CN113953685A - Planar plate laser cutting path planning method - Google Patents
Planar plate laser cutting path planning method Download PDFInfo
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- CN113953685A CN113953685A CN202111402183.6A CN202111402183A CN113953685A CN 113953685 A CN113953685 A CN 113953685A CN 202111402183 A CN202111402183 A CN 202111402183A CN 113953685 A CN113953685 A CN 113953685A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The invention discloses a planning method for a laser cutting path of a planar plate, which is used for optimizing a cutting track under the condition of meeting a cutting rule when large-scale part laser cutting is carried out. The method comprises the following steps: reading the outline of the part; extracting feature points; discretizing; layering the outlines; arranging a lead; numbering the outlines; preprocessing and sorting; s8, performing cross sorting and forming a track set; s9, judging the priority; the final track is formed.
Description
Technical Field
The invention relates to the technical field of laser cutting, in particular to a planning method for a laser cutting path of a planar plate.
Background
Laser cutting is an important process in the modern manufacturing process, and the problem of a laser cutting path is always accompanied with the development of laser cutting, so far, the laser cutting path is still the key for improving the cutting efficiency and saving energy. Since the application of laser to the cutting field, three passes were made (Chinese patent: CN 201810785295.6). The initial laser path planning is manually planned by depending on experience, the method is simple and easy to operate, but the optimal cutting path of the large-batch parts cannot be guaranteed, the requirement on workers is high, and the labor cost is increased; with the development of automation technology to the manufacturing industry, a specific arrangement rule is used for planning a laser path instead of a manual planning method, such as an n-shaped method (shown in figure 1) and the like, the method reduces the labor input, has certain robustness, but cannot obtain an optimal path for complex and various part sizes; at present, an artificial intelligence technology becomes a research hotspot of each industry, in the aspect of laser cutting path planning, an intelligent algorithm, such as an ant colony algorithm, a particle swarm algorithm and the like, can obtain a very ideal cutting path, and the method has high robustness, but has high requirements on computer performance, large calculation amount, large storage capacity and poor real-time performance, and cannot better adapt to the current market differentiation and small-batch individualized production trend. At present, automatic cutting track planning is mainly adopted, and when track planning is carried out on large-scale parts, better effects cannot be obtained frequently, the production efficiency of enterprises is influenced, the time cost is improved, and the competitiveness of the enterprises is reduced.
The most of the current cutting modes still adopt 'integral cutting', namely the contour of the whole part is completely cut, the next part contour is cut, the cutting starting point and the cutting end point of each contour are overlapped, so that the laser head is forced to continue to cut along the track, and the flexibility of the laser head in walking is reduced. After the parts are discretized according to a certain rule, the constraint of the part outline on the walking of the laser head can be effectively reduced, the operation is more flexible, the idle stroke can be effectively shortened, and the cutting path is optimized.
Disclosure of Invention
The invention provides a planning method for a laser cutting path of a planar plate, aiming at achieving an optimal path during cutting, and the planning method can be used for optimizing the cutting track under the condition of meeting the cutting rule during large-scale laser cutting of parts.
The purpose of the invention is realized as follows:
a planar plate laser cutting path planning method comprises the following steps:
s1, reading part contour
Reading all profiles of each part of the plane plate;
s2, feature point extraction
Extracting corresponding feature points on each contour;
s3 discretization
Dispersing all the contours from each characteristic point to form discrete contours;
s4, contour layering
Layering all discrete contours of each part into an inner layer contour and an outer layer contour;
s5, setting lead wire
Respectively arranging lead wires on the inner layer profile and the outer layer profile, setting the outer layer profile as a male cutting, and setting the inner layer profile as a female cutting;
s6, outline number
Numbering all the discrete profiles; the random numbering is equivalent to naming the discrete part profile.
S7, preprocessing sorting
Placing all inner layer outlines of each part in front of outer layer outlines of the part, and arranging the part outlines in an n shape;
s8, cross sorting and forming track set
Randomly and alternately sequencing all the part profiles for multiple times to form a track set, and judging an optimal track;
s9, determining priority
Carrying out priority judgment on the part profile sections which are randomly and crossly ordered;
and S10, forming a final track.
Preferably, in step S1, the part contour reading method includes: each part in the cad drawing at least comprises one outline, LabVIEW software is used for reading the outline of the part from the cad drawing, the cad drawing is in a DXF file format, and the outline of the part is read by using the characteristics of the DXF file.
