CN113962188B - Path planning method for conformal printing of multi-scale circuit on free-form surface - Google Patents
Path planning method for conformal printing of multi-scale circuit on free-form surface Download PDFInfo
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- 238000007639 printing Methods 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 80
- 238000001125 extrusion Methods 0.000 claims abstract description 14
- 238000005259 measurement Methods 0.000 claims description 10
- 238000003854 Surface Print Methods 0.000 claims description 3
- 238000002790 cross-validation Methods 0.000 claims description 3
- 238000013138 pruning Methods 0.000 claims description 3
- 238000012549 training Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000007921 spray Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 235000015842 Hesperis Nutrition 0.000 description 1
- 235000012633 Iberis amara Nutrition 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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Abstract
A path planning method for conformal printing of a multi-scale circuit on a free-form surface takes three-dimensional measurement-obtained curved surface point cloud data, two-dimensional points on a circuit conductive wiring structure and printing parameters as inputs, prints the input circuit structure on any area of a curved surface based on a k-nearest neighbor method, sets a threshold value to control printing precision, obtains a printing path formed by a three-dimensional path point set, and directly and conformally prints the multi-scale circuit on the free-form surface; the invention can directly print the conductive circuit on any curved surface by using an extrusion printing process and an electrostatic printing process, simplifies the data processing process and improves the printing precision.
Description
Technical Field
The invention belongs to the technical field of additive manufacturing, and particularly relates to a path planning method for conformal printing of a multi-scale circuit on a free-form surface.
Background
The multi-scale circuit is conformally manufactured on the surface of the free-form surface, so that the multi-scale circuit can be applied to wearable flexible electronic equipment and a biosensor, is widely applied to sensing detection and satellite communication on aircrafts such as airplanes and rockets, and has great development prospects in the fields of aerospace, information communication and the like.
The 3D printing technology is one of the key methods for conformally manufacturing multi-scale circuits on the free-form surface, and the common printing methods include extrusion printing and electrostatic direct-writing printing. The extrusion printing process is to extrude printing ink from the spray head to form continuously distributed fibers, and has the advantages of low printing cost and simplicity in operation; the basic principle of the electrostatic direct-writing printing process is that direct-current high-voltage electricity is applied between a nozzle and a substrate, charge accumulation is generated on the surface of a material solution at the position of the printing nozzle and gradually evolves into a Taylor cone state, and when the electrostatic field force exceeds the surface tension of the material solution, the material solution forms extremely fine jet flow which is far smaller than the diameter of a printing spray head at the top end of the Taylor cone in a pulling-out mode. According to the two printing methods, the matched movement of the receiving substrate and the Z axis is controlled, namely, a reasonable printing path is controlled, a circuit with the line width of more than one hundred micrometers is manufactured by using an extrusion printing process by using a spray head with the same diameter, a circuit with the line width of less than one hundred micrometers is manufactured by using an electrostatic direct-writing printing process, and a specific multi-scale circuit pattern can be printed on a curved substrate.
The existing path planning method for the 3D printing circuit on the free-form surface is characterized in that on a curved surface model with known modeling parameters in advance, a designed circuit pattern is projected onto the curved surface after being processed by commercial slicing software such as UG, solidWorks, and the planned printing path is represented by expressions such as parameter spline curves, B-spline curves or NURBS curves.
For the situation that the starting point of the printing path needs to be specified and parameters of the curved surface model are unknown, for example, when the original conformal circuit defect is repaired or an additional circuit is added at a specified position on a circuit of the curved surface model with unknown modeling parameters, the existing path planning method cannot accurately repair the defect or add the circuit at the specified position as required, and has a certain limitation. Therefore, it is necessary to explore a path planning method that can be applied to not only a model of unknown curved surface parameters, but also print a multi-scale circuit at an arbitrary position.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a path planning method for conformal printing of a multi-scale circuit on the surface of a free curved surface, which can directly print a conductive circuit on any curved surface by using an extrusion printing process and an electrostatic printing process, simplify the data processing process and improve the printing precision.
