CN113954228A - SOFC support body processing system and application method thereof - Google Patents
SOFC support body processing system and application method thereof Download PDFInfo
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- CN113954228A CN113954228A CN202111244919.1A CN202111244919A CN113954228A CN 113954228 A CN113954228 A CN 113954228A CN 202111244919 A CN202111244919 A CN 202111244919A CN 113954228 A CN113954228 A CN 113954228A
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- 238000012545 processing Methods 0.000 title claims abstract description 177
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000005520 cutting process Methods 0.000 claims abstract description 177
- 238000003754 machining Methods 0.000 claims abstract description 24
- 238000001035 drying Methods 0.000 claims description 27
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 25
- 238000012216 screening Methods 0.000 claims description 23
- 239000002699 waste material Substances 0.000 claims description 16
- 239000000428 dust Substances 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 claims description 6
- 238000007788 roughening Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 6
- 238000005245 sintering Methods 0.000 description 8
- 238000007789 sealing Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B15/00—General arrangement or layout of plant ; Industrial outlines or plant installations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/12—Apparatus or processes for treating or working the shaped or preshaped articles for removing parts of the articles by cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/0063—Control arrangements
- B28B17/0072—Product control or inspection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/0063—Control arrangements
- B28B17/0081—Process control
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Structural Engineering (AREA)
- Automation & Control Theory (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention provides a SOFC support body processing system, which comprises: a conveying device; a feeding device; the scanning analysis system is used for scanning the workpiece to be machined according to the preset length and/or width information to obtain a cutting positioning point of the workpiece to be machined and/or scanning the workpiece to be machined after cutting to obtain a reference plane for planar machining of the workpiece to be machined after cutting; the cutting device is used for cutting the workpiece to be machined according to the cutting positioning point; a plane processing device for processing the upper surface and/or the lower surface of the workpiece to be processed after cutting according to the reference plane; the conveying device is positioned above the feeding device, the cutting device and the plane processing device, and the scanning analysis system is arranged on the outer sides of the cutting device and the plane processing device in a surrounding mode. The scanning analysis system of the invention obtains the cutting positioning point and the plane processing datum plane, the cutting device cuts the length and the width based on the cutting positioning point, the plane processing device processes the plane based on the datum plane, and the processed dimension has high precision and good uniformity.
Description
Technical Field
The invention relates to the technical field of fuel cells, in particular to an SOFC support body processing system and a using method thereof.
Background
At present, Solid Oxide Fuel Cells (SOFC) are widely used due to their characteristics of high power generation efficiency, silence, no noise, cleanness, no pollution, diversified fuels, and the like.
In the SOFC structure, the sealing performance of the cell stack is important, when the seal of the stack fails, Ni is rapidly oxidized into NiO, when the atmosphere becomes a reducing atmosphere again, NiO is reduced into Ni, and since the oxidation of Ni into NiO is accompanied by the volume change of more than 60%, the reciprocating oxidation-reduction process inevitably causes the cracking of ceramic phase, thereby causing the cell to crack and fail. The sealing failure of the cell stack is usually generated in the operation process after the cell stack system is assembled, the uniformity of the size precision of the SOFC support body is an important factor influencing the assembly and operation reliability of the cell stack system, the higher the size precision of the SOFC support body is, the smaller the defects when a functional layer (an electrolyte layer is generally about 10 micrometers, a film layer is a compact film layer, a barrier layer is generally within 5 micrometers, and the film layer is a compact film layer) is coated and prepared on the SOFC support body, the better the electrical property is, the smaller the packaging difficulty of the cell stack is, and the smaller the possibility of the sealing failure in the operation process is. However, the prior art lacks a device and a method for processing the support body with high precision, the SOFC support body with uniform dimensional precision is difficult to obtain, and the assembly and operation reliability of a cell stack system and the sealing performance of the cell stack cannot be ensured.
Disclosure of Invention
The invention provides an SOFC support body processing system and an application method thereof, and aims to solve the technical problems that in the prior art, a device and a method for processing a support body with high precision are lacked, an SOFC support body with uniform dimensional precision is difficult to obtain, and the assembly and operation reliability of a cell stack system and the sealing performance of the cell stack cannot be guaranteed.
