CN113933620A - Heating module state detection circuit and refrigeration equipment - Google Patents
Heating module state detection circuit and refrigeration equipment Download PDFInfo
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 121
- 238000001514 detection method Methods 0.000 title claims abstract description 41
- 238000005057 refrigeration Methods 0.000 title abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 63
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- 238000010257 thawing Methods 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 2
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
- G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/30—Structural combination of electric measuring instruments with basic electronic circuits, e.g. with amplifier
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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Abstract
The invention relates to a heating module state detection circuit and a refrigeration device. The processor MCU in the heating module state detection circuit is connected with a control electrode G of the silicon controlled rectifier SCR through a drive circuit, and the processor MCU controls the on-off state of the silicon controlled rectifier SCR through the drive circuit; pin 1 of the silicon controlled rectifier SCR is connected with a first power supply terminal VCC1, and pin 2 of the silicon controlled rectifier SCR is connected with the heating module; thermistor RT is closely adjacent to silicon controlled rectifier SCR and is set up, and thermistor RT and divider resistor R1 series connection, and second supply terminal VCC2 is connected to one end after the series connection, and the other end ground connection after the series connection, and the processor MCU is connected to thermistor RT and divider resistor R1's tie point. The processor MCU acquires sampling voltage after controlling the SCR to be switched on through the driving circuit, and searches the state of the heating module corresponding to the sampling voltage through the corresponding relation of the voltage and the state. The invention can actively monitor the working state of the heating module and improve the stability of the equipment.
Description
Technical Field
The invention relates to the field of refrigeration equipment, in particular to a heating module state detection circuit and refrigeration equipment.
Background
The frosting phenomenon is a common problem of refrigeration equipment, and the defrosting is heated by arranging a defrosting heating module in the prior art. In the defrosting process of the defrosting heating module, the prior art only records the working time of the defrosting heating module, does not detect the working state of the defrosting heating module, and possibly has the problem that the defrosting heating module is damaged and is unknown, thereby influencing the use of the refrigeration equipment and reducing the use experience of users.
Disclosure of Invention
The present invention provides a heating module state detection circuit and a refrigeration device, which are directed to overcome the above-mentioned drawbacks of the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows: the heating module state detection circuit is constructed and comprises a processor MCU, a silicon controlled rectifier SCR, a thermistor RT, a divider resistor R1 and a drive circuit;
the processor MCU is connected with a control electrode G of the silicon controlled rectifier SCR through the drive circuit, and the processor MCU controls the on-off state of the silicon controlled rectifier SCR through the drive circuit; pin 1 of the silicon controlled rectifier SCR is connected with a first power supply terminal VCC1, and pin 2 of the silicon controlled rectifier SCR is connected with the heating module; the thermistor RT is arranged close to the SCR, the thermistor RT is connected with the divider resistor R1 in series, one end of the thermistor RT is connected with the second power supply end VCC2 after the thermistor RT is connected in series, the other end of the thermistor RT is grounded after the thermistor RT is connected in series, and the connection point of the thermistor RT and the divider resistor R1 is connected with the processor MCU;
the processor MCU acquires sampling voltage after the SCR is controlled to be switched on by the driving circuit, and searches the state of the heating module corresponding to the sampling voltage according to the corresponding relation of the voltage and the state.
Further, in the heating module state detection circuit of the present invention, the driving circuit includes a transistor Q, a resistor R2, a resistor R3, a resistor R4, and a resistor R5;
the base electrode of the triode Q is connected with the processor MCU through the resistor R4, and the base electrode of the triode Q is connected with the emitting electrode of the triode Q through the resistor R5; the emitting electrode of the triode Q is grounded; the collector of the triode Q is connected with the control electrode G of the SCR through the resistor R3, the collector of the triode Q is connected with the first end of the resistor R2 through the resistor R3, and the second end of the resistor R2 is connected with the pin 1 of the SCR.
Further, in the heating module state detection circuit of the present invention, a first end of the thermistor RT is connected to a second power supply terminal VCC, and a second end of the thermistor RT is grounded through the voltage dividing resistor R1; or
The first end of divider resistance R1 connects second supply terminal VCC, the second end of divider resistance R1 is passed through thermistor RT ground connection.
Further, in the heating module state detection circuit according to the present invention, the heating module is a defrosting heating module.