Preferably, in step S2, the method for extracting the feature points includes: regarding the polygon, the vertex of the polygon is taken as the characteristic point of the polygon; for the circular arc line, a starting point, an end point and a middle point are used as characteristic points of the circular arc line; in the case of a circle, the vertex of an inscribed square of the circle is used as a characteristic point, and in the case of an ellipse, the intersection point of the major axis and the minor axis of the ellipse with the ellipse is used as the characteristic point.
Preferably, in step S3, all the part profiles are dispersed into line segments and/or arcs.
Preferably, in step S4, the method for determining the inner layer profile and the outer layer profile includes: and reading the part contour layer information in the DXF format file by adopting LabVIEW software, and layering all contours of the part into an inner layer contour and an outer layer contour according to the part contour layer information.
Preferably, in step S8, the cross-sorting method includes: and judging whether the part profiles are the first part profile after the preprocessing sequencing and the last part profile after the preprocessing, wherein the first profile of the inner layer profile cannot be crossed forwards continuously, the last profile of the outer layer profile cannot be crossed backwards, and for other part profiles except the first profile and the last profile, the random crossing sequencing is carried out by adopting a method of crossing the sections of the inner layer profile forwards and crossing the sections of the outer layer profile backwards.
Preferably, in step S8, the value range of N, which is the number of the random moving positions of the part profile, is 0 or more and N or less, and a probability gradient is set, where the probability gradient satisfies a discrete linear function, and N is a set limit value of the number of the moving positions.
Preferably, in step S8, the criterion for determining the optimal trajectory is: whether the length s of the idle stroke of the track is smaller than or equal to a preset value Q or not is judged, if the value of s does not meet the standard, the next step is returned to the previous step to continue the cross sorting so as to obtain a new path; if s meets the standard, inputting the path as an optimal track to the next stage; and if the times M of the cross sequencing reaches a preset upper limit value M, setting the track with the shortest hollow stroke in the generated track as an optimal track and inputting the optimal track to the next stage.
Preferably, in step S9, the method for determining the priority of the part contour segment includes: whether the serial numbers of the inner layers are all adjusted to be before the serial numbers of the outer layers of the subordinating parts or not is judged so as to ensure the relation between the inner layers and the outer layers of the parts; if the formed track is found to have errors in the priority of the profile, the suboptimal track is input for judgment until a combination meeting the priority relationship is found.
Due to the adoption of the technical scheme, the invention has the following beneficial effects:
through discretization, all the outlines of the parts are discretized, so that more possibilities are provided when the path direction is selected, and the idle stroke is effectively controlled.
By layering the inner layer and the outer layer and adjusting the priority of contour cutting, the part precision can not be lost due to falling and thermal deformation caused by cutting the contour line of the outer layer in the cutting process.
Through preprocessing, the calculation amount of subsequent priority adjustment is reduced, and the working efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of an n-shaped planning method;
FIG. 2a and FIG. 2b are schematic diagrams of a file reading procedure;
FIG. 3 is a schematic diagram of reading entity data;
FIG. 4 is an overall flow chart of the present invention;
FIG. 5 is a flow chart of feature point extraction;
FIG. 6 is a flow chart of the pretreatment;
FIG. 7 is a flow chart of a cross-sorting process;
FIG. 8 is a schematic view of a lead arrangement;
FIG. 9 is a schematic cross-sequencing diagram;
fig. 10 is a flowchart of determination of an optimal trajectory.
Detailed Description
Referring to fig. 1-10, an embodiment of a method for planning a laser cutting path of a planar plate material is shown.
