CN113921367B

CN113921367B - Cavity device

Info

Publication number: CN113921367B
Application number: CN202111314061.1A
Authority: CN
Inventors: 杨光
Original assignee: Changxin Memory Technologies Inc
Current assignee: Changxin Memory Technologies Inc
Priority date: 2021-11-08
Filing date: 2021-11-08
Publication date: 2023-07-14
Anticipated expiration: 2041-11-08
Also published as: CN113921367A

Abstract

The application relates to a cavity device, comprising: voltage generating means for generating a radio frequency voltage; the cavity is internally used for placing a substrate to be processed; the upper cover seals the cavity and comprises a gas box, the gas box is conductive, and the inside of the gas box is used for introducing source gas; the conductive base is arranged at the top of the gas tank and comprises at least one capacitor structure and at least one conductive strip, the capacitor structure comprises an outer conductive part and an inner conductive part which are insulated from each other, the outer conductive part is hollow, the inner conductive part is positioned in the hollow of the outer conductive part, the at least one conductive strip is connected through the capacitor structure to form a closed conductive ring structure, and the closed conductive ring structure is in contact with the outer surface of the gas tank; and the conductive connecting part is used for connecting the voltage generating device and the closed conductive ring structure. The film forming quality in the cavity equipment can be effectively improved.

Description

Cavity device

Technical Field

The application relates to the technical field of semiconductor equipment, in particular to cavity equipment.

Background

The cavity apparatus is an apparatus commonly used in semiconductor processing. In some chamber apparatuses, the voltage generating means may release the radio frequency voltage when deposition is performed after the substrate to be processed is introduced into the chamber. The radio frequency voltage is conducted to the conductive gas box and ionizes the source gas in the gas box to generate plasma. The plasma is then emitted into the chamber, ionizing the process gas within the chamber, thereby creating a thin film on the substrate to be processed.

The inventor researches to find whether the ionization in the gas box has an important influence on the film formed by the substrate to be processed. The non-uniformity of ionization may seriously affect the film thickness, yield, impurity particles, etc. of the thin film. While current conventional chamber devices typically contact the conductive gas box from a side point when a radio frequency voltage is applied to the gas box, then release electrical energy. The problem of poor ionization uniformity in the gas box can be caused by releasing electric energy through one side point position, so that the film forming quality on the substrate to be processed is affected.

Disclosure of Invention

Based on this, the embodiment of the application provides a cavity device. The cavity device can improve film forming quality.

A cavity apparatus, comprising:

voltage generating means for generating a radio frequency voltage;

the cavity is internally used for placing a substrate to be processed;

the upper cover is used for sealing the cavity and comprises a gas box, wherein the gas box is conductive and is internally used for introducing source gas;

the conductive base is arranged at the top of the gas tank and comprises at least one capacitor structure and at least one conductive strip, the capacitor structure comprises an outer conductive part and an inner conductive part which are insulated from each other, the inner conductive part is positioned in the hollow of the outer conductive part, the at least one conductive strip is connected through the capacitor structure to form a closed conductive ring structure, and the closed conductive ring structure is in contact with the outer surface of the gas tank;

and the conductive connecting part is used for connecting the voltage generating device with the closed conductive ring structure.

In one embodiment, each of the conductive strips is connected by the outer conductive portion to form a closed conductive loop structure.

In one embodiment, the conductive base includes a plurality of capacitor structures and a plurality of conductive strips, and the conductive connection portion is connected to each of the outer conductive portions.

In one embodiment, each of the conductive strips is connected by the inner conductive portion to form a closed conductive loop structure.

In one embodiment, the conductive base includes a plurality of capacitor structures and a plurality of conductive strips, and the conductive connection portion is connected to each of the inner conductive portions.

In one embodiment, the conductive connection connects the conductive strip.

In one embodiment, the conductive base includes a plurality of capacitor structures and a plurality of conductive strips, and the conductive connection portion is connected to each of the conductive strips.

In one embodiment, the cavity apparatus further comprises:

and the first connecting piece is used for fixing the conducting strip on the top of the gas tank and is in contact with the surface of the gas tank.

In one embodiment, the first connecting piece is used for fixing the conducting strip on the top of the air box and connecting the conducting connecting part with the conducting strip.

In one embodiment, the conductive connection portion is integrally formed with the conductive strip.

