CN113962981A - Method and apparatus for analyzing defects of ball grid array - Google Patents
Method and apparatus for analyzing defects of ball grid array Download PDFInfo
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- CN113962981A CN113962981A CN202111297961.XA CN202111297961A CN113962981A CN 113962981 A CN113962981 A CN 113962981A CN 202111297961 A CN202111297961 A CN 202111297961A CN 113962981 A CN113962981 A CN 113962981A
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000007547 defect Effects 0.000 title claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract description 102
- 238000004458 analytical method Methods 0.000 claims abstract description 10
- 238000010586 diagram Methods 0.000 description 13
- 230000002950 deficient Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000013519 translation Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- G—PHYSICS
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T5/00—Image enhancement or restoration
- G06T5/90—Dynamic range modification of images or parts thereof
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
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- G06T2207/30148—Semiconductor; IC; Wafer
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Abstract
The invention provides a ball grid defect analysis method and equipment, wherein the method comprises the steps of acquiring a ball grid array image containing missing solder balls; extracting a pad area image of a pad where the missing solder ball is located; determining the gray scale of pixels in the pad area image and the number of pixels corresponding to the gray scale; determining a defect type of the missing solder balls based on the gray scale and the number of the pixels.
Description
Technical Field
The present invention relates to ball grid array processes, and more particularly to the analysis of defective ball grids.
Background
Ball Grid Array (BGA) is a new chip packaging form, which uses solder balls (or columns) arranged in a matrix on a bare chip as leading-out terminals, has superior characteristics to pin packaging, and thus is widely used to adapt to the development of the semiconductor industry. However, due to the limitation of the packaging technology, problems such as missing solder balls may occur during the ball mounting process of the chip, and therefore, these problems need to be detected to avoid the problem of chip flowing out. One reason for 'missing solder balls' is that the ball mounting operation fails, for example, the solder balls may not be placed in the center of the solder paste on the pad, resulting in the solder balls being stuck unstably and falling off, as shown in the left diagram of fig. 1; another reason for 'missing solder balls' may be that the solder paste printing on the blank pads fails, so that no solder paste exists on the pads, as shown in the right diagram of fig. 1, and thus the solder balls cannot be bonded due to the absence of solder paste at all during ball mounting.
Disclosure of Invention
The invention provides a scheme for automatically detecting the reasons of solder ball missing by using an image analysis technology, which can classify the missing types of the missing solder balls and greatly improve the detection efficiency; thereby providing a reference for ball-planting process or equipment improvement to avoid the occurrence of defective ball grids.
According to one aspect of the invention, a ball grid defect analysis method is provided, which comprises the steps of obtaining a ball grid array image containing missing solder balls, and extracting a pad area image of a pad where the missing solder balls are located; determining the gray scale of pixels in the pad area image and the number of pixels corresponding to the gray scale; and determining the defect type of the missing solder balls based on the gray scale and the number of the pixels.
In a preferred example, determining the gray scale and the number of pixels in the pad area image includes: determining the gray scale of the effective pixels and the number of the effective pixels in the pad area image, including: determining the gray value of each pixel in the pad area image; counting a first number of pixels with gray values within a first gray range in the pad area image; and counting a second number of pixels with the gray values within a second gray range in the pad area image, wherein the larger one of the first number and the second number is taken as the number of the effective pixels, and the average value of the gray range corresponding to the larger one of the first number and the second number is taken as the gray value of the effective pixels. Wherein when the number of effective pixels is within a predetermined range of values: and if the gray scale of the effective pixel is greater than or equal to a first preset gray scale threshold value, determining that the missing solder ball belongs to a solder paste missing type, otherwise, if the gray scale is less than or equal to a second preset gray scale threshold value, determining that the missing solder ball belongs to a ball implantation failure type, wherein the first preset gray scale threshold value is preset based on the image gray scale of the blank pad without solder paste, and the second preset gray scale threshold value is preset based on the image gray scale of the pad with solder paste.
In a preferred example, wherein the first grayscale range is defined to be greater than or equal to the first predetermined grayscale threshold value and the second grayscale range is defined to be less than or equal to the second predetermined grayscale threshold value, the grayscale values of the pixels in the pad region image that fall within the first grayscale range and the second grayscale range, respectively, are binarized to determine a first number of pixels having a first pixel value and a second number of pixels having a second pixel value; and taking the larger of the first pixel quantity and the second pixel quantity as the quantity of the effective pixels and the corresponding first pixel value or second pixel value as the gray scale of the effective pixels.
