CN113931408B - Integrated ground system and construction method thereof - Google Patents

Abstract

The application relates to an integrated ground system and a construction method thereof, wherein the integrated ground system comprises a filling ring, a laying plate and a floor, wherein the filling ring is annular, and sand is filled in the filling ring; the surface of the laying plate is fixedly provided with a boss which can be inserted into the filling ring and is matched with the filling ring. This application has the effect that does benefit to and lays the bottom plate level on blank room cement ground.

Description

Integrated ground system and construction method thereof

Technical Field

The application relates to the field of architectural decoration and laying, in particular to an integrated ground system and a construction method thereof.

Background

The ground integrated system is used as an indispensable unit module for building an integrated house, and has the functions of beautifying and keeping warm at the same time.

The ground integrated system is laid on the cement ground of the blank room, and a common ground integrated system comprises a heating pipeline laid on the cement ground and a floor laid on the heating pipeline.

In view of the above-mentioned related art, the inventors consider that when the floor is laid on a cement floor, unevenness of the cement floor causes the floor to be inclined.

Disclosure of Invention

In order to reduce the possibility of inclination of a floor when the floor is laid on a cement floor, the present application provides an integrated floor system and a construction method thereof.

In a first aspect, the integrated ground system provided by the present application adopts the following technical solutions:

an integrated ground system comprises a filling ring, a laying plate and a floor, wherein sand is filled in the filling ring;

the surface of the laying plate is fixedly provided with a boss, the boss can be inserted into the filling ring, and the boss is matched with the filling ring.

Through adopting above-mentioned technical scheme, pack the ring bonding and cement subaerial, pack the intra-annular sand of going into to packing, increase the input of sand in bonding the intra-annular packing that ground is sunken, make and pack intra-annular sand and be in same level, insert the boss again and establish and pack the intra-annular for all lay the board and be located same level, thereby make the floor that bonds on laying the board can both be located same horizontal plane, and then make the floor water tiling establish blank room cement subaerial.

Optionally, the filling ring is a strip-shaped annular structure.

Through adopting above-mentioned technical scheme, the loop configuration both convenient to use person can fill in the sand to filling the intra-annular, can also insert at the boss and establish in filling the intra-annular after for the boss can not move about at will, promotes the stability in use after the floor installation.

Optionally, a long through groove, a first arc through groove and a second arc through groove, one ends of which are respectively communicated with the long through groove, are formed on the surface of the laying plate away from the boss, and the other ends of the first arc through groove and the second arc through groove are respectively communicated with the side surface of the laying plate;

two are seted up respectively in logical groove of first circular arc and the logical groove of second circular arc, and the arc opening that logical groove of first circular arc and second circular arc led to the groove sets up relatively.

Through adopting above-mentioned technical scheme, heating installation pipeline can bond and lead to the inslot microscopically, and when a plurality of boards of laying splice, two first circular arcs on arbitrary two adjacent boards of laying lead to groove or two second circular arcs lead to the groove, form the semicircle, when heating installation pipeline is the S-shaped and lays, can transfer the direction with heating installation pipeline through the semicircle that forms and lay the microscopically logical inslot on the adjacent board of laying.

Optionally, two ends of the long through groove are respectively communicated with two opposite side surfaces of the laying plate.

Through adopting above-mentioned technical scheme, when a plurality of boards of laying splice, a plurality of microscler logical grooves of laying on the board can communicate for heating installation pipeline can bond in succession on laying the board.

Optionally, the two first circular-arc through slots and the two second circular-arc through slots are symmetrically distributed on two sides of the long through slot in the length direction of the long through slot.

Through adopting above-mentioned technical scheme, when a plurality of boards of laying splice, the logical groove of first circular arc on the adjacent board of laying or the logical groove of second circular arc can communicate and form a semicircle and lead to the groove for heating installation pipeline leads to the turn direction through the semicircle and bonds in microscler logical inslot.

Optionally, the integrated ground system further comprises a heat insulation board, wherein a laying elongated slot for laying a pipeline and a laying arc slot with one end communicated with the laying elongated slot are formed in the heat insulation board, and one end of the laying arc slot, which is far away from the laying elongated slot, is communicated with the side wall of the heat insulation board;

four paving arc grooves are formed, two paving arc grooves are located on the same side of the paving long groove, openings of the two paving arc grooves are arranged oppositely, and the other two paving arc grooves are symmetrically arranged on the other side of the paving long groove by taking the paving long groove as an axis.

