CN113933323B - Acquisition and application method of K-edge authentication capability parameter table - Google Patents
Acquisition and application method of K-edge authentication capability parameter table Download PDFInfo
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- 239000000463 material Substances 0.000 claims abstract description 76
- 238000012360 testing method Methods 0.000 claims abstract description 45
- 238000003384 imaging method Methods 0.000 claims abstract description 36
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims description 34
- 230000000694 effects Effects 0.000 abstract description 9
- 238000005259 measurement Methods 0.000 abstract description 6
- 238000001228 spectrum Methods 0.000 abstract description 5
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- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 7
- 229910052740 iodine Inorganic materials 0.000 description 7
- 239000011630 iodine Substances 0.000 description 7
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 6
- 238000013095 identification testing Methods 0.000 description 4
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- 238000000354 decomposition reaction Methods 0.000 description 3
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- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
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Abstract
The invention provides a method for acquiring and applying a K-edge discrimination capability parameter table, which comprises the following steps: adjusting an energy threshold preset by the detector; selecting die bodies to be tested of different materials into a detection area; identifying and testing the selected die body to be tested; the detector obtains energy signals of the die body to be detected penetrating through different materials under different energy thresholds; according to the energy signals, calculating to obtain mass attenuation coefficients of the die bodies to be tested of different materials in different energy threshold sections, and forming mass attenuation curves of the die bodies to be tested; and summarizing mass attenuation curves of a plurality of die bodies to be tested to form a K-edge discrimination capability parameter table. The method is used for obtaining the actual and accurate K-edge discrimination capability parameter table of various different materials, namely the discrimination capability of the detector for K-edge of various different materials, effectively reducing errors between theoretical calculation and actual measurement, providing reliable and accurate parameter selection basis for energy spectrum application such as K-edge imaging and the like, and optimizing the application effect of K-edge imaging.
Description
Technical Field
The invention relates to the technical field of imaging, in particular to a method for acquiring and applying a K-edge discrimination capability parameter table.
Background
In recent years, the potential use of energy-resolved photon counting detectors in the field of X-ray medical imaging has been actively studied.
In application, the theoretical mass attenuation coefficient curve of the material to be measured is usually used as a guide for actual application, however, the discrimination degradation effect of the detector on K-edge of different materials is inconsistent, so that errors exist between the actual mass attenuation coefficient of the material and a theoretical value, and the theoretical mass attenuation coefficient is used for guiding the actual application, so that the application effect is not as expected.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a method for acquiring and applying a K-edge authentication capability parameter table.
The invention provides a method for acquiring a K-edge discrimination capability parameter table, which comprises the following steps:
Adjusting an energy threshold preset by the detector;
Selecting die bodies to be tested of different materials into a detection area of a detector;
identifying and testing the selected die body to be tested;
The detector obtains energy signals of the die body to be detected penetrating through different materials under different energy thresholds;
According to the energy signals, calculating mass attenuation coefficients of the die bodies to be tested of different materials in different energy threshold sections to form mass attenuation curves of the die bodies to be tested;
And summarizing mass attenuation curves of a plurality of die bodies to be tested to form a K-edge discrimination capability parameter table.
In one embodiment, in the step of adjusting the energy threshold value preset by the detector, the range of the preset energy threshold value is + -30 keV of the K-edge theoretical energy value of the die body to be measured.
In one embodiment, in the step of adjusting the preset energy threshold of the detector, the method further comprises the steps of: and adjusting the working voltage of the ray source, wherein the working voltage is a nominal voltage, or the voltage value of the working voltage is 2 times of the theoretical K-edge energy value of the die body to be tested.
In one embodiment, each die body to be tested is tested, and the comparison die body is tested under the same test conditions as the die body to be tested.
In one embodiment, the material of the comparative phantom is a gas.
In one embodiment, in the step of selecting the phantom to be tested to the detection area of the detector for detection, the distance between the phantom to be tested and the detector is adjusted to adjust the projection magnification ratio.
In one embodiment, in the step of obtaining the mass attenuation coefficients of the die body to be measured under different energy thresholds to form a mass attenuation curve, fitting a plurality of mass attenuation coefficients to form a mass attenuation curve.
