CN113962180B - Optimization method for analyzing position of acceleration sensor on PCB based on FEA - Google Patents

Optimization method for analyzing position of acceleration sensor on PCB based on FEA Download PDF

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CN113962180B
CN113962180B CN202111539365.8A CN202111539365A CN113962180B CN 113962180 B CN113962180 B CN 113962180B CN 202111539365 A CN202111539365 A CN 202111539365A CN 113962180 B CN113962180 B CN 113962180B
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pcb
deformation
acceleration sensor
frequency
amplitude
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CN113962180A (en
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王峰
雷彬
罗治
童志峰
崔勇
胡棋杨
尹小波
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Zhongda Intelligent Technology Co.,Ltd.
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Zhongda Testing Hunan Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/36—Circuit design at the analogue level
    • G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2115/00—Details relating to the type of the circuit
    • G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces

Abstract

The invention discloses an optimization method for analyzing the position of an acceleration sensor on a PCB (printed circuit board) based on FEA (field emission analysis), relates to the technical field of acceleration sensors, and solves the technical problem that the acceleration values measured by the acceleration sensor at different positions of the PCB are very different, and the optimization method comprises the following steps: carrying out static stress analysis on the PCB, and researching the deformation condition of the PCB; dynamically analyzing the PCB and researching the deformation condition of the PCB; performing dynamic response analysis at the midpoint position of the PCB to obtain the instantaneous maximum deformation of the middle position of the PCB; analyzing to obtain the position of the midpoint of the PCB as the position with the maximum deformation according to the deformation condition of the PCB under different conditions, wherein the deformation is smaller when the position is closer to the screw; and welding the acceleration sensor at the middle position of the PCB and the position close to the screw to perform a comparison test, and analyzing according to the deformation condition of the acceleration sensor to obtain the optimal solution of the layout scheme of the acceleration sensor on the PCB.

Description

Optimization method for analyzing position of acceleration sensor on PCB based on FEA
Technical Field
The invention relates to the technical field of acceleration sensors, in particular to an optimization method for analyzing the position of an acceleration sensor on a PCB (printed circuit board) based on FEA (field emission analysis).
Background
The core detecting element of the wireless inclinometer is an acceleration sensor, and generally consists of a mass block, a damper, an elastic element, a sensitive element, an adaptive circuit and the like; in the acceleration process, the acceleration sensor obtains an acceleration value by measuring the inertial force borne by the mass block and utilizing a Newton's second law; by measuring the acceleration due to gravity, the inclination angle of the device relative to the horizontal plane can be calculated; by analyzing the dynamic acceleration, the moving mode of the equipment can be analyzed;
the acceleration sensor is mainly used for safety performances of an automobile safety airbag, an anti-lock system, a traction control system and the like; for example: 1. in security applications, fast response of the accelerometer is important; the time when the airbag should pop up is determined quickly, so the acceleration sensor must react instantaneously; the response time of the device can be shortened by using a sensor design that can reach a steady state quickly rather than vibrating more than ever; 2. in the application of bridge health monitoring, the method mainly comprises the steps of observing structural vibration, such as long-term monitoring of bridge transverse dynamic displacement of structures such as a main beam, a stay cable and a bridge pier;
the acceleration sensor has great difference of acceleration values measured at different positions of a PCB, if the acceleration sensor is welded at the position with the maximum deformation of the PCB, the measured acceleration value is far away from the real acceleration value, and due to the resonance influence, the acceleration measurement value will be seriously deviated from the real value, possibly resulting in early warning time delay of monitoring equipment or false missing report, and failing to make corresponding measures to solve the problems in time, thus causing great economic loss and casualties.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides an optimization method for analyzing the position of the acceleration sensor on the PCB based on the FEA, and aims to weld the acceleration sensor at the position with small stress and deformation of the PCB, give full play to the optimal measurement performance of the acceleration sensor and provide more accurate measurement values for equipment.
