CN113927572A - Soldering robot, soldering method and storage medium - Google Patents
Soldering robot, soldering method and storage medium Download PDFInfo
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- CN113927572A CN113927572A CN202111306895.8A CN202111306895A CN113927572A CN 113927572 A CN113927572 A CN 113927572A CN 202111306895 A CN202111306895 A CN 202111306895A CN 113927572 A CN113927572 A CN 113927572A
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- 238000000034 method Methods 0.000 title claims abstract description 51
- 238000003860 storage Methods 0.000 title claims abstract description 15
- 238000003466 welding Methods 0.000 claims abstract description 102
- 229910000679 solder Inorganic materials 0.000 claims description 42
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- 238000012797 qualification Methods 0.000 claims description 7
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
- B25J9/1669—Programme controls characterised by programming, planning systems for manipulators characterised by special application, e.g. multi-arm co-operation, assembly, grasping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
- B25J9/1697—Vision controlled systems
Abstract
The application relates to a soldering robot, a soldering method and a storage medium, comprising: the device comprises a first mechanical arm, a second mechanical arm, a pickup device, a welding device, an image acquisition device and a control device; the image acquisition device is used for acquiring an image of the circuit board to be welded and a welding spot image of the circuit board to be welded under the control of the control device; the control device determines the pose of the circuit board to be welded according to the image of the circuit board to be welded, determines the welding point position of the circuit board to be welded according to the welding point image of the circuit board to be welded, controls the pick-up device on the first mechanical arm to pick up the circuit board to be welded according to the pose of the circuit board to be welded, and controls the welding device on the second mechanical arm to perform soldering on the circuit board to be welded on the pick-up device according to the welding point position of the circuit board to be welded. The application can adapt to the soldering work of circuit board styles of different models, improves the adaptability and flexibility of changing the model of the circuit board and the production, and improves the production efficiency.
Description
Technical Field
The application relates to the technical field of automatic soldering equipment, in particular to a soldering robot, a soldering method and a storage medium.
Background
At present, the updating and upgrading speed of electronic products in the electronic industry is increasing, and the demand for fast changing and replacing production of the electronic products is increasing as the PCB (Printed Circuit Board) is used as an important component of the electronic products and a carrier for electrical connection of electronic components.
Soldering is a welding method in which a low-melting-point metal solder is melted by heating and then penetrates into and fills a gap at a joint of metal parts. At present, the soldering process of most printed circuit boards is finished by adopting special soldering equipment, and the circuit board to be soldered needs to be installed in a clamp before soldering. The jig needs to be positioned and manufactured again for the circuit board subjected to type changing and production changing, certain manpower and time need to be consumed, and the production flexibility and the working efficiency of an automatic production line are limited to a great extent.
Disclosure of Invention
In order to solve the above technical problems or at least partially solve the above technical problems, the present application provides a soldering robot, a soldering method, and a storage medium.
The application provides a soldering robot, which comprises a first mechanical arm, a second mechanical arm, a pickup device, a welding device, an image acquisition device and a control device; the picking device is arranged at the tail end of the first mechanical arm, the welding device is arranged at the tail end of the second mechanical arm, and the control device is electrically connected with the first mechanical arm, the second mechanical arm, the picking device, the welding device and the image acquisition device respectively;
the image acquisition device is used for acquiring an image of the circuit board to be welded and a welding spot image of the circuit board to be welded under the control of the control device;
the control device determines the pose of the circuit board to be welded according to the image of the circuit board to be welded, determines the welding point position of the circuit board to be welded according to the welding point image of the circuit board to be welded, controls the pick-up device on the first mechanical arm to pick up the circuit board to be welded according to the pose of the circuit board to be welded, and controls the welding device on the second mechanical arm to perform tin soldering on the circuit board to be welded on the pick-up device according to the welding point position of the circuit board to be welded.
Optionally, the pick-up device comprises a jaw device and/or a suction cup device.