In one embodiment, the die body to be tested comprises a substrate and a material to be tested, a containing cavity is formed in the substrate, and the material to be tested is installed in the containing cavity.
The invention provides an application method of a K-edge discrimination capability parameter table, wherein the K-edge discrimination capability parameter table is any one of the K-edge discrimination capability parameter tables; the application method of the K-edge authentication capability parameter table comprises the following steps:
Determining the K-edge imaging purpose;
Determining the material of an object to be detected;
Selecting a mass attenuation curve corresponding to the material of the object to be detected according to the material of the object to be detected and the K-edge discrimination capability parameter table;
Recommending an energy threshold parameter corresponding to the K-edge imaging application of the object to be detected according to the mass attenuation curve of the object to be detected;
And adjusting the energy threshold parameter according to the recommended energy threshold parameter and different application requirements.
In one embodiment, different K-edge imaging applications have different noise and/or imaging contrast requirements.
The acquisition and application method of the K-edge discrimination capability parameter table provided by the invention has the following beneficial effects compared with the prior art:
According to the invention, the identification test is carried out on the to-be-tested die bodies of various different materials by the same detector, so that the detector obtains energy signals of the to-be-tested die bodies penetrating through different materials under different energy thresholds, a K-edge identification capacity parameter table of various materials is formed by calculating and summarizing the energy signals, namely, the identification capacity of the detector on K-edge of various different materials is represented, errors between theoretical calculation and actual measurement of the K-edge of the materials are effectively eliminated, reliable and accurate parameter selection basis is provided for energy spectrum application such as subsequent K-edge imaging, and the accuracy of energy threshold recommendation and the efficiency of energy threshold parameter recommendation in the application of energy spectrum such as K-edge imaging are improved, and the application effect of K-edge imaging is optimized.
Drawings
Fig. 1 is a schematic diagram of a measuring device suitable for use in the present invention.
Fig. 2 is a schematic structural view of another measuring device suitable for use in the present invention.
Fig. 3 is a partial schematic view of the measuring device of fig. 2.
FIG. 4 is a flowchart of a method for obtaining a K-edge authentication capability parameter table according to an embodiment of the present invention.
Fig. 5 is a mass decay curve of iodine.
In the figure, 100, measuring device; 10. a substrate; 101. a receiving chamber; 20. a die body to be tested; 30. a support base; 40. a drive assembly; 401. a first driving motor; 402. a second driving motor; 403. a third driving motor; 404. a first conveyor belt; 405. a second conveyor belt; 50. comparing the mold bodies; 200. a radiation source; 300. a detector; 3001. a detection region.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
It is noted that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "or/and" as used herein includes any and all combinations of one or more of the associated listed items.
At present, the theoretical K-edge curve of the material is known, however, in practical application, the energy resolution of each detector 300 is different, the performance is different, the discrimination effect of different detectors 300 on the same material is inconsistent, and the detection results in that the quality attenuation coefficient of the same material has systematic errors with the theoretical value, and degradation sources such as measurement errors, quantum noise and the like, so that the practical application is guided by the theoretical value, the range selection of the energy threshold value of the practical K-edge imaging is possibly wrong, and the optimal imaging effect cannot be obtained. Therefore, the capability of the detector 300 to identify a plurality of different materials needs to be obtained for the actual detector 300 to form a reliable K-edge identification capability parameter table, so as to guide the implementation of the K-edge imaging application.
Accordingly, the present application provides a method of acquiring the detection capability of a detector 300, referring to fig. 4, the method comprising the steps of:
s1: adjusting an energy threshold preset by the detector 300;
s2: selecting the die bodies 20 to be tested of different materials into the detection area 3001;
s3: identifying and testing the selected die body to be tested;
S4: the detector obtains energy signals of the die body 20 to be tested passing through different materials under different energy thresholds;
s5: according to the energy signals, calculating mass attenuation coefficients of the die bodies 20 to be tested of different materials in different energy threshold sections to form mass attenuation curves of the die bodies 20 to be tested;
S6: the mass decay curves of the plurality of test patterns 20 are summed to form a K-edge discrimination capability parameter table.
