CN113961493A - Communication mainboard, communication device and electronic equipment - Google Patents
Communication mainboard, communication device and electronic equipment Download PDFInfo
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- CN113961493A CN113961493A CN202111332964.2A CN202111332964A CN113961493A CN 113961493 A CN113961493 A CN 113961493A CN 202111332964 A CN202111332964 A CN 202111332964A CN 113961493 A CN113961493 A CN 113961493A
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- 238000004891 communication Methods 0.000 title claims abstract description 112
- 230000008054 signal transmission Effects 0.000 claims abstract description 45
- 238000006243 chemical reaction Methods 0.000 claims description 42
- 239000003990 capacitor Substances 0.000 claims description 16
- 230000005672 electromagnetic field Effects 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/382—Information transfer, e.g. on bus using universal interface adapter
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L12/00—Data switching networks
- H04L12/02—Details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
Abstract
The application relates to a communication mainboard, a communication device and electronic equipment, wherein the communication mainboard comprises a controller, a signal transmission circuit and a temperature sensing integrated circuit, the signal transmission circuit is connected with the controller and the temperature sensing integrated circuit, the signal transmission circuit is further connected with a target mainboard, and the temperature sensing integrated circuit is connected with the target mainboard. The temperature sensing integrated circuit is additionally arranged to be connected with the target mainboard, the temperature sensing integrated circuit is connected with the controller of the communication mainboard through the signal transmission circuit, the communication function of the controller of the communication mainboard and the target mainboard can be achieved through the temperature sensing integrated circuit, the requirements of different fields and different places are met, the interference of a strong electromagnetic field is avoided, and the application range is effectively widened.
Description
Technical Field
The present application relates to the field of device communication technologies, and in particular, to a communication motherboard, a communication apparatus, and an electronic device.
Background
With the development of science and technology and the continuous progress of society, more and more kinds of electric appliances appear in the daily life and work of people. Data transmission between different types of electrical equipment often needs to be carried out through corresponding communication interface devices. The communication interface devices are also various, such as an RS-485 communication interface, an RS-4232 communication interface and the like. However, all conventional communication interface devices perform fixed protocol conversion to transmit information, and are only applicable to specific scenes, which limits the application range.
Disclosure of Invention
Therefore, it is necessary to provide a communication motherboard, a communication device, and an electronic apparatus, which can effectively improve the application range, in order to solve the problem that the conventional communication interface device limits the application range.
A communication mainboard comprises a controller, a signal transmission circuit and a temperature sensing integrated circuit, wherein the signal transmission circuit is connected with the controller and the temperature sensing integrated circuit, the signal transmission circuit is further connected with a target mainboard, and the temperature sensing integrated circuit is connected with the target mainboard.
In one embodiment, the temperature sensing integrated circuit performs electric-thermal conversion according to a signal sent by the target mainboard, generates a corresponding conversion signal according to the converted heat energy, and sends the conversion signal to the controller; and the controller compares the voltage value of the received conversion signal with a preset voltage threshold value, and obtains the level type of the signal transmitted by the target mainboard according to the comparison result.
In one embodiment, the controller obtains a first type level signal transmitted by a target motherboard when the voltage value of the conversion signal is greater than the preset voltage threshold; and when the voltage value of the conversion signal is less than or equal to the preset voltage threshold value, the controller obtains a second type level signal transmitted by the target mainboard.
In one embodiment, the temperature sensing integrated circuit comprises a resistance wire and a temperature sensing package, one end of the resistance wire is connected with the target mainboard, the other end of the resistance wire is grounded, one end of the temperature sensing package is connected with a power supply end, and the other end of the temperature sensing package is connected with the controller through the signal transmission circuit.