To achieve the above object, an embodiment according to a first aspect of the present invention provides an optimization method for analyzing the position of an acceleration sensor on a PCB based on FEA, comprising the steps of:
the method comprises the following steps: analyzing static stress of the PCB, and researching the deformation condition of the PCB to obtain a first reference example;
the hypothetical conditions for the analysis were: the grade of the PCB material is FR-4, and the composite material is made of epoxy resin, filler and glass fiber; the ideal assumption here is that the PCB material is epoxy;
in the first reference example, the maximum deformation of the PCB of 0.0272mm is located at the middle position of the PCB, and the corresponding stress at the middle position of the PCB is 0.01517N/m;
step two: dynamically analyzing the PCB, and researching the deformation condition of the PCB to obtain a reference example II; performing dynamic response analysis at the midpoint position of the PCB to obtain the instantaneous maximum deformation of the middle position of the PCB; the middle point position of the PCB is the middle position of the PCB;
in reference example two, the maximum deformation amount of the PCB is 2.707 × 10-6mm is located at the middle position of the PCB, and the corresponding stress of the middle position of the PCB is 0.007913N/m;
the two analyses with reference example one gave: the middle point position of the PCB is the position with the maximum deformation, and the position closer to the screw deforms less;
step three: welding an acceleration sensor at the middle position of the PCB and at a position close to the screw to perform a comparison test, and verifying whether the deformation of two decimal places influences the test precision of the equipment; and analyzing to obtain the optimal solution of the layout scheme of the acceleration sensor on the PCB according to the deformation condition of the acceleration sensor.
Further, static stress analysis is performed on the PCB, specifically:
defining the loading condition: applying a harmonic load with the amplitude of 1N and the frequency of 1Hz to the PCB along the normal direction in the opposite direction, wherein the frequency lasts for 5 s; dividing according to a standard grid, and researching the deformation condition of the PCB;
carrying out post-processing on the deformation condition of the PCB: checking the calculation stress, strain and displacement results of each point of the PCB; obtaining reference example I; and analyzing according to the reference example to obtain the maximum deformation of the PCB and the stress at the corresponding position.
Further, the dynamic analysis is performed on the PCB, specifically:
defining the loading condition: applying a harmonic load with the amplitude of 1N and the frequency of 1Hz to the PCB along the normal direction, wherein the frequency lasts for 5 s; dividing according to a standard grid, and researching the deformation condition of the PCB;
carrying out post-processing on the deformation condition of the PCB: checking the calculation stress, strain and displacement results of each point of the PCB; obtaining reference example II; and (4) analyzing according to the reference example to obtain the maximum deformation of the PCB and the stress at the corresponding position.
Further, weld acceleration sensor in PCB intermediate position and be close to the screw position and do the contrast test, concrete step is:
determining the worst condition situation based on the multi-frequency dynamic analysis of the PCB at the amplitude of 1N and the amplitude of 5N, and acquiring the corresponding harmonic load; the harmonic load comprises an amplitude and a frequency;
in response to the acquisition of the corresponding harmonic load, performing dynamic analysis of the acceleration sensor at the position where the deformation amount is maximum based on the harmonic load; the method comprises the following steps:
welding an acceleration sensor at the middle position of a PCB, dividing the acceleration sensor according to a standard grid, and researching the deformation condition of the acceleration sensor; welding an acceleration sensor at a position of the PCB close to the screw; dividing according to a standard grid, and researching the deformation condition of the acceleration sensor;
and analyzing to obtain the optimal solution of the layout scheme of the acceleration sensor on the PCB according to the deformation conditions of the acceleration sensor at different positions.
Further, the multi-frequency dynamic analysis of the PCB with the amplitude of 1N specifically includes:
respectively applying harmonic loads with the amplitude of 1N and the frequencies of 1Hz, 5Hz, 10Hz, 20Hz, 50Hz and 100Hz and the frequency duration of 5s to the PCB along the normal direction, and researching the deformation condition of the PCB according to grid control and grid division based on curvature; and obtaining deformation data of each frequency when the amplitude is 1N.