The above steps S1-S6 do not have a fixed sequence relationship, for example, when the die bodies 20 to be tested of different materials are subjected to identification test, the energy threshold of the detector 300 is adjusted, or the energy threshold is adjusted once each time, the die bodies 20 to be tested are switched to perform the test, and after the test of the die bodies 20 to be tested is completed, the energy threshold is adjusted once again, and the die bodies 20 to be tested are repeatedly tested; alternatively, one of the die bodies 20 to be tested may be selected for testing, and the energy threshold may be gradually adjusted during the test until the test of the die body 20 to be tested is completed, and then the die body 20 to be tested of other materials may be switched for testing. The two testing steps can be used for testing various die bodies 20 to be tested under various energy threshold conditions, and the specific testing step sequence is not limited in the application.
According to the invention, the same detector 300 is used for carrying out identification test on the die body 20 to be tested of a plurality of different materials, so that the actual mass attenuation curve of the die body 20 to be tested is obtained, errors between theoretical calculation and actual measurement of the material K-edge are effectively eliminated, the mass attenuation curves of the die body 20 to be tested are summarized to form a K-edge identification capability parameter table of a plurality of materials, namely the identification capability of the detector 300 on K-edge of a plurality of different materials is represented, reliable and accurate parameter selection basis can be provided for energy spectrum application such as subsequent K-edge imaging, the accuracy of energy threshold parameter recommendation in the energy spectrum application such as K-edge imaging is improved, the efficiency of energy threshold parameter selection is improved, and the application effect of K-edge imaging is optimized.
The die body 20 to be tested comprises a substrate 10 and a material to be tested, a containing cavity 101 is formed in the substrate 10, and the material to be tested is installed in the containing cavity 101.
In one implementation, the substrate 10 is a resin plate, and of course, in other embodiments, the material of the substrate 10 is not limited to the above, and other materials may be selected.
In addition, in the application, the material of the die body 20 to be tested can be gold, silver, copper, titanium, iodine, tellurium, palladium or high-concentration solution, compound and the like, the material of the die body 20 to be tested is abundant in material, comprises a wide k-edge range, and is suitable for performance test of various detectors.
In addition, the phantom 20 to be measured is positioned in the beam path of the source 200 and the detector 300, and the detection area 3001 refers to the usable area of the detector 300 where photons can be received.
Preferably, the distance between the phantom 20 to be measured and the detector 300 is adjusted, so as to change the projection magnification ratio, and most preferably, the projection of the phantom 20 to be measured completely covers the detection area 3001 of the detector 300, so as to ensure that the pixel points of the detector 300 can receive the energy attenuation signal after the radiation source 200 passes through the phantom 20 to be measured. Of course, in other embodiments, the projection of the phantom 20 to be measured may cover only a portion of the detection area of the detector 300.
In step S1, the range of the adjustable energy threshold is preferably within + -30 keV of the K-edge theoretical energy value of the phantom 20 to be measured. During testing, the detection is performed within the energy threshold, the X-ray signals are collected from the lowest energy threshold, the response level of the detector 300 is guaranteed to be about 80% of the highest dynamic range, multi-frame projections are collected to reduce quantum noise, then the energy threshold is adjusted step by step, the energy signals passing through the die body 20 to be tested are scanned step by step, for example, the range of the energy threshold [10keV,70keV ] is collected, the energy threshold of the detector 300 is adjusted to be 10keV in the energy threshold range to begin scanning, then each adjustment is increased by 1keV, the adjustment of the energy threshold is equal to taking 1keV as a step distance, the identification test is repeated step by step until the energy threshold adjustment reaches 70keV, after the completion of the scanning, the detector 300 receives the energy distribution of the rays attenuated by the die body to be tested, and the energy attenuation signals of the die body 20 to be tested under different energy threshold conditions can be obtained through comparison and calculation with the die body data to be tested. In other embodiments, the step size of the energy threshold adjustment is not limited, and the energy threshold may be adjusted step by step, for example, with a step size of 2keV or 0.1 keV.
In other embodiments, the energy threshold range may also be modified based on the energy threshold adjustment range of the detector 300 and the voltage range of the radiation source 200 that are actually used. Further, in step S1, the method further includes the following steps: the radiation source 200 is started and the operating voltage of the radiation source 200 is regulated, and the operating voltage can be a nominal voltage, so as to meet the testing requirements of various materials.
