CN113944804A - Liquid metal door, method for producing and driving the same, and substance release cartridge using the same - Google Patents
Liquid metal door, method for producing and driving the same, and substance release cartridge using the same Download PDFInfo
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- CN113944804A CN113944804A CN202111006204.2A CN202111006204A CN113944804A CN 113944804 A CN113944804 A CN 113944804A CN 202111006204 A CN202111006204 A CN 202111006204A CN 113944804 A CN113944804 A CN 113944804A
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- liquid metal
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 148
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000000126 substance Substances 0.000 title description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims abstract description 31
- 230000007547 defect Effects 0.000 claims abstract description 23
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000004891 communication Methods 0.000 claims abstract description 3
- 230000000903 blocking effect Effects 0.000 claims abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical group Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 230000007480 spreading Effects 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 7
- 239000000243 solution Substances 0.000 description 17
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 7
- 229910052733 gallium Inorganic materials 0.000 description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 229920000747 poly(lactic acid) Polymers 0.000 description 4
- 239000004626 polylactic acid Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000002791 soaking Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 230000009347 mechanical transmission Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000008055 phosphate buffer solution Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 210000000683 abdominal cavity Anatomy 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
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- 210000001124 body fluid Anatomy 0.000 description 1
- 239000010839 body fluid Substances 0.000 description 1
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- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
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- 239000002504 physiological saline solution Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
- F16K99/0017—Capillary or surface tension valves, e.g. using electro-wetting or electro-capillarity effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
- F16K99/0028—Valves having multiple inlets or outlets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K99/0001—Microvalves
- F16K99/0034—Operating means specially adapted for microvalves
- F16K99/0042—Electric operating means therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0073—Fabrication methods specifically adapted for microvalves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0082—Microvalves adapted for a particular use
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K99/00—Subject matter not provided for in other groups of this subclass
- F16K2099/0082—Microvalves adapted for a particular use
- F16K2099/0086—Medical applications
Abstract
The invention relates to a liquid metal door, a preparation method and a driving method thereof, and a material release bin adopting the liquid metal door, wherein the liquid metal door comprises a metal ring, a layer of intermetallic compound is formed on the inner ring surface of the metal ring, the intermetallic compound is formed by infiltrating the metal ring and liquid metal, a certain volume of liquid metal is contained in the inner ring hole of the metal ring, the liquid metal forms a liquid film for blocking the communication of the two sides of the liquid metal in the inner ring hole, the inner ring surface of the metal ring is also provided with a liquid film mechanical defect site which is a blank scarce area of the intermetallic compound, the liquid metal door also comprises a bearing layer and a sealing layer, the bearing layer and the sealing layer are both provided with openings and are respectively arranged at the two ends of the metal ring to limit the liquid metal between the bearing layer and the liquid metal, the liquid metal is supported on the bearing layer, and the distance between the sealing layer and the bearing layer is larger than the thickness of the liquid film. The liquid metal door has simple working environment and driving mode and wide application space.
Description
Technical Field
The invention relates to the field of application of liquid metal, in particular to a liquid metal door, a preparation method and a driving method thereof, and also relates to a substance release bin adopting the liquid metal door.
Background
"Gate" is a broad concept ranging from macroscopic "gates" to micro/nano-pores or channels, which vary in form. The basic function of the door is to control the entrance and exit of substances according to needs, and the door is widely applied to the fields of buildings, circuits, biological organs, cells and the like. The control strategy and corresponding structure of these gates may vary according to their size.
For a macroscopic gate, large complex systems such as pneumatics, electrics, machines and the like can be adopted to actively control the gate. For micro-to nano-scale lock tubes, such as nanopores or channels, it is common to seal with a liquid. The operating environment and the manner of actuation of the liquid gate determine its application.
The gallium-based liquid metal is used as a flexible intelligent material, has the characteristics of high heat conduction and electric conduction of metal and the fluidity of fluid, and has abundant application in the fields of heat management, 3D printing, flexible electronics, catalysts, cancer treatment and the like. The adjustable surface tension of the gallium-based liquid metal enables the gallium-based liquid metal to have large deformation and movement capabilities, and the invention aims to utilize the surface tension characteristic of the gallium-based liquid metal to research and develop the application of the gallium-based liquid metal in more fields.
Disclosure of Invention
The invention aims to provide a liquid metal door, a preparation method and a driving method thereof, and a substance release bin adopting the liquid metal door.