In order to achieve the above purpose, the present invention is realized by the following technical scheme:
a path planning method for conformal printing of a multi-scale circuit on a free-form surface takes three-dimensional measurement of curved surface point cloud data, two-dimensional points on a circuit conductive wiring structure and printing parameters as input, prints the input circuit structure on any area of a curved surface based on a k-nearest neighbor method, sets a threshold value to control printing precision, obtains a printing path formed by a three-dimensional path point set, and directly and conformally prints the multi-scale circuit on the free-form surface.
A path planning method for conformal printing of a multi-scale circuit on a free-form surface comprises the following steps:
step S1, inputting point cloud data, two-dimensional points and printing parameters: extracting curved surface point cloud data obtained by three-dimensional measurement, planning a circuit conductive wiring structure, sequentially extracting two-dimensional points in the circuit conductive wiring structure, and setting printing parameters such as starting point coordinates, threshold values, receiving distances and the like;
step S2, selecting a printing starting point and converting a coordinate system: selecting a printing starting point, shifting the printed two-dimensional points according to the starting point coordinates, and moving the two-dimensional points to a designated area;
step S3, solving the z coordinate of the two-dimensional point corresponding to the curved surface based on a k nearest neighbor method to obtain a three-dimensional path point;
step S4, deleting three-dimensional path points: setting a threshold value to perform pruning operation on the three-dimensional path points, and reserving special points;
step S5, three-dimensional path point bias: biasing the three-dimensional path points according to the receiving distance of the curved surface printing;
step S6, outputting a printing path formed by the three-dimensional path point set: g codes are generated according to the three-dimensional path point set, and the multi-scale circuit is directly printed on the free-form surface in a conformal mode by using an extrusion printing process and an electrostatic printing process.
The specific implementation method of the step S3 is as follows: based on a k nearest neighbor method, adopting a cross validation method to select an optimal k value, a distance measurement and a classification decision method, taking curved surface point cloud data obtained by scanning as a sample data set, printing plane coordinates of a circuit structure as sample points to be tested, solving an average value of k training sample points nearest to the sample points to be tested, wherein the average value is the z coordinate of the sample points to be tested projected onto a curved surface, solving a three-dimensional coordinate corresponding to a two-dimensional point, and obtaining a three-dimensional path point.
The specific implementation method of the step S4 is as follows:
4.1 Extracting three adjacent points k from the three-dimensional path point i ,k i+1 ,k i+2 Judging k i+1 Whether or not to useFor special points, if k i+1 If the point is a non-special point, performing step 4.2); if k i+1 Is a special point, reserve k i+1 Let i=i+1, empty temp_point, repeat step 4.1);
4.2 To k) i+1 Storing temp_point, setting threshold z th Calculating the point-to-point in temp_pointIs the maximum distance z of (2) max When z max ≤z th When deleting point k i+1 The method comprises the steps of carrying out a first treatment on the surface of the When z max >z th When reserve k i+1 Let i=i+1, empty temp_point;
4.3 Repeating steps 4.1), 4.2), traversing all the path points.
Determining point k i+1 The method for judging whether the special point is as follows: if point k i ,k i+1 ,k i+2 The projection points on the XY plane are collinear, then k i+1 Is a non-special point of the pattern; if point k i ,k i+1 ,k i+2 The projection points on the XY plane are not collinear, then k i+1 Let i=i+1, empty temp_point, and re-judge k for a special point of the pattern i ,k i+1 ,k i+2 Until a non-special point is found.
The invention has the following beneficial effects:
1) Simplifying the path planning flow: and compared with the traditional method for acquiring the curved surface stl model and then acquiring the printing path through slicing processing in a plurality of commercial software, the method does not need to reconstruct the curved surface stl model, simplifies the flow and improves the data processing efficiency.
2) Parameterizing: by setting parameters such as printed circuit conductive wiring structures, printing starting points, threshold values, offset distances and the like, specific circuit structures can be printed in a specified area of the curved surface, and printing precision is controlled.
3) The calculation accuracy is high: and the z coordinate of the two-dimensional point corresponding to the curved surface is calculated based on a k nearest neighbor method, so that a three-dimensional path point is obtained, an optimal k value, a distance measurement and a classification decision method can be selected according to scanned curved surface data, and the calculation accuracy is improved.