To achieve higher incident doses and to increase the signal-to-noise ratio of the test data, the preferred operating voltage of the radiation source 200 is based on the preferred nominal voltage of the phantom 20 under test, or the average energy of the radiation source 200 is generally set to an adjustment corresponding to the theoretical K-edge energy value of the phantom 20 under test, e.g., an operating voltage equal to 2 times the theoretical K-edge energy value of the phantom 20 under test. The average energy of the radiation source 200 is generally close to half of the peak voltage, and the average energy of the radiation source 200 varies with the voltage, so that the working voltage of the radiation source 200 can be adjusted to 2 times of the K-edge energy of the die body 20 to be tested, and the average energy of the radiation source 200 can float up and down near the 2 times of the K-edge energy value during actual testing, thus realizing better signal-to-noise ratio output. Of course, in other embodiments, the operating voltage values set by the radiation source 200 are not limited to those described above.
It should be noted that, when the radiation is affected by the external environment and has mass attenuation, for example, when the radiation passes through the air, in order to improve the detection accuracy as much as possible, the comparison phantom 50 needs to be tested and identified, and an energy signal passing through the comparison phantom 50 under a specific energy threshold is obtained, so as to correct the mass attenuation coefficient of the phantom 20 to be tested. Therefore, in step S4, each of the test dies 20 is tested, the comparison die 50 is tested under the same test conditions as the test dies 20. Of course, the comparison mold 50 may be tested first, and then a plurality of different mold bodies to be tested may be measured under the same test conditions, so that the comparison mold 50 does not need to be tested repeatedly, and the test time is saved.
Wherein the material of the contrast mold 50 is a gas, preferably a gas having a density of less than or equal to 1.29Kg/m, such as air having a density of 1.29Kg/m at standard atmospheric pressure. Of course, a gas having a density of more than 1.29Kg/m may be used.
In step S4, one detection is completed to obtain an energy signal, and the energy threshold of the detector 300 is adjusted again each time the detection is completed, the comparison phantom 50 and the phantom 20 to be detected are detected under the adjusted energy threshold condition, and repeated for multiple times to obtain multiple energy signals of the phantom 20 to be detected under different energy threshold conditions, and multiple energy signals of the comparison phantom 50 under different energy threshold conditions.
Under one of the energy threshold conditions, the radiation source 200 irradiates the phantom under test, and the radiation energy passing through the phantom under test is received by the detector 300. Under the preset energy threshold condition, the detector 300 receives an energy signal value. The energy threshold of the detector 300 is adjusted and the detector 300 receives another energy signal value at the corresponding energy threshold condition. The two energy signal values are differenced to obtain an energy signal received by the detector 300 within an energy threshold period between the two energy thresholds. In this embodiment, the discrimination test is repeated by adjusting the energy threshold step by step with a pitch of 1 keV as the step, so that the pitches of each energy threshold segment are equal.
In step S5, the energy signal of the die body 20 to be measured in the energy threshold section is processed to obtain the mass attenuation coefficient of the die body 20 to be measured in the energy threshold section.
In one embodiment, the method for calculating the mass attenuation coefficient of the die body 20 to be measured in different energy threshold segments is specifically as follows:
The source 200 is directly irradiated onto the detector 300, and the energy signal received by the detector within an energy threshold period is recorded as ; The comparative phantom 50 is subjected to a discrimination test, and the energy signal received by the detector during an energy threshold period is recorded as; The discrimination test is performed on the phantom 20 to be tested, and the energy signal received by the detector 300 within an energy threshold period is recorded as; The mass attenuation coefficient of the phantom 20 to be measured is:
(1.1)
wherein, To determine the material density of the mold body 20 to be tested,Is the material thickness of the mold body 20 to be measured.
If the attenuation effect of the detection environment on photons is not considered, the mass attenuation coefficient of the die body 20 to be detected is:
(1.2)
wherein, To determine the material density of the mold body 20 to be tested,Is the thickness of the mold body 20 to be measured.
And in the range of the adjustable energy threshold, adjusting the energy threshold at a fixed step distance and testing to obtain a plurality of energy signals, and calculating the energy signals of the energy threshold sections between every two adjacent energy threshold values to obtain the mass attenuation coefficient of the die body 20 to be measured in different energy threshold sections.