In one embodiment, the signal transmission circuit comprises a pin base, the pin base comprises a sending terminal, a receiving terminal, a power supply terminal and a grounding terminal, a sending pin of the controller is connected with a target mainboard through the sending terminal of the pin base, the resistance wire is grounded through the grounding terminal of the pin base, one end of the temperature-sensing bulb is connected with a power supply end through the power supply terminal of the pin base, and the other end of the temperature-sensing bulb is connected with the receiving pin of the controller through the receiving terminal of the pin base.
In one embodiment, the signal transmission circuit further includes a resistor, one end of the resistor is connected to the receiving pin of the controller, and the other end of the resistor is grounded.
In one embodiment, the signal transmission circuit further comprises a first capacitor connected in parallel with the resistor.
In one embodiment, the signal transmission circuit further comprises a second capacitor connected in parallel with the resistor.
A communication device comprises more than two communication mainboards.
An electronic device comprises the communication device.
According to the communication mainboard, the communication device and the electronic equipment, the temperature sensing integrated circuit is additionally arranged to be connected with the target mainboard, the temperature sensing integrated circuit is connected with the controller of the communication mainboard through the signal transmission circuit, the controller of the communication mainboard and the communication function of the target mainboard can be achieved through the temperature sensing integrated circuit, the requirements of different fields and different places are met, the interference of a strong electromagnetic field is avoided, and the application range is effectively widened.
Drawings
Fig. 1 is a block diagram of a communication motherboard according to an embodiment;
FIG. 2 is a schematic diagram of a communication device according to an embodiment;
FIG. 3 is a flow chart of a signal transmitting portion of a motherboard A of the communication device according to an embodiment;
fig. 4 is a flowchart of a signal receiving portion of a motherboard a of the communication device according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. The "connection" in the following embodiments is understood as "electrical connection", "communication connection", or the like if the connected circuits, modules, units, or the like have electrical signals or data transmission therebetween.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, the terminology used in this specification includes any and all combinations of the associated listed items.
The application provides a communication mainboard can be applied to and communicate between the more than two communication mainboards. Taking communication between two communication motherboards as an example, the two communication motherboards both comprise a controller, a signal transmission circuit and a temperature sensing integrated circuit, and the signal transmission circuit of each communication motherboard is connected with the temperature sensing integrated circuit of the other communication motherboard. When one of the communication main boards sends a signal, the signal output by the controller is transmitted to the other communication main board through the internal signal transmission circuit, the temperature sensing integrated circuit of the other communication main board carries out electric heat conversion according to the received signal, and generates a corresponding conversion signal according to the converted heat energy to send the signal to the internal controller. The high-low level change of the signal can influence the heat energy generated by the temperature sensing integrated circuit, so that the voltage amplitude of the obtained conversion signal is changed, and the level type of the received signal can be determined according to the voltage amplitude of the conversion signal, thereby realizing the transmission of the signal.
In one embodiment, as shown in fig. 1, a communication motherboard is provided, which includes a controller 110, a signal transmission circuit 120 and a temperature sensing integrated circuit 130, the signal transmission circuit 120 is connected to the controller 110 and the temperature sensing integrated circuit 130, the signal transmission circuit 120 is further connected to a target motherboard, and the temperature sensing integrated circuit 130 is connected to the target motherboard. Specifically, the signal transmission circuit 120 transmits a signal output by the controller 110 to a target motherboard, and the temperature sensing integrated circuit 130 is configured to perform electrothermal conversion according to the signal sent by the target motherboard, and generate a corresponding conversion signal according to the converted heat energy and send the conversion signal to the controller 110. The controller 110 may be an Integrated Circuit (IC) chip.
When the communication motherboard needs to communicate with the target motherboard, the signal transmission circuit 120 of the communication motherboard can be connected to the temperature sensing integrated circuit of the target motherboard, and the temperature sensing integrated circuit 130 of the communication motherboard can be connected to the signal transmission circuit of the target motherboard. The signal transmission circuit 120 of the communication motherboard can be connected to the temperature sensing integrated circuit of the target motherboard through a dc power line, and the temperature sensing integrated circuit 130 of the communication motherboard can also be connected to the signal transmission circuit of the target motherboard through a dc power line. When the communication motherboard receives a signal, the temperature sensing integrated circuit 130 performs electrothermal conversion according to the signal sent by the target motherboard, that is, generates corresponding heat energy according to the amplitude of the received signal, and then generates a corresponding conversion signal according to the converted heat energy to send to the controller 110.