4) The number of the three-dimensional path points is adjustable: the maximum error allowed when deleting the path points can be controlled according to the threshold value, and a proper number of three-dimensional path points can be selected, so that the requirements of printing precision and speed can be met.
5) Pattern fidelity: when deleting three-dimensional path points, special points on the printed pattern are reserved, and the integrity of the printed pattern is ensured when the multi-scale circuit is printed on the free-form surface in a conformal mode.
6) The application range is wide: the method is applicable to extrusion printing technology and electrostatic printing technology, and can be used for directly conformally printing a multi-scale circuit on the free-form surface.
Drawings
FIG. 1 is a flow chart of the method of the present invention.
Fig. 2 is a schematic diagram of input point cloud data and two-dimensional points in the method of the present invention.
FIG. 3 is a schematic diagram of selecting a print origin and converting a coordinate system in the method of the present invention.
FIG. 4 (a) is a schematic diagram of a method of determining the z-coordinate of a two-dimensional point on a curved surface according to the present invention; fig. 4 (b) is a schematic illustration of a three-dimensional point of path deleted in the method of the present invention.
FIG. 5 (a) is a schematic representation of three-dimensional waypoint biasing in the method of the present invention; FIG. 5 (b) is a schematic diagram of the output three-dimensional set of path points in the method of the present invention; fig. 5 (c) is a schematic diagram of a print path formed by outputting a three-dimensional set of path points according to the method of the present invention.
FIG. 6 is a flow chart of a method for eliminating three-dimensional waypoints in the method of the present invention.
FIG. 7 is a schematic diagram of a method of determining whether a point is a special point according to the present invention.
FIG. 8 is a schematic diagram of a multi-scale circuit for conformal printing on a free-form surface in accordance with the present invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It is to be understood that the described embodiments are some, but not all, of the embodiments of the present invention, and that the specific embodiments described herein are intended to be illustrative of the invention and not limiting.
As shown in fig. 1, a path planning method for conformally printing a multi-scale circuit on a free-form surface includes the following steps:
step S1, inputting point cloud data, two-dimensional points and printing parameters: extracting curved surface point cloud data obtained by three-dimensional measurement, planning a circuit conductive wiring structure, sequentially extracting two-dimensional points in the circuit conductive wiring structure, and setting printing parameters such as starting point coordinates, threshold values, receiving distances and the like;
as shown in fig. 2, curved surface point cloud data obtained by three-dimensional measurement is obtained, a coordinate system is set as O-xyz, and specific formats of Qu Miandian cloud data are vertex files such as asc, vtx, pcd and the like; below fig. 2 is a planned circuit conductive wiring structure, which may be drawn using commercial CAD software, such as Solidworks, UG, or may be programmed using languages such as Python, c++, etc.; the coordinate system of the circuit conductive wiring structure is O ' -x ' y ', the printing starting point is A, the printing end point is B, and the printing direction is shown in the figure; sequentially extracting two-dimensional points at intervals of a distance according to the printing direction to obtain a series of plane coordinates;
step S2, selecting a printing starting point and converting a coordinate system: selecting a printing starting point, shifting the printed two-dimensional points according to the starting point coordinates, and moving the two-dimensional points to a designated area;
as shown in fig. 3, a coordinate system O ' -x ' y ' is overlapped with the xy plane of the coordinate system O-xyz, a point is selected on the curved surface as a printing starting point, a point a in fig. 3 is a printing starting point, and the two-dimensional point is translated to a designated printing position;
step S3, solving the z coordinate of the two-dimensional point corresponding to the curved surface based on a k nearest neighbor method to obtain a three-dimensional path point;
as shown in fig. 4 (a), based on a k nearest neighbor method, selecting an optimal k value, a distance measurement and a classification decision method by adopting a cross validation method, taking curved surface point cloud data obtained by scanning as a sample data set, printing plane coordinates of a circuit structure as sample points to be tested, and calculating an average value of k training sample points nearest neighbor to the sample points to be tested, wherein the average value is the z coordinate of the sample points to be tested projected onto a curved surface, and calculating three-dimensional coordinates corresponding to two-dimensional points to obtain three-dimensional path points, wherein fig. 4 (a) shows all three-dimensional path points;
step S4, deleting three-dimensional path points: setting a threshold value to perform pruning operation on the three-dimensional path points, and reserving special points;
as shown in fig. 4 (b), the three-dimensional path points are pruned according to the set threshold value, the special points are reserved, fig. 4 (b) shows the pruned three-dimensional path points, 720 three-dimensional path points are added, and 47281 three-dimensional path points are reduced compared with fig. 4 (a);
step S5, three-dimensional path point bias: biasing the three-dimensional path points according to the receiving distance of the curved surface printing;
as shown in fig. 5 (a), the three-dimensional path point is shifted upward according to the distance between the head and the receiving substrate at the time of 3D printing; as shown in fig. 5 (b), outputting a printed three-dimensional set of path points; as shown in fig. 5 (c), three-dimensional path points are sequentially connected to obtain a print path formed by a three-dimensional path point set;
step S6, outputting a printing path formed by the three-dimensional path point set: g codes are generated according to the three-dimensional path point set, and the multi-scale circuit is directly printed on the free-form surface in a conformal mode by using an extrusion printing process and an electrostatic printing process.
