CN113953968A

CN113953968A - Polishing solution supply device and chemical mechanical polishing equipment

Info

Publication number: CN113953968A
Application number: CN202111264391.4A
Authority: CN
Inventors: 梁清波; 王春龙
Original assignee: Beijing Haike Technology Co ltd
Current assignee: Beijing Haike Technology Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2022-01-21

Abstract

The invention discloses a polishing solution supply device and a chemical mechanical polishing device, wherein the polishing solution supply device comprises: the rotating shaft is connected with the driving mechanism to realize bidirectional automatic rotation; the base component is sleeved on the peripheral side of the rotating shaft and plays a role in supporting and fixing; the swing arm is connected to the top of the rotating shaft and can be driven by the rotating shaft to realize bidirectional swing; a polishing liquid supply pipe extending upward via the rotating shaft and arranged along the length direction of the swing arm; the limiting assembly is used for limiting the position of the swing arm at a working position and a maintenance position; and the scale mechanism is used for indicating the position information of a polishing liquid falling point flowing down from the polishing liquid supply pipe when the swing arm is positioned at a working position.

Description

Polishing solution supply device and chemical mechanical polishing equipment

Technical Field

The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing solution supply device and chemical mechanical polishing equipment.

Background

The integrated circuit industry is the core of the information technology industry and plays a key role in the process of upgrading the boosting manufacturing industry to digitalization and intellectualization transformation. The chip is a carrier of an integrated circuit, and the chip manufacturing relates to the process flows of chip design, wafer manufacturing, wafer processing, electrical property measurement, cutting packaging, testing and the like. Wherein, the chemical mechanical polishing belongs to the wafer manufacturing process.

Chemical Mechanical Polishing (CMP) is a globally planarized ultra-precise surface processing technique. Chemical mechanical polishing generally attracts a wafer to a bottom surface of a carrier head, the surface of the wafer having a deposition layer is pressed against an upper surface of a polishing pad, and the carrier head rotates in the same direction as the polishing pad under the actuation of a driving assembly and gives a downward load to the wafer; meanwhile, the polishing solution is supplied to the upper surface of the polishing pad and distributed between the wafer and the polishing pad, so that the chemical mechanical polishing of the wafer is completed under the combined action of chemistry and machinery.

The polishing liquid supply device is an important component of chemical mechanical polishing, and supplies the polishing liquid to the upper surface of the polishing pad. The dropping position of the polishing solution is related to the removal rate of the wafer and the utilization rate of the polishing solution, and the polishing solution supply position needs to be adjusted by adjusting the swing angle of the polishing solution supply arm.

The polishing solution supply arm in the prior art swings manually, and can be manually moved from a working position to a maintenance position after being stopped, so that the work of other mechanisms can be influenced. The polishing solution supply arm and the fixed base are connected and disconnected through the positioning pin, a large gap needs to be formed between the positioning pin and a groove hole of the fixed base, when the external environment changes or a machine table vibrates, the polishing solution supply arm can shake due to the existence of the gap, so that the dropping position of polishing solution drops is inaccurate, the consistency of the resetting position of the polishing solution supply arm is deviated, namely, the resetting is not in the same position every time, and the dropping position of the polishing solution is not uniform, so that the polishing effect is influenced.

Disclosure of Invention

The embodiment of the invention provides a polishing solution supply device and chemical mechanical polishing equipment, and aims to at least solve one of the technical problems in the prior art.

A first aspect of embodiments of the present invention provides a polishing liquid supply apparatus, including:

the rotating shaft is connected with the driving mechanism to realize bidirectional automatic rotation;

the base component is sleeved on the peripheral side of the rotating shaft and plays a role in supporting and fixing;

the swing arm is connected to the top of the rotating shaft and can be driven by the rotating shaft to realize bidirectional swing;

a polishing liquid supply pipe extending upward via the rotating shaft and arranged along the length direction of the swing arm;

the limiting assembly is used for limiting the position of the swing arm at a working position and a maintenance position;

and the scale mechanism is used for indicating the position information of a polishing liquid falling point flowing down from the polishing liquid supply pipe when the swing arm is positioned at a working position.