Further, in the heating module state detection circuit of the present invention, the SCR is turned on to obtain a sampling voltage and a sampling time, and the heating module state corresponding to the sampling voltage and the sampling time is searched for by a time-voltage-state correspondence.
In addition, the invention also provides a heating module state detection circuit, which comprises a processor MCU, a silicon controlled rectifier SCR, a temperature sensor and a drive circuit;
the processor MCU is connected with a control electrode G of the silicon controlled rectifier SCR through the drive circuit, and the processor MCU controls the on-off state of the silicon controlled rectifier SCR through the drive circuit; pin 1 of the silicon controlled rectifier SCR is connected with a first power supply terminal VCC1, and pin 2 of the silicon controlled rectifier SCR is connected with the heating module; the temperature sensor is arranged close to the SCR, and is used for collecting the temperature of the SCR;
the processor MCU acquires sampling temperature after the SCR is controlled to be switched on by the driving circuit, and searches the state of the heating module corresponding to the sampling temperature according to the corresponding relation of the temperature and the state.
Further, in the heating module state detection circuit of the present invention, the driving circuit includes a transistor Q, a resistor R2, a resistor R3, a resistor R4, and a resistor R5;
the base electrode of the triode Q is connected with the processor MCU through the resistor R4, and the base electrode of the triode Q is connected with the emitting electrode of the triode Q through the resistor R5; the emitting electrode of the triode Q is grounded; the collector of the triode Q is connected with the control electrode G of the SCR through the resistor R3, the collector of the triode Q is connected with the first end of the resistor R2 through the resistor R3, and the second end of the resistor R2 is connected with the pin 1 of the SCR.
Further, in the heating module state detection circuit according to the present invention, the heating module is a defrosting heating module.
Further, in the heating module state detection circuit of the present invention, the SCR is turned on to obtain a sampling temperature and a sampling time, and a heating module state corresponding to the sampling temperature and the sampling time is searched for by a time-temperature-state correspondence.
In addition, the invention also provides a refrigerating device which comprises a refrigerating module and a heating module, and the refrigerating device also comprises the heating module state detection circuit.
The heating module state detection circuit and the refrigeration equipment have the following beneficial effects: the invention can actively monitor the working state of the heating module and improve the stability of the equipment.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a circuit diagram of a heater module status detection circuit according to an embodiment of the present invention;
FIG. 2 is a circuit diagram of a heater module status detection circuit according to an embodiment of the present invention;
FIG. 3 is a circuit diagram of a heater module status detection circuit according to an embodiment of the present invention;
fig. 4 is a circuit diagram of a heating module status detection circuit according to an embodiment of the present invention.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
In a preferred embodiment, referring to fig. 1, the heating module state detection circuit of this embodiment includes a processor MCU, a silicon controlled rectifier SCR, a thermistor RT, a voltage dividing resistor R1 and a driving circuit 10, the processor MCU is connected to a control electrode G of the silicon controlled rectifier SCR through the driving circuit 10, and the processor MCU controls the on/off state of the silicon controlled rectifier SCR through the driving circuit 10. Pin 1 of the SCR is connected to the first power supply terminal VCC1, and pin 2 of the SCR is connected to the heating module 20. Thermistor RT is closely adjacent the silicon controlled rectifier SCR setting, and thermistor RT and divider resistor R1 series connection, second supply terminal VCC2 is connected to thermistor RT and divider resistor R1 one end after establishing ties, and thermistor RT and divider resistor R1 establish ties the back other end ground connection, and the processor MCU is connected to thermistor RT and divider resistor R1's tie point.
The working principle of the heating module state detection circuit is as follows: the temperature of the SCR changes along with the change of the internal current, the larger the current flowing through the SCR is, the larger the heat productivity of the SCR is, and the higher the temperature of the SCR is, so that the current flowing through the SCR can be judged by monitoring the heat productivity of the SCR. And the current flowing through the SCR flows to the heating module 20, that is, the current of the heating module 20 is known, and whether the heating module 20 works normally is judged. In addition, the resistance value of the thermistor RT changes along with the temperature change of the thermistor RT, the thermistor RT is arranged close to the SCR, and the thermistor RT changes the temperature and the resistance value of the thermistor RT under the heating influence of the SCR. Further, the change of the resistance value of the thermistor RT causes the change of the serial voltage division of the serial thermistor RT and the voltage dividing resistor R1, so the change of the voltage division of the serial thermistor RT and the voltage dividing resistor R1 can reflect the change of the current flowing through the SCR, and further reflect the change of the current of the heating module 20, that is, the working state of the heating module 20 can be known. The processor MCU obtains sampling voltage provided by the series thermistor RT and the divider resistor R1 after the SCR is controlled to be switched on by the driving circuit 10, and searches the heating module state corresponding to the sampling voltage according to the corresponding relation of the voltage and the state, wherein the corresponding relation of the voltage and the state is the corresponding relation of the sampling voltage and the working state of the heating module 20. Alternatively, the voltage and state correspondence is pre-stored in the processor MCU, or the voltage and state correspondence is pre-stored in a memory communicatively connected to the processor MCU.