Further, the multi-frequency dynamic analysis of the PCB at an amplitude of 5N specifically includes:
respectively applying harmonic loads with the amplitude of 5N, the frequencies of 1Hz, 5Hz, 10Hz, 20Hz, 50Hz and 100Hz and the frequency duration of 5s to the PCB along the normal direction, and researching the deformation condition of the PCB according to grid control and grid division based on curvature; and obtaining deformation data of each frequency when the amplitude is 5N.
Further, comparing and analyzing the deformation data of each frequency at the amplitude of 1N with the deformation data of each frequency at the amplitude of 5N, preliminarily obtaining the adjoint relationship between the deformation amount and the amplitude and the frequency, and determining the worst condition, namely the condition with the maximum increase of the deformation amount.
The accompanying relationship between the deformation amount, the amplitude and the frequency specifically comprises the following steps:
when the load amplitude is kept unchanged and the load frequency is increased, the deformation is increased;
when the load frequency is kept constant, the load amplitude increases, and the deformation increases very obviously.
Further, in the dynamic analysis of the acceleration sensor at the position where the amount of deformation is the largest, the acceleration sensor is replaced with a rectangular parallelepiped of length × width × height =6mm × 6mm × 2.2mm, and the material is silicon.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the maximum deformation of the PCB and the stress at the corresponding position are obtained by performing static stress analysis and dynamic analysis on the PCB; then, carrying out dynamic response analysis at the midpoint position of the PCB to obtain the instantaneous maximum deformation of the middle position of the PCB; comparing by combining the analysis results to obtain that the midpoint position of the PCB is the position with the maximum deformation, and the position closer to the screw is smaller in deformation; then welding an acceleration sensor at the middle position of the PCB and at a position close to the screw to perform a comparison test, verifying whether the deformation of two decimal places influences the test precision of the equipment, wherein the worst condition is determined by the multi-frequency dynamic analysis of the PCB at the amplitude of 1N and the amplitude of 5N, and the corresponding harmonic load is obtained; dynamic analysis of the acceleration sensor at the position with the maximum deformation is carried out on the basis of the harmonic load, so that the difference of comparison test data is more obvious, and comparison is convenient; and analyzing the optimal solution of the layout scheme of the acceleration sensor on the PCB according to the deformation conditions of the acceleration sensor at different positions, thereby further improving the measurement precision of the wireless inclinometer equipment based on the acceleration sensor chip.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of the method of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the optimization method for analyzing the position of the acceleration sensor on the PCB based on the FEA includes the following steps:
the method comprises the following steps: performing static stress analysis on the PCB, wherein the assumed conditions of the analysis are as follows: the grade of the PCB material is FR-4, and the composite material is made of epoxy resin, filler and glass fiber; the ideal assumption here is that the PCB material is epoxy; the method specifically comprises the following steps:
defining the loading condition: applying a harmonic load with the amplitude of 1N and the frequency of 1Hz to the PCB along the normal direction in the opposite direction, wherein the frequency lasts for 5 s; dividing according to a standard grid, and researching the deformation condition of the PCB;
carrying out post-processing on the deformation condition of the PCB: checking the calculation stress, strain and displacement results of each point of the PCB; obtaining reference example I; analyzing according to a reference example to obtain the maximum deformation of the PCB and the stress at the corresponding position; in the first reference example, the maximum deformation of the PCB of 0.0272mm is located at the middle position of the PCB, and the corresponding stress at the middle position of the PCB is 0.01517N/m;
in the embodiment, a severe working condition of a limit is assumed, namely a constant pressure of 1N is applied to the PCB along the normal direction, namely, a special point with the instantaneous value of the harmonic load of the linear power as a peak point is selected to research the deformation condition of the PCB;
step two: the dynamic analysis is carried out on the PCB, and specifically comprises the following steps:
defining the loading condition: applying a harmonic load with the amplitude of 1N and the frequency of 1Hz to the PCB along the normal direction, wherein the frequency lasts for 5 s; dividing according to a standard grid, and researching the deformation condition of the PCB;