For example, when the signal received by the communication motherboard is at a high level, the temperature sensing integrated circuit 130 generates heat rapidly, and the generated heat enables the temperature sensing integrated circuit 130 to transmit the high-voltage amplitude conversion signal to the controller 110; when the received signal is at a low level, the temperature sensing integrated circuit 130 does not generate heat or generates a small amount of heat, and sends a conversion signal with a low voltage amplitude to the controller 110, and the controller 110 detects the voltage amplitude of the conversion signal sent by the temperature sensing integrated circuit 130, so as to determine whether the signal sent by the target motherboard is at a high level or a low level. Correspondingly, when the communication motherboard sends a signal, the signal transmission circuit 120 transmits the signal sent by the controller 110 to the temperature sensing integrated circuit of the target motherboard, and the temperature sensing integrated circuit of the target motherboard also performs electrothermal conversion, and generates a corresponding conversion signal according to the generated heat to send to the controller of the target motherboard.
In one embodiment, the controller 110 compares the voltage value of the received conversion signal with a preset voltage threshold, and obtains the level type of the signal transmitted by the target motherboard according to the comparison result. Specifically, the controller 110 may detect an average voltage value of the signal transmitted by the temperature sensing integrated circuit 130 before the communication is performed, and store the average voltage value as a preset voltage threshold. The specific value of the preset voltage threshold is influenced by the temperature of the equipment where the communication mainboard is located when the equipment operates. After receiving the signal sent by the target motherboard, the controller 110 obtains the actual voltage division value of the converted signal sent by the temperature sensing integrated circuit 130 and compares the actual voltage division value with the preset voltage threshold, and accordingly, it can know whether the signal transmitted by the target motherboard is at a high level or a low level according to the magnitude relationship between the actual voltage division value and the preset voltage threshold. It should be noted that the specific amplitudes of the high level and the low level transmitted by the target motherboard are not unique, and only the voltage amplitude of the high level is greater than that of the low level.
In one embodiment, the controller 110 obtains a first type level signal transmitted by the target motherboard when the voltage value of the converted signal is greater than a preset voltage threshold; when the voltage value of the converted signal is less than or equal to the preset voltage threshold, the controller 110 obtains a second type level signal transmitted by the target motherboard. The first type level signal is a high level signal/a low level signal, and the second type level signal is a low level signal/a high level signal. The corresponding relation between the voltage value of the conversion signal and the preset voltage threshold value and the signal type transmitted by the target mainboard can be pre-stored, and after the actual voltage division value of the conversion signal is determined, the signal type transmitted by the target mainboard can be directly obtained according to the stored corresponding relation.
Further, in an embodiment, the controller 110 is further configured to determine whether the voltage value of the converted signal is within a preset voltage range, and compare the received voltage value of the converted signal with a preset voltage threshold when the voltage value of the converted signal is within the preset voltage range. The preset voltage range can be determined according to the specific amplitude of the signal sent by the target motherboard, and if the actual voltage division value of the converted signal sent by the temperature sensing integrated circuit 130 is not within the preset voltage range, the target motherboard can be considered to not send the signal, and no signal comparison is performed.