Optionally, the image capturing device includes a first image capturing device and a second image capturing device, and the first image capturing device is disposed on the pickup device; the first image acquisition device is used for acquiring an image of the circuit board to be welded; the second image acquisition device is arranged on the welding device; the second image acquisition device is used for acquiring a welding spot image of the circuit board to be welded.
Optionally, the soldering robot further comprises a positioning device for the circuit board to be soldered;
optionally, the positioning device of the circuit board to be welded is electrically connected with the control device; the positioning device for the circuit board to be welded is used for detecting whether the circuit board to be welded enters a working area or not; the control device is used for controlling the image acquisition device to execute the operation of acquiring the pose of the circuit board to be welded after the circuit board to be welded enters the working area.
The present application further provides a soldering method, the method comprising:
acquiring an image of a circuit board to be welded through a first image acquisition device, and determining the pose of the circuit board to be welded according to the image of the circuit board to be welded;
controlling a pickup device on a first mechanical arm to pick up the circuit board to be welded according to the pose of the circuit board to be welded;
acquiring a welding spot image of the circuit board to be welded through a second image acquisition device, and determining the welding spot position of the circuit board to be welded according to the welding spot image of the circuit board to be welded;
and controlling a welding device on the second mechanical arm to solder the circuit board to be welded on the pick-up device according to the welding point position of the circuit board to be welded.
Optionally, after the controlling the pick-up device on the first robot arm to pick up the circuit board to be soldered according to the pose of the circuit board to be soldered, the method further includes:
and controlling the first mechanical arm to move the circuit board to be welded to a welding working position, and enabling the surface of the circuit board to be welded, which is provided with the welding spot, to face a specified direction.
Optionally, before the obtaining, by the first image capturing device, an image of the circuit board to be welded and determining the pose of the circuit board to be welded according to the image of the circuit board to be welded, the method further includes:
and detecting whether the circuit board to be welded enters a working area, and executing the operation of acquiring an image of the circuit board to be welded and determining the pose of the circuit board to be welded according to the image of the circuit board to be welded after the circuit board to be welded enters the working area.
Optionally, after controlling the welding device on the second mechanical arm to solder the circuit board to be soldered on the pickup device according to the solder joint position of the circuit board to be soldered, the method further includes: and obtaining a welding spot image of the circuit board to be soldered after soldering, and performing soldering qualification verification according to the welding spot image of the circuit board to be soldered after soldering.
Optionally, after obtaining a welding spot image of the circuit board to be soldered after soldering, and performing a qualified soldering verification according to the welding spot image of the circuit board to be soldered, the method further includes:
optionally, according to the welding spot image after the circuit board to be soldered is soldered, controlling a welding device on the second mechanical arm to repair and solder the circuit board to be soldered, which is unqualified in soldering.
The present application also provides a computer-readable storage medium having stored thereon a computer program which, when being executed by a processor, carries out the steps of the soldering method as described above.
Compared with the prior art, the technical scheme provided by the application has the following advantages:
the application provides a soldering robot, adopts two arms, first arm and second arm to set up pickup apparatus at first arm end, set up welding set at the end of second arm. The image acquisition device is adopted to acquire the image of the circuit board to be welded, and the control device can determine the pose of the circuit board to be welded according to the image of the circuit board to be welded so as to control the pick-up device on the first mechanical arm to pick up the circuit board to be welded. Therefore, special jigs do not need to be manufactured according to different circuit board types, after the circuit board is remodeled, the pose of the circuit board to be welded can be determined in a machine vision mode, and therefore the picking mode of the picking device on the first mechanical arm is adjusted. The image acquisition device is adopted to acquire the welding spot image of the circuit board to be welded, and the control device can determine the welding spot position of the circuit board to be welded according to the welding spot image of the circuit board to be welded so as to control the welding device on the second mechanical arm to perform soldering. Because the welding point position of the circuit board to be welded is determined in a machine vision mode, even if the circuit board is remodeled, the welding point position of the circuit board to be welded can be automatically identified according to the circuit board models of different models, and therefore the soldering process of the welding device of the picking device on the second mechanical arm is adjusted. Therefore, the tin soldering device can adapt to tin soldering work of circuit boards of different models, enhances adaptability and flexibility of quick model changing and production changing of the circuit boards, and improves production efficiency.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the technical solutions in the present application or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for a person skilled in the art to obtain other drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a soldering robot provided by the present application;
fig. 2 is a schematic flow chart of a soldering method provided in the present application.