The liquid metal door of the invention is realized by the following scheme: a liquid metal gate includes a metal ring, an inner annular surface of the metal ring is formed with a layer of intermetallic compound, the intermetallic compound is formed by infiltrating a metal ring and the liquid metal, a certain volume of the liquid metal is contained in an inner ring hole of the metal ring, the liquid metal forms a layer of liquid film which blocks the communication of the two sides of the liquid metal in the inner ring hole, the inner ring surface of the metal ring is also provided with liquid film mechanical defect sites, the site is an empty intermetallic compound scarce area, if the intermetallic compound layer at the area of the site is covered, the liquid metal door also comprises a bearing layer and a sealing layer which are provided with openings, the liquid metal is supported on the supporting layer, and the distance between the sealing layer and the supporting layer is larger than the thickness of the liquid film.
In the invention, the bearing layer and the sealing layer are named according to the functions of the bearing layer and the sealing layer, namely the bearing layer for bearing the liquid metal and the sealing layer which is the other layer opposite to the bearing layer. The distance between the bearing layer and the sealing layer is larger than the thickness of the liquid film, and the bearing layer and the sealing layer are used for leaving space for deformation of the liquid film.
After the liquid metal door is driven, a liquid film has holes from the mechanical defect sites, and the liquid metal door is opened, so that the bearing layer and the sealing layer both meet the following characteristics: firstly, supporting the liquid metal to avoid dripping; and secondly, after the liquid metal door is opened, the two sides of the door are not prevented from being communicated through the hole in the liquid film.
The thickness of the liquid film is generally required to be more than 1mm, the larger the thickness of the liquid film is, the smaller the hole is when the liquid film is opened, and the hole on the bearing layer and the sealing layer is generally required to have the hole diameter of less than 1mm so as to prevent the liquid metal from leaking.
The metal ring can be a copper ring, a silver ring, a gold ring and the like, and can also be a ring prepared by adopting other materials such as polyurethane, Teflon, polylactic acid and the like through metal sputtering or metal deposition, the shape of the ring can also be various, and for example, except a common circular ring, a triangular ring, a square ring and the like can also be adopted. The inner diameter of the ring is preferably between 5mm and 5cm, preferably between 9 and 25 mm.
The mechanical defect sites can be generally manufactured into 1-3 mechanical defect sites according to the requirement, a plurality of mechanical defect sites are used for realizing multi-channel control, the length of each mechanical defect site is recommended to be 5-9mm, and the proportion of the total length of the mechanical defect sites in the metal ring is recommended to be 5% -50%.
The driving method of the liquid metal door comprises the following steps:
and placing the liquid metal door in a conductive liquid environment, then switching on a power supply, connecting the positive electrode of the power supply with the solution, connecting the negative electrode of the power supply with the liquid metal door, and controlling the opening and closing of the liquid metal door by controlling the on-off of the power supply.
The included angle between the liquid metal door and the horizontal direction is within the range of +/-20 degrees.
The supply voltage is preferably between 2-5V.
The conducting solution preferably has a pH of between 2 and 12.
Under the action of an external voltage, the liquid metal is reduced, and the liquid film generates large deformation to generate holes at the positions of the defect sites, so that the liquid metal door is opened. The shape of the metal ring and the liquid metal is restrained by the wetting force between the metal ring and the liquid metal in the deformation process of the liquid metal, so that the state of the liquid metal door can be controlled when the liquid metal door is opened. After the external voltage is removed, the liquid metal is oxidized, the surface tension is reduced, and the liquid metal door is naturally closed under the action of mechanical force.
The preparation method of the liquid metal door comprises the following steps:
s1, putting the polished metal ring into an environment for promoting the metal ring to be infiltrated with liquid metal, adding the liquid metal to infiltrate the metal ring with the liquid metal, and generating a layer of intermetallic compound on the surface of the metal ring;
s2, taking out the wetted metal ring, removing the liquid metal adhered to the surface, coating at least one section of coating for covering the intermetallic compound on the inner annular surface of the metal ring, and standing for airing;
s3, arranging a bearing layer at the lower end of the copper ring, then adding a certain volume of liquid metal into the copper ring, spreading the liquid metal on the bearing layer, and arranging a sealing layer.
In step S1, the environment may be a hydrochloric acid solution with a concentration of 0.01-1mol/L, or a sodium hydroxide solution with a concentration of 0.01-1mol/L, or other conductive solutions capable of removing the oxide layer of the metal ring and the liquid metal after applying a voltage, and the voltage range is preferably 2V-5V.