It is understood that the specific structures of the signal transmission circuit 120 and the temperature sensing integrated circuit 130 are not exclusive, and in one embodiment, the temperature sensing integrated circuit 130 includes a resistance wire and a temperature sensing package, one end of the resistance wire is connected to the target motherboard, the other end of the resistance wire is grounded, one end of the temperature sensing package is connected to a power supply, and the other end of the temperature sensing package is connected to the controller 110 through the signal transmission circuit 120. Specifically, the resistance wire and the temperature sensing bulb are arranged in a closely-attached wrapping mode, and the resistance wire is connected with a signal transmission circuit of a target mainboard through a direct-current power line. When the target main board sends a high level, the current is transmitted to the resistance wire through the direct current power line, the resistance wire is conducted and generates heat rapidly, and the heat is transmitted to the temperature sensing bulb through heat transfer, so that the voltage amplitude of a conversion signal output by the AI detection circuit in the temperature sensing bulb is increased. At this time, if the voltage value data detected by the controller 110 is higher than the preset voltage threshold, it is determined as a high level; otherwise it remains low. Therefore, communication of the target main board for sending signals and the communication main board for receiving signals is achieved. In other embodiments, the temperature sensing integrated circuit 130 may be replaced by a patch device integrated on a circuit board.
Correspondingly, in one embodiment, the signal transmission circuit 120 includes a socket, the socket includes a transmitting terminal, a receiving terminal, a power supply terminal and a ground terminal, the transmitting pin of the controller 110 is connected to the target motherboard through the transmitting terminal of the socket, the resistance wire is grounded through the ground terminal of the socket, one end of the thermal bulb is connected to the power supply terminal through the power supply terminal of the socket, and the other end of the thermal bulb is connected to the receiving pin of the controller 110 through the receiving terminal of the socket. And the needle seat is connected with related devices, so that the connection management is convenient.
In one embodiment, the signal transmission circuit 120 further includes a resistor, one end of the resistor is connected to the receiving pin of the controller 110, and the other end of the resistor is grounded. By setting the pull-down resistor, the controller 110 can conveniently judge the voltage amplitude. Further, in one embodiment, the signal transmission circuit 120 further includes a first capacitor connected in parallel with the resistor. In addition, the signal transmission circuit 120 may further include a second capacitor connected in parallel with the resistor. And the first capacitor and the second capacitor are used for filtering, so that clutter interference is reduced.
According to the communication mainboard, the temperature sensing integrated circuit 130 is additionally arranged to be connected with the target mainboard, the temperature sensing integrated circuit 130 is connected with the controller 110 of the communication mainboard through the signal transmission circuit 120, the communication function of the controller 110 of the communication mainboard and the target mainboard can be realized through the temperature sensing integrated circuit 130, the requirements of different fields and different places are met, the interference of a strong electromagnetic field is avoided, and the application range is effectively enlarged.
In one embodiment, a communication device is further provided, which includes more than two communication motherboards. Each communication mainboard can be arranged on different equipment, so that data transmission between the equipment is realized through the communication mainboard. Each communication mainboard can include controller, signal transmission circuit and temperature sensing integrated circuit.
Taking one of the communication motherboards as an example, the other communication motherboards are target motherboards. When the signal received by the communication mainboard is at a high level, the temperature sensing integrated circuit rapidly generates heat, and the generated heat enables the temperature sensing integrated circuit to transmit a conversion signal of a high voltage amplitude to the controller; when the received signal is at low level, the temperature sensing integrated circuit does not generate heat or generates a small amount of heat, the conversion signal of low voltage amplitude is sent to the controller, and the controller detects the voltage amplitude of the conversion signal sent by the temperature sensing integrated circuit, so that whether the signal sent by the target mainboard is at high level or low level can be judged. Correspondingly, when the communication mainboard sends a signal, the signal transmission circuit transmits the signal sent by the controller to the temperature sensing integrated circuit of the target mainboard, the temperature sensing integrated circuit of the target mainboard also carries out electrothermal conversion, and generates a corresponding conversion signal according to the generated heat to send to the controller of the target mainboard.