As shown in fig. 6, the specific implementation method for deleting the path point in the step S4 is as follows:
1) Extracting three adjacent points k from three-dimensional path points i ,k i+1 ,k i+2 Judging k i+1 If it is a special point, if k i+1 If the point is a non-special point, performing the step 2); if k i+1 Is a special point, reserve k i+1 Let i=i+1, empty temp_point, repeat step 1);
2) Will k i+1 Storing temp_point, setting threshold z th Calculating the point-to-point in temp_pointIs the maximum distance z of (2) max When z max ≤z th When deleting point k i+1 The method comprises the steps of carrying out a first treatment on the surface of the When z max >z th When reserve k i+1 Let i=i+1, empty temp_point;
3) Repeating the step 1) and the step 2), and traversing all the path points.
As shown in fig. 7, the point k is determined i+1 The method for judging whether the special point is as follows: if point k i ,k i+1 ,k i+2 The projection points on the XY plane are collinear, then k i+1 Is a non-special point of the pattern; if point k i ,k i+1 ,k i+2 The projection points on the XY plane are not collinear, then k i+1 Is a special point of the pattern; in FIG. 7, point k 1 ,k 2 ,k 3 The projection points on the XY plane are collinear, and therefore, k 2 Is a non-special point; point k 2 ,k 3 ,k 4 The projection points on the XY plane are not collinear, and therefore, k 3 Is a special point.
In an embodiment, a multi-scale circuit is conformally printed on the surface of a wavy curved surface with unknown model parameters.
A path planning method for conformal printing of a multi-scale circuit on a free-form surface comprises the following steps:
step S1, inputting point cloud data, two-dimensional points and printing parameters: selecting a wavy polyimide curved surface with unknown model parameters, extracting curved surface point cloud data obtained by three-dimensional measurement, programming a Python program to program a circuit conductive wiring structure, sequentially extracting two-dimensional points in the circuit conductive wiring structure, setting starting point coordinates (23, 47), setting a threshold value to be 0.005mm, setting the diameter of a needle to be 210 mu m, setting the receiving distance to be 400 mu m, setting the printing speed to be 10mm/s, adopting extrusion flow to be 200 mu L/h, and setting the direct current voltage applied at a nozzle to be 750V;
step S2, selecting a printing starting point and converting a coordinate system: selecting a printing starting point (23, 47), shifting the printed two-dimensional point to a specified area according to the starting point coordinates;
step S3, solving the z coordinate of the two-dimensional point corresponding to the curved surface based on a k nearest neighbor method to obtain a three-dimensional path point;
step S4, deleting three-dimensional path points: according to the set threshold value of 0.005mm, deleting the three-dimensional path points, and reserving special points;
step S5, three-dimensional path point bias: biasing the three-dimensional path points according to the receiving distance 400 mu m of the curved surface electrostatic printing;
step S6, outputting a printing path formed by the three-dimensional path point set: generating a G code according to the three-dimensional path point set, directly conformally printing a multi-scale circuit on the free-form surface of polyimide by using an electrostatic printing process, wherein the printing material is conductive silver paste, and a spray head is connected with a 750V high-voltage direct current power supply in the printing process; as shown in FIG. 8, the wire width of the electrostatic printing was about 80. Mu.m.