Alternatively, the heating module 20 is a defrosting heating module for defrosting of the refrigerator.
According to the heating control system, the heating condition of the silicon controlled rectifier SCR is monitored through the thermistor RT, the working state of the heating module is indirectly and actively monitored, whether the heating module normally works or not can be judged, reference is provided for relevant control, and therefore the stability of equipment is improved.
In the heating module state detection circuit of some embodiments, referring to fig. 2, the heating module state detection circuit of this embodiment includes a processor MCU, a silicon controlled rectifier SCR, a thermistor RT, a voltage dividing resistor R1, and a driving circuit 10, the processor MCU is connected to a control electrode G of the silicon controlled rectifier SCR through the driving circuit 10, and the processor MCU controls the on/off state of the silicon controlled rectifier SCR through the driving circuit 10. Pin 1 of the SCR is connected to the first power supply terminal VCC1, and pin 2 of the SCR is connected to the heating module 20. Thermistor RT is closely adjacent the silicon controlled rectifier SCR setting, and thermistor RT and divider resistor R1 series connection, second supply terminal VCC2 is connected to thermistor RT and divider resistor R1 one end after establishing ties, and thermistor RT and divider resistor R1 establish ties the back other end ground connection, and the processor MCU is connected to thermistor RT and divider resistor R1's tie point.
Further, the driving circuit 10 includes a transistor Q, a resistor R2, a resistor R3, a resistor R4, and a resistor R5, wherein a base of the transistor Q is connected to the MCU through the resistor R4, and a base of the transistor Q is connected to an emitter of the transistor Q through the resistor R5. The emitter of the triode Q is grounded. The collector of triode Q passes through resistance R3 and connects the control pole G of silicon controlled rectifier SCR, and the collector of triode Q passes through resistance R3 and connects the first end of resistance R2, and the second end of resistance R2 connects pin 1 of silicon controlled rectifier SCR. The controller MCU controls the on-off state of the silicon controlled rectifier SCR by controlling the on-off of the triode Q.
In the heating module state detection circuit according to some embodiments, when the thermistor RT is connected in series to the voltage divider resistor R1, the first terminal of the thermistor RT is connected to the second power supply terminal VCC, the second terminal of the thermistor RT is grounded through the voltage divider resistor R1, the second terminal of the thermistor RT is connected to the processor MCU, and the processor MCU collects the voltage across the voltage divider resistor R1.
In the heating module state detection circuit according to some embodiments, when the thermistor RT is connected in series to the voltage divider resistor R1, the first terminal of the voltage divider resistor R1 is connected to the second power supply terminal VCC, the second terminal of the voltage divider resistor R1 is grounded through the thermistor RT, the second terminal of the voltage divider resistor R1 is connected to the processor MCU, and the processor MCU collects the voltage across the thermistor RT.
In the heating module state detection circuit according to some embodiments, considering that the SCR gradually accumulates and gradually increases with the energization time from zero current to current, the energization time may more accurately reflect the state of temperature change of the SCR, and thus more accurately reflect the state of the heating module 20. The silicon controlled rectifier SCR of this embodiment obtains sampling voltage and sampling time after being turned on, searches for a heating module state corresponding to the sampling voltage and the sampling time through a time-voltage-state corresponding relationship, where the time-voltage-state includes a sampling time and sampling voltage corresponding relationship and a sampling voltage and heating module state corresponding relationship, obtains a preset voltage corresponding to the sampling time according to the sampling time and sampling voltage corresponding relationship after obtaining the sampling time, compares the preset voltage with the sampling voltage to obtain a voltage comparison result, and determines the heating module state according to the voltage comparison result and the sampling voltage and heating module state corresponding relationship. For example, under a normal working condition, the corresponding preset voltage is a first voltage after the silicon controlled rectifier SCR is electrified for one minute, and if the sampling voltage is equal to the first voltage after the silicon controlled rectifier SCR is electrified for one minute, it indicates that the current flowing through the silicon controlled rectifier SCR is normal, and further indicates that the heating module 20 is normal; if the sampling voltage is not equal to the first voltage after the silicon controlled rectifier SCR is electrified for one minute, the current flowing through the silicon controlled rectifier SCR is abnormal, and then the heating module 20 is abnormal. Alternatively, the time-voltage-state correspondence is pre-stored in the processor MCU, or the time-voltage-state correspondence is pre-stored in a memory communicatively connected to the processor MCU. The embodiment further considers the influence of time on the temperature, so that the state monitoring of the heating module is more accurate.