By adopting the technical scheme, the heat insulation board is beneficial to improving the heat insulation effect of the integrated ground system, the heating pipeline is laid in the laying long groove, and the direction is turned by laying the arc groove, so that the heating pipeline is laid on the heat insulation board in an S shape.

Optionally, the heated board is provided with a plurality ofly, has seted up half hole on the heated board, and when two heated boards laminating, two half holes form a bar hole, and the packing ring can inlay to be established at the bar downthehole.

Through adopting above-mentioned technical scheme, the packing ring can be placed on the heated board steadily, has reduced the possibility of relative slip between packing ring and the heated board.

In a second aspect, the construction method of the integrated ground system provided by the present application adopts the following technical scheme:

a construction method of an integrated ground system comprises the following construction steps:

the method comprises the following steps: uniformly fixing a plurality of filling rings on the cement ground of the blank room;

step two: filling a proper amount of sand into the filling ring according to whether the cement ground is flat or not;

step three: inserting the boss into the filling ring filled with sand until the laying plate is in a horizontal state;

step four: laying a heating pipeline;

step five: and laying a floor on the laying plate.

Through adopting above-mentioned technical scheme, the sand can keep apart laying plate and cement ground, help improving integrated ground system's heat preservation effect, according to the condition on cement ground, suitably increase or reduce and fill intra-annular sand, make and fill intra-annular sand and can be in same horizontal plane, insert the boss and fill intra-annular, make all laying plates can be in on the same level, and make the laying plate difficult and fill the ring and take place relative slip, bond the heating pipeline on laying plate, lay the floor on laying plate again, make the floor be in the horizontality.

In summary, the present application includes at least one of the following beneficial technical effects:

the packing ring is bonded on the cement ground, sand is filled into the packing ring, the filling amount of the sand is increased in the packing ring bonded at the ground sunken place, the sand in the packing ring is positioned at the same horizontal height, and then the lug boss is inserted into the packing ring, so that all the laying plates are positioned in the same horizontal plane, and the floor bonded on the laying plates can be positioned at the same horizontal plane.

The annular structure is convenient for a user to fill sand into the filling ring, and can also be inserted into the filling ring at the boss, so that the boss cannot move freely, and the use stability of the floor after installation is improved.

Heating installation pipeline can bond and lead to the inslot microscopically, and when a plurality of boards of laying splice, two first circular arcs that arbitrary two adjacent boards of laying lead to groove or two second circular arcs lead to the groove, form the semicircle, when heating installation pipeline is the S-shaped and lays, can transfer the direction with heating installation pipeline through the semicircle that forms and lay the microscopically logical inslot on the adjacent board of laying.

Drawings

Fig. 1 is a schematic diagram of the overall structure of an integrated ground system.

Fig. 2 is a side view of an integrated floor system.

Fig. 3 is a plan view of the laying board.

Fig. 4 is a schematic diagram of a paving slab structure.

Fig. 5 is a schematic view of the overall structure of the integrated floor system in embodiment 2.

Fig. 6 is a side view of the integrated floor system in embodiment 2.

FIG. 7 is a schematic view of the structure of the heat-insulating plate in example 2.

Description of reference numerals: 1. a cement floor; 2. filling the ring; 3. sand; 4. laying a board; 41. a boss; 42. a long through groove; 43. a first arc through groove; 44. a second circular arc through groove; 5. a floor; 6. a thermal insulation board; 61. laying long grooves; 62. paving an arc groove; 63. and (5) half holes.

Detailed Description

The present application is described in further detail below with reference to figures 1-7.

The embodiment of the application discloses an integrated ground system and a construction method thereof.

Example 1:

referring to fig. 1, the integrated floor system includes a packing ring 2 for being bonded to a cement floor 1, a flooring 4 laid on the packing ring 2, and a floor 5 bonded to the flooring 4.

Referring to fig. 1, the floor 5 is formed by splicing a plurality of strip-shaped plates, and the floor 5 can be made of ceramic tiles or wood plates.

Referring to fig. 1, a plurality of packing rings 2 are provided, and the plurality of packing rings 2 are spaced and uniformly distributed on a cement floor 1. The filling rings 2 are strip-shaped annular structures, two ends of each filling ring are processed into arc sections, and the length directions of the filling rings 2 are parallel to each other.