Drawings
FIG. 1 schematically illustrates two types of ball missing schematic diagrams;
FIG. 2 schematically illustrates a solder paste scattering diagram;
FIG. 3 illustrates a flow diagram of missing solder ball analysis according to one example;
figure 4A schematically shows a ball grid array image,
FIG. 4B schematically illustrates a schematic view of the positioning of missing solder balls in a ball grid array;
FIG. 5 shows a flow diagram of missing solder ball analysis according to another example;
fig. 6 shows a schematic diagram of the pad image subjected to the binarization process.
Detailed Description
The scheme provided by the embodiment of the invention is explained in detail in the following with reference to the attached drawings. While the preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
The technique of the present invention for analyzing the missing type of solder balls is based on the surface finish of the pads used for attaching solder paste. For both types of defects, i.e., 'solder paste failure' and 'ball attach failure', the surface finish of the pad region where the missing solder ball is located is affected differently. As shown in fig. 2, for the PAD printed with the solder paste, due to the existence of the intermetallic compound generated by the reaction of the solder paste with the PAD under the action of the reflow temperature field, the smoothness is low, and the light has the diffuse reflection phenomenon, so that less light is reflected to the camera when the camera is used for acquiring the image of the PAD area, thereby causing the gray level of the image of the PAD area to be low. In contrast, for the pad without printing the solder paste, since the pad itself is made of metal or alloy such as Ni, Pd, Au, the characteristic of high smoothness is maintained because the pad does not react with the solder paste, and thus the gray level of the image of the pad area obtained when the pad area is imaged is high. It should be noted here that since no solder paste exists, the subsequent ball-mounting process does not significantly affect the surface smoothness of the bonding pad. The invention judges the reason why the solder ball is missing at the position of the PAD by detecting the image gray difference of the PAD PAD area of the PAD without the solder ball.
Fig. 3 illustrates a method for analyzing defective solder balls on an on-chip ball grid array, in accordance with one embodiment of the present invention. In step 301, an image BGImage of a back ball grid array of the SoC chip is obtained, where the image BGImage includes a pad area image PadImg of missing solder balls, and a raw inspection data set ORG _ DataSet, where each piece of data in the data set ORG _ DataSet includes Position information Position for identifying the missing solder balls. Fig. 4 shows an exemplary ball grid array image BGImg in which missing solder balls occurred at the location indicated by BA 12. It is to be noted here that the data set ORG _ DataSet is a collection of Position identification data Position of defective solder balls generated in advance based on processing the ball grid image BGImg and identifying missing solder balls contained therein, in one example, the Position information Position contains Position data of a missing solder ball center or a pad center where a missing solder ball is located, and in another implementation, the Position information Position contains Position data of a reference point and coverage data associated with the reference point, with which a pad area image can be determined, as shown in fig. 4B, wherein for a solder ball a, its Position is defined by a reference point R and a coverage SQ.
In step 303, a pad area image PadImg of the pad Position where the missing solder ball, for example, BA12, is located is extracted from the image BGImage based on the missing solder ball Position information Position. For example, in the case where the Position information Position includes Position data of the pad center, an area image within a predetermined radius range around the pad center may be selected as the pad area image PadImg. When the Position information Position includes the reference point R and the coverage SQ data associated therewith, the image in the coverage SQ is read with reference to the reference point R as a reference, and is used as the pad area image PadImg.