Fitting the plurality of mass attenuation coefficient values to obtain a mass attenuation curve of the phantom 20 under test at the energy resolution of the detector 300, the mass attenuation curve characterizing the K-edge discrimination capability of the detector 300 for the phantom 20 under test.
Various methods for fitting the mass attenuation coefficients exist, for example, a polynomial interpolation method can be used for fitting, and other methods can be used for curve fitting.
In step S5, the steps S1 to S3 are repeated by switching the mold body 20 to be tested with different materials, so as to obtain mass attenuation curves of the mold bodies 20 to be tested with different materials, and the mass attenuation curves are summarized to form a K-edge discrimination capability parameter table of the detection device.
In order to improve the efficiency of the authentication test when implementing the method for acquiring the K-edge authentication capability parameter table, the present invention further provides a measuring apparatus 100 suitable for the method for acquiring the K-edge authentication capability parameter table, although in other embodiments, the specific structure of the apparatus suitable for the method is not limited to the following description or the drawings.
Referring to fig. 1-3, the measurement device 100 is positioned between the radiation source 200 and the detector 300 to enable the radiation source 200 to impinge on the measurement device 100.
The measuring device 100 includes a substrate 10 and a plurality of die bodies 20 to be measured. Wherein, the substrate 10 is provided with a plurality of accommodating cavities 101; the plurality of die bodies 20 to be tested are correspondingly arranged in the accommodating cavity 101; it should be noted that the materials of each die body 20 to be tested are different, so that the measuring device 100 can provide a plurality of die bodies 20 to be tested with different materials for testing. The measuring device 100 further comprises a driving assembly 40, wherein the driving assembly 40 is connected with the substrate 10; the substrate 10 is driven to move by the driving assembly 40 to switch different mold bodies 20 to be tested to be positioned in the detection area 3001 for testing.
The measuring device 100 is configured to provide a plurality of die bodies 20 to be tested with different materials, and in step S2, the die bodies 20 to be tested can be automatically switched by the driving component 40 according to the testing process, so as to improve the testing efficiency; the measuring device 100 is provided with a plurality of to-be-measured die bodies 20 with different K-edge, can meet the performance test of a plurality of detectors 300 with energy discrimination capability in clinic and before clinic, and has wide application range; meanwhile, the measuring device 100 can be used for repeated testing for a plurality of times, and has high stability.
In the present application, the substrate 10 is a resin plate, however, in other embodiments, the material of the substrate 10 is not limited to the above, and other materials may be selected.
Correspondingly, the comparative mold 50 is a gas contained in the containing cavity 101, and the density of the gas is 1.29Kg/m. Of course, in other embodiments, a vacuum may be provided within the cavity 101 to form the contrast mold 50.
Preferably, in order to control the test variables, the thickness of the plurality of die bodies 20 to be tested is uniform, in other words, the thickness of the accommodating cavity 101 in the substrate 10 is uniform, so as not to cause different test conditions due to different thicknesses.
In one embodiment, the plurality of accommodating cavities 101 are arranged in an array on the substrate 10, and the plurality of die bodies 20 to be tested and the comparison die bodies 50 respectively installed in the plurality of accommodating cavities 101 are arranged in an array on the substrate 10, so that the substrate 10 can be driven by the driving assembly 40 to move, and the die bodies 20 to be tested can be switched.
Specifically, in one embodiment, referring to fig. 1, a plurality of accommodating cavities 101 are annularly arranged with the center of the substrate 10 as a center, and a plurality of mold bodies 20 to be tested and a plurality of comparison mold bodies 50 are correspondingly arranged with the accommodating cavities 101. Of course, in other embodiments, the arrangement of the plurality of accommodating cavities 101 on the substrate 10 is not limited to the above, for example, as shown in fig. 2 and 3, the plurality of accommodating cavities 101 may be arranged along the length direction of the substrate 10, where the direction of the radiation source 200 emitting the radiation toward the detector 300 is the first direction; the longitudinal direction of the substrate 10 is perpendicular to the first direction. The accommodating chambers 101 may be arranged in other paths, which is not limited herein.