carrying out post-processing on the deformation condition of the PCB: checking the calculation stress, strain and displacement results of each point of the PCB; obtaining reference example II; analyzing according to a reference example to obtain the maximum deformation of the PCB and the stress at the corresponding position; in reference example two, the maximum deformation amount of the PCB is 2.707 × 10-6mm is located at the middle position of the PCB, and the corresponding stress of the middle position of the PCB is 0.007913N/m;
performing dynamic response analysis on the midpoint position of the PCB to obtain that the instantaneous maximum deformation of the middle position of the PCB is 0.0283884-0.03 mm, is larger than the average value in the reference example II and is approximately equal to the instantaneous value of 0.0272mm in the reference example I; the middle point position of the PCB is the middle position of the PCB;
the two analyses with reference example one gave: the middle point position of the PCB is the position with the maximum deformation, and the position closer to the screw deforms less; obtaining an optimal solution of the layout scheme of the acceleration sensor on the PCB;
step three: welding an acceleration sensor ADXL355BEZ at the middle position of the PCB and the position close to the screw to perform a comparison test, and verifying whether the deformation of two decimal places influences the test precision of the equipment; the method specifically comprises the following steps:
s31: PCB multi-frequency dynamic analysis when the amplitude is 1N: respectively applying harmonic loads with the amplitude of 1N and the frequencies of 1Hz, 5Hz, 10Hz, 20Hz, 50Hz and 100Hz and the frequency duration of 5s to the PCB along the normal direction, and researching the deformation condition of the PCB according to grid control and grid division based on curvature; the deformation data of each frequency at an amplitude of 1N is shown in Table 1;
TABLE 1 deformation data for frequencies at amplitude 1N
Frequency of 1Hz 5Hz 10Hz 20Hz 50Hz 100Hz
Deformation/mm 6.828e-05 4.311e-04 5.543e-09 2.941e-08 3.361e-07 1.762e-06
S32: and (3) PCB multi-frequency dynamic analysis at the amplitude of 5N: respectively applying harmonic loads with the amplitude of 5N, the frequencies of 1Hz, 5Hz, 10Hz, 20Hz, 50Hz and 100Hz and the frequency duration of 5s to the PCB along the normal direction, and researching the deformation condition of the PCB according to grid control and grid division based on curvature; the deformation data of each frequency at an amplitude of 5N is shown in Table 2;
TABLE 2 deformation data for each frequency at amplitude 5N
Figure DEST_PATH_IMAGE002
And (4) conclusion: (1) from tables 1 and 2, it is found that when the load frequency is increased while keeping the load amplitude constant, the deformation is increased; (2) when the load frequency is kept unchanged, the load amplitude is increased, and the deformation is obviously increased;
s33: dynamic analysis of the acceleration sensor at the position of the maximum deformation, wherein the assumed conditions of the analysis are as follows: the acceleration sensor entity is subjected to the general assumption of grid pretreatment, the silk screen printing of the acceleration sensor does not participate in the division of grids, the stress at the sharp corner is considered to be far lower than the yield strength of epoxy resin, and the deformation at the sharp corner is ignored, so that the acceleration sensor can be replaced by a cuboid with the length multiplied by the width multiplied by the height =6mm multiplied by 2.2mm, and the material is silicon; the method specifically comprises the following steps:
defining the loading condition: selecting the worst condition, namely the harmonic load with the amplitude of 5N and the frequency of 100Hz, from the table 2;
welding an acceleration sensor at the middle position of a PCB, dividing the acceleration sensor according to a standard grid, and researching the deformation condition of the acceleration sensor; although the maximum von mises stress of the PCB is reduced and the stress of the PCB is locally improved by the welding process of the acceleration sensor, the basic characteristic that the maximum deformation of the PCB is in the middle position of the PCB is still not changed, and based on the characteristic, when the distance between the 4 holes is large enough, the large enough deformation is generated in the middle position of the PCB, so that the measurement of the acceleration sensor on the true value of the target position is influenced, and even the actual value is far deviated;
welding the acceleration sensor at a position of the PCB close to the screw (the position close to the screw is understood in a broad sense, namely the acceleration sensor is only welded near the screw mounting hole, and does not refer to a specific screw mounting hole position); dividing according to a standard grid, and researching the deformation condition of the acceleration sensor;