In step S1, the soaking time is 5-30 min.
In step S2, the coating may be a paint layer or a curable glue layer, and the coating region is the mechanical defect site on the inner ring surface of the metal ring.
The realization scheme of the substance release bin adopting the liquid metal door is as follows: the device comprises an insulating cylinder body, wherein the liquid metal door is positioned and sealed at a cylinder opening end opposite to the cylinder bottom of the cylinder body, and a closed material bin is formed between the cylinder bottom and the liquid metal door.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
1) the liquid metal door disclosed by the invention can work in a solution environment, can be driven to open by low voltage electricity and closed by mechanical force, does not need a complex mechanical transmission structure, does not need a precise pneumatic or electric module, is simple and safe in driving method, high in response speed, low in cost, simple in structure, simple in preparation process, convenient to control, large in control substance flow and the like, has potential application value in the field of substance control and release, and can be used in the fields of drug release, reaction control and the like.
2) The driving method can realize the opening and closing control of the liquid metal door in a liquid environment, has a very simple driving mode, can drive the opening and closing of the liquid metal door through 2-5V voltage, and has high safety.
Drawings
FIG. 1 is a schematic view of a liquid metal door (the support layer and the sealing layer of the liquid metal door are omitted and the liquid metal door is shown in an open state);
FIG. 2 is a schematic view of the external structure of the material release cartridge;
FIG. 3 is a cross-sectional view of a substance release cartridge;
fig. 4 is a diagram showing the opened state of the liquid metal door under the two-pass control (the supporting layer and the sealing layer of the liquid metal door are omitted here).
Detailed Description
The present invention will be described in further detail with reference to specific examples.
The embodiment provides a liquid metal door and a preparation method thereof, wherein the preparation method of the liquid metal door comprises the following steps:
s1, selecting a circular copper ring with the outer diameter of 10mm, the height of 5mm and the inner diameter of 9mm, polishing the surface of the circular copper ring by using abrasive paper, then putting the circular copper ring into a hydrochloric acid solution, wherein the concentration of the solution is 0.01mol/L, adding excessive liquid metal to enable the copper ring and the liquid metal to be infiltrated, and generating a layer of intermetallic compound on the surface of the copper ring; the reaction time was 5 minutes;
s2, taking out the wetted copper ring, removing the liquid metal adhered to the surface, and coating a layer of white paint on the set position of the inner ring surface of the copper ring by using a painting tool to cover the intermetallic compound, wherein the position is the set mechanical defect site; then, standing for waiting for the white paint to be dried; the size of the smearing part is 5mm by 5mm, and 1 part is total;
s3, disposing a supporting layer at the lower end of the copper ring, adding 100uL of liquid metal into the inner ring hole of the copper ring, spreading and flattening the liquid metal on the supporting layer, disposing a sealing layer at the upper end of the copper ring, and leaving a gap between the sealing layer and the liquid film therebelow, so as to form the liquid metal door, as shown in fig. 1 (the supporting layer and the sealing layer of the liquid metal door are omitted, and the liquid metal door is shown in an opened state). 1 is a copper ring, 2 is a formed intermetallic compound layer, 3 is a liquid film formed by liquid metal, 4 is a formed liquid film mechanical defect site, and 5 is a hole formed at the defect site by the liquid film when the liquid metal door is opened.
The liquid metal door can be continuously manufactured into a substance release bin, and the specific method comprises the following steps:
s4, the liquid metal door prepared in the step S3 is placed in a cylinder body and positioned and sealed at the end, opposite to the bottom of the cylinder body, of a cylinder opening, and a closed space is formed between the bottom of the cylinder body and the liquid metal door. The space forms a material compartment in which the material to be controlled is stored.
The substance release bin manufactured by the method is shown in figures 2 and 3, the height of the barrel body of the release bin is 10mm, the inner diameter of the barrel body is 10mm, the outer diameter of the barrel body is 11mm, and the height of the substance bin manufactured by polylactic acid materials is 4 mm. The 6 is a cylinder body of the material releasing bin, and the 61 is a cylinder bottom of the cylinder body 6, which forms a detachable structure with the cylinder wall of the cylinder body 6, such as being buckled on the cylinder wall of the cylinder body 6. And 7 is a gasket for positioning the bearing layer 8. And 9 is a sealing layer which is connected with the cylinder 6 through threads. The copper ring 1 and the cylinder 6 are in close fit.