In one embodiment, the base assembly is provided with a base hole penetrating along the length direction of the base assembly, the rotating shaft is coaxially arranged in the base hole, the top of the rotating shaft extends out of the base hole and is provided with a cantilever extending outwards, and the cantilever is connected with the swing arm.

In one embodiment, the stop assembly includes a first stop mechanism for defining the swing arm in a working position and a second stop mechanism for defining the swing arm in a maintenance position.

In one embodiment, the first limiting mechanism comprises a positioning part and a drop point adjusting part, the drop point adjusting part is an adjustable part, and the rotating angle of the swing arm can be changed by adjusting the relative position between the drop point adjusting part and the positioning part.

In one embodiment, the drop point adjusting member can adjust the amount of expansion and contraction so as to adjust the rotation range of the rotating shaft and further change the drop point of the polishing solution.

In one embodiment, the positioning element is fixed on the top of the base assembly, the drop point adjusting element is connected with the cantilever and can rotate along with the rotating shaft, and the drop point adjusting element moves to be in contact with the positioning element to limit.

In one embodiment, the drop point adjustment member is mounted on top of the base assembly and a positioning member is coupled to the cantilever arm.

In one embodiment, the scale mechanism includes indicator and graduation marks provided on the swing arm and base assembly, respectively.

In one embodiment, the drive mechanism is a pneumatic pendulum table.

A second aspect of an embodiment of the present invention provides a chemical mechanical polishing apparatus, including: the polishing device comprises a polishing disk, a polishing pad adhered on the polishing disk, a bearing head for absorbing a wafer and driving the wafer to rotate, a trimmer for trimming the polishing pad, and a polishing liquid supply device for supplying polishing liquid to the surface of the polishing pad.

The embodiment of the invention has the beneficial effects that: the problem of polishing solution dropping point rock and the inconsistent polishing solution dropping point position after reseing is solved.

Drawings

The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only and do not limit the scope of protection of the invention, wherein:

FIG. 1 is a schematic structural diagram of a chemical mechanical polishing apparatus according to an embodiment of the present invention;

FIG. 2 is a perspective view of a polishing solution supply apparatus according to an embodiment of the present invention;

FIG. 3 is a perspective view of a polishing solution supply apparatus without a housing and a polishing solution supply tube according to an embodiment of the present invention;

FIG. 4 is a top view of FIG. 3;

FIG. 5 is a cross-sectional view of FIG. 3;

FIG. 6 shows the operation of the polishing liquid supply apparatus;

FIG. 7 illustrates an embodiment of a slurry supply at a service location;

FIG. 8 shows an embodiment of the slurry supply apparatus in the work position;

FIG. 9 shows another embodiment of the slurry supply apparatus in the work position;

fig. 10 shows a further embodiment in which the polishing liquid supply means is located at the work station.

Detailed Description

The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein. It should be understood that, unless otherwise specified, the following description of the embodiments of the present invention is made for the convenience of understanding, and the description is made in a natural state where relevant devices, apparatuses, components, etc. are originally at rest and no external control signals and driving forces are given.

Further, it is also noted that terms used herein such as front, back, up, down, left, right, top, bottom, front, back, horizontal, vertical, and the like, to denote orientation, are used merely for convenience of description to facilitate understanding of relative positions or orientations, and are not intended to limit the orientation of any device or structure.

In order to explain the technical solution of the present invention, the following description is made with reference to the accompanying drawings in combination with the embodiments.

In the present application, Chemical Mechanical Polishing (Chemical Mechanical Planarization) is also called Chemical Mechanical Planarization (Chemical Mechanical Planarization), and wafer (wafer) is also called wafer, silicon wafer, substrate or substrate (substrate), which means and actually functions equivalently.

As shown in fig. 1, a chemical mechanical polishing apparatus 1 according to an embodiment of the present invention includes a polishing disk 10, a polishing pad 20 adhered to the polishing disk 10, a carrier head 30 that adsorbs a wafer and rotates the wafer, a dresser 40 that dresses the polishing pad 20, and a polishing liquid supply device 50 that supplies a polishing liquid to a surface of the polishing pad 20.