Detailed Description
In order that the above-mentioned objects, features and advantages of the present application may be more clearly understood, the solution of the present application will be further described below. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in other ways than those described herein; it is to be understood that the embodiments described in this specification are only some embodiments of the present application and not all embodiments. All other embodiments that can be derived by one of ordinary skill in the art from the description of the embodiments are intended to be within the scope of the present disclosure.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
At present, the soldering process of most printed circuit boards is finished by adopting special soldering equipment, and the circuit board to be soldered needs to be installed in a clamp before soldering. The jig needs to be positioned and manufactured again for the circuit board subjected to type changing and production changing, certain manpower and time need to be consumed, and the production flexibility and the working efficiency of an automatic production line are limited to a great extent.
In order to solve the above technical problems or at least partially solve the above technical problems, embodiments of the present application provide a soldering robot, a soldering method, and a storage medium that can adapt to soldering work of different types of circuit board models.
Fig. 1 is a schematic structural diagram of a soldering robot according to an embodiment of the present disclosure, which includes a first robot arm 110, a second robot arm 120, a pickup device 130, a welding device 140, an image capturing device 150, and a control device (not shown in the drawings).
Wherein the pick-up device 130 is located at the end of the first robot arm 110. The welding device 140 is disposed at the end of the second robot arm 120. The control device is electrically connected to the first robot arm 110, the second robot arm 120, the pickup device 130, the welding device 140, and the image capturing device 150, respectively.
The image capturing device 150 is used for acquiring an image of the circuit board 160 to be soldered and a solder joint image of the circuit board 160 to be soldered under the control of the control device. The image capturing device 150 may be disposed on the first robot arm 110 and/or the second robot arm 120, or may be disposed at a position other than the first robot arm 110 and the second robot arm 120, for example, at a fixed position in a work area of a soldering robot. In addition, the embodiments of the disclosure do not limit the types and the number of the image capturing devices 150, for example, RGBD cameras or other types of image capturing devices may be used.
After the control device receives the image of the circuit board to be welded 160 collected by the image collecting device 150, the pose of the circuit board to be welded 160 can be determined according to the image of the circuit board to be welded 160. The embodiment of the present application does not limit the specific manner of determining the pose of the circuit board 160 to be soldered according to the image of the circuit board 160 to be soldered, including but not limited to performing image graying processing, image automatic threshold processing, image morphology processing, image median filtering processing, and the like on the image of the circuit board 160 to be soldered. After the control device determines the pose of the circuit board to be soldered 160, the pick device 130 on the first robot arm 110 may be driven to pick up the circuit board to be soldered 160 according to the pose of the circuit board to be soldered 160. By the arrangement, special jigs do not need to be manufactured according to different circuit board styles, and after the circuit board is reshaped, the corresponding poses of the circuit boards to be welded 160 of different models can be determined in a machine vision mode, so that the picking position and the picking mode of the picking device on the first mechanical arm are correspondingly adjusted, and the adaptability of the soldering robot to rapid reshaping and production changing of the circuit board is improved.
