CN113953239A - Physical cleaning device for wafer edge - Google Patents

Physical cleaning device for wafer edge Download PDF

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Publication number
CN113953239A
CN113953239A CN202111039694.6A CN202111039694A CN113953239A CN 113953239 A CN113953239 A CN 113953239A CN 202111039694 A CN202111039694 A CN 202111039694A CN 113953239 A CN113953239 A CN 113953239A
Authority
CN
China
Prior art keywords
toothed wheel
shell
wafer edge
corner cylinder
cleaning apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202111039694.6A
Other languages
Chinese (zh)
Inventor
钱诚
李刚
王建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Aelsystem Intelligent Equipment Co ltd
Original Assignee
Wuxi Aelsystem Intelligent Equipment Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Aelsystem Intelligent Equipment Co ltd filed Critical Wuxi Aelsystem Intelligent Equipment Co ltd
Priority to CN202111039694.6A priority Critical patent/CN113953239A/en
Publication of CN113953239A publication Critical patent/CN113953239A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)

Abstract

The invention discloses a physical cleaning device for a wafer edge, which comprises a motor, a first toothed wheel, a toothed belt, a telescopic rod and an L-shaped plate, wherein the first toothed wheel is installed on an output shaft of the motor, a second toothed wheel is installed on one side of the first toothed wheel, the second toothed wheel is connected with the first toothed wheel through the toothed belt, the second toothed wheel is installed on a hollow shaft, a rotating joint is installed at the lower end of the hollow shaft, and a second fixing seat is arranged above the second toothed wheel and connected to the hollow shaft. The invention has simple integral structure, convenient and reliable operation and use, good cleaning effect and high intelligent degree by utilizing the upper hairbrush, the lower hairbrush and the side hairbrush to clean the edge of the wafer, and has stronger popularization and use values.