although a local stress is generated in the vicinity of the screw mounting hole due to the pre-tightening force applied to the screw, this makes an ideal reasonable assumption in the FEA analysis that the stress in the vicinity of the screw mounting hole has no influence on the deformation; the deformation of the acceleration sensor is easily found to be reduced by at least 5 times, and even the maximum deformation is reduced by 10^23 times; the invention finds the optimal solution of the layout scheme of the acceleration sensor on the PCB by utilizing the harmonic load vibration analysis of the FEA, and further improves the measurement precision of the wireless inclinometer equipment based on the acceleration sensor chip.
The working principle of the invention is as follows:
the optimization method for analyzing the position of the acceleration sensor on the PCB based on the FEA comprises the steps of firstly carrying out static stress analysis on the PCB when the optimization method works; applying a harmonic load with the amplitude of 1N and the frequency of 1Hz and the frequency duration of 5s to the PCB along the normal direction, dividing according to a standard grid, and researching the deformation condition of the PCB to obtain a reference example I; then, dynamically analyzing the PCB, and applying a harmonic load with the amplitude of 1N and the frequency of 1Hz and the frequency duration of 5s to the PCB along the normal direction; dividing according to standard grids, researching the deformation condition of the PCB to obtain a reference example II, and performing dynamic response analysis at the midpoint position of the PCB to obtain the instantaneous maximum deformation of the middle position of the PCB; the two analyses with reference example one gave: the middle point position of the PCB is the position with the maximum deformation, and the position closer to the screw deforms less;
then welding an acceleration sensor at the middle position of the PCB and at a position close to the screw to perform a comparison test, and verifying whether the deformation of two decimal places influences the test precision of the equipment; determining the worst condition, namely the harmonic load with the frequency of 5N and the frequency of 100Hz, by the multi-frequency dynamic analysis of the PCB at the amplitude of 1N and the amplitude of 5N; respectively welding the acceleration sensor at the middle position of the PCB and the position close to the screw based on the harmonic load with the amplitude of 5N and the frequency of 100Hz, dividing according to a standard grid, and researching the deformation condition of the acceleration sensor; the optimal solution of the layout scheme of the acceleration sensor on the PCB is obtained according to the deformation condition analysis of the acceleration sensor, and the measurement precision of the wireless inclinometer equipment based on the acceleration sensor chip is improved.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims (7)

1. The optimization method for analyzing the position of the acceleration sensor on the PCB based on the FEA is characterized by comprising the following steps of:
the method comprises the following steps: analyzing static stress of the PCB, and researching the deformation condition of the PCB to obtain a first reference example; the method specifically comprises the following steps:
defining the loading condition: applying a harmonic load with the amplitude of 1N and the frequency of 1Hz to the PCB along the normal direction in the opposite direction, wherein the frequency lasts for 5 s; dividing according to a standard grid, and researching the deformation condition of the PCB;
carrying out post-processing on the deformation condition of the PCB: checking the calculation stress, strain and displacement results of each point of the PCB to obtain a first reference example; analyzing according to a reference example to obtain the maximum deformation of the PCB and the stress at the corresponding position;
step two: dynamically analyzing the PCB, and researching the deformation condition of the PCB to obtain a reference example II; the method specifically comprises the following steps:
defining the loading condition: applying a harmonic load with the amplitude of 1N and the frequency of 1Hz to the PCB along the normal direction, wherein the frequency lasts for 5 s; dividing according to a standard grid, and researching the deformation condition of the PCB;
carrying out post-processing on the deformation condition of the PCB: checking the results of stress, strain and displacement of each point of the PCB to obtain a second reference example; analyzing according to a reference example to obtain the maximum deformation of the PCB and the stress at the corresponding position;
performing dynamic response analysis at the midpoint position of the PCB to obtain the instantaneous maximum deformation of the middle position of the PCB; the middle point position of the PCB is the middle position of the PCB; the two analyses with reference example one gave: the middle point position of the PCB is the position with the maximum deformation, and the position closer to the screw deforms less;
step three: welding an acceleration sensor at the middle position of the PCB and at a position close to the screw to perform a comparison test, and verifying whether the deformation of two decimal places influences the test precision of the equipment; and analyzing to obtain the optimal solution of the layout scheme of the acceleration sensor on the PCB according to the deformation condition of the acceleration sensor.