In one aspect, the present invention provides a SOFC support body processing system, comprising: a conveying device; a feeding device for storing workpieces to be processed; the scanning analysis system is used for scanning the workpiece to be machined according to the preset length and/or width information to obtain a cutting positioning point of the workpiece to be machined and/or scanning the workpiece to be machined after cutting to obtain a reference plane for planar machining of the workpiece to be machined after cutting; the cutting device is used for cutting the workpiece to be machined according to the cutting positioning point; a plane processing device for processing the upper surface and/or the lower surface of the workpiece to be processed after cutting according to the reference plane; the conveying device is positioned above the feeding device, the cutting device and the plane processing device, and the scanning analysis system is arranged on the outer sides of the cutting device and the plane processing device in a surrounding mode.
Compared with the prior art, the invention has the following beneficial effects: the scanning analysis system scans the workpiece to be processed according to the preset length and/or width information to obtain a cutting positioning point of the workpiece to be processed, and the cutting device cuts the length and the width based on the cutting positioning point; the scanning analysis system obtains a reference surface for planar processing of the to-be-processed workpiece after cutting by scanning the to-be-processed workpiece after cutting, the planar processing device performs planar processing on the basis of the reference surface, and the processed workpiece is high in dimensional accuracy, good in uniformity and capable of achieving high-precision processing; in addition, the workpiece to be machined is moved by the aid of the conveying device, the machining process is carried out by the aid of the cutting device, the surface machining device and the scanning analysis system, the whole machining process is separated from manpower, automation is achieved, and manpower is saved.
In some embodiments of the invention, the loading device comprises a loading station for storing the pieces to be processed; the conveying device comprises a sliding rail and a gripping device which is positioned on the sliding rail and can move along the sliding rail.
The technical scheme has the advantages that the loading station is convenient for storing the workpieces to be processed; the conveying device comprises a sliding track and a grabbing device located on the sliding track, the sliding track is located above the feeding device, the cutting device and the plane machining device, the grabbing device can move along the sliding track, workpieces to be machined are conveniently conveyed along the sliding track by means of the grabbing device, and machining processing of the workpieces to be machined at the cutting device and the plane machining device is achieved.
In some embodiments of the invention, the gripping device comprises a robotic arm movable along a slide rail and a suction cup connected to the robotic arm.
The beneficial effects of adopting above-mentioned further technical scheme lie in, grabbing device is including the arm that can follow the slip track removal and the sucking disc of being connected with the arm, adsorbs through the sucking disc and treats the machined part, drives sucking disc and sucking disc through the arm and adsorbs treating the machined part and remove, grabbing device simple structure, the machined part is treated in the sucking disc adsorption, and the adsorption affinity is strong, prevents to remove the in-process and treats that the machined part drops.
In some embodiments of the invention, the cutting device comprises a cutting area and a first dust collection area, and the conveying device positions the workpiece to be processed to the cutting area according to the cutting positioning point; the plane processing device comprises a positioning processing area and a second dust collecting area, and the conveying device positions the workpiece to be processed after cutting to the positioning processing area according to the reference plane.
The beneficial effects of adopting above-mentioned further technical scheme lie in, cutting device includes cutting area and first dust collecting area, and conveyer will treat that the machined part location cuts after to the cutting area according to the cutting locating point, and the dust collecting area is used for cleaing away the waste material under the cutting, guarantees cutting device's cleanliness, prevents the polluted environment. The plane processing device comprises a positioning processing area and a second dust collecting area, the conveying device positions the to-be-processed workpiece after cutting to the positioning processing area according to the reference surface and then performs plane processing, and the dust collecting area is used for removing waste materials after plane processing, so that the cleanliness of the plane processing device is guaranteed, and the environment pollution is prevented.
In some embodiments of the invention, the scan analysis system includes a scan data collector and a positioning analyzer.
The scanning analysis system comprises a scanning data collector and a positioning analyzer, wherein the scanning data collector can scan the cutting device to be processed and/or processed to be processed after cutting and respectively acquire dimension data information, and the positioning analyzer is used for analyzing the dimension data information to obtain a cutting positioning point of the to-be-processed workpiece and/or a reference plane for plane processing of the to-be-processed workpiece after cutting, so that accurate cutting of the cutting device and accurate plane processing of the plane processing device are facilitated.
In some embodiments of the present invention, the scan analysis system obtains length and/or width information of the workpiece to be processed while scanning the workpiece to be processed; the scanning analysis system is used for acquiring information of a cutting surface of the cut workpiece to be machined when the cut workpiece to be machined is scanned, the plane machining device or the conveying device is further used for adjusting the cutting surface to be vertical to a horizontal scanning surface, the scanning analysis system is further used for identifying the lowest point of the upper surface and/or the highest point of the lower surface of the adjusted cut workpiece to be machined, and the reference surface is a horizontal plane passing through the lowest point or the highest point on the cut workpiece to be machined.