After the control device receives the solder joint image of the circuit board to be soldered 160 collected by the image collecting device 150, the solder joint position of the circuit board to be soldered 160 can be determined according to the solder joint image of the circuit board to be soldered 160. Similarly, the embodiment of the present application does not limit the specific manner of determining the solder joint position of the circuit board to be soldered 160 according to the solder joint image of the circuit board to be soldered 160. After the control device determines the solder joint position of the circuit board 160 to be soldered, the soldering device 140 on the second robot arm 120 may be controlled to perform a soldering operation on each solder joint of the circuit board 160 to be soldered, which is located on the pick device 130, according to the solder joint position of the circuit board 160 to be soldered. By means of the arrangement, the positions of the welding points of the circuit board 160 to be welded are determined in a machine vision mode, so that even if the circuit board is remodeled, the positions of the welding points of the circuit board 160 to be welded can be automatically identified and obtained according to the distribution of the welding points in the circuit boards of different models, and the soldering process of the welding device on the second mechanical arm can be adjusted in real time.
After the circuit board to be welded is grabbed by the pick-up device on the first mechanical arm, the circuit board to be welded does not need to be placed on a fixing tool as in the existing production line. When soldering is performed subsequently, the soldering device 140 on the second robot arm 120 can directly perform a soldering operation on the respective solder points of the circuit board 160 to be soldered located on the pick-up device 130. Therefore, the fixing tool does not need to be arranged. For the circuit board of remodeling and production changing, the fixing tool does not need to be redesigned according to the circuit board of remodeling. In addition, because need not additionally set up the fixed frock of fixedly placing the circuit board of treating welding, consequently can reduce the repetition of treating the circuit board of welding and snatch, for example this application embodiment can save the operation of will treating the circuit board and take away from on the fixed frock of treating the circuit board of fixedly placing after the tin welding. Therefore, the flexibility and the working efficiency of production of an automatic production line are improved while the equipment cost is saved.
It should be noted that the first robot arm 110 and the second robot arm 120 may be any kind of six-axis industrial robot arm capable of moving according to the time-varying requirements of the spatial pose (position and posture), and the industrial robot arm is an anthropomorphic arm, wrist, and hand function mechatronic device.
The welding device 140 may include, for example, a welding power source, a welding control system, a welding torch (clamp), and the like.
In some embodiments, the pick-up device 130 optionally comprises a jaw device and/or a suction cup device.
It can be understood that the pick-up device 130 connected to the end of the first robot arm 110 needs to perform pick-up operations on different types of circuit boards 160 to be soldered, and may be a clamping jaw device of a clamping jaw type, a suction chuck device of a suction clamping type, and further includes the pick-up device 130 for simultaneously mounting the two types of clamping devices together as the circuit boards 160 to be soldered.
By arranging different types of clamping devices as the pickup device 130, flexible application can be performed for different pickup objects, thereby improving the adaptability of the pickup device 130 to different types of circuit board pattern structures.
In other embodiments, the pick-up device 130 may also adopt other forms of structural devices known to those skilled in the art, which can be suitably mounted on a robot arm and can stably pick up the circuit board, and is not limited herein.
In some embodiments, the image capturing device 150 comprises a first image capturing device 151 and a second image capturing device 152, wherein the first image capturing device 151 is disposed on the pickup device 130; the first image acquisition device 151 is used for acquiring an image of the circuit board 160 to be welded; the second image acquisition device 152 is arranged on the welding device 140; the second image capturing device 152 is used for capturing the welding point image of the circuit board 160 to be welded.
By installing the first image acquisition device 151 on the pickup device 130 and installing the second image acquisition device 152 on the welding device 140, the pickup and welding actions of the first mechanical arm 110 and the second mechanical arm 120 can be respectively adjusted in real time according to the acquired images, so that the action accuracy of the soldering robot is further ensured; through setting up mutual independent image acquisition device, reduced the design degree of difficulty of soldering robot's image acquisition and processing.
It should be noted that the image capturing device mainly includes one or more image capturing devices and an image capturing card, and the image capturing devices may be various types of industrial cameras or industrial lenses, such as cameras based on ccd (charge Coupled device) or cmos (complementary Metal Oxide semiconductor) chips.
In some embodiments, optionally, the soldering robot further includes a circuit board to be soldered positioning device for detecting whether the circuit board to be soldered enters the working area. And the circuit board positioning device to be welded is electrically connected with the control device.