2. The optimization method of the acceleration sensor at the PCB position based on the FEA analysis of the claim 1, wherein the acceleration sensor is welded at the middle position of the PCB and the position close to the screw to perform a comparison test, the specific steps are as follows:
determining the worst condition situation based on the multi-frequency dynamic analysis of the PCB at the amplitude of 1N and the amplitude of 5N, and acquiring the corresponding harmonic load; the harmonic load comprises an amplitude and a frequency;
in response to the acquisition of the corresponding harmonic load, performing dynamic analysis of the acceleration sensor at the position where the deformation amount is maximum based on the harmonic load; the method comprises the following steps:
welding an acceleration sensor at the middle position of a PCB, dividing the acceleration sensor according to a standard grid, and researching the deformation condition of the acceleration sensor; welding an acceleration sensor at a position of the PCB close to the screw, dividing the acceleration sensor according to a standard grid, and researching the deformation condition of the acceleration sensor;
and analyzing to obtain the optimal solution of the layout scheme of the acceleration sensor on the PCB according to the deformation conditions of the acceleration sensor at different positions.
3. The method of claim 2, wherein the PCB multi-frequency dynamic analysis with an amplitude of 1N comprises:
respectively applying harmonic loads with the amplitude of 1N and the frequencies of 1Hz, 5Hz, 10Hz, 20Hz, 50Hz and 100Hz and the frequency duration of 5s to the PCB along the normal direction, and researching the deformation condition of the PCB according to grid control and grid division based on curvature; and obtaining deformation data of each frequency when the amplitude is 1N.
4. The method as claimed in claim 3, wherein the PCB multi-frequency dynamic analysis at an amplitude of 5N comprises:
respectively applying harmonic loads with the amplitude of 5N, the frequencies of 1Hz, 5Hz, 10Hz, 20Hz, 50Hz and 100Hz and the frequency duration of 5s to the PCB along the normal direction, and researching the deformation condition of the PCB according to grid control and grid division based on curvature; and obtaining deformation data of each frequency when the amplitude is 5N.
5. The optimization method of the acceleration sensor on the PCB position based on the FEA analysis of the claim 4 is characterized in that the deformation data of each frequency at the amplitude of 1N and the deformation data of each frequency at the amplitude of 5N are compared and analyzed, the adjoint relationship between the deformation amount and the amplitude and the frequency is preliminarily obtained, and the condition with the worst working condition, namely the condition with the largest deformation amount increase is determined.
6. The method as claimed in claim 1, wherein the PCB is analyzed by using a composite material of epoxy resin, filler and glass fiber, and the grade is FR-4.
7. The method as claimed in claim 2, wherein the acceleration sensor is replaced with a rectangular parallelepiped of length x width x height =6mm x 2.2mm, and the material is silicon in the dynamic analysis of the acceleration sensor at the position of the maximum deformation.
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