Then, in step 305, the gray scale and the pixel number characteristic of each pixel in the pad area image PadImg are analyzed, and the gray scale and the number of effective pixels in the pad area image PadImg are determined by analyzing the gray scale of each pixel in the pad area image PadImg. According to one example, the gray value V of each pixel in the pad area image PadImg is read out first, where V ═ V1,v2,v3,……vNWhere N represents the number of pixels contained in the image PadImg. Subsequently, counting that each gray value v in the pad area image PadImg is in a first gray range S1Number of pixels N within1And the gray value is in the second gray range S2Number of pixels N within2. Since the existence of solder paste on the PAD affects the surface smoothness of the PAD and there is a large difference between the two, as described above, in one example of the present invention, the threshold value V is determined in advanceT1And a gray level threshold value VT2Wherein the gray level threshold value VT1Correspond toImage gray scale on pad without solder paste, and gray scale threshold VT2Corresponding to the image gray scale of the pad with solder paste. Using a grey threshold VT1And a gray level threshold value VT2Establishing a grayscale Range S1And S2I.e. the gray scale range S1Corresponding to greater than or equal to VT1And a gray scale range S2Corresponding to less than VT2. Thereby utilizing the gray scale range S1And the gray scale range S2Dividing pixels in the pad area image PadImg for the pixels which are not positioned in the gray scale range S1And the gray scale range S2Pixels in any range can be discarded. Thereby, based on the counted gray scale range S1Number of pixels N within1And a gray scale range S2Number of pixels N within2Valid pixels within the current pad area image PadImg can be determined. As shown in fig. 1, for a pad with solder paste, it is obvious that the main body of the pad image is mainly composed of intermetallic compound pixels formed by the solder paste and the pad, and the gray value of the intermetallic compound pixels is low; and for the pad image without the solder paste, the image is basically the metal or alloy surface image of the blank pad, and has basically consistent high pixel gray value. In an example of the present invention, the effective subject of the current PadImg, i.e. the effective pixel, specifically N, may be determined based on the number of pixels located in the different gray scale ranges S1And N2The pixel corresponding to the larger one of the pad area image bodies is used as an effective pixel of the pad area image body. At the same time, the calculation is performed in different gray scale ranges S1And S2Average gray value V of inner pixelS1And VS2。
In step 307, the number N and the gray scale V of the effective pixels are determined based on the step 305SThe type of missing solder balls at the current pad may be determined. For example, when N is1Greater than N2And V isS1Substantially equal to or greater than the gray threshold value VT1Determining that the missing solder ball at the current pad position belongs to the missing type of the soldering paste; when N is2Greater than N1And V isS2Substantially equal to or less than the gradation threshold value VT2Then the current pad position is determinedThe missing solder balls in (2) are of the ball attachment failure type. In another example of the present invention, in order to ensure that the body of the currently valid pixel represents a real body and avoid erroneous judgment of the pad due to contamination of the pad by other foreign matter and the like, a pixel count threshold NTR is further set, which corresponds to a reference pixel count on the pad area occupied by the standard solder paste printed on the pad, which may be determined in advance based on the camera resolution of the shot ball grid array and the size of the standard solder paste. Thus, in step 307, based on the determined N1And N2The larger of these, e.g. N2Further determine N2Whether substantially equal to the pixel count threshold NTR. If N is present2Substantially equal to NTR, or e.g. N2In the range of 80% -110% of NTR, the image body in PadImg is solder paste, so that the missing solder balls at the current pad positions can be made to belong to the ball mounting failure type. If N is present2If the current bonding pad position is not within the tolerance range of NTR, the judgment on the type of the bonding ball is abandoned, an alarm signal is generated, the current bonding pad position is indicated to be abnormal, and a worker is guided to further check. Similarly, if N1Is substantially equal to NTR, or N2Within the range of 80% -110% of NTR, normal judgment can be carried out, otherwise, the fact that the surface image of the pad which is not affected by soldering accounts for the main body relatively means that the surface image of the pad does not meet the requirement of a blank pad in PadImg is shown, and therefore an alarm signal is generated similarly to indicate that the position of the current pad is abnormal.
In another embodiment of the invention, for the ball grid array image shown in fig. 4A, the Position data Position of the detected defective ball grid is typically represented by physical coordinate data of missing solder balls on the image BGImg, e.g., in microns. Therefore, in order to facilitate image processing, in the present embodiment, translation processing is performed on data in the original detection data set ORG _ DataSet, mapping physical data into pixel data. Fig. 5 shows a flow chart of an analysis method of missing solder balls according to this example.
In step 501, an image BGImage of a back ball grid array of a SoC chip and a raw inspection data set ORG _ DataSet are obtained, wherein the data set ORG _ DataSet includesEach piece of data includes physical Position data PHY _ Position of missing solder balls. In this example, the physical Position data PHY _ Position includes a reference point R (x) identifying a defective ball grid0，y0) And its coverage data SQ (L, W), for example as shown in fig. 4B, these physical Position data PHY _ Position are obtained under an X-Y coordinate system as shown in the figure, where L, W then represent the side length of the rectangular range box SQ, and the origin of coordinates (0,0) corresponds to, for example, the upper left corner of the die-bottom ball grid array image shown in fig. 4A.