It will be appreciated that the positioning means for the circuit board to be soldered may be any kind of correlation or proximity sensor mounted on the working platform of the soldering robot, which triggers the sensor to send an electrical signal to the control means when the circuit board to be soldered enters the working area. Or a positioning device based on image recognition, when the circuit board 160 to be welded enters the working area, the difference between two consecutive frames of images before and after the collection is recognized to detect whether the circuit board 160 to be welded enters the working area, for example, the first image collecting device mounted on the first robot arm 110 may also be used as the positioning device for the circuit board to be welded.
In other embodiments, the positioning device for the circuit board to be soldered may also adopt other structural devices known to those skilled in the art and suitable for detecting whether the circuit board to be soldered 160 enters the working area, and is not limited herein.
The embodiment of the present application further provides a soldering method, which can be used for the soldering robot described in any of the above embodiments, and fig. 2 is a schematic flow chart of the soldering method provided in the embodiment of the present application. The soldering method will be described in detail with reference to fig. 1 and 2, as an example. The soldering method provided by the embodiment of the application comprises the following steps:
s110, obtaining an image of the circuit board to be welded, and determining the pose of the circuit board to be welded according to the image of the circuit board to be welded.
An image of the circuit board to be soldered can be acquired, for example, by the image acquisition device 150. Preprocessing the image of the circuit board to be welded to obtain three-dimensional point cloud data of the circuit board to be welded under a coordinate system of an image acquisition device 150; wherein the preprocessing includes, but is not limited to, target detection and segmentation, key point feature extraction, point cloud denoising, point cloud simplification, point cloud registration, and the like.
Therefore, according to the three-dimensional point cloud data of the circuit board to be welded acquired under the coordinate system of the image acquisition device 150, coordinate transformation is used for determining the pose of the circuit board to be welded based on the coordinate system of the pickup device 130. The pose includes, but is not limited to, three-dimensional space coordinate point information of the circuit board to be welded in the coordinate system and a pose angle relation between the three coordinate axes in the coordinate system.
And S120, controlling a pickup device on the first mechanical arm to pick up the circuit board to be welded according to the pose of the circuit board to be welded.
Acquiring the pose of the circuit board to be welded based on the coordinate system of the pickup device 130, wherein the pose includes but is not limited to the pose of the pickup position of the circuit board to be welded; the control device sends out a control action command according to the pose as a target pose, drives the first mechanical arm 120 to move to the pose of the picking position of the circuit board to be welded, and further controls the picking operation of the picking device 130 on the first mechanical arm 120 on the circuit board to be welded.
It is understood that the pick-up device 130 on the first robot arm 120 may adopt a clamping jaw device of a jaw clamping type or a suction clamping type when picking up the circuit board to be soldered, and further includes mounting the two types of clamping devices at the same time. Specifically, the suction cup device picks up the circuit board to be soldered at the pick-up position by a method including, but not limited to, vacuum suction, and the like, and the jaw device may pick up the circuit board to be soldered at the pick-up position by a gripper capable of adjusting a gripping force. So set up, adopt nimble various mode of picking up to be applicable in the circuit board style structure of different grade type.
S130, obtaining a welding spot image of the circuit board to be welded, and determining the welding spot position of the circuit board to be welded according to the welding spot image of the circuit board to be welded.
The image acquisition device 150 acquires the welding point image of the circuit board to be welded, wherein the welding point image information of the circuit board to be welded includes, but is not limited to, the color, shape, size and the like of each welding point in the circuit board to be welded. And preprocessing the welding spot images of the circuit board to be welded for obtaining the relative position information among the welding spots of the circuit board to be welded in a plane to be welded, wherein the preprocessing comprises but is not limited to target detection and segmentation, key point feature extraction, point cloud denoising, point cloud simplification, point cloud registration and the like.
And S140, controlling a welding device on the second mechanical arm to solder the circuit board to be welded on the pick-up device according to the welding point position of the circuit board to be welded.