The driving method of the liquid metal door and the substance release bin comprises the following steps:
and (3) putting the metal liquid door or the substance release bin into 0.01mol/L NaCl solution, introducing 2V voltage to open the liquid metal door, connecting the liquid metal door with a negative electrode, and connecting the solution with a positive electrode. For general applicability, the angle of the liquid metal door is recommended to be within plus or minus 20 degrees from the horizontal. Of course, the smaller the inner diameter of the metal ring, the greater the angle at which the liquid metal gate may deviate from horizontal, as would be appreciated by those skilled in the art.
The liquid metal used in the above embodiment is a gallium indium alloy, and may also be a gallium indium tin alloy, a gallium tin liquid alloy, or the like.
The copper ring in the above embodiment may be replaced by a silver ring, a gold ring, a platinum ring, or the like, or may be a ring prepared from other materials such as polyurethane, teflon, polylactic acid, or the like through metal sputtering or metal deposition, and the shape of the ring may also be various, such as a triangular ring, a square ring, an elliptical ring, or the like.
The concentration of the hydrochloric acid solution in step S1 is not limited to 0.01mol/L, and can be selected from the range of 0.01-1mol/L, or can be selected from sodium hydroxide solution with the concentration of 0.01-1mol/L, or can be selected from other conductive solutions with applied voltage. The step aims to process the copper ring, remove the oxide layers of the copper and the liquid metal, and accelerate the infiltration speed of the copper and the liquid metal, thereby quickly forming an infiltration layer. The range of the applied voltage is preferably 2-5V.
In step S1, the soaking time can be prolonged appropriately, and generally speaking, the soaking time is 5-30 min.
In step S2, a curable glue may be used to prepare mechanical defect sites, or an intermetallic compound blank region may be formed during infiltration. The number of the defect sites is not limited to one, and can be generally 1-3 according to the needs, and when the number of the defect sites is more than one, multi-channel control can be realized. The open state of the liquid metal door in the multi-pass control is shown in fig. 4 (the supporting layer and the sealing layer of the liquid metal door are omitted here). The height of the liquid film defect site is recommended to be as high as that of the metal ring, and the length is recommended to be 5-9mm, of course, the total length of all the defects is recommended to be 5% -50% according to the inner ring hole of the metal ring.
In step S3, the liquid metal is a supporting layer, or vice versa, i.e. a sealing layer, generally speaking, the upper layer is a sealing layer, and the lower layer is a supporting layer. All be equipped with the trompil on bearing layer and the layer of sealing, the trompil size can not be too big on it, will guarantee to bear liquid metal, avoids its water clock to open the back at liquid metal door, do not hinder the door both sides through the hole intercommunication on the liquid film. Generally, the aperture of the opening in the support layer and the sealing layer is 1mm or less. The distance between the bearing layer and the sealing layer is larger than the thickness of the liquid film, and the bearing layer and the sealing layer are used for leaving space for deformation of the liquid film.
In step S3, the volume of the added liquid metal is controlled according to the diameter of the copper ring, and for the metal ring with a pore diameter of 9-25mm, the volume of the added liquid metal is between 100uL and 1600uL, generally speaking, the larger the pore diameter is, the more liquid metal should be added, and the adding amount should ensure that the thickness of the formed liquid film is more than 1 mm.
The cylinder in step S4 may be made of flexible material such as PDMS or Ecoflex, in addition to thermoplastic processing of polymer material such as polylactic acid.
In the above driving method, the concentration of the NaCl solution may be selected from the range of 0.01mol/L to 1mol/L, and of course, other conductive solutions such as phosphate buffer solution may be selected. The pH value of the solution is selected in a wide range and can be selected from a range of 2 to 12. The voltage is preferably between 2 and 5V.
In the liquid metal door or the material release bin in this embodiment, the opening and closing of the liquid metal door or the material release bin are controlled by adjusting the thickness of the oxide layer on the surface of the liquid metal and regulating the surface tension of the liquid metal through the applied voltage by utilizing the wettability between the liquid metal and the metal ring and the characteristic that the surface tension of the liquid metal can be changed along with the surface oxide layer. When voltage is applied, the liquid metal is reduced, and the liquid film generates large deformation to generate holes at the defect sites, so that the liquid metal door is opened. The shape of the metal ring and the liquid metal is restrained by the wetting force between the metal ring and the liquid metal in the deformation process of the liquid metal, so that the state of the liquid metal door can be controlled when the liquid metal door is opened. After the external voltage is removed, the liquid metal is oxidized, the surface tension is reduced, and the liquid metal door is naturally closed under the action of mechanical force.