In a preferred embodiment, referring to fig. 3, the heating module state detection circuit of this embodiment includes a processor MCU, a silicon controlled rectifier SCR, a temperature sensor 30, and a driving circuit 10, the processor MCU is connected to a control electrode G of the silicon controlled rectifier SCR through the driving circuit 10, and the processor MCU controls the on/off state of the silicon controlled rectifier SCR through the driving circuit 10. Pin 1 of the SCR is connected to the first power supply terminal VCC1, and pin 2 of the SCR is connected to the heating module 20. The temperature sensor 30 is disposed adjacent to the silicon controlled rectifier SCR, and the temperature sensor 30 is used to acquire the temperature of the silicon controlled rectifier SCR.
The working principle of the heating module state detection circuit is as follows: the temperature of the SCR changes along with the change of the internal current, the larger the current flowing through the SCR is, the larger the heat productivity of the SCR is, and the higher the temperature of the SCR is, so that the current flowing through the SCR can be judged by monitoring the heat productivity of the SCR. And the current flowing through the SCR flows to the heating module 20, that is, the current of the heating module 20 is known, and whether the heating module 20 works normally is judged. The temperature sensor 30 is closely adjacent to the Silicon Controlled Rectifier (SCR), the temperature sensor 30 can acquire the temperature of the Silicon Controlled Rectifier (SCR), the current change flowing through the Silicon Controlled Rectifier (SCR) can be known by monitoring the temperature change of the Silicon Controlled Rectifier (SCR), and then the current change of the heating module 20 can be monitored, and the working state of the heating module 20 can be known. The processor MCU obtains the sampling temperature after controlling the SCR to be switched on through the driving circuit 10, and searches the heating module state corresponding to the sampling temperature through the corresponding relation of the temperature and the state, wherein the corresponding relation of the temperature and the state is the corresponding relation of the sampling temperature and the working state of the heating module 20. Alternatively, the temperature and state correspondence is pre-stored in the processor MCU, or the temperature and state correspondence is pre-stored in a memory communicatively connected to the processor MCU.
Alternatively, the heating module 20 is a defrosting heating module for defrosting of the refrigerator.
This embodiment is through the condition of generating heat of monitoring silicon controlled rectifier SCR, and the operating condition of indirect active monitoring heating module can judge whether heating module normally works, provides the reference for relevant control to improve equipment's stability.
In the heating module state detection circuit of some embodiments, referring to fig. 4, the heating module state detection circuit of this embodiment includes a processor MCU, a silicon controlled rectifier SCR, a temperature sensor 30, and a driving circuit 10, the processor MCU is connected to a control electrode G of the silicon controlled rectifier SCR through the driving circuit 10, and the processor MCU controls the on/off state of the silicon controlled rectifier SCR through the driving circuit 10. Pin 1 of the SCR is connected to the first power supply terminal VCC1, and pin 2 of the SCR is connected to the heating module 20. The temperature sensor 30 is disposed adjacent to the silicon controlled rectifier SCR, and the temperature sensor 30 is used to acquire the temperature of the silicon controlled rectifier SCR.
Further, the driving circuit 10 includes a transistor Q, a resistor R2, a resistor R3, a resistor R4 and a resistor R5, wherein a base of the transistor Q is connected to the MCU through the resistor R4, and a base of the transistor Q is connected to an emitter of the transistor Q through the resistor R5; the emitting electrode of the triode Q is grounded; the collector of triode Q passes through resistance R3 and connects the control pole G of silicon controlled rectifier SCR, and the collector of triode Q passes through resistance R3 and connects the first end of resistance R2, and the second end of resistance R2 connects pin 1 of silicon controlled rectifier SCR. The controller MCU controls the on-off state of the silicon controlled rectifier SCR by controlling the on-off of the triode Q.