Before polishing starts, the robot carries the wafer to the wafer storage portion, and the carrier head 30 moves from the wafer storage portion to above the polishing disk 10 in the radial direction of the polishing disk 10 after loading the wafer. During chemical mechanical polishing, the carrier head 30 presses the wafer against the polishing pad 20 covered by the surface of the polishing disk 10, and the size of the polishing pad 20 is larger than the size of the wafer to be polished, for example, 1.2 times or more the size of the wafer, thereby ensuring that the wafer is uniformly polished. The carrier head 30 performs a rotating motion and reciprocates in a radial direction of the polishing pad 10 so that the surface of the wafer contacting the polishing pad 20 is gradually polished while the polishing pad 10 rotates, and the polishing liquid supply device 50 sprays the polishing liquid onto the surface of the polishing pad 20. Under the chemical action of the polishing liquid, the wafer is rubbed against the polishing pad 20 by the relative movement of the carrier head 30 and the polishing platen 10 to perform polishing. Polishing liquid consisting of submicron or nanometer abrasive particles and chemical solution flows between a wafer and a polishing pad 20, the polishing liquid is uniformly distributed under the action of transmission and rotation centrifugal force of the polishing pad 20 to form a layer of liquid film between the wafer and the polishing pad 20, chemical components in the liquid and the wafer generate chemical reaction to convert insoluble substances into easily soluble substances, then the chemical reactants are removed from the surface of the wafer through micro-mechanical friction of the abrasive particles and dissolved into the flowing liquid to be taken away, namely surface materials are removed in the alternate process of chemical film forming and mechanical film removing to realize surface planarization treatment, thereby achieving the purpose of global planarization. The dresser 40 is used to dress and activate the topography of the polishing pad 20 during polishing. The dresser 40 can remove foreign particles remaining on the surface of the polishing pad 20, such as abrasive particles in the slurry and waste materials released from the surface of the wafer, and can also flatten the surface deformation of the polishing pad 20 caused by abrasion, thereby ensuring the consistency of the surface topography of the polishing pad 20 during polishing and stabilizing the removal rate of polishing. After the polishing is completed, the carrier head 30 adsorbs the wafer to place it on the wafer holding section, and the robot arm takes the wafer from the wafer holding section and transports the wafer to the post-processing unit.

During the polishing process, the drop point of the polishing solution needs to be accurately controlled. A polishing liquid supply apparatus 50 according to an embodiment of the present invention is described below with reference to fig. 2 to 10.

As shown in fig. 2 to 10, a polishing liquid supply apparatus 50 according to an embodiment of the present invention includes:

a rotating shaft 52 connected to the driving mechanism 51 to realize bidirectional automatic rotation;

a base component 54, which is sleeved on the outer periphery of the rotating shaft 52 and plays a role in supporting and fixing;

a swing arm 60 connected to the top of the rotating shaft 52 and driven by the rotating shaft 52 to swing in two directions;

a polishing liquid supply pipe extending upward via the rotation shaft 52 and provided along the length direction of the swing arm 60;

a limiting assembly for limiting the position of the swing arm 60 in the working position and the maintenance position;

and a scale mechanism 80 for indicating positional information of a drop point of the polishing liquid flowing down from the polishing liquid supply pipe when the swing arm 60 is at the working position.

According to the embodiment of the invention, under the combined action of the driving mechanism 51 and the limiting assembly, the swing arm 60 can be positioned at the working position without shaking, and the two problems of shaking of the polishing liquid drop point and inconsistent drop point positions after reset are solved. Meanwhile, the positioning function of the maintenance position is added, the problem that the swing arm 60 is not positioned during maintenance is solved, auxiliary personnel are not needed during maintenance, and field personnel operation is facilitated.

