CN113934278A - Temperature control system of immersed liquid cooling heat dissipation device - Google Patents

Temperature control system of immersed liquid cooling heat dissipation device Download PDF

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Publication number
CN113934278A
CN113934278A CN202110785601.8A CN202110785601A CN113934278A CN 113934278 A CN113934278 A CN 113934278A CN 202110785601 A CN202110785601 A CN 202110785601A CN 113934278 A CN113934278 A CN 113934278A
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CN
China
Prior art keywords
oil
tank
temperature
cooling
circulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110785601.8A
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Chinese (zh)
Inventor
朱欢来
张楠赓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canaan Creative Co Ltd
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Canaan Creative Co Ltd
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Filing date
Publication date
Application filed by Canaan Creative Co Ltd filed Critical Canaan Creative Co Ltd
Publication of CN113934278A publication Critical patent/CN113934278A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/3058Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/203Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures by immersion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid

Abstract

The invention discloses a temperature control system of an immersed liquid cooling heat dissipation device, wherein the immersed liquid cooling heat dissipation device comprises a liquid cooling tank, an oil path circulating cooling assembly and a water path circulating cooling assembly, a computing device to be dissipated is arranged in the liquid cooling tank, the oil path circulating cooling assembly is connected with the liquid cooling tank, the water path circulating cooling assembly exchanges heat with the oil path circulating cooling assembly, the oil path circulating cooling assembly comprises a circulating oil pump, the water path circulating cooling assembly comprises a circulating water pump, the temperature control system comprises a PID temperature controller and a control module connected with the PID temperature controller, and the control module is connected with the circulating oil pump and the circulating water pump. The invention adopts the PID temperature controller to effectively control the temperature of each computing device to be radiated, the temperature of the chip to be radiated can not fluctuate along with the change of the external environment temperature, and the temperature consistency of different chips can be ensured. And when the circulating water pump is increased to the highest working frequency and still cannot meet the requirement of stabilizing the oil temperature, the control module sequentially starts the fans to control the oil temperature.