Description

Physical cleaning device for wafer edge
Technical Field
The invention relates to the technical field of cleaning devices, in particular to a physical cleaning device for a wafer edge.
Background
With the development of integrated circuit processes, the specifications of wafers are gradually developing towards large sizes, the enlargement of the wafer sizes correspondingly causes the enlargement of the edge areas of the wafers, and the control of the edge defects of the wafers is more important, so called the edge defects of the wafers refer to the defects that a film is peeled off under the action of internal stress or external force after the edge of the wafer is accumulated to a certain degree, if the film falls into a device area on the wafer, the film becomes a defect affecting the yield of products, and serious defects even cause the scrapping of the products, so a physical cleaning device for the edge of the wafer is needed to eliminate the adverse effects.
Disclosure of Invention
The present invention is directed to solving the above problems and to providing a physical cleaning apparatus for wafer edges.
The invention realizes the purpose through the following technical scheme:
a physical cleaning device for wafer edges comprises a motor, a first toothed wheel, a toothed belt, telescopic rods and L-shaped plates, wherein the first toothed wheel is installed on an output shaft of the motor, a second toothed wheel is installed on one side of the first toothed wheel and connected with the first toothed wheel through the toothed belt, the second toothed wheel is installed on a hollow shaft, a rotating joint is installed at the lower end of the hollow shaft, a second fixing seat is arranged above and connected to the hollow shaft and is provided with the second toothed wheel, a first fixing seat is installed above the second fixing seat, a shell is arranged between the second fixing seat and the first fixing seat, two L-shaped plates are symmetrically installed on two sides of the shell, the telescopic rods are installed on the two L-shaped plates, and frameworks are installed on telescopic shafts of the two telescopic rods, two side brush is all installed to the inboard of skeleton the top of hollow shaft and two install the sucking disc between the skeleton two first corner cylinder, two are installed to the oblique diagonal symmetry in upper end of casing the spray lance is installed, two at the top of first corner cylinder the lower extreme of spray lance all is provided with the shower nozzle, the spray lance is kept away from the honeycomb duct is installed to the one end of shower nozzle, the rear of sucking disc just is in second corner cylinder is installed to the inboard of casing, the lower brush is installed down to the lower extreme of second corner cylinder bull stick, third corner cylinder is installed in the place ahead of sucking disc, the brush is installed at the top of third corner cylinder, the useless pipe joint is installed to the inboard one corner of casing, the useless pipe of arranging is installed to the lower extreme that useless pipe connects.
Preferably: the first gear is in key connection with the motor, and the hollow shaft is in key connection with the second gear.
So set up, through the key-type connection has guaranteed the accuracy of the motion transmission between the two of connection.
Preferably: the rotary joint is connected with the hollow shaft through threads, and the L-shaped plate is fixedly connected with the shell through bolts.
So set up, rotary joint is used for connecting outside evacuation equipment, the L template is used for fixing the telescopic link.
Preferably: the telescopic rod with the L template passes through bolt fastening connection, the skeleton with the telescopic shaft of telescopic rod passes through screw fastening connection.
So set up, the skeleton is used for fixed mounting the side brush.
Preferably: the side brush is connected with the framework in a fastening mode through screws, and the spray rod is connected with the rotating telescopic shaft of the first corner cylinder in a fastening mode through screws.
So set up, through quick assembly disassembly between the two of screw fastening connection be convenient for connect.
Preferably: the first corner cylinder is fixedly connected with the shell through a bolt.
So set up, be convenient for through bolt-up connection to the fixed of first corner cylinder.
Preferably: the honeycomb duct with the spray lance passes through threaded connection, the second corner cylinder with the casing passes through screw fastening connection.
So set up, the honeycomb duct is used for connecting spray lance and outside washing liquid device.
Preferably: the spray head and the spray rod are integrally formed, and the lower hairbrush is fixedly connected with the rotating rod of the second corner cylinder through a screw.
So set up, integrated into one piece is convenient for process manufacturing, and it is convenient for right through screw fastening connection the fixed mounting of lower brush.
Preferably: and the third corner cylinder is fixedly connected with the shell through a screw.
So set up, guaranteed certain joint strength between the two of interconnect.
Preferably: the upper hairbrush is fixedly connected with a rotating rod of the third corner cylinder through a screw, the waste pipe joint is connected with the shell in an adhesive mode, and the waste discharge pipe is connected with the waste pipe joint through threads.
So set up, go up the brush and be used for clearing up the lower limb of wafer, the waste discharge pipe is used for discharging the inside waste water of casing.
Compared with the prior art, the invention has the following beneficial effects:
connecting a rotary joint to external vacuum equipment, connecting a flow guide pipe to external cleaning liquid conveying equipment, placing a wafer to be cleaned on a sucker, vacuumizing the inside of the sucker through the vacuum equipment to realize fixed clamping of the wafer, starting a motor, driving a first toothed wheel to rotate by the operation of the motor, driving a second toothed wheel to rotate through the transmission of a toothed belt, mounting the second toothed wheel on a hollow shaft, further enabling the wafer on the sucker to rotate, simultaneously rotating two first corner cylinders to one side of the wafer, spraying cleaning liquid to the surface of the wafer by using a spray head, extending two telescopic rods to drive a side hairbrush to move until the two side hairbrushes contact the edge of the wafer, then rotating the second corner cylinder and a third corner cylinder to the inner side, cleaning the upper edge of the wafer by using a lower hairbrush, cleaning the lower edge of the wafer by using an upper hairbrush, and discharging generated waste water through a waste discharge pipe, the device overall structure is simple, and operation convenient to use is reliable, utilizes brush, lower brush and side brush to wash the edge of wafer, and abluent effectual, intelligent degree is high, has stronger using value widely.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic diagram of a first embodiment of a physical cleaning apparatus for wafer edges according to the present invention;