With continued reference to fig. 1, when the plurality of accommodating cavities 101 are circumferentially arranged around the center of the substrate 10, and the corresponding driving assemblies 40 include a first driving motor 401, a driving shaft of the first driving motor 401 is connected with the substrate 10 to drive the substrate 10 to rotate, so as to switch the die body 20 to be tested in the area to be tested, provide the detector 300 with the die body 20 to be tested of a plurality of different materials, and facilitate detection of the die bodies 20 to be tested. In other embodiments, the specific structure of the corresponding driving assembly 40 is not limited to the above description or the drawings, and the switching of the die body 20 to be tested can be realized only, so that the applicability can be adjusted according to the actual requirement.
For example, in other embodiments, referring to fig. 2 and 3, when the plurality of accommodating chambers 101 are arranged along the length direction of the substrate 10; correspondingly, the drive assembly 40 comprises a first conveyor 404 and a second drive motor 402: the first conveyor 404 is extended along the length direction of the substrate 10; the substrate 10 is mounted on the first conveyor 404, and the second driving motor 402 is connected to the first conveyor 404 and is used for driving the first conveyor 404 to rotate, and the first conveyor 404 can drive the substrate 10 to move by rotating, so as to switch different die bodies 20 to be tested to move to the detection area 3001.
Further, referring to fig. 2 and 3, the driving assembly 40 further includes a second conveyor belt 405 and a third driving motor 403, where the second conveyor belt 405 extends along a direction in which the radiation source 200 emits the light beam; the substrate 10 is connected to the second conveyor belt 405, and the third driving motor 403 is used for driving the second conveyor belt 405 to rotate, and the second conveyor belt 405 rotates to drive the substrate 10to move along the direction in which the radiation source 200 emits the light beam, so as to adjust the interval between the die body 20 to be measured and the detector 300, and adjust the projection magnification ratio.
Preferably, the spacing between the phantom 20 and the detector 300 is adjusted such that the projection of the phantom 20 completely covers the detection area 3001, in other words, the projection of the phantom 20 completely covers the usable area of the detector 300. Of course, in other embodiments, the projection magnification ratio may be adjusted according to actual requirements.
Referring to fig. 1 and 2, the measuring apparatus 100 further includes a support base 30, the substrate 10 and the driving assembly 40 are mounted on the support base 30, and the support base 30 is used for carrying the substrate 10 and the driving assembly 40.
The invention also provides an application method based on the K-edge discrimination capability parameter table, which is used for rapidly acquiring the energy threshold parameter of the K-edge imaging of the object to be detected and improving the working efficiency, and comprises the following specific steps:
P1, determining the imaging purpose of K-edge;
P2, determining the material of the object to be detected;
p3, selecting a mass attenuation curve corresponding to the material of the object to be detected according to the material of the object to be detected and the K-edge discrimination capability parameter table;
P4, recommending an energy threshold parameter corresponding to the imaging application of the K-edge of the object to be detected according to the mass attenuation curve of the object to be detected;
And P5, adjusting the energy threshold parameter according to the recommended energy threshold parameter and different application requirements.
The following examples show the guiding function of the K-edge authentication capability parameter table on practical application, and specifically show the calling method of the K-edge authentication capability parameter table in the K-edge imaging protocol:
example 1: k-edge dual-energy silhouette imaging of iodine
Firstly, determining the application of K-edge imaging as K-edge dual-energy silhouette imaging; and secondly, determining the material of the object to be detected as iodine, and selecting a mass attenuation curve of the iodine according to the K-edge discrimination capability parameter table. Referring to fig. 5, the black dotted line in fig. 5 is a theoretical mass decay curve of iodine, and the black solid line is an actual mass decay curve of iodine. According to the mass attenuation curve of iodine, recommending two energy threshold sections above and below the K-edge energy, respectively scanning and imaging in the two energy threshold sections, and then performing weight silhouette imaging; during imaging, the imaging method is used for providing larger attenuation contrast and also giving consideration to the problem of excessive noise caused by too narrow energy threshold segments, so that the recommended energy threshold segments are adjusted according to actual requirements. The energy resolution of the detector 300 used herein is 3keV, a mass attenuation curve corresponding to the iodine material is found according to the K-edge discrimination capability parameter table, the two energy threshold parameter segments of the detector 300 should be recommended to be 23-33keV and 33-43keV, and then the energy threshold of the detector 300 is finely tuned according to the actual imaging requirement.