The liquid metal door or the material release bin of the embodiment has a simple structure, easily-achieved control conditions, no complex mechanical transmission structure and no need of a precise pneumatic or electric module, and is wide in application range in the field of controlling material release, particularly in the aspect of controlling material release in solution.
It can be seen from the above embodiments that the liquid metal door or the substance release chamber of the present embodiment can be normally driven in the environment close to the environment of human body fluid, such as physiological saline and phosphate buffer solution, and through proper selection of the metal ring, the liquid metal and the cylinder body, the liquid metal door or the substance release chamber can be placed in the abdominal cavity or implanted in the muscle tissue, thereby exerting the potential value in the aspect of drug release control.
It should be noted that the above examples are only for clearly illustrating the present invention and should not be construed as limiting the embodiments of the present invention. Many other variations and modifications of the invention, based on the above description, will suggest themselves to those skilled in the art, and it is not necessary or necessary to exhaustively enumerate all embodiments, but obvious variations and modifications therefrom will fall within the scope of the invention.
Claims (10)
1. The liquid metal door is characterized by comprising a metal ring, wherein a layer of intermetallic compound is formed on the inner annular surface of the metal ring, the intermetallic compound is formed by infiltrating the metal ring and the liquid metal, a certain volume of the liquid metal is contained in the inner annular hole of the metal ring, the liquid metal forms a liquid film for blocking the communication of the two sides of the liquid metal in the inner annular hole, the inner annular surface of the metal ring is also provided with a liquid film mechanical defect site which is a blank scarce area of the intermetallic compound, the liquid metal door further comprises a bearing layer and a sealing layer, both the bearing layer and the sealing layer are provided with openings and are respectively arranged at the two ends of the metal ring, the liquid metal is limited between the bearing layer and the sealing layer, and the distance between the sealing layer and the bearing layer is larger than the thickness of the liquid film.
2. A liquid metal door according to claim 1, characterized in that the inner diameter of the metal ring is between 5mm and 5 cm.
3. A liquid metal door according to claim 2, characterized in that the inner diameter of the metal ring is between 9-25 mm.
4. The liquid metal door of claim 3, wherein the mechanical defect sites are fabricated in an amount of 1-3 as needed, each mechanical defect site has a length of 5-9mm, and the total length of the mechanical defect sites is 5% -50% of the total length of the annular ring.
5. A method for driving a liquid metal door as claimed in any one of claims 1 to 4, wherein the liquid metal door is placed in an environment of conductive liquid, then a power supply is connected, the positive electrode of the power supply is connected with the liquid metal door, the negative electrode of the power supply is connected with the liquid metal door, and the opening and closing of the liquid metal door are controlled by controlling the on-off of the power supply.
6. The driving method as claimed in claim 5, wherein the liquid metal gate is included within ± 20 ° from the horizontal.
7. The driving method according to claim 6, wherein the power supply voltage is between 2-5V.
8. A method of manufacturing a liquid metal door as claimed in any one of claims 1 to 4,
s1, putting the polished metal ring into an environment for promoting the metal ring to be infiltrated with liquid metal, adding the liquid metal to infiltrate the metal ring with the liquid metal, and generating a layer of intermetallic compound on the surface of the metal ring;
s2, taking out the wetted metal ring, removing the liquid metal adhered to the surface, coating at least one section of coating for covering the intermetallic compound on the inner annular surface of the metal ring, and standing for airing;
s3, arranging a bearing layer at the lower end of the copper ring, then adding a certain volume of liquid metal into the copper ring, spreading the liquid metal on the bearing layer, and arranging a sealing layer.
9. The method as claimed in claim 8, wherein the environment is hydrochloric acid solution with a concentration of 0.01-1mol/L, or sodium hydroxide solution with a concentration of 0.01-1mol/L, or other conductive solution capable of removing the metal ring and the oxide layer of the liquid metal after applying voltage, and the applied voltage is in a range of 2V-5V in step S1.
10. A material release cartridge employing a liquid metal gate as claimed in any one of claims 1 to 4, comprising an insulating cylinder, said liquid metal gate being positioned at and blocking the mouth end of said cylinder opposite the bottom of said cylinder, a closed material cartridge being formed between said bottom and said liquid metal gate.
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