FIG. 2 is a schematic diagram of a second structure of a physical cleaning apparatus for wafer edge according to the present invention;
FIG. 3 is a front view of a physical cleaning apparatus for wafer edges according to the present invention;
FIG. 4 is a top view of a physical cleaning apparatus for wafer edges according to the present invention;
FIG. 5 is a cross-sectional view B-B of FIG. 4;
FIG. 6 is a schematic view of a side brush of a physical cleaning apparatus for wafer edges according to the present invention;
FIG. 7 is an enlarged partial view at A of FIG. 6;
FIG. 8 is a schematic view of a second gear assembly of the physical cleaning apparatus for wafer edge according to the present invention.
The reference numerals are explained below:
1. a motor; 2. a first gear type wheel; 3. a toothed belt; 4. a telescopic rod; 5. an L-shaped plate; 6. a housing; 7. a first corner cylinder; 8. a flow guide pipe; 9. a spray rod; 10. a second corner cylinder; 11. a lower brush; 12. a framework; 13. a side brush; 14. a third corner cylinder; 15. a brush is arranged; 16. a rotating joint; 17. a spray head; 18. a second gear type; 19. a waste pipe joint; 20. a waste discharge pipe; 21. a first fixed seat; 22. a second fixed seat; 23. a hollow shaft; 24. and (4) sucking discs.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The invention will be further described with reference to the accompanying drawings in which:
as shown in fig. 1-8, a physical cleaning device for wafer edge comprises a motor 1, a first gear wheel 2, a toothed belt 3, an expansion link 4, and L-shaped plates 5, wherein the first gear wheel 2 is installed on an output shaft of the motor 1, a second gear wheel 18 is installed on one side of the first gear wheel 2, the second gear wheel 18 is connected with the first gear wheel 2 through the toothed belt 3, the second gear wheel 18 is installed on a hollow shaft 23, a rotary joint 16 is installed at the lower end of the hollow shaft 23, a second fixing seat 22 is installed above the second gear wheel 18 and connected to the hollow shaft 23, a first fixing seat 21 is installed above the second fixing seat 22, a housing 6 is installed between the second fixing seat 22 and the first fixing seat 21, two L-shaped plates 5 are symmetrically installed on two sides of the housing 6, the expansion links 4 are installed on the two L-shaped plates 5, and frameworks 12 are installed on the expansion links 4, side brushes 13 are installed on the inner sides of the two frameworks 12, a suction cup 24 is installed on the top end of a hollow shaft 23 and between the two frameworks 12, two first corner cylinders 7 are installed on the upper end of a shell 6 in an oblique diagonal symmetry mode, spray rods 9 are installed at the tops of the two first corner cylinders 7, spray heads 17 are arranged at the lower ends of the two spray rods 9, a guide pipe 8 is installed at one end, far away from the spray heads 17, of each spray rod 9, a second corner cylinder 10 is installed behind the suction cup 24 and on the inner side of the shell 6, a lower brush 11 is installed at the lower end of a rotating rod of the second corner cylinder 10, a third corner cylinder 14 is installed in front of the suction cup 24, an upper brush 15 is installed at the top of the third corner cylinder 14, a waste pipe joint 19 is installed on the inner side of the shell 6, and a waste discharge pipe 20 is installed at the lower end of the waste pipe joint 19.
Preferably: the first gear wheel 2 is in key connection with the motor 1, the hollow shaft 23 is in key connection with the second gear wheel 18, and the accuracy of motion transmission between the first gear wheel and the second gear wheel is ensured through key connection; the rotary joint 16 is connected with the hollow shaft 23 through threads, the L-shaped plate 5 is fixedly connected with the shell 6 through bolts, the rotary joint 16 is used for connecting external vacuum-pumping equipment, and the L-shaped plate 5 is used for fixing the telescopic rod 4; the telescopic rod 4 is fixedly connected with the L-shaped plate 5 through a bolt, the framework 12 is fixedly connected with a telescopic shaft of the telescopic rod 4 through a screw, and the framework 12 is used for fixedly mounting the side brush 13; the side brush 13 is fastened and connected with the framework 12 through a screw, the spray rod 9 is fastened and connected with a rotary telescopic shaft of the first corner cylinder 7 through a screw, and the spray rod and the rotary telescopic shaft are connected through the screw in a fastening manner, so that the spray rod and the rotary telescopic shaft can be quickly disassembled and assembled; the first corner cylinder 7 is fixedly connected with the shell 6 through bolts, and the first corner cylinder 7 is fixed conveniently through the bolt fastening connection; the guide pipe 8 is connected with the spray rod 9 through threads, the second corner cylinder 10 is fixedly connected with the shell 6 through screws, and the guide pipe 8 is used for connecting the spray rod 9 with an external cleaning liquid device; the spray head 17 and the spray rod 9 are integrally formed, the lower hairbrush 11 is fixedly connected with the rotating rod of the second corner cylinder 10 through screws, the integral forming is convenient for processing and manufacturing, and the fixed installation of the lower hairbrush 11 is convenient through the screw fastening connection; the third corner cylinder 14 is fixedly connected with the shell 6 through screws, so that certain connecting strength between the two connected parts is ensured; go up brush 15 and the bull stick of third corner cylinder 14 and pass through screw fastening connection, waste pipe connects 19 and casing 6 adhesive bonding, arranges waste pipe 20 and waste pipe connects 19 and passes through threaded connection, goes up brush 15 and is used for clearing up the lower limb of wafer, arranges waste pipe 20 and is used for discharging the inside waste water of casing 6.
The working principle and the using method of the invention are as follows: when the cleaning device is used, the rotary joint 16 is connected to external vacuum equipment, the flow guide pipe 8 is connected to external cleaning liquid conveying equipment, a wafer to be cleaned is placed on the suction cup 24, the inside of the suction cup 24 is vacuumized through the vacuum equipment, the wafer is fixedly clamped, the motor 1 is started, the motor 1 runs to drive the first gear wheel 2 to rotate, the second gear wheel 18 is driven to rotate through the transmission of the toothed belt 3, the second gear wheel 18 is installed on the hollow shaft 23, the wafer on the suction cup 24 is further driven to rotate, meanwhile, the two first corner cylinders 7 rotate towards one side of the wafer, the cleaning liquid is sprayed to the surface of the wafer through the spray head 17, the two telescopic rods 4 extend to drive the side brushes 13 to move until the two side brushes 13 contact the edge of the wafer, then the second corner cylinder 10 and the third corner cylinder 14 rotate inwards, and the lower brush 11 cleans the upper edge of the wafer, the upper brush 15 cleans the lower edge of the wafer, and the resultant waste water is discharged through the waste discharge pipe 20.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.