Description

Temperature control system of immersed liquid cooling heat dissipation device
Technical Field
The invention relates to the technical field of servers, in particular to a temperature control system of an immersed liquid cooling heat dissipation device.
Background
The existing block chain server usually adopts forced air cooling, but the air cooling gradually fails to meet the heat dissipation requirement along with the increase of the heat dissipation density. At this time, the immersed single-phase liquid cooling becomes one of the future options. Therefore, how to control the temperature of the oil cooling server cluster becomes a core problem to be solved urgently for the immersed oil cooling cluster.
Disclosure of Invention
The invention aims to provide a temperature control system of an immersed liquid cooling heat dissipation device, which can effectively control the temperature of each computing device to be dissipated of the immersed liquid cooling heat dissipation device.
In order to achieve the above purpose, in the temperature control system of the immersion type liquid cooling heat dissipation device, the immersion type liquid cooling heat dissipation device includes a liquid cooling tank, an oil path circulating cooling assembly and a water path circulating cooling assembly, a computing device to be cooled is arranged in the liquid cooling tank, the oil path circulating cooling assembly is connected with the liquid cooling tank, the water path circulating cooling assembly exchanges heat with the oil path circulating cooling assembly, the oil path circulating cooling assembly includes a circulating oil pump, the water path circulating cooling assembly includes a circulating water pump, the temperature control system includes a PID temperature controller and a control module connected with the PID temperature controller, and the control module is connected with the circulating oil pump and the circulating water pump.
In an embodiment of the above temperature control system of the immersed liquid cooling heat dissipation device, the water path circulating cooling assembly further includes a cooling tower, the cooling tower includes a spray pump, and the control module is connected to the spray pump.
In an embodiment of the above temperature control system of the immersion type liquid cooling heat dissipation device, the cooling tower includes a fan, and the control module is connected to the fan.
In an embodiment of the temperature control system of the above immersion type liquid cooling heat dissipation device, the oil path circulating cooling assembly and the water path circulating cooling assembly are connected by a plate, and when the oil temperature at the outlet of the plate is higher than a predetermined value, the control module controls the fan to start.
In an embodiment of the temperature control system of the above immersion type liquid cooling heat dissipation device, the number of the fans is multiple.
In an embodiment of the above temperature control system of the immersion type liquid cooling heat dissipation device, the control module includes a power supply cut-off unit, and the power supply cut-off unit includes a water pump failure detection piece, an oil pump failure detection piece and a water pressure detection piece.
In an embodiment of the temperature control system of the above immersion type liquid cooling heat dissipation device, the control module includes a comprehensive alarm unit, and the comprehensive alarm unit includes an oil temperature detection piece, a water liquid level detection piece and an oil liquid level detection piece.
In an embodiment of the temperature control system of the above immersion type liquid cooling heat dissipation device, the liquid cooling tank includes a first device tank, a second device tank, and a return tank, the return tank is located between the first device tank and the second device tank, and the computing device to be cooled is disposed in the first device tank and the second device tank.
In an embodiment of the temperature control system of the above immersion type liquid cooling heat dissipation device, the liquid cooling tank further includes an oil tank oil inlet and an oil tank oil outlet, the oil tank oil inlet is connected to the first equipment tank and the second equipment tank, the oil tank oil outlet is connected to the return tank, and the oil tank oil inlet is lower than the computing equipment to be cooled.
In an embodiment of the above temperature control system of the immersion type liquid cooling heat dissipation device, the liquid cooling tank further includes a plurality of oil return ports, and the oil return ports are disposed on the wall surface between the first equipment tank and the return tank and between the second equipment tank and the return tank.
The temperature control system of the immersion type liquid cooling heat dissipation device has the beneficial effects that the PID temperature controller is adopted to carry out effective temperature control on each computing device to be dissipated of the immersion type liquid cooling heat dissipation device.
And when the circulating water pump rises to the highest working frequency and still cannot meet the requirement of stable oil temperature, the control module sequentially starts the fans to control the oil temperature.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
FIG. 1 is a block diagram of a temperature control system of an immersion liquid-cooled heat sink of the present invention;
FIG. 2 is a flow chart of the operation of the temperature control system of the immersion liquid-cooled heat sink of the present invention;
FIG. 3 is a schematic diagram of an application of a temperature control system of the immersion liquid-cooled heat sink of the present invention;
fig. 4 is a side view of a portion of an immersion liquid-cooled heat sink.
Wherein the reference numerals
10: immersed liquid cooling heat radiator
20: to-be-cooled computing device
30: PID temperature controller
40: control module
41: power supply cut-off unit
411: water pump fault detection piece
412: oil pump fault detection piece
413: water pressure detection piece
42: integrated alarm unit
421: oil temperature detection piece
422: water temperature detection piece
423: water level detection piece
424: oil level detection piece
100: liquid cooling tank
110: first equipment tank
120: second equipment tank
130: return tank
140: oil return port