Specifically, the controller in the communication motherboard compares the voltage value of the received conversion signal with a preset voltage threshold, and obtains the level type of the signal transmitted by the target motherboard according to the comparison result. The specific value of the preset voltage threshold is influenced by the temperature of the equipment where the communication mainboard is located when the equipment operates. After receiving a signal sent by a target mainboard, the controller acquires an actual voltage division value of a conversion signal sent by the temperature sensing integrated circuit and compares the actual voltage division value with a preset voltage threshold value, and accordingly whether the signal transmitted by the target mainboard is a high level or a low level can be known according to the magnitude relation between the actual voltage division value and the preset voltage threshold value. When the voltage value of the conversion signal is greater than a preset voltage threshold value, the controller obtains a first type level signal transmitted by a target mainboard; and when the voltage value of the conversion signal is less than or equal to the preset voltage threshold value, the controller obtains a second type level signal transmitted by the target mainboard. It should be noted that the specific amplitudes of the high level and the low level transmitted by the target motherboard are not unique, and only the voltage amplitude of the high level is greater than that of the low level.
Further, the controller also judges whether the voltage value of the conversion signal is within a preset voltage range, and when the voltage value of the conversion signal is within the preset voltage range, the voltage value of the received conversion signal is compared with a preset voltage threshold value. The preset voltage range can be determined according to the specific amplitude of the signal sent by the target mainboard, and if the actual voltage division value of the conversion signal sent by the temperature sensing integrated circuit is not in the preset voltage range, the target mainboard can be considered not to send the signal, and the signal comparison is not carried out.
Taking the example that the communication device comprises two communication main boards, as shown in fig. 2, the communication device comprises a main board a and a main board B, the main board a comprises a controller a, a needle seat a, a thermal bulb a, a resistance wire a, a resistor R1, a capacitor C1 and a capacitor C2, and the main board B comprises a controller B, a needle seat B, a thermal bulb B, a resistance wire B, a resistor R2, a capacitor C3 and a capacitor C4.
In the mainboard A, a sending terminal of the needle stand A is connected with a sending pin of the controller A through a port INPUT-A, and a power supply terminal of the needle stand A is connected with one end of the thermal bulb A and is connected with an mutexternal power supply through a port DC-A. And the receiving terminal of the needle seat A is connected with the other end of the thermal bulb A and is connected with the receiving pin of the controller A through the port OUTPUT-A. One end of the resistance wire A is connected with a sending terminal of a needle seat B in the main board B through a direct current power line, and the other end of the resistance wire A is grounded through a grounding terminal of the needle seat A. The resistor R1, the capacitor C1 and the capacitor C2 are connected in parallel, one end of the resistor is connected with the port OUTPUT-A, and the other end of the resistor is grounded. Wherein, the port DC-A can be a power supply connected with 3.3V or 5V.
In the mainboard B, a sending terminal of the needle seat B is connected with a sending pin of the controller B through a port INPUT-B, and a power supply terminal of the needle seat B is connected with one end of the thermal bulb B and is connected with an external power supply through a port DC-B. And the receiving terminal of the needle seat B is connected with the other end of the thermal bulb B and is connected with the receiving pin of the controller B through the port OUTPUT-B. One end of the resistance wire B is connected with a sending terminal of the needle seat A in the main board A through a direct current power line, and the other end of the resistance wire B is grounded through a grounding terminal of the needle seat B. The resistor R2, the capacitor C3 and the capacitor C4 are connected in parallel, one end of the resistor is connected with the port OUTPUT-B, and the other end of the resistor is grounded. Wherein, the port DC-B can be a power supply connected with 3.3V or 5V.
According to the communication device, the temperature sensing integrated circuit is additionally arranged to be connected with the target mainboard, the temperature sensing integrated circuit is connected with the controller of the communication mainboard through the signal transmission circuit, the communication function of the controller of the communication mainboard and the target mainboard can be achieved through the temperature sensing integrated circuit, the requirements of different fields and different places are met, the interference of a strong electromagnetic field is avoided, and the application range is effectively enlarged.
In one embodiment, an electronic device is also provided, which includes the communication apparatus described above. The electronic device may be an air conditioning unit or other device. Specifically, a communication main board can be respectively installed on the air conditioner external unit and the air conditioner internal unit, so that the communication between the internal unit and the external unit is realized.