The technical scheme has the advantages that the scanning analysis system obtains the length and/or width information of the workpiece to be machined when scanning the workpiece to be machined, determines the cutting positioning point based on the preset length and/or width information and the length and/or width information of the workpiece to be machined, outputs a machining signal by adopting a positioning key point method, coordinates with the cutting device to perform scanning cutting, not only accurately positions and cuts, but also mainly solves the problem that the three-dimensional direction is not perpendicular to each other, saves the complexity of comprehensive scanning, and is simple and efficient. The scanning analysis system acquires information of a cutting surface of the workpiece to be machined after cutting when the workpiece to be machined is scanned and cut, the plane machining device or the conveying device adjusts the cutting surface to be vertical to the horizontal scanning surface based on the cutting surface of the workpiece to be machined after cutting and the horizontal scanning surface, the lowest point and/or the highest point of the lower surface of the upper surface of the workpiece to be machined after cutting are anchored by adopting a ranging scanning positioning method, a horizontal plane passing through the lowest point or the highest point is taken as a reference surface, machining signals are output, and the plane machining device is matched for fine grinding of the upper surface and the lower surface, so that the precision and the efficiency are realized.
In some embodiments of the invention, the SOFC support body processing system further includes a roughening device, the transport device being located above the roughening device; the roughness processing device can perform surface roughness processing on the workpiece to be processed which moves to the roughness processing device.
The SOFC support body blank processed by the cutting device and the plane processing device is sintered to obtain the SOFC support body. The roughness processing device is used for processing the SOFC supporting body. The cutting device and the plane processing device are used for performing high-precision processing on the SOFC support body blank, the SOFC support body obtained by sintering the processed SOFC support body blank has high dimensional precision, and a large amount of processing is not needed (the surface problem possibly caused by sintering is eliminated by performing simple plane processing in the plane processing device at most, and the subsequent surface roughness processing is performed in the roughness processing device), so that the processing difficulty is reduced (the hardness after sintering is increased), and cracks and the like caused by a large amount of processing are avoided; after the SOFC supporting body is subjected to surface roughness processing by the roughness processing device, a functional layer is easily coated on the surface of the SOFC supporting body, and the functional layer is not easy to fall off; the SOFC support body has high dimensional accuracy, small defects when a functional layer is coated and prepared on the SOFC support body, good electrical performance, small galvanic pile packaging difficulty, small possibility of sealing failure in the operation process, and ensured assembly and operation reliability of a cell galvanic pile system and sealing performance of the cell galvanic pile.
In some embodiments of the invention, the SOFC support processing system further includes an ultrasonic cleaning and drying system, the conveyor being positioned above the ultrasonic cleaning and drying system; the ultrasonic cleaning and drying system comprises an ultrasonic cleaning area which can clean the workpiece to be processed after the roughness processing which is moved to the ultrasonic cleaning and drying system and a microwave drying area which can dry the workpiece to be processed after cleaning.
The beneficial effects of adopting above-mentioned further technical scheme lie in, treat after the roughness processing that the machined part can send into ultrasonic cleaning drying system with the help of conveyer, realize the automation, use manpower sparingly, the human cost has also been practiced thrift in the automatic ultrasonic cleaning of flow stoving, and is high-efficient swift, need not extra increase manual cleaning drying step again. In addition, the ultrasonic cleaning and drying system ensures that the surface of the SOFC support body after roughness processing is clean and pollution-free during film covering, and avoids causing functional layer defects.
In some embodiments of the invention, the SOFC support processing system further includes a screening system, the screening system being located below the transport device, the scanning analysis system further including a data outputter, the screening system including a signal receiver; the screening system can screen the processed parts which are obtained after being processed by the cutting device and the plane processing device and move to the screening system into qualified products, waste products and products to be secondarily processed based on the information which is received by the signal receiver and is sent to the qualified product storage area, the waste product area and the feeding device respectively in cooperation with the conveying device.
The beneficial effects of adopting above-mentioned further technical scheme lie in, accurate size data transmission to the screening system is collected to the scanning analysis system, and the screening system sieves out certified products, waste product and treats secondary operation article to cooperation conveyer conveys respectively to certified products storage area, waste product district and loading attachment, will need secondary operation treat secondary operation article and convey back loading attachment and carry out secondary operation, improve the utilization ratio, reduce the wasting of resources.