It can be understood that the positions of the solder joints of different types of circuit boards to be soldered are not distributed the same, and the soldering device 140 on the second mechanical arm 120 needs to be controlled by the control device to move to the position points of the respective solder joints in the circuit boards to be soldered in sequence for performing the soldering operation.
In the process of controlling the soldering device 140 on the second mechanical arm 120 to perform soldering, soldering working parameters of the soldering device 140 need to be determined according to the shape of the circuit board to be soldered and different positions of each solder joint. Including but not limited to the tin electrode current, the electrode holder stroke, the welding pressure, etc. in the welding device 140.
Alternatively, the image capturing device 150 in the above method steps S110-S140 may include a first image capturing device 151 and a second image capturing device 152, wherein the first image capturing device 151 is disposed on the pickup device 130 for completing the capturing of the image of the circuit board to be soldered in S110; the second image capturing device 152 is disposed on the pickup device 130, and is used for completing the capturing of the solder joint image of the circuit board to be soldered in S130. Therefore, by arranging the image acquisition devices which are mutually independent, the design difficulty of image acquisition and processing of the soldering robot is reduced, and the working reliability of the soldering robot is improved.
In other embodiments, the image capturing device 150 may also adopt other arrangement positions and arrangements known to those skilled in the art to facilitate the pick-up and soldering operations of the circuit boards to be soldered, and is not limited herein.
In some embodiments, after controlling the pickup device 130 on the first robot arm 110 to pick up the circuit board to be soldered according to the pose of the circuit board to be soldered, the method further includes:
and controlling the first mechanical arm 110 to move the circuit board to be welded to a welding working position, and enabling the surface of the circuit board to be welded, which is provided with the welding points, to face a specified direction.
After the pick-up device 130 on the first robot arm 110 is controlled to pick up the circuit board to be welded according to the pose of the circuit board to be welded, the pick-up device 130 on the first robot arm 110 drives the circuit board to be welded to move to a preset welding working position. Then the pick-up device 130 drives the circuit board to be soldered to turn over so that the side of the circuit board to be soldered, on which the solder joint is disposed, faces the designated direction. For example, the side of the circuit board to be soldered, on which the solder joints are provided, is directed upwards. After the arrangement, the first mechanical arm and the pickup device 130 control the circuit board to be soldered to be fixed, so that the second image acquisition device 152 on the second mechanical arm 120 can conveniently acquire the solder joint image of the circuit board to be soldered, the subsequent soldering device on the second mechanical arm can conveniently perform soldering towards the solder joint of the circuit board to be soldered, the time for debugging and positioning the circuit board to be soldered before soldering operation is performed on the circuit board to be soldered is saved, and the production efficiency is improved.
It is understood that the designated orientation may be an orientation that facilitates soldering operation of the circuit board to be soldered, and may also be adjusted in real time according to different positions of each solder joint of the circuit board to be soldered, which is not limited herein.
In some embodiments, before acquiring an image of the circuit board to be soldered by using the first image capturing device 151 on the first robot arm 110, the method further includes:
detecting whether the circuit board to be welded enters a working area or not, executing the operation of obtaining an image of the circuit board to be welded after the circuit board to be welded enters the working area, and determining the pose of the circuit board to be welded according to the image of the circuit board to be welded.
With the arrangement, after the circuit board to be welded enters the working area, the characteristics of the circuit board to be welded can be identified through the positioning device of the circuit board to be welded, the identification information is transmitted to the control device, and then the control device is triggered to drive the first image acquisition device 150 to execute the operation of acquiring the pose image of the circuit board to be welded.
Based on this, the control device accurately triggers the first image acquisition device 151 on the first mechanical arm 110 to execute the operation of acquiring the pose image of the circuit board to be soldered by receiving the identification information of the circuit board to be soldered positioning device, so as to drive the pickup device 130 to complete the pickup action of the circuit board to be soldered in the working area and transfer the circuit board to the soldering working position, thereby further improving the working reliability of the soldering robot.