111: oil inlet of oil groove
112: oil outlet of oil tank
200: oil circuit circulating cooling assembly
210: circulating oil pump
300: waterway circulating cooling assembly
310: circulating water pump
320: cooling tower
321: spray pump
322: fan blower
400: board changer
Detailed Description
The following detailed description of the embodiments of the present invention with reference to the drawings and specific examples is provided for further understanding the objects, aspects and effects of the present invention, but not for limiting the scope of the appended claims.
References in the specification to "an embodiment," "another embodiment," "the present embodiment," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not intended to refer to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
Where certain terms are used in the specification and following claims to refer to particular components or features, those skilled in the art will understand that various terms or numbers may be used by a skilled user or manufacturer to refer to the same component or feature. This specification and the claims that follow do not intend to distinguish between components or features that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. In addition, the term "coupled" is intended to include any direct or indirect coupling.
It should be noted that in the description of the present invention, the orientation or positional relationship indicated by the terms "lateral", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. appears on the basis of the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplicity of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. For the sake of clarity, the terms "first," "second," "third," "fourth," and the like, as used herein, are used to distinguish one element, region, or section from another, the same or similar element, region, or section, and are not intended to limit the particular element, region, or section.
Fig. 1 to 3 show a block diagram of a temperature control system of an immersion liquid-cooled heat sink according to the present invention in fig. 1, fig. 2 shows a flow chart of the temperature control system of the immersion liquid-cooled heat sink according to the present invention in fig. 2, and fig. 3 shows an application diagram of the temperature control system of the immersion liquid-cooled heat sink according to the present invention in fig. 3.
The immersed liquid cooling heat dissipation device 10 comprises a liquid cooling tank 100, an oil path circulating cooling assembly 200 and a water path circulating cooling assembly 300, wherein the oil path circulating cooling assembly 200 is connected with the liquid cooling tank 100, the water path circulating cooling assembly 300 exchanges heat with the oil path circulating cooling assembly 200, the oil path circulating cooling assembly 200 comprises a circulating oil pump 210, and the water path circulating cooling assembly 300 comprises a circulating water pump 310. The to-be-radiated computing equipment 20 is arranged in the liquid cooling tank 100, the cooling oil is circulated through the oil path circulating cooling assembly 200, and exchanges heat with the oil path circulating cooling assembly 200 through the water path circulating cooling assembly 300, namely, the cold cooling oil is continuously input and the hot cooling oil is extracted, so that the to-be-radiated computing equipment 20 arranged in the liquid cooling tank 100 radiates heat. The computing device 20 to be cooled is, for example, a block chain server.
The temperature control system of the immersed liquid cooling heat dissipation device comprises a PID temperature controller 30 and a control module 40, wherein the PID temperature controller 30 is connected with the control module 40, and the control module 40 is connected with a circulating oil pump 210 of an oil circuit circulating cooling assembly 200 and a circulating water pump 310 of a water circuit circulating cooling assembly 300.
According to the invention, the PID temperature controller 30 and the control module 40 are used for controlling the opening and closing and the working frequency of the circulating oil pump 210 and the circulating water pump 310 so as to control the computing equipment 20 to be cooled in the immersed liquid cooling heat dissipation device 10 to work at a stable temperature.
The oil circuit circulation cooling assembly 200 and the water circuit circulation cooling assembly 300 are connected through a plate switch 400, the water circuit circulation cooling assembly 300 further comprises a cooling tower 320, the cooling tower 320 comprises a spray pump 321, and the control module 40 is connected with the spray pump 321.
The circulating oil pump 210 drives the cooling oil to take away heat generated by the computing equipment 20 to be radiated, and the cooling oil circulates and cools the computing equipment 20 to be radiated after the cooling oil is sent to the board exchanger 400 to release heat. The other side of the plate exchanger 400 is driven by the circulating water pump 310 to drive cooling water to absorb heat in the plate exchanger 400, then the cooling water releases heat in the cooling tower 320, and then the cooling water returns to the plate exchanger 400.
The cooling tower 320 of the water circuit circulating cooling assembly 300 further comprises a fan 322, and the control module 40 is connected with the fan 322. When the outlet oil temperature of the plate exchanger 400 is higher than a predetermined value, the control module 40 controls the fan 322 to start.
In detail, referring to fig. 2, the temperature control system of the immersion type liquid cooling heat dissipation device of the present invention works as follows:
after the control module 40 is powered on for self-test, the circulating oil pump 210, the circulating water pump 310 and the spray pump are started, wherein the circulating water pump 310 is a variable frequency pump. The circulating water pump 310 performs PID closed-loop regulation according to the oil temperature and the set PID parameters of the PID temperature controller 30, so that the oil temperature is stabilized at a proper working point. Since the chip temperature of the computing device 20 to be cooled has a direct linear relationship with the oil temperature, after the oil temperature is stable, the temperature equalization of the chip of the computing device 20 to be cooled is also stable at the target point, thereby ensuring the normal operation of the computing device 20 to be cooled.