According to the electronic equipment, the temperature sensing integrated circuit is additionally arranged to be connected with the target mainboard, the temperature sensing integrated circuit is connected with the controller of the communication mainboard through the signal transmission circuit, the controller of the communication mainboard and the communication function of the target mainboard can be achieved through the temperature sensing integrated circuit, the requirements of different fields and different places are met, the electronic equipment is not interfered by a strong electromagnetic field, and the application range is effectively widened.
In order to better understand the communication motherboard, the communication device and the electronic equipment, the following detailed explanation is made in conjunction with specific embodiments.
The application provides a method for communication through temperature sensing, wherein an AI and an integrated circuit for sensing the temperature of a resistance wire are added on two communication boards, and the integrated circuit for receiving data through an AI circuit and sensing the temperature of the resistance wire sends a voltage level, so that the function of communication of the temperature sensing package is increased, the function of automatic anti-interference of mistaken sending is also increased, the interference of a strong electromagnetic field and the influence of other equipment temperatures are avoided, and the communication failure rate is reduced.
As shown in fig. 2-4, the circuits of the main board a and the main board B are respectively added with an integrated circuit for sensing the temperature of the thermal bulb AI and the temperature of the resistance wire, and the thermal bulb and the resistance wire are wrapped together in a close fit manner. Taking motherboard a sending and motherboard B receiving as examples:
when the mainboard needs to communicate, the IC in the mainboard continuously detects and acquires real-time voltage value data (according to the average voltage value corresponding to the temperature when the temperature of the thermal bulb is not obviously changed when the unit machine operates) through the thermal bulb AI circuit as a judgment basis so as to ensure that the voltage value of the thermal bulb is not influenced by the surrounding environment.
According to related communication protocols, when the mainboard A sends a high level, the port INPUT-A of the mainboard A sends the high level, current is transmitted to the resistance wire B through the power line of the needle seat A, the resistance wire B is conducted and rapidly generates heat, and the heat is transmitted to the temperature sensing bulb B of the mainboard B through heat transfer. And the main IC in the mainboard B detects the voltage division value B of the thermal bulb B according to the OUTPUT-B in the AI detection circuit, compares the voltage division value B with the voltage value data during communication and judges whether the voltage division value B is a high level or not. When the detected voltage value is larger than the voltage value data, the high level is judged; otherwise it remains low. Therefore, communication sent by the mainboard A and received by the mainboard B is realized.
When the mainboard A receives, the mainboard B sends: when the main board B sends a high level, the port INPUT1-B of the main board B sends the high level, the resistance wire A generates heat through the power line of the needle seat B, and the heat is transferred to the temperature sensing bag A of the main board A through heat transfer. The same reasoning is adopted; and judging the high and low levels according to the comparison of the two values, thereby realizing the communication sent by the mainboard A and the mainboard B. The temperature sensing bulb and the resistance wire can be replaced by surface mount devices and integrated on the circuit board.
In addition, a non-communication value can be set, when the mainboard outputs a current in a fixed range, the resistance wire can generate heat in a certain range, and the temperature sensing bulb can also have resistance value change in a certain range, namely, the mainboard A outputs a current in a certain range corresponding to a voltage value in a certain range measured by the IC chip of the mainboard B, and the range can be confirmed according to the pins of the IC chip. If the detected voltage is not within the voltage value range, it is determined to be a malfunction and no processing is performed.
According to the temperature sensing communication method, the temperature sensing bulb AI and the resistance wire temperature sensing integrated circuit are added on the two communication boards, and the AI circuit receives data and the resistance wire temperature sensing integrated circuit sends voltage level, so that the temperature sensing bulb communication function is added, and the requirements of different fields and different places are met; in addition, an automatic anti-interference function for sending by mistake is added, the interference of a strong electromagnetic field and the influence of other equipment temperature are avoided, and the communication failure rate is reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A communication mainboard is characterized by comprising a controller, a signal transmission circuit and a temperature sensing integrated circuit, wherein the signal transmission circuit is connected with the controller and the temperature sensing integrated circuit, the signal transmission circuit is further connected with a target mainboard, and the temperature sensing integrated circuit is connected with the target mainboard.