In some embodiments, optionally, after controlling the welding device 140 on the second mechanical arm 120 to solder the to-be-welded circuit board 160 on the pick device 130 according to the welding point position of the to-be-welded circuit board, the method further includes:
and obtaining a welding spot image of the circuit board to be soldered after soldering, and performing soldering qualification verification according to the welding spot image of the circuit board to be soldered after soldering.
It can be understood that, after the soldering operation is completed, the welding device 140 on the second mechanical arm 120 may obtain the soldering point image of the circuit board after the soldering operation by using the image acquisition device 150, and compare the soldering point image with the soldering point image of the standard circuit board stored in advance, so as to identify and check the corresponding soldering point soldering condition of the circuit board after the soldering operation is completed, so as to ensure the accuracy and reliability of the soldering operation performed by the soldering robot.
In some embodiments, after obtaining a solder joint image after the circuit board to be soldered is soldered, and performing a solder qualification verification according to the solder joint image after the circuit board to be soldered is soldered, the method further includes: and controlling a welding device 140 on the second mechanical arm 120 to repair-weld the unqualified circuit board to be soldered according to the soldering point image after the circuit board to be soldered is soldered.
By comparing with the soldering image of the soldering point of the standard circuit board stored in advance, the control device controls the welding device 140 on the second mechanical arm 120 to complete the repair welding operation on the circuit board with the soldering point missing welding and/or the false welding, so as to further improve the quality of the soldering operation of the soldering robot.
In some embodiments, after obtaining a solder joint image after the circuit board to be soldered is soldered, and performing a solder qualification verification according to the solder joint image after the circuit board to be soldered is soldered, the method further includes: and controlling a pickup device 130 on the first mechanical arm 110 to discard the to-be-soldered circuit board which is unqualified to an unqualified area according to the soldering point image after the to-be-soldered circuit board is soldered.
It can be understood that, by comparing the soldering point image after the circuit board to be soldered is soldered with the soldering point image of the standard circuit board stored in advance, for the circuit board with the soldering point missoldered, the pick-up device 130 on the first mechanical arm 110 is driven by the control device to discard to the unqualified area because the repair soldering cannot be performed, so that the circuit board with unqualified soldering is prevented from entering the next process operation, and the quality of the finished soldering product of the soldering robot is further ensured;
in some embodiments, after obtaining a solder joint image after the circuit board to be soldered is soldered, and performing a solder qualification verification according to the solder joint image after the circuit board to be soldered is soldered, the method further includes: and controlling a pickup device 130 on the first mechanical arm 110 to transfer and place the qualified circuit board to be soldered onto a production line according to the soldering point image of the circuit board to be soldered so as to complete the next process operation.
According to the comparison between the soldering point image of the circuit board to be soldered and the soldering point image of the standard circuit board soldering point stored in the control device in advance, for the circuit board meeting the qualified soldering requirement, the control device is used for driving the pick-up device 130 on the first mechanical arm 110 to transfer the circuit board meeting the qualified soldering requirement to a subsequent production line so as to complete the operation of the next procedure. By the arrangement, the automation of soldering operation is realized, the labor and the time are saved, and the production efficiency of the circuit board is further improved.
In an embodiment of the present application, there is also provided a computer-readable storage medium having stored thereon a computer program or instructions that can implement the steps of the soldering method according to any of the embodiments applied to the soldering robot as described above.