As shown in FIG. 2, in one embodiment, the driving mechanism 51 is connected to the rotating shaft 52, the rotating shaft 52 is connected to the swing arm 60, the base assembly 54 is arranged outside the rotating shaft 52, and the base assembly 54 is fixed on the mounting platform. A polishing disk 10 is also secured to the mounting platform.

In one embodiment, the driving mechanism 51 is an automatic rotating mechanism, which does not require manual rotation, and may be a pneumatic swing table or an electric turntable. The driving mechanism 51 is arranged at the bottom of the polishing liquid supply device 50, and the driving mechanism 51 can automatically drive the swing arm 60 at the top to swing clockwise or counterclockwise in two directions through the rotating shaft 52, so that the swing arm 60 can be controlled to be fixed at two positions: a work station and a maintenance station.

As shown in fig. 6, the working position is a position of the swing arm 60 in an area above the polishing platen 10 when the chemical mechanical polishing apparatus 1 performs a chemical mechanical polishing work. The maintenance position is the area of the swing arm 60 outside the polishing pad 10 to facilitate preventive maintenance.

As shown in fig. 2, in one embodiment, in order to prevent the polishing liquid or the cleaning liquid from splashing inside the polishing liquid supply device 50 and ensure the normal operation of the internal transmission components, a housing is disposed at the upper part of the swing arm 60. Meanwhile, the arrangement of the housing can also prevent the lubricating oil or other impurities inside from dissociating to the outside of the polishing solution supply device 50 to cause pollution of the polishing environment.

As shown in fig. 5, in one embodiment, the base member 54 has a base hole 55 penetrating along a length direction thereof, and the rotation shaft 52 is coaxially disposed in the base hole 55.

As shown in fig. 3 and 4, the top of the rotating shaft 52 extends out of the base hole 55 and has a cantilever 53 extending all around, and the cantilever 53 is connected to a swing arm 60. The swing arm 60 is driven by the rotation shaft 52 to swing so as to adjust the position of the end of the polishing liquid supply pipe disposed at the upper side of the swing arm 60, thereby controlling the polishing liquid drop point.

As shown in FIG. 5, in one embodiment, the base assembly 54 includes a base 56 and a stationary shaft 57. The base 56 is fixed to the mounting platform and the fixed shaft 57 is fixedly connected to the base 56 and extends upwardly. The susceptor 56 has a columnar structure, a susceptor hole 55 is formed at the center thereof in the longitudinal direction, and a slurry supply pipe is inserted through the susceptor hole 55. The fixing shaft 57 is located above the base 56, and the fixing shaft 57 is a cylindrical structure with a through hole formed therein.

As shown in fig. 5, in one embodiment, the polishing liquid supply device 50 further includes a sleeve 58, and the upper end of the sleeve 58 is connected to the swing arm 60 and is stationary relative to the swing arm 60. A sleeve 58 is rotatably disposed on the outside of the fixed shaft 57 and above the base 56, and the sleeve 58 is rotated relative to the base assembly 54 by a swing arm 60.

As shown in fig. 5, in one embodiment, the fixed shaft 57 is coupled to the sleeve 58 by a bearing 59.

As shown in fig. 3 and 4, in one embodiment, the swing arm 60 includes a rod portion 62 and a ring portion 61, which are integrally formed, the ring portion 61 is concentrically disposed on the top surface of the sleeve 58, the ring portion 61 is disposed on the outer ring of the top of the rotating shaft 52, and the ring portion 61 is connected to the suspension 53.

As shown in fig. 5, the rotating member in the polishing liquid supply apparatus 50 includes: a drive mechanism 51, a shaft 52, a swing arm 60, a bearing cup, and a sleeve 58, which are connected in turn for common movement.

The components of the polishing liquid supply device 50 that function as a support and hold device and remain stationary include: base 56, fixed axle 57 and bearing inner race.

As shown in fig. 7-10, in one embodiment, the stop assembly includes a first stop mechanism for defining the swing arm 60 in the working position and a second stop mechanism for defining the swing arm 60 in the maintenance position.