2. The communication motherboard of claim 1, wherein the temperature sensing integrated circuit performs electrothermal conversion according to the signal sent by the target motherboard, and generates a corresponding conversion signal according to the converted heat energy to send to the controller; and the controller compares the voltage value of the received conversion signal with a preset voltage threshold value, and obtains the level type of the signal transmitted by the target mainboard according to the comparison result.
3. The communication motherboard of claim 2, wherein the controller obtains a first type level signal transmitted by a target motherboard when the voltage value of the converted signal is greater than the preset voltage threshold; and when the voltage value of the conversion signal is less than or equal to the preset voltage threshold value, the controller obtains a second type level signal transmitted by the target mainboard.
4. The communication mainboard of claim 1, wherein the temperature sensing integrated circuit comprises a resistance wire and a temperature sensing package, one end of the resistance wire is connected with the target mainboard, the other end of the resistance wire is grounded, one end of the temperature sensing package is connected with a power supply end, and the other end of the temperature sensing package is connected with the controller through the signal transmission circuit.
5. The communication motherboard of claim 4, wherein the signal transmission circuit comprises a pin socket, the pin socket comprises a transmitting terminal, a receiving terminal, a power supply terminal and a ground terminal, a transmitting pin of the controller is connected with a target motherboard through the transmitting terminal of the pin socket, the resistance wire is grounded through the ground terminal of the pin socket, one end of the thermal bulb is connected with a power supply terminal through the power supply terminal of the pin socket, and the other end of the thermal bulb is connected with the receiving pin of the controller through the receiving terminal of the pin socket.
6. The communication motherboard of claim 5, wherein the signal transmission circuit further comprises a resistor, one end of the resistor is connected to the receiving pin of the controller, and the other end of the resistor is grounded.
7. The communication motherboard of claim 6 wherein the signal transmission circuitry further comprises a first capacitor in parallel with the resistor.
8. The communication motherboard of claim 6 wherein the signal transmission circuitry further comprises a second capacitor in parallel with the resistor.
9. A communication device comprising two or more communication boards according to any one of claims 1 to 8.
10. An electronic device characterized by comprising the communication apparatus of claim 9.
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| CN112306952A (en) * | 2020-11-25 | 2021-02-02 | 海光信息技术股份有限公司 | Mainboard and server |
| KR20210051981A (en) * | 2019-10-31 | 2021-05-10 | 에이치에스디엔진 주식회사 | Sensor data communication system |
| CN213365511U (en) * | 2020-11-25 | 2021-06-04 | 海光信息技术股份有限公司 | Mainboard and server |
-
2021
- 2021-11-11 CN CN202111332964.2A patent/CN113961493B/en active Active
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| JPS58219618A (en) * | 1982-06-15 | 1983-12-21 | Mitsubishi Electric Corp | Temperature controller |
| KR20190019584A (en) * | 2017-08-18 | 2019-02-27 | 성균관대학교산학협력단 | Method and apparatus for interfacing |
| KR20200034156A (en) * | 2018-09-21 | 2020-03-31 | 울랄라랩 주식회사 | Curcuit of sensor controller which is acceptable with a variety of sensor |
| KR20210051981A (en) * | 2019-10-31 | 2021-05-10 | 에이치에스디엔진 주식회사 | Sensor data communication system |
| CN112306952A (en) * | 2020-11-25 | 2021-02-02 | 海光信息技术股份有限公司 | Mainboard and server |
| CN213365511U (en) * | 2020-11-25 | 2021-06-04 | 海光信息技术股份有限公司 | Mainboard and server |
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| CN113961493B (en) | 2024-04-26 |
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