by a bolt, fig. 1 is provided with a first sealing box part 34 on the lower side of the busbar, and the first sealing box part 34 is provided with a groove and a second sealing box part 22 for matching to ensure the sealing performance of the structure.
Fig. 2 shows that a second sealed box part 22 is arranged between the IGBT/IGBT components, the lower concave-convex groove structure of the second sealed box part 22 forms a seal with the periphery of the IGBT, and the upper part is matched with the first sealed box part 34.
Fig. 6 and 7 are schematic diagrams of the composite busbar, the IGBT module and the like after installation.
As shown in fig. 6 and 7, the first sealed box portion 34, the composite busbar 3, the second sealed box portion 22, and the housing structure of the IGBT module 2 are fitted to each other, so that a sealed space is formed between each terminal of the IGBT and each terminal of the composite busbar, and the insulating paste 10 is filled in the sealed space.
Fig. 4 is that the E-shaped groove insulating strip is installed on the upper part of the composite busbar 3, the electric gap and the creepage distance between the terminals after the composite busbar 3 is installed are increased, and the number and the depth of different E-shaped grooves can be used according to the structure and the electric appliance gap requirement.
Fig. 5 shows that the circular groove insulating columns are arranged on each terminal on the upper part of the composite busbar 3, the electric gap and the creepage distance between the terminals after the composite busbar 3 is arranged are increased, and the circular groove insulating columns can be completely arranged or partially arranged according to the structure and the electric gap requirement. Of course, other reinforced insulation structures can be adopted to meet the electrical performance requirement of the upper part of the busbar.
The improvement of the structure can enable the power module to meet the requirement of high-altitude electrical performance.
In an embodiment of the present invention, the water-cooled substrate 1 may adopt a metal profile welding structure, or may adopt a heat pipe heat dissipation method, etc.
In an embodiment of the present invention, the number of the driving circuit boards 6 may be the same as the number of the IGBTs in the IGBT component 2, or one driving circuit board 6 may correspond to one bridge arm.
In one embodiment of the present invention, the signal transmission between the pulse distribution board 7 and the driving circuit board 6 may be an electrical signal or an optical signal.
In one embodiment of the present invention, the input control signal transmission of the pulse distribution board 7 may be an electrical signal or an optical signal.
In an embodiment of the present invention, the IGBT component 2 includes a plurality of parallel IGBTs to form a bridge arm, and a multi-bridge arm structure may also be adopted.
In an embodiment of the present invention, under the same condition that the water joint 1 is used as an inflow end and the water joint 2 is used as an outflow end, the flow resistance of the water-cooled substrate 1 is substantially consistent, and the installation is convenient without being affected by the installation mode (the bottom is horizontal downward, the bottom is horizontal upward, the bottom is vertical, etc.).
In one embodiment of the present invention, the pulse distribution board 7 and the driving circuit board 6 may be integrated together to form an integrated structure, and mounted on the busbar cover 4.
In an embodiment of the invention, an insulator is arranged at the front end of the water-cooling substrate 1 to support the AC end of the composite busbar, so that the AC end is convenient to connect wires, and the damage of the vibration of the busbar to the IGBT is reduced.
In one embodiment of the invention, handles 101 are respectively installed at the front end and the rear end of the water-cooled base plate 1, so that the power module is convenient to install and transport.
In one embodiment of the invention, the pulse distribution plate 7 and the driving circuit board 6 are respectively provided with the distribution plate cover 8 and the driving plate cover 9, so that the protection of the pulse distribution plate 7 and the driving circuit board 6 is increased, and the reliability of the pulse distribution plate 7 and the driving circuit board 6 is increased.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A power module, comprising: the IGBT device comprises an IGBT component and a composite busbar arranged on the upper part of the IGBT component; a sealing box structure is arranged between the composite busbar and the IGBT assembly; insulating glue is filled and sealed in a sealing cavity in the sealing box structure, so that all terminals on the lower surface of the composite busbar are electrically isolated through the insulating glue, and all terminals of the IGBT in the IGBT assembly are electrically isolated through the insulating glue.
2. The power module of claim 1, wherein the sealed box structure comprises: a first sealed box portion and a second sealed box portion, the first sealed box portion and the second sealed box portion being connected; the first sealing box part is fixed on the lower surface of the composite busbar, and the second sealing box part is fixedly connected with the IGBT assembly.
3. The power module of claim 1, further comprising: water-cooling the substrate; the IGBT assembly is fixed on the water-cooling substrate;
the seal box structure includes: a first sealed box portion and a second sealed box portion, the first sealed box portion and the second sealed box portion being connected; the first sealing box part is fixed on the lower surface of the composite busbar, the second sealing box part is fixed on the water-cooling substrate, and the IGBT assembly is located inside the second sealing box part.
4. The power module of claim 1, wherein an insulating strip for separating terminals of different polarities is provided on an upper surface of the composite busbar.
5. The power module of claim 1, wherein each terminal on the upper surface of the composite busbar is provided with a circular ring insulation column.
6. The power module of claim 1, wherein an insulating strip for separating terminals of different polarities is provided on a lower surface of the composite busbar.
7. The power module of claim 1, wherein each terminal of the lower surface of the composite busbar is provided with a circular ring insulation column.
8. The power module of claim 1, wherein an insulating protective layer is sprayed on the non-contact surface of each terminal of the lower surface of the composite busbar.
9. A power module according to claim 4 or 6, characterized in that the insulating strips are E-shaped insulating strips.
10. The power module of claim 1, wherein the composite busbar comprises: the direct current positive busbar, the direct current negative busbar and the alternating current end busbar are arranged on the bus bar; the IGBT assembly comprises one or more single-phase bridges, each single-phase bridge consists of an upper bridge arm and a lower bridge arm, and the upper bridge arm and/or the lower bridge arm can consist of an IGBT or a plurality of IGBTs connected in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111373927.6A CN113965094A (en) | 2021-11-19 | 2021-11-19 | Power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111373927.6A CN113965094A (en) | 2021-11-19 | 2021-11-19 | Power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113965094A true CN113965094A (en) | 2022-01-21 |
Family
ID=79471136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111373927.6A Pending CN113965094A (en) | 2021-11-19 | 2021-11-19 | Power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113965094A (en) |
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2021
- 2021-11-19 CN CN202111373927.6A patent/CN113965094A/en active Pending
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