Referring to fig. 2, the inside of the packing ring 2 is filled with sand 3, and the amount of the filled sand 3 is increased in the packing ring 2 at the depression of the cement floor 1 such that the upper surfaces of all the sand 3 are at the same level.

Referring to fig. 3 and 4, a boss 41 is provided on one surface of the laying plate 4, the boss 41 is a strip-shaped plate, both ends of the boss 41 are processed into arc shapes, and the boss 41 is adapted to the inside of the packing ring 2 and can be engaged with the inside of the packing ring 2.

After the boss 41 is clamped into the filling ring 2, the table top of the boss 41 departing from the paving plate 4 is attached to the upper surface of the sand 3, the sand 3 has certain heat absorption capacity, and the paving plate 4 and the cement ground 1 are isolated by the sand 3, so that the integrated ground system has a heat preservation effect.

Referring to fig. 3 and 4, the laying plate 4 is a strip-shaped plate, a long through groove 42 is formed in the surface of the laying plate 4 away from the boss 41, the length direction of the long through groove 42 is parallel to the length direction of the laying plate 4, the length direction of the long through groove 42 coincides with the central line of the laying plate 4, and the two ends of the long through groove 42 are respectively communicated with the end surfaces of the two ends of the laying plate 4.

Referring to fig. 3 and 4, the plate surface of the laying plate 4 provided with the long through groove 42 is further provided with two first circular-arc through grooves 43 and two second circular-arc through grooves 44, and the two first circular-arc through grooves 43 are symmetrically distributed on two sides of the long through groove 42 by taking the long through groove 42 as an axis. The two second circular arc through slots 44 are symmetrically distributed on two sides of the long through slot 42 by taking the long through slot 42 as an axis. The arc opening directions of the first arc through groove 43 and the second arc through groove are opposite, the first arc through groove 43 and the second arc through groove 44 are symmetrical along the central line perpendicular to the length direction of the laying plate 4, and the arc section of the first arc through groove 43 is the same as that of the second arc through groove 44.

Referring to fig. 3 and 4, the two ends of the first circular-arc through groove 43 and the second circular-arc through groove 44 are respectively communicated with the long through groove 42 and the side wall of the laying plate 4 in the length direction.

The implementation principle of the integrated ground system in the embodiment of the application is as follows: bond a plurality of packing rings 2 on cement ground 1, to packing ring 2 internal packing sand 3, according to the unevenness' S on ground condition, increase the income volume of sand 3 in the packing ring 2 of ground depressed place, establish boss 41 card in packing ring 2 again, make a plurality of boards of laying 4 be located same horizontal plane, glue the heating installation pipeline in microscler logical groove 42, when the heating installation pipeline need turn around the direction and lay, can turn around the direction through first circular arc logical groove 43 or second circular arc logical groove 44, make the heating installation water pipe be the S-shaped and lay. The floor 5 is adhered to the heating water pipe.

Example 2:

the present embodiment is different from embodiment 1 in that, referring to fig. 5 and 6, the surface of laying plate 4 facing away from boss 41 is a plane.

Referring to fig. 5 and 6, an integrated floor system further includes an insulation board 6 for being bonded to the cement floor 1.

Referring to fig. 6 and 7, the plurality of heat insulation boards 6 are provided, each heat insulation board 6 is made of a strip-shaped plate, a laying elongated slot 61 is formed in the surface of each heat insulation board 6, which is far away from the cement floor 1, and the length direction of the laying elongated slot 61 is parallel to the length direction of each heat insulation board 6.

Referring to fig. 7, four paving arc grooves 62 are further formed on the surface of the thermal insulation board 6 on which the paving elongated groove 61 is formed, two paving arc grooves 62 are formed on the same side of the paving elongated groove 61, the opening directions of the two paving arc grooves 62 are opposite, another two paving arc grooves 62 symmetrical to each other with the paving elongated groove 61 as an axis are formed on the other side of the paving elongated groove 61, and two ends of each paving arc groove 62 are respectively communicated with the paving elongated groove 61 and the side wall of the thermal insulation board 6.

Referring to fig. 7, two half holes 63 are opened on the surface of the heat insulating plate 6 not opened with the long laying groove 61 and the circular arc laying groove 62, the half holes 63 are half strip-shaped holes, both ends of the half strip-shaped holes are circular arc-shaped, and the two half holes 63 are symmetrical with the long laying groove 61 as an axis.