When the oil temperature is higher than the target value, the circulating water pump 310 increases the frequency to decrease the oil temperature so that it is stabilized at the target value. When the circulating water pump 310 is raised to the maximum operating frequency and still fails to meet the condition that the oil temperature is stabilized at the target value, the control module 40 sequentially activates the plurality of fans 322 to control the oil temperature.
In the temperature control mode, when the temperature is high in summer, the oil temperature can be controlled by adjusting the frequency of the circulating water pump 310 and the number of the fans, when the temperature is low in winter, the oil temperature is controlled by only starting the circulating water pump 310, and meanwhile, as the fans 322 of the cooling tower 320 are stopped, the water temperature in winter can be consistent with that in summer, and the risk of freezing in winter is avoided. Moreover, because the circulating oil pump 210 runs at power frequency all the time, the temperature difference of the oil is not changed, and the temperature difference of the chip of the computing equipment 20 to be radiated is also not changed, which is beneficial to the consistency of the temperature of the chip.
As shown in fig. 1, the control module 40 includes a power cut-off unit 41, and the power cut-off unit 41 includes a water pump failure detecting part 411, an oil pump failure detecting part 412, and a water pressure detecting part 413.
The control module 40 includes an integrated alarm unit 42 including an oil temperature detecting member 421, a water temperature detecting member 422, a water level detecting member 423, and an oil level detecting member 424.
In the present invention, when the oil pump failure detection part 412 detects that the circulating oil pump 210 fails, the water pump failure detection part 411 detects that the circulating water pump 310 fails, or the water pressure detection part 412 detects that the water pressure is too low, the power supply is cut off by the power supply cut-off unit 41, and the operation is stopped, so as to protect the safety of the server cluster of the whole system.
In the invention, when the oil temperature detecting part 421 detects that the oil temperature of the cooling oil in the oil path circulation cooling assembly 200 is too high or too low, the water temperature detecting part 422 detects that the water temperature of the cooling water in the water path circulation cooling assembly 300 is too high or too low, the water liquid level detecting part 423 detects that the water liquid level in the water path circulation cooling assembly 300 is too high or too low, and the oil liquid level detecting part 424 detects that the oil liquid level in the oil path circulation cooling assembly 200 is too high or too low, the comprehensive alarm unit 42 gives an alarm to remind the operator to detect.
Fig. 4 is a schematic side view of an immersion liquid-cooled heat sink, as shown in fig. 3 and 4. The liquid cooling tank 100 includes a first equipment tank 110, a second equipment tank 120, and a return tank 130, wherein the first equipment tank 110 and the second equipment tank 120 are located at two sides of the return tank 130, or the return tank 130 is located between the first equipment tank 110 and the second equipment tank 130. A plurality of computing devices 20 to be cooled are disposed submerged within first device bin 110 and second device bin 120.
The liquid cooling tank 100 further includes an oil tank oil inlet 111 and an oil tank oil outlet 112, the oil tank oil inlet 111 is disposed on the first equipment tank 110 and the second equipment tank 120, and the oil tank oil outlet 112 is disposed on the return tank 130. The cooling oil enters the first equipment tank 110 and the second equipment tank 120 from the oil groove oil inlet 111, absorbs heat dissipation of the computing equipment 20 to be dissipated in the first equipment tank 110 and the second equipment tank 120, and the cooling oil after heat absorption is converged into the middle return tank 130 and enters the oil circuit circulation cooling assembly 200 through the oil groove oil outlet 112 for cooling circulation.
In the present invention, the oil inlet 111 of the oil tank of the liquid cooling tank 100 is lower than the computing devices 20 to be cooled, and the flow direction of the cooling oil is from bottom to top, so as to cool and dissipate the computing devices 20 to be cooled.
The liquid-cooled tank 100 further includes an oil return port 140, and the oil return port 140 is provided on a wall surface between the first equipment tank 110 and the return tank 130, and on a wall surface between the second equipment tank 120 and the return tank 130. After absorbing heat, the cooling oil in the first equipment tank 110 flows back to the return tank 130 from the oil return opening 140 on the wall surface between the first equipment tank 110 and the return tank 130, after absorbing heat, the cooling oil in the second equipment tank 120 flows back to the return tank 130 from the oil return opening 140 on the wall surface between the second equipment tank 120 and the return tank 130, and the height of the oil return opening 140 is located at the highest liquid level of the computing equipment 20 to be cooled.
The scheme of the invention can control the temperature of the server cluster to be at a stable temperature, the temperature of the server chip can not fluctuate along with the change of the external environment temperature, and the temperature consistency of different chips can also be ensured. Meanwhile, the temperature control scheme considers the operation at high temperature in summer and also considers the requirement of freezing prevention in winter, so that the immersed oil-cooled mining machine can adapt to the conversion of different geographical positions in four seasons, namely spring, summer, autumn and winter, and has universality. And the conditions of equipment accidents and abnormal detection parameters are considered, and the main brake is cut off or the comprehensive alarm is given according to different conditions.
Embodiments, various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and it is intended that all such changes and modifications fall within the scope of the appended claims.