In another aspect, the present invention further provides a method for using the SOFC support body processing system described in any one of the above, including the following steps: s1, placing the workpiece to be machined in a feeding device; s2, moving the workpiece to be processed in the feeding device to the cutting device through the conveying device; s3, based on the scanning analysis system, obtaining a cutting positioning point of the workpiece to be processed by scanning the workpiece to be processed according to the preset length and/or width information; s4, positioning the workpiece to be machined through the conveying device according to the cutting positioning point, and cutting the workpiece to be machined based on the cutting device; s5, moving the workpiece to be machined after cutting to a plane machining device through a conveying device; s6, based on the scanning analysis system, obtaining a reference plane for planar processing of the cut workpiece to be processed by scanning the cut workpiece to be processed; and S7, positioning the workpiece to be processed after cutting by the conveying device according to the reference surface, and carrying out plane processing on the upper surface and the lower surface of the workpiece to be processed after cutting along the reference surface based on the plane processing device.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, a workpiece to be machined is moved to a cutting device through a conveying device, a scanning analysis system obtains a cutting positioning point of the workpiece to be machined through scanning the workpiece to be machined according to preset length and/or width information, and then the workpiece to be machined is positioned through the conveying device according to the cutting positioning point, so that accurate cutting in the length and width directions is realized through the cutting device; the workpiece to be machined is moved to the plane machining device after being cut through the conveying device, the scanning analysis system obtains a datum plane of the workpiece to be machined after being cut through the workpiece to be machined after being scanned and cut, then the workpiece to be machined after being cut is positioned through the conveying device according to the datum plane, and accurate plane machining is conducted on the upper surface and the lower surface of the workpiece to be machined after being cut and positioned on the conveying device along the datum plane through the plane machining device. The whole processing process does not need manpower, automation is realized, in addition, high-precision processing is realized through the mutual matching of the scanning analysis system, the cutting device and the plane processing device, and a processed part obtained after processing is high in size precision and good in uniformity.
Drawings
In order to more clearly illustrate the technical solution in the embodiment of the present invention, the drawings required to be used in the embodiment of the present invention will be described below.
Fig. 1 is a schematic structural view of an SOFC support processing system according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a scanning analysis system, a conveying device and a cutting device of the SOFC support body processing system according to an embodiment of the present invention for cooperatively positioning and cutting a workpiece to be processed;
fig. 3 is a schematic structural diagram of a workpiece to be processed after the SOFC support body processing system according to an embodiment of the present invention is subjected to scanning analysis, positioning, and planar processing by the conveyor and the planar processing device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following detailed description of various aspects of the present invention is provided with specific examples, which are only used for illustrating the present invention and do not limit the scope and spirit of the present invention.
The present embodiments provide a SOFC support body processing system. Fig. 1 shows a schematic structural diagram (top view) of the SOFC support body processing system of this embodiment, fig. 2 shows a schematic structural diagram (positioning key point scanning and cutting method) of the SOFC support body processing system of this embodiment, which is used for positioning and cutting a workpiece to be processed in cooperation with a scanning analysis system, a conveying device, and a cutting device, and fig. 3 shows a schematic structural diagram (ranging scanning and positioning method) of the SOFC support body processing system of this embodiment, which is used for positioning and planar processing of the workpiece to be processed after cutting.
As shown in fig. 1, the SOFC support body processing system of the present embodiment includes a transfer device 1, a loading device 2 that stores workpieces to be processed, a cutting device 3, a planar processing device 4, and a scanning analysis system 5. The scanning analysis system 5 is used for obtaining a cutting positioning point of the workpiece to be machined by scanning the workpiece to be machined according to the preset length and/or width information, and/or is used for obtaining a reference plane for planar machining of the workpiece to be machined after cutting by scanning the workpiece to be machined after cutting. The cutting device 3 is used for cutting the workpiece to be processed according to the cutting positioning points. The surface processing device 4 is used for performing surface processing on the upper surface and/or the lower surface of the workpiece to be processed after cutting according to the reference surface. In the present embodiment, the conveying device 1 is located above the loading device 2, the cutting device 3 and the plane processing device 4, and the scanning analysis system 5 is disposed around the outside of the cutting device 3 and the plane processing device 4. In the present embodiment, to facilitate the scanning analysis of the scanning analysis system 5, the scanning analysis system 5 is disposed around the outer side of the cutting device 3 and the plane processing device 4, that is, the scanning analysis system 5 is disposed around the cutting device 3 and the plane processing device 4. In addition, the positional relationship of the conveyor 1 and the scanning and analyzing system 5 is not limited as long as the scanning and analyzing system 5 does not interfere with the operation of the conveyor 1, and for example, the conveyor 1 is located above the loading device 2, the cutting device 3, and the plane processing device 4 and passes through the space between the scanning and analyzing system 5 and the cutting device 3 and the plane processing device 4.