It should be noted that examples of readable storage media include, but are not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatuses, or devices, or any combination thereof. More specific examples (a non-exhaustive list) of the readable storage medium include: an Electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a Read-Only Memory (ROM), an erasable Programmable Read-Only Memory (EPROM), an optical fiber, a portable Compact Disc Read-Only Memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
The storage medium provided by the above-mentioned embodiment of the present application and the soldering method based on the vision system and the two-arm robot provided by the embodiment of the present application have the same advantages as the method adopted, operated or realized by the stored application program or instruction.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A soldering robot, comprising:
the device comprises a first mechanical arm, a second mechanical arm, a pickup device, a welding device, an image acquisition device and a control device;
the picking device is arranged at the tail end of the first mechanical arm, the welding device is arranged at the tail end of the second mechanical arm, and the control device is electrically connected with the first mechanical arm, the second mechanical arm, the picking device, the welding device and the image acquisition device respectively;
the image acquisition device is used for acquiring an image of the circuit board to be welded and a welding spot image of the circuit board to be welded under the control of the control device;
the control device determines the pose of the circuit board to be welded according to the image of the circuit board to be welded, determines the welding point position of the circuit board to be welded according to the welding point image of the circuit board to be welded, controls the pick-up device on the first mechanical arm to pick up the circuit board to be welded according to the pose of the circuit board to be welded, and controls the welding device on the second mechanical arm to solder the circuit board to be welded on the pick-up device according to the welding point position of the circuit board to be welded.
2. A soldering robot according to claim 1, characterised in that the pick up means comprises jaw means and/or suction cup means.
3. A soldering robot according to claim 1, wherein the image capturing device includes a first image capturing device and a second image capturing device, the first image capturing device being provided on the pickup device; the first image acquisition device is used for acquiring an image of the circuit board to be welded; the second image acquisition device is arranged on the welding device; the second image acquisition device is used for acquiring a welding spot image of the circuit board to be welded.
4. The soldering robot according to claim 1, further comprising: a positioning device for the circuit board to be welded;
the circuit board to be welded positioning device is electrically connected with the control device; the positioning device for the circuit board to be welded is used for detecting whether the circuit board to be welded enters a working area or not; the control device is used for controlling the image acquisition device to execute the operation of acquiring the pose of the circuit board to be welded after the circuit board to be welded enters the working area.
5. A soldering method applied to a soldering robot according to any one of claims 1 to 4, the method comprising:
acquiring an image of a circuit board to be welded, and determining the pose of the circuit board to be welded according to the image of the circuit board to be welded;
controlling a pickup device on a first mechanical arm to pick up the circuit board to be welded according to the pose of the circuit board to be welded;
acquiring a welding spot image of a circuit board to be welded, and determining the welding spot position of the circuit board to be welded according to the welding spot image of the circuit board to be welded;
and controlling a welding device on the second mechanical arm to solder the circuit board to be welded on the pick-up device according to the welding point position of the circuit board to be welded.
6. A soldering method according to claim 5, characterized by, after the controlling a pick-up device on the first robot arm to pick up the circuit board to be soldered according to the attitude of the circuit board to be soldered, further comprising:
and controlling the first mechanical arm to move the circuit board to be welded to a welding working position, and enabling the surface of the circuit board to be welded, which is provided with the welding spot, to face a specified direction.
7. A soldering method according to claim 5, characterized by, before acquiring an image of a circuit board to be soldered and determining the pose of the circuit board to be soldered from the image, further comprising:
and detecting whether the circuit board to be welded enters a working area, and executing the operation of acquiring an image of the circuit board to be welded and determining the pose of the circuit board to be welded according to the image of the circuit board to be welded after the circuit board to be welded enters the working area.
8. A soldering method according to claim 5, wherein after controlling the soldering device on the second mechanical arm to solder the circuit board to be soldered on the pick-up device according to the solder joint position of the circuit board to be soldered, the soldering method further comprises:
and obtaining a welding spot image of the circuit board to be soldered after soldering, and performing soldering qualification verification according to the welding spot image of the circuit board to be soldered after soldering.
9. A soldering method according to claim 8, wherein after obtaining an image of a solder joint after the circuit board to be soldered is soldered and performing a solder qualification verification based on the image of the solder joint after the circuit board to be soldered, the soldering method further comprises:
and controlling a welding device on the second mechanical arm to repair and weld the unqualified circuit board to be soldered according to the soldering point image after the circuit board to be soldered is soldered.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 5 to 9.
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| CN202111306895.8A CN113927572A (en) | 2021-11-05 | 2021-11-05 | Soldering robot, soldering method and storage medium |
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Application publication date: 20220114 |