The first limiting mechanism comprises a positioning part 71 and a drop point adjusting part 72, the drop point adjusting part 72 is an adjustable part, and the rotation angle of the swing arm 60 can be changed by adjusting the relative position between the drop point adjusting part 72 and the positioning part 71. The drop point adjustment member 72 may be formed in a retractable, arcuate or tapered manner to change position. Specifically, the drop point adjuster 72 is adjusted until the swing arm 60 swings to a desired position, the drop point adjuster 72 is locked, and the position is fixed.

As an implementation manner, the positioning member 71 is fixed on the top of the base assembly 54, the drop point adjusting member 72 is connected to the cantilever 53 and can rotate along with the rotating shaft 52, the drop point adjusting member 72 moves to contact with the positioning member 71 for limiting, and the drop point adjusting member 72 can adjust the amount of expansion and contraction to adjust the rotating range of the rotating shaft 52 and thus change the drop point of the polishing solution.

Specifically, the positioning element 71 is fixed on the top surface of the fixed shaft 57, the drop point adjusting element 72 is in threaded connection with the cantilever 53, as shown in fig. 8, the swing arm 60 rotates counterclockwise to drive the drop point adjusting element 72 to move, and the drop point adjusting element 72 abuts against the positioning element 71 to achieve limiting.

The drop point adjusting member 72 may be implemented by a screw having an arc shape at an end contacting the positioning member 71. By screwing in and out the screw, the length of the screw extending out of one side of the cantilever 53 can be adjusted, and the distance between the cantilever 53 connected with the screw and the positioning part 71 is changed, so that the rotation angle of the swing arm 60 is changed.

As another alternative, the drop point adjustment member 72 is mounted on top of the base assembly 54 and the positioning member 71 is connected to the cantilever 53.

In one embodiment, the second limiting mechanism can be a positioning pin 73, the positioning pin 73 is disposed on the top of the base assembly 54, specifically, the positioning pin 73 is fixed on the top surface of the fixing shaft 57,

as shown in fig. 7, when the driving mechanism 51 rotates clockwise, the swing arm 60 is driven to swing clockwise, the cantilever 53 at the top of the rotating shaft 52 is attached to the positioning pin 73, and at this time, the swing arm 60 is fixed at the maintenance position.

As shown in fig. 8 and 9, when the driving mechanism 51 rotates counterclockwise, the swing arm 60 is driven to swing counterclockwise, the falling point adjusting member 72 is attached to the positioning member 71, and at this time, the swing arm 60 is fixed at the working position.

As shown in fig. 7-10, in one embodiment, the scale mechanism 80 includes indicator lines 81 and graduation lines 82 provided on the swing arm 60 and base assembly 54, respectively, for indicating relative position. Specifically, the indication line 81 is provided on the top surface of the ring portion 61 of the swing arm 60 and the scale 82 is provided on the top surface of the fixed shaft 57, or the indication line 81 is provided on the top surface of the fixed shaft 57 and the scale 82 is provided on the top surface of the ring portion 61 of the swing arm 60.

The scale line 82 is used to indicate the distance L between the polishing liquid drop point and the center of the polishing pad at the current position.

As shown in fig. 7 to 10, a scale line 82 is marked on the top surface of the fixed shaft 57 in the range of 100 and 160, and an indication line 81 is marked on the swing arm 60. The positions of the graduation marks 82 and the indication lines 81 can be accurately calculated from the relative positions of the center of the polishing pad 10 and the center of the rotating shaft 52 shown in fig. 6. When the indicating line 81 on the swing arm 60 coincides with a certain graduation line 82, the graduation line 82 reads the position of the polishing liquid falling point at the moment, i.e. the distance L from the polishing liquid falling point to the center of the polishing disk shown in fig. 6. The state shown in FIG. 8 is a state where the polishing liquid dropping point is at a position of 100 mm. If the process is required, the position of the polishing liquid drop point needs to be adjusted, for example, the position of the polishing liquid drop point needs to be adjusted from 100mm to 140 mm. The length of the screw-fit between the drop point adjusting piece 72 and the cantilever 53 is adjusted, and the indicating line 81 on the swing arm 60 coincides with the scale line 82 with the reading of 140. The state shown in FIG. 9 is a state where the slurry landing point is at a position of 140 mm.