In the present embodiment, the loading device 2 comprises a loading station 21 for storing the pieces to be processed. The transfer device 1 comprises a slide rail 11 and a gripping device 12 which is located on the slide rail 11 and is movable along the slide rail 11. Preferably, in the present embodiment, the gripping device 12 includes a robot arm movable along the slide rail 11 and a suction cup connected to the robot arm (the specific structure of the robot arm and the suction cup is not shown in the figure).
In the present embodiment, the cutting device 3 includes a cutting area 31 and a first dust collecting area 32, and the conveying device 1 positions the workpiece to be processed to the cutting area 31 according to the cutting positioning point. The plane processing device 4 comprises a positioning processing area 41 and a second dust collecting area 42, and the conveying device 1 positions the workpiece to be processed after cutting to the positioning processing area 41 according to the reference plane. In the present embodiment, the positions of the first dust collecting area 32 and the second dust collecting area 42 include, but are not limited to, the positions shown in fig. 1, as long as the cut waste and the waste after the flat surface processing can be cleaned.
In the present embodiment, the scan analysis system 5 includes a scan data collector and a positioning analyzer (not shown in the figure).
In the present embodiment, the scan analysis system 5 acquires length and/or width information of the workpiece to be processed while scanning the workpiece to be processed. The scanning analysis system 5 determines a cutting positioning point based on the preset length and/or width information and the length and/or width information of the workpiece to be processed, and the workpiece to be processed is positioned by matching with the conveying device 1, namely the cutting device 3 realizes the cutting of the length and/or the width by a positioning key point scanning cutting method. Specifically, taking the cutting device only cutting the length direction as an example, as shown in fig. 2, the scanning and analyzing system 5 obtains the length and width information of the workpiece to be processed at the cutting device 3, determines the center line of the length direction, the scanning and analyzing system 5 determines the vertical length cutting lines M 'N' and M "N" based on the preset length information (M "M ', N" N') and the length information of the workpiece to be processed at the cutting device 3, and determines the cutting positioning point ABCD point (ABCD point is a suction cup fixing point, which has the functions of transferring and pressing, and the suction cup brings M 'N' and M "N" to the cutting position through the ABCD point and positions them, so that the cutting device 3 performs precise cutting, if the length and width dimensions of the workpiece to be machined do not meet the requirements, the length and width directions need to be machined, and the cutting machining mode can adopt the positioning key point scanning cutting method of FIG. 2.
In this embodiment, the scanning and analyzing system 5 obtains information of a cutting surface of the workpiece to be machined after cutting when scanning the workpiece to be machined after cutting, the planar processing device 4 or the conveying device 1 is further configured to adjust the cutting surface to be perpendicular to a horizontal scanning surface, the scanning and analyzing system 5 is further configured to identify the lowest point and/or the highest point of the upper surface of the workpiece to be machined after cutting, and the reference surface is a horizontal plane passing through the lowest point or the highest point on the workpiece to be machined after cutting. Namely, the plane processing device 4 realizes plane processing of the upper and lower surfaces by a distance measuring scanning positioning method. Specifically, as shown in fig. 3, the scanning analysis system 5 obtains information (JHGI, KFEL) of the cut surfaces of the workpiece to be processed after being cut by the planar processing device 4, makes the cut surfaces (JHGI, KFEL) perpendicular to the horizontal scanning plane (the cut surfaces perpendicular to the horizontal scanning plane can ensure that the pore channels in the workpiece to be processed after being cut by the planar processing device 4 are parallel to the horizontal scanning plane, i.e. ensure that the plane processed by the planar processing is parallel to the pore channels, prevent the pore channels from inclining relative to the plane to affect the utility of the SOFC prepared subsequently) by adjusting the table top of the planar processing device 4 or adjusting the position of the workpiece to be processed after being cut by the planar processing device 4 by the conveyor device 1, determines the lowest point of the JKLI plane through scanning, where the lowest point is J in fig. 3, and the horizontal plane parallel to the horizontal scanning plane where the J point is located is a reference plane, and positions the workpiece to be processed after being cut by the planar processing device 4 in cooperation with the conveyor device 1, and performing plane machining on the lowest point J along the reference plane to obtain a finally machined plane JK 'L' I. In this embodiment, if both the upper and lower surfaces of the workpiece to be processed at the surface processing device 4 do not meet the requirements, after one surface is processed, the other surface needs to be processed. When the other surface needs to be processed, the other surface can be directly inverted until the bottom surface faces upwards, and then the same method is adopted for plane processing.