The heat insulation plate 6 can be an extruded plate or a common foam plate, and the heat insulation plate 6 is beneficial to improving the heat insulation effect of the integrated ground system.

When a plurality of heated boards 6 splice, two on two adjacent heated boards 6 lay circular arc groove 62 and form a half slot, and two half holes 63 form a bar hole, bar hole and 2 adaptations of packing ring.

Heating installation pipeline lays in laying elongated slot 61, and heating installation pipeline can turn the direction through the half slot and lay, makes heating installation pipeline can be the S-shaped and lays on a plurality of heated boards 6, packs ring 2 at the downthehole embedding of bar, after packing ring 2 imbeds the bar hole, packs ring 2 and heated board 6' S upper surface and is located same horizontal plane.

Referring to fig. 5 and 6, the sand 3 is filled in the filling ring 2, and the filling amount of the sand 3 is increased in the filling ring 2 at the recess of the cement floor 1 so that the upper surfaces of all the sand 3 are at the same level, thereby finally maintaining the floor 5 horizontal after the boss 41 is placed in the filling ring 2. In addition, the heating pipeline is laid in the long laying groove 61 and the circular arc laying groove 62, and heat of the heating pipeline is transferred to the sand 3, so that the sand 3 absorbs heat to achieve the heat preservation effect.

The implementation principle of the integrated ground system in the embodiment of the application is as follows: bond heated board 6 on cement ground 1, the user can be according to the actual conditions during the construction, be the S-shaped with heating pipeline and lay in laying elongated slot 61 and laying arc groove 62, again with a plurality of packing ring 2 imbed one by one in the bar hole, pack into sand 3 in the ring 2 to packing, according to the unevenness' S on ground condition, increase the volume of packing of sand 3 in the ring 2 that packs of ground depressed place, again with boss 41 card establish in packing ring 2, make a plurality of boards 4 of laying lie in same horizontal plane, again bond floor 5 on the board 4 of laying.

Example 3:

the embodiment discloses a construction method of an integrated ground, which comprises the following construction steps:

the method comprises the following steps: uniformly fixing a plurality of filling rings 2 on a cement ground 1 of a blank room, or paving a plurality of insulation boards 6 on the cement ground 1, and then arranging the filling rings 2 on the insulation boards 6;

step two: according to whether the cement ground 1 is flat or not, filling a proper amount of sand 3 into the filling ring 2;

step three: inserting the boss 41 into the filling ring 2 filled with sand 3 until the laying plate 4 is in a horizontal state;

step four: heating pipes are laid in the long laying grooves 61 and the circular arc laying grooves 62;

step five: a floor 5 is laid on the laying plate 4.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (2)

1. An integrated floor system, comprising: comprises a filling ring (2), a laying plate (4) and a floor (5), wherein sand (3) is filled in the filling ring (2);

the integrated ground system comprises a plurality of insulation boards (6), wherein bosses (41) are fixedly arranged on the surface of the laying board (4), the bosses (41) can be inserted into the filling rings (2), the bosses (41) are matched with the filling rings (2), laying elongated grooves (61) for laying pipelines and laying arc grooves (62) with one ends communicated with the laying elongated grooves (61) are formed in the insulation boards (6), one ends of the laying arc grooves (62) far away from the laying elongated grooves (61) are communicated with the side walls of the insulation boards (6), the laying arc grooves (62) are four in number, the two laying arc grooves (62) are located on the same side of the laying elongated grooves (61), openings of the two laying arc grooves (62) are oppositely arranged, the other two laying arc grooves (62) are symmetrically arranged on the other side of the laying elongated grooves (61) by taking the laying elongated grooves (61) as an axis, semi-holes (63) are formed in the insulation boards (6), and the strip-shaped holes (2) can be embedded in the filling rings.

2. A construction method applied to the integrated floor system of claim 1, wherein: the method comprises the following construction steps:

the method comprises the following steps: uniformly fixing a plurality of filling rings (2) on a cement floor (1) of a blank room;

step two: according to whether the cement ground (1) is flat or not, filling a proper amount of sand (3) into the filling ring (2);

step three: the boss (41) is inserted into the filling ring (2) filled with the sand (3) until the laying plate (4) is in a horizontal state;

step four: laying a heating pipeline;

step five: a floor (5) is laid on the laying plate (4).

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