Claims (10)

1. The utility model provides an immersion liquid cooling heat abstractor's temperature control system, immersion liquid cooling heat abstractor includes liquid cooling tank, oil circuit circulative cooling subassembly and water route circulative cooling subassembly, its characterized in that, wait to dispel the heat the calculation equipment set up in the liquid cooling tank, oil circuit circulative cooling subassembly is connected the liquid cooling tank, water route circulative cooling subassembly with oil circuit circulative cooling subassembly exchanges the heat transfer, oil circuit circulative cooling subassembly includes circulating oil pump, water route circulative cooling subassembly includes circulating water pump, temperature control system includes the PID temperature controller and connects the control module of PID temperature controller, control module connects circulating oil pump and circulating water pump.
2. The system of claim 1, wherein the hydronic assembly further comprises a cooling tower, the cooling tower including a spray pump, and the control module is coupled to the spray pump.
3. The system of claim 2, wherein the cooling tower includes a fan, and the control module is coupled to the fan.
4. The system of claim 3, wherein the oil cooling module and the water cooling module are connected by a plate switch, and the control module controls the fan to start when an outlet oil temperature of the plate switch is higher than a predetermined value.
5. The system of claim 3, wherein the plurality of fans are provided.
6. The system of claim 1, wherein the control module comprises a power shut-off unit comprising a water pump failure detector, an oil pump failure detector, and a water pressure detector.
7. The system of claim 1, wherein the control module comprises a general alarm unit comprising an oil temperature detector, a water level detector, and an oil level detector.
8. The system of any one of claims 1 to 7, wherein the liquid cooling bath comprises a first equipment tank, a second equipment tank, and a return tank, the return tank being located between the first and second equipment tanks, and the computing equipment to be cooled being disposed in the first and second equipment tanks.
9. The system of claim 8, wherein the liquid-cooled bath further comprises an oil bath inlet connected to the first and second equipment tanks and an oil bath outlet connected to the return tank, and wherein the oil bath inlet is lower than the computing equipment to be cooled.
10. The system of claim 8, wherein the liquid-cooled tank further comprises a plurality of oil returns disposed on the wall between the first equipment tank and the return tank and between the second equipment tank and the return tank.
CN202110785601.8A 2020-07-14 2021-07-12 Temperature control system of immersed liquid cooling heat dissipation device Pending CN113934278A (en)

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CN202021383262 2020-07-14
CN2020213832628 2020-07-14

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116981219A (en) * 2023-07-19 2023-10-31 上海柏晟能源科技有限公司 Integrated photovoltaic energy storage's immersion liquid cooling server circulation cooling system
CN116997140A (en) * 2023-07-19 2023-11-03 上海柏晟能源科技有限公司 Integrated modularized submerged liquid cooling server circulating heat dissipation system
TWI822565B (en) * 2023-01-19 2023-11-11 緯穎科技服務股份有限公司 Immersion fluid module and server system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI822565B (en) * 2023-01-19 2023-11-11 緯穎科技服務股份有限公司 Immersion fluid module and server system
CN116981219A (en) * 2023-07-19 2023-10-31 上海柏晟能源科技有限公司 Integrated photovoltaic energy storage's immersion liquid cooling server circulation cooling system
CN116997140A (en) * 2023-07-19 2023-11-03 上海柏晟能源科技有限公司 Integrated modularized submerged liquid cooling server circulating heat dissipation system

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