At step 503, each reference point R physical location (x) in the data set ORG _ DataSet is mapped to a camera resolution dpi based on the ball grid array image BGImg obtained0，y0) And the physical coverage (L, W) is translated into a reference pixel position (Px) in pixels0And Py0) And a Pixel footprint (Lp, Wp), wherein Lp, Wp represents the lateral and longitudinal dimensions of the footprint in pixels, thereby generating a Pixel data set Pixel _ DataSet of defective ball grids, which contains the Pixel position PixelPosition of each missing solder ball.
For example, in the case where the image resolving dpi is conventionally expressed in inches, the mapping relationship of the physical position to the pixel position is as follows for the case where the physical position of each reference point R and its coverage SQ are expressed in micrometers in this example:
Px0＝x′0·dpi/25400
Py0＝y′0·dpi/25400
Lp＝L·dpi/25400
Wp＝W·dpi/25400
the above-mentioned conversion relationship of pixels is expressed in microns and in inches, and it is understood that the conversion relationship can be realized by adjusting the scale factor (25400 in this example) for the case of expressing the physical location and the pixels in other units.
In step 505, the Pixel position PixelPosition of each missing solder ball is obtained from the Pixel _ DataSet generated in step 503, and the reference point position (Px) of each missing solder ball is extracted from the image BGImage0And Py0) Pad area within the indicated pixel coverage (Lp, Wp)Image PadImg.
In step 507, a gray scale range S is utilized1And the gray scale range S2To count the gray levels of each pixel in the pad area image PadImg, in this example, each pixel in the image PadImg can be distinguished by using a simplified gray level range. For example, a gradation threshold value V may be setT1＝VT2＝VTIn which V isTMay be VT2Or VT1Or any value in between. Thereby, the gray threshold V is usedTPerforming binarization processing on the gray level of each pixel in the pad area image PadImg, wherein the gray level of the pixel in the PadImg is greater than or equal to VTIs given a first value, e.g. VT1And the pixel gray scale in PadImg is smaller than VTIs given a second value, e.g. VT2. As shown in fig. 6, a diagram a shows a pad area image PadImgc with solder paste, a 'diagram a binarized pad area image PadImgc in a diagram a, a diagram B shows an area image PadImgc of an empty pad without solder paste, and a diagram B' shows an binarized area image PadImgc in a diagram B. As can be seen from the a 'and B' graphs, the resulting converted binary image has a significant difference in gray scale with respect to the presence or absence of solder paste.
In step 509, the statistics have a first gray value VT1Number of pixels N1And has a second grey value VT2Number of pixels N2To determine the valid pixels in PadImg. Wherein when N is1Greater than N2Then, it can be determined that there is a pixel value V in PadImgT1The pixel of (2) constitutes an effective pixel, whereas when N is used1Less than N2Then, it can be determined that there is a pixel value V in PadImgT2The pixels of (a) constitute effective pixels. It is to be noted here that if N is present1Is equal to N2Then the analysis for missing solder balls at that location is abandoned and the process returns to step 501 to continue analyzing the next location.
In step 511, the number of effective pixels N determined in step 509 is further determined1Or N2Whether or not the pixel count threshold NTR is satisfiedE.g. determining N1Or N2Whether it is in the range of 80% to 110% of NTR. If not, the solder ball detection is aborted and the process returns to step 501 to continue processing the next missing solder ball in the ball grid image BGImg. If it is determined in step 511 that the number of valid pixels meets the pixel count threshold requirement, then the type of reason for missing solder balls is output in step 513, e.g., when N is1Greater than N2Determining that the missing solder ball at the current pad position belongs to the missing type of the soldering paste; when N is2Greater than N1And if so, determining that the missing solder balls at the current pad position belong to the ball mounting failure type.
In this example, the pixel translation is illustrated by using the reference point R as an example of the position of each missing solder ball in the original inspection data set ORG _ DataSet, but the pixel translation process is similar to the case where the missing solder ball is indicated by other methods such as the solder ball center position in ORG _ DataSet, and the description thereof is omitted here.