In this embodiment, the member to be machined comprises a SOFC support body green body and a SOFC support body. The SOFC support body blank is a workpiece to be processed which needs to be processed by a cutting device, a plane processing device and a subsequent screening system. The SOFC support body refers to a product which is obtained after SOFC support body blanks processed by a cutting device and a plane processing device are screened by a screening system and judged to be qualified products and sintered, and the SOFC support body needs to be processed by a subsequent roughness processing device and an ultrasonic cleaning and drying system (if the sintering brings surface problems, simple plane processing needs to be carried out in the plane processing device before the subsequent roughness processing device and the ultrasonic cleaning and drying system are processed), and if the sintering does not bring surface problems, the subsequent roughness processing device and the ultrasonic cleaning and drying system are directly processed. In this embodiment, the loading device 2 can also be used for storing the SOFC support. The SOFC support body processing system also comprises a roughness processing device 6, the conveying device 1 is positioned above the roughness processing device 6, and the roughness processing device 6 can carry out surface roughness processing on the SOFC support body moved to the roughness processing device 6. In this embodiment, the specific manner of the roughness processing is not limited, and the processing means commonly used in the art may be adopted.
In this embodiment the SOFC support processing system further comprises an ultrasonic cleaning and drying system 7, the transfer device 1 being located above the ultrasonic cleaning and drying system 7. The ultrasonic cleaning and drying system 7 comprises an ultrasonic cleaning zone 71 for cleaning the rough-machined SOFC support body moved to the ultrasonic cleaning and drying system 7 and a microwave drying zone 72 for drying the cleaned SOFC support body.
In this embodiment, the SOFC support processing system further includes a screening system 8, the screening system 8 is located below the conveyor 1, the scanning analysis system 5 further includes a data outputter, and the screening system 8 includes a signal receiver. The screening system 8 can screen the workpiece (SOFC support body blank) obtained after being processed by the cutting device 3 and the plane processing device 4 and moved to the screening system 8 into a qualified product, a waste product and a product to be secondarily processed based on the information received by the signal receiver from the data outputter, and the qualified product, the waste product and the product to be secondarily processed are respectively conveyed to the qualified product storage area 9, the waste product area 10 and the feeding device 2 in cooperation with the conveying device 1. In the present embodiment, the cutting device 3 may perform cutting processing only on the length direction of the workpiece to be processed at the cutting device 3, and the surface processing device 4 may perform processing only on one surface of the workpiece to be processed after cutting at the surface processing device 4, and after being screened by the screening system 8, the workpiece to be secondarily processed is returned to the feeding device 2 to process the width direction and the other surface of the workpiece to be secondarily processed.
The present embodiment also provides a method for using the SOFC support body processing system of the present embodiment, including the following steps:
s1, placing the workpiece to be processed in the feeding device 2;
s2, moving the workpiece to be processed in the feeding device 2 to the cutting device 3 through the conveying device 1;
s3, based on the scanning analysis system 5, obtaining a cutting positioning point of the workpiece to be processed by scanning the workpiece to be processed according to the preset length and/or width information;
s4, positioning the workpiece to be machined through the conveying device 1 according to the cutting positioning point, and cutting the workpiece to be machined based on the cutting device 3;
s5, moving the workpiece to be machined after cutting to the plane machining device 4 through the conveying device 1;
s6, based on the scanning analysis system 5, obtaining a reference plane for planar processing of the workpiece to be processed after cutting by scanning the workpiece to be processed after cutting;
and S7, positioning the workpiece to be processed after cutting by the conveyer 1 according to the reference surface, and carrying out plane processing on the upper and lower surfaces of the workpiece to be processed after cutting along the reference surface based on the plane processing device 4.