Claims (10)

1. A physical cleaning device for wafer edges is characterized in that: comprises a motor (1), a first toothed wheel (2), a toothed belt (3), a telescopic rod (4) and an L-shaped plate (5), wherein the first toothed wheel (2) is installed on an output shaft of the motor (1), a second toothed wheel (18) is installed on one side of the first toothed wheel (2), the second toothed wheel (18) is connected with the first toothed wheel (2) through the toothed belt (3), the second toothed wheel (18) is installed on a hollow shaft (23), a rotating joint (16) is installed at the lower end of the hollow shaft (23), a second fixing seat (22) is arranged above the second toothed wheel (18) and connected to the hollow shaft (23), a first fixing seat (21) is installed above the second fixing seat (22), and a shell (6) is arranged between the second fixing seat (22) and the first fixing seat (21), the two L-shaped plates (5) are symmetrically arranged on two sides of the shell (6), the telescopic rods (4) are arranged on the two L-shaped plates (5), the frameworks (12) are arranged on telescopic shafts of the two telescopic rods (4), the side brushes (13) are arranged on the inner sides of the two frameworks (12), suckers (24) are arranged on the top end of the hollow shaft (23) and between the two frameworks (12), two first corner cylinders (7) are symmetrically arranged on oblique diagonal angles of the upper end of the shell (6), spray rods (9) are arranged at the tops of the two first corner cylinders (7), spray nozzles (17) are arranged at the lower ends of the two spray rods (9), a guide pipe (8) is arranged at one end, far away from the spray nozzles (17), of the suction pipes (24), and second corner cylinders (10) are arranged on the inner sides of the shell (6), lower brush (11) are installed to the lower extreme of second corner cylinder (10) bull stick, third corner cylinder (14) are installed in the place ahead of sucking disc (24), brush (15) are installed at the top of third corner cylinder (14), waste pipe joint (19) are installed to the inboard one corner of casing (6), waste pipe (20) are installed to the lower extreme of waste pipe joint (19).
2. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the first gear (2) is in key connection with the motor (1), and the hollow shaft (23) is in key connection with the second gear (18).
3. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the rotary joint (16) is connected with the hollow shaft (23) through threads, and the L-shaped plate (5) is fixedly connected with the shell (6) through bolts.
4. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the telescopic rod (4) is fixedly connected with the L-shaped plate (5) through bolts, and the framework (12) is fixedly connected with a telescopic shaft of the telescopic rod (4) through screws.
5. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the side brush (13) is connected with the framework (12) in a fastening mode through screws, and the spray rod (9) is connected with a rotary telescopic shaft of the first corner cylinder (7) in a fastening mode through screws.
6. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the first corner cylinder (7) is fixedly connected with the shell (6) through a bolt.
7. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the flow guide pipe (8) is in threaded connection with the spray rod (9), and the second corner cylinder (10) is in fastening connection with the shell (6) through screws.
8. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the spray head (17) and the spray rod (9) are integrally formed, and the lower hairbrush (11) and a rotating rod of the second corner cylinder (10) are fixedly connected through screws.
9. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: the third corner cylinder (14) is fixedly connected with the shell (6) through screws.
10. A physical wafer edge cleaning apparatus as claimed in claim 1, wherein: go up brush (15) with the bull stick of third corner cylinder (14) passes through screw fastening connection, waste pipe connects (19) with casing (6) bonding connection, arrange waste pipe (20) with waste pipe connects (19) through threaded connection.
CN202111039694.6A 2021-09-06 2021-09-06 Physical cleaning device for wafer edge Withdrawn CN113953239A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111039694.6A CN113953239A (en) 2021-09-06 2021-09-06 Physical cleaning device for wafer edge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111039694.6A CN113953239A (en) 2021-09-06 2021-09-06 Physical cleaning device for wafer edge

Publications (1)

Publication Number Publication Date
CN113953239A true CN113953239A (en) 2022-01-21

Family

ID=79461140

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111039694.6A Withdrawn CN113953239A (en) 2021-09-06 2021-09-06 Physical cleaning device for wafer edge

Country Status (1)

Country Link
CN (1) CN113953239A (en)

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Application publication date: 20220121

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