Example 2: k-edge material decomposition imaging of iodine
Firstly, determining the application of the K-edge imaging application as K-edge material decomposition imaging; and secondly, determining the material of the object to be detected as iodine, and selecting a mass attenuation curve of the iodine according to the K-edge discrimination capability parameter table. With continued reference to fig. 5, according to two energy thresholds above and below the recommended K-edge energy in the mass attenuation curve of iodine, fine tuning is performed on the recommended energy threshold parameters according to actual requirements, and a scanning result containing K-edge information is obtained through testing; and then carrying out material decomposition according to photoelectric absorption, compton effect and K-edge information. When the energy resolution of the detector 300 used herein is 3keV, the two energy thresholds should be recommended to be 25keV and 35keV, and then the energy threshold of the detector 300 is fine-tuned according to the actual imaging requirements.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
The technical features of the above embodiments may be combined in any manner, and for brevity, all of the possible combinations of the technical features of the above embodiments are not described, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
It will be appreciated by persons skilled in the art that the above embodiments have been provided for the purpose of illustrating the invention and are not to be construed as limiting the invention, and that suitable modifications and variations of the above embodiments are within the scope of the invention as claimed.
Claims (7)
1. The application method of the K-edge authentication capability parameter table is characterized by comprising the following steps of:
Adjusting a preset energy threshold of the detector (300); the range of the preset energy threshold is the K-edge theoretical energy value + -30 keV of the die body (20) to be detected;
Selecting a die body (20) to be tested of different materials into a detection area (3001);
identifying the selected die body (20) to be tested;
The detector (300) obtains energy signals of the die body (20) to be detected passing through different materials under different preset energy thresholds;
according to the energy signals, calculating mass attenuation coefficients of the die bodies (20) to be tested of different materials in different preset energy threshold sections to form mass attenuation curves of the die bodies (20) to be tested;
Each die body (20) to be tested tests a comparison die body (50) under the same test conditions as the die body (20) to be tested, and corrects the mass attenuation coefficient of each die body (20) to be tested based on the energy signal of the comparison die body (50);
summarizing the corrected mass attenuation curves of a plurality of die bodies (20) to be tested to form a K-edge discrimination capability parameter table of the detector (300) for different materials;
Determining the K-edge imaging purpose;
Determining the material of an object to be detected;
Selecting a mass attenuation curve corresponding to the material of the object to be detected according to the material of the object to be detected and the K-edge discrimination capability parameter table;
recommending an energy threshold parameter corresponding to the K-edge imaging application of the object to be detected according to a mass attenuation curve corresponding to the material of the object to be detected;
And adjusting the energy threshold parameter according to the recommended energy threshold parameter and different application requirements.
2. The method of claim 1, wherein in the step of adjusting the energy threshold preset by the detector (300), further comprising the steps of: and adjusting the working voltage of the ray source (200), wherein the working voltage is a nominal voltage or the voltage value of the working voltage is 2 times of the theoretical K-edge energy value of the die body (20) to be tested.
3. The method of claim 1, wherein the material of the comparison module (50) is a gas.
4. The method of claim 1, wherein the distance between the phantom (20) to be measured and the detector (300) is adjusted to adjust the projection magnification ratio.
5. The method according to claim 1, wherein in the step of calculating mass attenuation coefficients of the mold bodies (20) to be measured of different materials in different preset energy threshold segments according to the energy signals to form mass attenuation curves of the mold bodies (20) to be measured, fitting the mass attenuation coefficients of each mold body (20) to be measured in different preset energy threshold segments to form mass attenuation curves corresponding to the mold bodies (20) to be measured.
6. The application method of the K-edge discrimination capability parameter table according to claim 1, wherein the die body (20) to be tested comprises a substrate (10) and a material to be tested, a containing cavity (101) is formed in the substrate (10), and the material to be tested is installed in the containing cavity (101).
7. The method of claim 1, wherein different K-edge imaging applications have different noise and/or imaging contrast requirements.
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