Preferably, the use method of the SOFC support body processing system of the embodiment may be as follows:
placing the SOFC support body blank in a feeding station 21 of a feeding device 2;
gripping the SOFC support body blank in the feeding station 21 by the suction cups of the gripping device 12 on the sliding rail 11 of the transfer device 1 and conveying the SOFC support body blank to the cutting area 31 of the cutting device 3;
the scanning analysis system 5 receives the signal, the data collector of the scanning analysis system 5 starts to collect the length and/or width information of the SOFC support body blank at the cut region 31 of the cutting device 3, the positioning analyzer determines a middle line in the length direction (width direction) based on the length and/or width information of the SOFC support body blank at the cut region 31 of the cutting device 3 collected by the data collector, the scanning analysis system 5 determines a vertical length cut line (vertical width cut line) based on preset length information (width information) and the length information (width information) of the SOFC support body blank at the cut region 31 of the cutting device 3, determining a cutting positioning point, adsorbing and pressing the SOFC support body blank at the cutting positioning point by using a sucker, bringing a vertical length cutting line (a vertical width cutting line) to the cutting position by using the sucker, positioning the cutting line, and further performing accurate cutting by using the cutting device 3;
the cut SOFC support body blank is grabbed by a sucker of a grabbing device 12 on a sliding rail 11 of the conveying device 1 and conveyed to a positioning processing area 41 of the plane processing device 4;
the scanning and analyzing system 5 receives the signal, the data collector of the scanning and analyzing system 5 starts to collect the cut surface information of the cut SOFC support body blank at the positioning and processing area 41 of the planar processing device 4, the cutting surface is perpendicular to the horizontal scanning surface by adjusting the table of the planar processing device 4 or adjusting the position of the SOFC support body blank at the positioning processing region 41 of the planar processing device 4 by the transfer device 1, determining the lowest point (highest point of the lower surface) of the upper surface of the SOFC support body blank cut at the positioning processing region 41 of the plane processing device 4 by scanning, recording the horizontal plane passing through the lowest point (highest point of the lower surface) of the upper surface as a reference plane, and performing plane processing along the reference plane to obtain a final processed plane by matching with the SOFC support body blank cut at the positioning processing region 41 of the plane processing device 4 positioned by the conveying device 1;
grabbing the SOFC support body blank subjected to plane processing by a sucker of a grabbing device 12 on a sliding rail 11 of the conveying device 1, and conveying the SOFC support body blank to a screening system 8;
the screening system 8 screens the SOFC support body blank after planar processing moved to the screening system 8 into qualified products, waste products and products to be secondarily processed based on information received by a signal receiver of the screening system 8 from a data output device of the scanning analysis system 5, and the qualified products, the waste products and the products to be secondarily processed are respectively transmitted to a qualified product storage area 9, a waste product area 10 and a feeding device 2 in cooperation with the transmission device 1;
the secondary processed product conveyed to the feeding device 2 is subjected to the steps;
sintering qualified products in the qualified product storage area 9 to obtain an SOFC support body, and placing the SOFC support body in a feeding station 21 of a feeding device 2;
gripping the SOFC support body in the feeding station 21 by using a sucker of a gripping device 12 on a sliding rail 11 of the conveying device 1, if sintering causes surface problems of the SOFC support body, conveying the SOFC support body to a positioning processing area 41 of a plane processing device 4 for simple plane processing (the specific method can be the same as that of plane processing of an SOFC support body blank), and then conveying the SOFC support body to a roughness processing device 6 for surface roughness processing; if the sintering does not cause the surface problem of the SOFC support body, directly conveying the SOFC support body to a roughness processing device 6 for surface roughness processing;
grabbing the SOFC support body processed in the roughness processing device 6 through a sucker of a grabbing device 12 on a sliding rail 11 of the conveying device 1, conveying the SOFC support body to an ultrasonic cleaning area 71 of an ultrasonic cleaning and drying system 7 for cleaning, and conveying the SOFC support body to a microwave drying area 72 of the ultrasonic cleaning and drying system 7 for drying after cleaning;
the SOFC support body processed in the ultrasonic cleaning and drying system 7 is gripped by the suction cups of the gripping device 12 on the slide rail 11 of the transfer device 1 and conveyed to the SOFC support body finished product region (not shown in the figure).
The present invention has been described in conjunction with specific embodiments which are intended to be exemplary only and are not intended to limit the scope of the invention, which is to be given the full breadth of the appended claims and any and all modifications, variations or alterations that may occur to those skilled in the art without departing from the spirit of the invention. Therefore, various equivalent changes made according to the present invention still fall within the scope covered by the present invention.