The indicating lines 81, the scale lines 82 and the related positioning parts are obtained by machining, the theoretical calculation precision and the machining precision are high enough, and the problem that the position of a polishing liquid drop point manually measured is inaccurate can be solved.

Further, as shown in fig. 10, in actual use, the polishing liquid supply device 50 may supply multiple paths of polishing liquids, for example, when switching to the path 2, the relative position of the dropping point of the polishing liquid is different from that of the path 1. As shown in fig. 10, "S1" and "S2" indicate positional information of two-way polishing liquid landing points.

Specifically, according to the center position of the polishing disk 10, the center position of the rotating shaft 52, and the relative positions of the two paths of polishing liquid falling points, the position of the indicating line corresponding to the 2 nd path of polishing liquid falling point position is calculated on the swing arm 60 and is marked as "S2". The indicator line corresponding to the 1 st polishing solution landing point position is marked as S1. As shown in fig. 10, when the indicator line S2 coincides with one of the graduation lines 82, the graduation line 82 reads the position of the landing point of the 2 nd path polishing liquid. FIG. 10 shows a state where the landing point of the 2 nd polishing slurry is at 120. Similarly, the positions of the indicator lines "S3" and "S4" may be set in sequence for determining the positions of the dropping points of the 3 rd path polishing solution and the 4 th path polishing solution.

In summary, the polishing liquid supply device 50 provided by the embodiment of the present invention can achieve the following functions:

1. the on-position is accurate, the actual position of the polishing solution drop point is consistent with the theoretical position, and no deviation exists;

2. the drop point of the polishing solution is fixed and does not shake during working;

3. the reset positions of the swing arms 60 are consistent after maintenance or other operations, and the positions of the polishing liquid falling points are uniform;

4. the maintenance position is added, and the operation of the machine during maintenance is facilitated.

The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A polishing liquid supply apparatus, comprising:

2. The polishing liquid supply apparatus according to claim 1, wherein the base assembly has a base hole penetrating along a length direction thereof, a rotary shaft is coaxially provided in the base hole, a top portion of the rotary shaft protrudes through the base hole and has an outwardly extending cantilever arm, and the cantilever arm is connected to the swing arm.

3. The polishing liquid supply apparatus according to claim 1, wherein the stopper assembly includes a first stopper mechanism for restricting the swing arm at the working position and a second stopper mechanism for restricting the swing arm at the maintenance position.

4. The polishing liquid supply apparatus according to claim 3, wherein the first limit mechanism includes a positioning member and a drop point adjusting member, the drop point adjusting member is an adjustable member, and the rotation angle of the swing arm can be changed by adjusting the relative position between the drop point adjusting member and the positioning member.

5. The polishing liquid supply apparatus according to claim 4, wherein the drop point adjusting member is adjustable in expansion and contraction to adjust a rotation range of the rotary shaft to change the drop point of the polishing liquid.

6. The polishing solution supply apparatus as claimed in claim 4, wherein the positioning member is fixed to a top of the base assembly, the drop point adjusting member is connected to the cantilever and rotatable with the rotation shaft, and the drop point adjusting member is moved to contact the positioning member for limiting.

7. The polishing solution supply apparatus as set forth in claim 4, wherein the drop point adjustor is installed at a top of the base assembly, and a positioning member is connected to the cantilever.

8. The polishing liquid supply apparatus according to claim 1, wherein the scale mechanism includes an indication line and a scale line provided on the swing arm and the base assembly, respectively.

9. The polishing liquid supply apparatus according to any one of claims 1 to 8, wherein the drive mechanism is a pneumatic pendulum table.

10. A chemical mechanical polishing apparatus, comprising: a polishing disk, a polishing pad adhered to the polishing disk, a carrier head for adsorbing a wafer and rotating the wafer, a dresser for dressing the polishing pad, and a polishing liquid supply apparatus according to any one of claims 1 to 9 for supplying a polishing liquid to a surface of the polishing pad.