Reading a DXF format file, opening a part drawing by using AutoCAD, storing the part drawing in a DXF file format, and reading a generated DXF file by using LabVIEW, wherein the file comprises the characteristic information of the part, one DXF file consists of a plurality of groups, each group occupies two lines, the first line is a code of the group, and the second line is a group value; the group code corresponds to a code of a data type, which is specified by a CAD graphic system, and the group value is a specific numerical value, which in combination represent the meaning and value of one data; information useful for the present invention can be read by using the characteristics of the DXF file, as shown in fig. 2a, 2b, and 3, coordinate values and layer information of a solid segment are read, and drawing processing is performed by using the read information; the requirement of the part drawing is that the drawing at least comprises a part outline; if no contour information is read, an error is reported and the input of correct drawing information is prompted;
the feature point extraction is to perform discretization better, the discretization is directly influenced by the feature point extraction, and the final cutting efficiency is indirectly influenced, so that the feature point extraction strategy is particularly important; the invention adopts the characteristic point strategy that: (1) for triangles, quadrilaterals and polygons, the strategy adopted is to take the vertexes thereof as the characteristic points; (2) the starting point, the end point and the middle point of the circular arc line are used as characteristic points; the characteristic points are taken according to the principle, and basically all part profiles can be contained, so that the laser cutting method can be widely applied to laser cutting of various parts; discretizing all the part outlines according to the extracted feature points, and completely discretizing all the part outlines into line segments and arc lines, including the inner layer outline and the outer layer outline of the part; compared with the original part profile, the discretized part profile has more units, so that the limitation of the part profile can be reduced during laser cutting, and the cutting path is more diversified; the specific flow of feature point extraction and discretization is shown in fig. 5: taking the read contour closest to the origin as a first contour, obtaining a starting point and an end point according to characteristic point dispersion, obtaining the characteristic points according to an arc line, obtaining the characteristic points according to the vertexes of an inscribed square by a circle, wherein the ellipse is the intersection point of a long half shaft and a short half shaft and the ellipse, obtaining the characteristic points according to each vertex by the rest n polygons, performing dispersion operation according to the obtained characteristic points, judging whether the contours are completely dispersed, if not, reading the next contour, and repeating the operation until all the contours are completely dispersed;
the most important principle to be followed when the plate is cut by laser is that the inner layer contour and the outer layer contour are cut separately, the inner layer contour is cut firstly, and then the outer layer contour is cut to ensure the cutting quality of parts and the safety of equipment, so that the judgment of the inner layer contour and the outer layer contour is very important; in the invention, LabVIEW software is adopted for judging the inner and outer layer outlines to read the layer information of the part outline in the DXF format file, and all the outlines are divided into the inner layer outline and the outer layer outline;
in order to ensure the cutting quality, a lead is required to be arranged when laser cutting is carried out; as shown in fig. 8, which is a diagram of a circular ring part to be cut, the outer contour circle is an outer layer contour, so that when a lead is arranged, the lead needs to be arranged outside the circular ring, namely, the lead 1 in the diagram, so as to prevent the part from being "over-burnt" when the cutting is carried out, which affects the quality and the integrity of the part; similarly, when the lead of the outline of the inner layer is arranged, the lead needs to be arranged at the inner side of the outline, namely the lead 2 in the figure; in order to ensure the cutting quality of the parts, for all the discrete part outlines, namely all line segments and arcs, leads are required to be arranged according to the belonged levels;
numbering all the discrete part profile sections;
in order to reduce the amount of calculation and improve the cutting efficiency, preprocessing is carried out before sequencing, and as shown in fig. 6, the preprocessing rule is that the inner layer profile section of each part profile is completely arranged in front of the outer layer profile section of the profile, and the part profiles are sequenced in an n-shaped manner; therefore, the cutting sequence can be ensured, and a large amount of calculation in the later sequencing can be reduced;
in order to obtain an optimal path, the processed part outlines need to be subjected to cross sequencing; a specific cross-sorting flow operation, as shown in fig. 7, after the information of the processed part outlines is read, it is necessary to determine whether the part outlines are the first part outline after the pre-processing sorting and the last part outline after the pre-processing sorting, because the inner layer outline of the first outline cannot be continuously crossed forward and the outer layer outline of the last outline cannot be crossed backward; for the outlines of other parts except the first and the last outlines, the strategies that the inner layer outline sections are crossed forwards and the outer layer outline sections are crossed backwards are adopted; as shown in FIG. 9, parts A, B, C, D, E are all parts that have been pre-processed and sorted; taking the part C as an example, the third contour section of the contour of the inner layer part moves forwards n positions randomly to the part A in the part contour point of the part B or before; considering the front-back relation of N-shaped parts during pretreatment, the value range of the number N of the random moving positions is more than or equal to 0 and less than or equal to N, because the cutting track generally cannot cross the outline of the parts, a probability gradient is set for N, the larger N is, the smaller the selected probability is, and the probability gradient meets a discrete linear function; and the outer contour section III of the part C moves backwards N positions randomly to the part E in the part contour point of the part D or behind the part E, and simultaneously, the probability gradient of N and N is set to be within the value range of N and less than or equal to 0 in consideration of the preprocessing result so as to reduce a certain amount of calculated amount; after all the part profiles are completely sequenced, length judgment needs to be carried out on the formed profile combination to serve as a termination condition; as shown in fig. 10, the determined criterion is whether the length s of the idle stroke of the trajectory is less than or equal to a preset value Q, if the value of s does not meet the criterion, the previous stage is returned to continue the cross sorting to obtain a new path; if s meets the standard, inputting the path to the next stage; if the times M of the cross sequencing reaches a preset value M, setting the track with the shortest hollow stroke in the generated track as an optimal path and inputting the optimal path to the next stage;
in order to ensure the final cutting quality of the parts and the safety of equipment, the priority of the inner layer and the outer layer of the part outline needs to be judged again, and whether the serial numbers of the inner layer are all adjusted to be before the subordinate serial numbers of the outer layer is judged so as to ensure the relation between the inner layer and the outer layer of the parts; if the formed track has errors on the priority of the profile, inputting and judging the suboptimal track until a combination which accords with the priority relation is found;
forming a final cutting track.