While the general aspects of the present invention have been described in connection with various embodiments, it should be noted that the steps in the above embodiments may be implemented in hardware, software, firmware, or a combination thereof, for example, the method disclosed herein may be implemented by a processor executing a machine-readable program or instructions stored in a memory. For example, in one application example of the present invention, the method disclosed herein may be implemented by a missing solder ball analysis apparatus, which includes a memory storing a computer readable program and a processor, wherein the processor executes the readable program to implement the missing solder ball analysis method proposed by the present invention. In an implementation of the invention, the memory may be any type of storage medium, such as a hard disk, a solid state disk, an optical storage medium, etc. Furthermore, a person skilled in the art will appreciate that different technical means described in the different embodiments above may be combined to obtain further embodiments, which are also within the scope of the invention.
Claims (13)
1. A ball grid defect analysis method comprises the following steps:
acquiring a ball grid array image containing missing solder balls;
extracting a pad area image of a pad where the missing solder ball is located;
determining the gray scale of pixels in the pad area image and the number of pixels corresponding to the gray scale;
determining a defect type of the missing solder balls based on the gray scale and the number of the pixels.
2. The method of claim 1, wherein determining the grayscale and number of pixels in the pad area image comprises: determining the gray scale of the effective pixels and the number of the effective pixels in the pad area image, including:
determining the gray value of each pixel in the pad area image;
counting a first number of pixels with gray values within a first gray range in the pad area image;
counting a second number of pixels in the pad area image having a gray value within a second gray range,
wherein the larger of the first number and the second number is taken as the number of the effective pixels, and the average value of the gradation range corresponding to the larger of the first number and the second number is taken as the gradation of the effective pixels.
3. The method of claim 2, when the number of valid pixels is within a predetermined range of values: if the gray scale of the effective pixel is larger than or equal to a first preset gray scale threshold value, determining that the missing solder ball belongs to a solder paste missing type, otherwise, if the gray scale is smaller than or equal to a second preset gray scale threshold value, determining that the missing solder ball belongs to a ball planting failure type,
wherein the first predetermined grayscale threshold is predetermined based on the grayscale of the image of the blank pad without solder paste and the second predetermined grayscale threshold is predetermined based on the grayscale of the image of the pad with solder paste.
4. The method of claim 3, wherein the first predetermined grayscale threshold is the same as the second predetermined grayscale threshold and is equal to an average of a grayscale image of the pad without solder paste and a grayscale image of the pad with solder paste.
5. A process as claimed in claim 3 or 4, wherein
Wherein the first gray scale range is defined as being greater than or equal to the first predetermined gray scale threshold value and the second gray scale range is defined as being less than or equal to the second predetermined gray scale threshold value
Binarizing pixel gray values in the pad region image which respectively fall into the first gray range and the second gray range to determine a first pixel number with a first pixel value and a second pixel number with a second pixel value;
and taking the larger of the first pixel quantity and the second pixel quantity as the quantity of the effective pixels and the corresponding first pixel value or second pixel value as the gray scale of the effective pixels.
6. The method of any of claims 1-4, wherein said extracting the pad area image of the pad where the missing solder ball is located further comprises:
acquiring position data of the missing solder balls on the ball grid array image;
and acquiring the pad area image in a preset space range based on the position data.
7. The method of claim 6, wherein the position data represents a center of the missing solder ball and the predetermined spatial extent is defined by a predetermined solder ball radius.
8. The method of claim 6, wherein,
the position data represents a reference point indicative of the missing solder balls;
the predetermined spatial range is associated with the reference point location data and defines a range of the missing solder balls.
9. The method of claim 5, wherein said position data represents a physical coordinate position of said missing solder balls in said ball grid array image, and said predetermined spatial range represents a physical spatial range;
the method further comprises the following steps: translating the physical coordinate position data and the predetermined spatial range into pixel coordinate data and a pixel spatial range in pixels according to a pixel resolution of the ball grid array image.
10. The method of claim 9, wherein a pixel resolution of said ball grid array image is defined by a camera resolution at which said ball grid array was captured.
11. A process as claimed in any one of claims 2 to 4, wherein
The predetermined range of values relates to a predetermined number of pixels of the standard solder paste at the resolution.
12. An apparatus for analyzing missing solder balls, comprising:
a memory having a computer readable program stored therein,
a processor for executing the readable program to implement the method of one of claims 1 to 11.
13. A computer readable storage medium having computer readable instructions stored thereon, which when executed by a processor, cause the processor to perform the method of one of claims 1-11.
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