Setting the starting point coordinates of extrusion printing as (15, 47), the threshold value as 0.01mm, the diameter of the needle head as 210 mu m, the receiving distance as 200 mu m, the printing speed as 1mm/s, adopting the extrusion flow as 200 mu L/h; repeating the steps S1 to S6 to obtain a printing path formed by a three-dimensional path point set, and directly printing a multi-scale circuit on the free-form surface of polyimide in a conformal manner by using an extrusion printing process, wherein the printing material is conductive silver paste; as shown in FIG. 8, the extrusion printed wire width was about 200. Mu.m.
Claims (4)
1. A path planning method for conformal printing of a multi-scale circuit on a free-form surface is characterized by comprising the following steps:
step S1, inputting point cloud data, two-dimensional points and printing parameters: extracting curved surface point cloud data obtained by three-dimensional measurement, planning a circuit conductive wiring structure, sequentially extracting two-dimensional points in the circuit conductive wiring structure, and setting printing parameters of starting point coordinates, threshold values and receiving distances;
step S2, selecting a printing starting point and converting a coordinate system: selecting a printing starting point, shifting the printed two-dimensional points according to the starting point coordinates, and moving the two-dimensional points to a designated area;
step S3, solving the z coordinate of the two-dimensional point corresponding to the curved surface based on a k nearest neighbor method to obtain a three-dimensional path point;
step S4, deleting three-dimensional path points: setting a threshold value to perform pruning operation on the three-dimensional path points, and reserving special points;
step S5, three-dimensional path point bias: biasing the three-dimensional path points according to the receiving distance of the curved surface printing;
step S6, outputting a printing path formed by the three-dimensional path point set: g codes are generated according to the three-dimensional path point set, and the multi-scale circuit is directly printed on the free-form surface in a conformal mode by using an extrusion printing process and an electrostatic printing process.
2. The path planning method for conformal printing of a multi-scale circuit on a free-form surface according to claim 1, wherein the specific implementation method of step S3 is as follows: based on a k nearest neighbor method, adopting a cross validation method to select an optimal k value, a distance measurement and a classification decision method, taking curved surface point cloud data obtained by scanning as a sample data set, printing plane coordinates of a circuit structure as sample points to be tested, solving an average value of k training sample points nearest to the sample points to be tested, wherein the average value is the z coordinate of the sample points to be tested projected onto a curved surface, solving a three-dimensional coordinate corresponding to a two-dimensional point, and obtaining a three-dimensional path point.
3. The path planning method for conformal printing of a multi-scale circuit on a free-form surface according to claim 1, wherein the specific implementation method of step S4 is as follows:
4.1 Extracting three adjacent points k from the three-dimensional path point i ,k i+1 ,k i+2 Judging k i+1 If it is a special point, if k i+1 If the point is a non-special point, performing step 4.2); if k i+1 Is a special point, reserve k i+1 Let i=i+1, empty temp_point, repeat step 4.1);
4.2 To k) i+1 Storing temp_point, setting threshold z th Calculating the point-to-point in temp_pointIs the maximum distance z of (2) max When z max ≤z th When deleting point k i+1 The method comprises the steps of carrying out a first treatment on the surface of the When z max ＞z th When reserve k i+1 Let i=i+1, empty temp_point;
4.3 Repeating steps 4.1), 4.2), traversing all the path points.
4. A path planning method for conformal printing of a multi-scale circuit on a free-form surface according to claim 3, wherein the judgment point k i+1 The method for judging whether the special point is as follows: if point k i ,k i+1 ,k i+2 The projection points on the XY plane are collinear, then k i+1 Is a non-special point of the pattern; if point k i ,k i+1 ,k i+2 The projection points on the XY plane are not collinear, then k i+1 Let i=i+1, empty temp_point, and re-judge k for a special point of the pattern i ,k i+1 ,k i+2 Until a non-special point is found.
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