Finally, it is noted that the above-mentioned preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the invention as defined by the appended claims.
Claims (9)
1. A planar plate laser cutting path planning method is characterized by comprising the following steps:
s1, reading part contour
Reading all profiles of each part of the plane plate;
s2, feature point extraction
Extracting corresponding feature points on each contour;
s3 discretization
Dispersing all the contours from each characteristic point to form discrete contours;
s4, contour layering
Layering all discrete contours of each part into an inner layer contour and an outer layer contour;
s5, setting lead wire
Respectively arranging lead wires on the inner layer profile and the outer layer profile, setting the outer layer profile as a male cutting, and setting the inner layer profile as a female cutting;
s6, outline number
Randomly numbering all discrete profiles;
s7, preprocessing sorting
Placing all inner layer outlines of each part in front of outer layer outlines of the part, and arranging the part outlines in an n shape;
s8, cross sorting and forming track set
Randomly and alternately sequencing all the part profiles for multiple times to form a track set, and judging an optimal track;
s9, determining priority
Carrying out priority judgment on the part profile sections which are randomly and crossly ordered;
and S10, forming a final track.
2. The method for planning the laser cutting path of the planar plate according to claim 1, wherein: in step S1, the part contour reading method includes: each part in the cad drawing at least comprises one outline, LabVIEW software is used for reading the outline of the part from the cad drawing, the cad drawing is in a DXF file format, and the outline of the part is read by using the characteristics of the DXF file.
3. The method for planning the laser cutting path of the planar plate according to claim 1, wherein in the step S2, the method for extracting the feature points comprises: regarding the polygon, the vertex of the polygon is taken as the characteristic point of the polygon; for the circular arc line, a starting point, an end point and a middle point are used as characteristic points of the circular arc line; in the case of a circle, the vertex of an inscribed square of the circle is used as a characteristic point, and in the case of an ellipse, the intersection point of the major axis and the minor axis of the ellipse with the ellipse is used as the characteristic point.
4. The method for planning the laser cutting path of the planar plate according to claim 1, wherein: in step S3, all the part profiles are fully discretized into line segments and/or arcs.
5. The method as claimed in claim 2, wherein in step S4, the method for determining the inner layer profile and the outer layer profile comprises: and reading the part contour layer information in the DXF format file by adopting LabVIEW software, and layering all contours of the part into an inner layer contour and an outer layer contour according to the part contour layer information.
6. The method for planning a laser cutting path of a planar plate according to claim 1, wherein in step S8, the cross sorting method comprises: and judging whether the part profiles are the first part profile after the preprocessing sequencing and the last part profile after the preprocessing, wherein the first profile of the inner layer profile cannot be crossed forwards continuously, the last profile of the outer layer profile cannot be crossed backwards, and for other part profiles except the first profile and the last profile, the random crossing sequencing is carried out by adopting a method of crossing the sections of the inner layer profile forwards and crossing the sections of the outer layer profile backwards.
7. The method for planning the laser cutting path of the planar plate according to claim 6, wherein in step S8, the number N of the randomly moving positions of the part contour ranges from 0 to N, and a probability gradient is set, wherein the probability gradient satisfies a discrete linear function, and N is a set limit value of the number of the moving positions.
8. The method for planning the laser cutting path of the planar plate according to claim 1 or 6, wherein in the step S8, the criteria for determining the optimal path are: whether the length s of the idle stroke of the track is smaller than or equal to a preset value Q or not is judged, if the value of s does not meet the standard, the next step is returned to the previous step to continue the cross sorting so as to obtain a new path; if s meets the standard, inputting the path as an optimal track to the next stage; and if the times M of the cross sequencing reaches a preset upper limit value M, setting the track with the shortest hollow stroke in the generated track as an optimal track and inputting the optimal track to the next stage.
9. The method for planning a laser cutting path of a planar plate according to claim 1, wherein in step S9, the method for determining the priority of the contour segment of the part is as follows: whether the serial numbers of the inner layers are all adjusted to be before the serial numbers of the outer layers of the subordinating parts or not is judged so as to ensure the relation between the inner layers and the outer layers of the parts; if the formed track is found to have errors in the priority of the profile, the suboptimal track is input for judgment until a combination meeting the priority relationship is found.
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