In the heating module state detection circuit according to some embodiments, considering that the SCR gradually accumulates and gradually increases with the energization time from zero current to current, the energization time may more accurately reflect the state of temperature change of the SCR, and thus more accurately reflect the state of the heating module 20. The silicon controlled rectifier SCR of this embodiment obtains sampling temperature and sampling time after being turned on, searches for a heating module state corresponding to the sampling temperature and the sampling time through a time-temperature-state corresponding relationship, where the time-temperature-state includes a sampling time and sampling temperature corresponding relationship and a sampling temperature and heating module state corresponding relationship, and after obtaining the sampling time, a preset temperature corresponding to the sampling time can be obtained according to the sampling time and sampling temperature corresponding relationship, and a temperature comparison result is obtained by comparing the preset temperature and the sampling temperature, and a heating module state is determined according to the temperature comparison result and the sampling temperature and heating module state corresponding relationship. For example, under a normal working condition, the corresponding preset temperature after the silicon controlled rectifier SCR is electrified for one minute is the first temperature, and if the sampling temperature after the silicon controlled rectifier SCR is electrified for one minute is equal to the first temperature, it indicates that the current flowing through the silicon controlled rectifier SCR is normal, and further indicates that the heating module 20 is normal; if the sampling temperature is lower than the first temperature after the silicon controlled rectifier SCR is electrified for one minute, the current flowing through the silicon controlled rectifier SCR is abnormal, and then the heating module 20 is abnormal. Alternatively, the time-temperature-state correspondence is pre-stored in the processor MCU, or the time-temperature-state correspondence is pre-stored in a memory communicatively connected to the processor MCU. The embodiment further considers the influence of time on the temperature, so that the state monitoring of the heating module is more accurate.
In a preferred embodiment, the refrigerating apparatus of the present embodiment includes a cooling module for generating cold air for the refrigerating apparatus and a heating module 20; alternatively, the heating module 20 is a defrosting heating module, which is used for defrosting operation of the refrigerator. The refrigeration appliance further includes a heating module state detection circuit as in the previous embodiment; alternatively, the refrigeration device may be a refrigerator, freezer, or the like. The refrigeration equipment of the embodiment can actively monitor the working state of the heating module and improve the stability of the equipment.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and are intended to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention. All equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (10)
1. A heating module state detection circuit is characterized by comprising a processor MCU, a silicon controlled rectifier SCR, a thermistor RT, a divider resistor R1 and a drive circuit (10);
the processor MCU is connected with a control electrode G of the silicon controlled rectifier SCR through the driving circuit (10), and the processor MCU controls the on-off state of the silicon controlled rectifier SCR through the driving circuit (10); pin 1 of the SCR is connected with a first power supply terminal VCC1, and pin 2 of the SCR is connected with a heating module (20); the thermistor RT is arranged close to the SCR, the thermistor RT is connected with the divider resistor R1 in series, one end of the thermistor RT is connected with the second power supply end VCC2 after the thermistor RT is connected in series, the other end of the thermistor RT is grounded after the thermistor RT is connected in series, and the connection point of the thermistor RT and the divider resistor R1 is connected with the processor MCU;
the processor MCU obtains sampling voltage after the SCR is controlled to be switched on through the driving circuit (10), and searches the state of the heating module corresponding to the sampling voltage through the corresponding relation of the voltage and the state.
2. The heating module state detecting circuit according to claim 1, characterized in that the driving circuit (10) comprises a transistor Q, a resistor R2, a resistor R3, a resistor R4 and a resistor R5;
the base electrode of the triode Q is connected with the processor MCU through the resistor R4, and the base electrode of the triode Q is connected with the emitting electrode of the triode Q through the resistor R5; the emitting electrode of the triode Q is grounded; the collector of the triode Q is connected with the control electrode G of the SCR through the resistor R3, the collector of the triode Q is connected with the first end of the resistor R2 through the resistor R3, and the second end of the resistor R2 is connected with the pin 1 of the SCR.
3. The heating module status detecting circuit according to claim 1, wherein a first terminal of said thermistor RT is connected to a second power supply terminal VCC, and a second terminal of said thermistor RT is grounded through said voltage dividing resistor R1; or
The first end of divider resistance R1 connects second supply terminal VCC, the second end of divider resistance R1 is passed through thermistor RT ground connection.