Claims (10)
1. An SOFC support body processing system, comprising:
a conveying device;
a feeding device for storing workpieces to be processed;
the scanning analysis system is used for scanning the workpiece to be machined according to the preset length and/or width information to obtain a cutting positioning point of the workpiece to be machined and/or scanning the workpiece to be machined after cutting to obtain a reference plane for planar machining of the workpiece to be machined after cutting;
the cutting device is used for cutting the workpiece to be machined according to the cutting positioning point;
a plane processing device for processing the upper surface and/or the lower surface of the workpiece to be processed after cutting according to the reference plane;
the conveying device is positioned above the feeding device, the cutting device and the plane processing device, and the scanning analysis system is arranged on the outer sides of the cutting device and the plane processing device in a surrounding mode.
2. The SOFC support body processing system of claim 1, wherein the loading device includes a loading station for storing the part to be processed; the conveying device comprises a sliding rail and a gripping device which is positioned on the sliding rail and can move along the sliding rail.
3. The SOFC support body processing system of claim 2, wherein the grasping device comprises a robotic arm movable along a slide rail and a suction cup coupled to the robotic arm.
4. The SOFC support body processing system of claim 1, wherein the cutting device includes a cutting region and a first dust collection region, the conveyor positioning the workpiece to be processed to the cutting region according to the cutting positioning point;
the plane processing device comprises a positioning processing area and a second dust collecting area, and the conveying device positions the workpiece to be processed after cutting to the positioning processing area according to the reference plane.
5. The SOFC support processing system of claim 1, wherein the scanning analysis system includes a scanning data collector and a positioning analyzer.
6. The SOFC support body processing system of claim 1, wherein the scanning analysis system obtains length and/or width information of the workpiece to be processed as the workpiece to be processed is scanned;
the scanning analysis system is used for acquiring information of a cutting surface of the cut workpiece to be machined when the cut workpiece to be machined is scanned, the plane machining device or the conveying device is further used for adjusting the cutting surface to be vertical to a horizontal scanning surface, the scanning analysis system is further used for identifying the lowest point of the upper surface and/or the highest point of the lower surface of the adjusted cut workpiece to be machined, and the reference surface is a horizontal plane passing through the lowest point or the highest point on the cut workpiece to be machined.
7. The SOFC support processing system of claim 1, further comprising a roughening device, the transport device positioned above the roughening device;
the roughness processing device can perform surface roughness processing on the workpiece to be processed which moves to the roughness processing device.
8. The SOFC support processing system of claim 7, further comprising an ultrasonic cleaning and drying system, wherein the conveyor is positioned above the ultrasonic cleaning and drying system;
the ultrasonic cleaning and drying system comprises an ultrasonic cleaning area which can clean the workpiece to be processed after the roughness processing which is moved to the ultrasonic cleaning and drying system and a microwave drying area which can dry the workpiece to be processed after cleaning.
9. The SOFC support processing system of claim 1, further comprising a screening system positioned below the conveyor, the scanning analysis system further comprising a data outputter, the screening system comprising a signal receiver;
the screening system can screen the processed parts which are obtained after being processed by the cutting device and the plane processing device and move to the screening system into qualified products, waste products and products to be secondarily processed based on the information which is received by the signal receiver and is sent to the qualified product storage area, the waste product area and the feeding device respectively in cooperation with the conveying device.
10. Method of use of the SOFC support body processing system of any of claims 1-9, comprising the steps of:
s1, placing the workpiece to be machined in a feeding device;
s2, moving the workpiece to be processed in the feeding device to the cutting device through the conveying device;
s3, based on the scanning analysis system, obtaining a cutting positioning point of the workpiece to be processed by scanning the workpiece to be processed according to the preset length and/or width information;
s4, positioning the workpiece to be machined through the conveying device according to the cutting positioning point, and cutting the workpiece to be machined based on the cutting device;
s5, moving the workpiece to be machined after cutting to a plane machining device through a conveying device;
s6, based on the scanning analysis system, obtaining a reference plane for planar processing of the cut workpiece to be processed by scanning the cut workpiece to be processed;
and S7, positioning the workpiece to be processed after cutting by the conveying device according to the reference surface, and carrying out plane processing on the upper surface and the lower surface of the workpiece to be processed after cutting along the reference surface based on the plane processing device.
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