4. The heating module status detection circuit according to claim 1, characterized in that the heating module (20) is a defrosting heating module.
5. The heating module state detection circuit of claim 1, wherein the SCR is turned on to obtain a sampling voltage and a sampling time, and the heating module state corresponding to the sampling voltage and the sampling time is searched for by a time-voltage-state correspondence.
6. A heating module state detection circuit is characterized by comprising a processor MCU, a silicon controlled rectifier SCR, a temperature sensor (30) and a drive circuit (10);
the processor MCU is connected with a control electrode G of the silicon controlled rectifier SCR through the driving circuit (10), and the processor MCU controls the on-off state of the silicon controlled rectifier SCR through the driving circuit (10); pin 1 of the SCR is connected with a first power supply terminal VCC1, and pin 2 of the SCR is connected with a heating module (20); the temperature sensor (30) is arranged close to the SCR, and the temperature sensor (30) is used for collecting the temperature of the SCR;
the processor MCU obtains sampling temperature after the SCR is controlled to be switched on through the driving circuit (10), and searches the state of the heating module corresponding to the sampling temperature through the corresponding relation of the temperature and the state.
7. The heating module state detecting circuit according to claim 6, characterized in that the driving circuit (10) comprises a transistor Q, a resistor R2, a resistor R3, a resistor R4 and a resistor R5;
the base electrode of the triode Q is connected with the processor MCU through the resistor R4, and the base electrode of the triode Q is connected with the emitting electrode of the triode Q through the resistor R5; the emitting electrode of the triode Q is grounded; the collector of the triode Q is connected with the control electrode G of the SCR through the resistor R3, the collector of the triode Q is connected with the first end of the resistor R2 through the resistor R3, and the second end of the resistor R2 is connected with the pin 1 of the SCR.
8. The heating module status detection circuit according to claim 6, characterized in that the heating module (20) is a defrosting heating module.
9. The heating module state detection circuit of claim 6, wherein the SCR is turned on to obtain a sampling temperature and a sampling time, and the heating module state corresponding to the sampling temperature and the sampling time is searched for by a time-temperature-state correspondence.
10. A cold storage device comprising a cooling module and a heating module (20), characterized in that it further comprises a heating module status detection circuit according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202111076743.3A CN113933620A (en) | 2021-09-14 | 2021-09-14 | Heating module state detection circuit and refrigeration equipment |
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| CN202111076743.3A CN113933620A (en) | 2021-09-14 | 2021-09-14 | Heating module state detection circuit and refrigeration equipment |
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| CN (1) | CN113933620A (en) |
Citations (6)
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| CN101267197A (en) * | 2008-04-15 | 2008-09-17 | 美的集团有限公司 | Control device and control method for reducing average drive current of silicon controlled rectifier |
| CN102342758A (en) * | 2011-09-09 | 2012-02-08 | 美的集团有限公司 | Control circuit of electric cooker |
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| CN110611296A (en) * | 2018-06-15 | 2019-12-24 | 辽宁鑫源节能集团有限责任公司 | Protective circuit for breakdown of controlled silicon and control method thereof |
| CN213244370U (en) * | 2020-08-05 | 2021-05-18 | 成都创宏汽车电子有限公司 | Heating system with protection mechanism |
| KR20210057261A (en) * | 2019-11-11 | 2021-05-21 | 한국철도기술연구원 | Anti-frost heating system in Rubber-tire AGT |
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| CN101267197A (en) * | 2008-04-15 | 2008-09-17 | 美的集团有限公司 | Control device and control method for reducing average drive current of silicon controlled rectifier |
| CN102342758A (en) * | 2011-09-09 | 2012-02-08 | 美的集团有限公司 | Control circuit of electric cooker |
| CN106052263A (en) * | 2016-06-13 | 2016-10-26 | 海信（山东）冰箱有限公司 | Defrosting control method and device of air-cooled refrigerator and air-cooled refrigerator |
| CN110611296A (en) * | 2018-06-15 | 2019-12-24 | 辽宁鑫源节能集团有限责任公司 | Protective circuit for breakdown of controlled silicon and control method thereof |
| KR20210057261A (en) * | 2019-11-11 | 2021-05-21 | 한국철도기술연구원 | Anti-frost heating system in Rubber-tire AGT |
| CN213244370U (en) * | 2020-08-05 | 2021-05-18 | 成都创宏汽车电子有限公司 | Heating system with protection mechanism |
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