In one embodiment, the cavity apparatus further comprises:

and the second connecting piece is used for fixing the inner conductive part on the top of the gas tank.

In one embodiment, the cavity apparatus further comprises:

and the insulating shell is used for coating the conductive base.

In one embodiment, the upper cover further comprises a showerhead in communication with the gas box for injecting plasma into the cavity.

In one embodiment, the cavity apparatus further comprises:

and the base is positioned in the cavity and used for placing the substrate to be processed.

In one embodiment, the base includes a heater,

the cavity equipment is provided with the conductive base at the top of the air box, and the conductive strips of the conductive base are connected through the capacitor structure to form the closed conductive ring structure, and the closed conductive ring structure is contacted with the outer surface of the air box.

Therefore, when the cavity device is used for process manufacturing, radio frequency voltage generated by the voltage generating device is transmitted to the closed conducting ring structure through the conducting connecting part. The closed conductive ring structure is in contact with the outer surface of the gas box so as to uniformly transfer electric energy to various positions of the gas box. Therefore, the gas box for obtaining the radio frequency voltage can uniformly ionize the source gas introduced into the gas box to form plasma, so that the quality of a film formed on a substrate to be processed can be improved effectively.

Meanwhile, the connection part of each conductive strip of the closed conductive ring structure is an outer conductive part or an inner conductive part of the capacitor structure. Therefore, the closed conductive loop structure can effectively filter the radio frequency signal transmitted to the closed conductive loop structure through the capacitor structure, so that the radio frequency voltage applied to the air box is more stable.

Simultaneously, when utilizing a plurality of cavity equipment of this application to carry out the operation simultaneously, can make the radio frequency signal transmission effect on the gas tank of each cavity unanimous, the gas ionization effect in every cavity is almost the same. Therefore, compared with the traditional equipment, the equipment can save a great deal of processing time.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 to 6 are schematic structural views of a cavity arrangement in different embodiments.

Fig. 7 is a schematic diagram illustrating a manner of fixing the inner conductive portion of the capacitor structure 410 in one embodiment.

Reference numerals illustrate:

100-voltage generating device, 200-cavity, 300-upper cover, 310-gas tank, 320-nozzle, 400-conductive base, 410-capacitor structure, 411-outer conductive part, 412-inner conductive part, 420-conductive strip, 500-conductive connection part.

Detailed Description

In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Examples of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first resistance may be referred to as a second resistance, and similarly, a second resistance may be referred to as a first resistance, without departing from the scope of the present application. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

Spatially relative terms, such as "under", "below", "beneath", "under", "above", "over" and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "under" or "beneath" other elements would then be oriented "on" the other elements or features. Thus, the exemplary terms "below" and "under" may include both an upper and a lower orientation. Furthermore, the device may also include an additional orientation (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

It is to be understood that in the following embodiments, "connected" is understood to mean "electrically connected", "communicatively connected", etc., if the connected circuits, modules, units, etc., have electrical or data transfer between them.

As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.

As the background art is said, the film forming quality of the cavity device needs to be improved. The inventors have found that the cause of such a problem is that whether the ionization in the gas box uniformly affects the film formed on the substrate to be processed. The non-uniformity of ionization may seriously affect the film thickness, yield, impurity particles, etc. of the thin film. While current conventional chamber devices typically contact the conductive gas box from a side point when a radio frequency voltage is applied to the gas box, then release electrical energy. And whether the electric energy is uniformly and simultaneously transmitted to all positions of the gas box directly affects the ionized gas degree. The release of electric energy through a side point location cannot ensure that the electric energy can be uniformly transmitted to each position of the gas tank, so that the problem of poor ionization uniformity exists in the gas tank, and the film forming quality on a substrate to be processed is affected.

In addition, in the actual production process, a plurality of machines and a plurality of cavities are usually required to perform operations simultaneously. The mode of releasing electric energy through one side point position can enable the difference of radio frequency signal transmission effects on the air boxes of all the machine stations and all the cavities to be larger. At this time, the quality of the films formed in different machine tables and different cavities is uneven, so that a great amount of manpower and material resources are required to be spent for processing, and various performances (film thickness, yield, impurity particles and the like) of the films formed in each machine table and each cavity are all within the specified standard.

Based on the above, the embodiment of the application provides a cavity device capable of improving film forming quality.

In one embodiment, referring to fig. 1, there is provided a chamber apparatus comprising: the voltage generating device 100, the chamber 200, the upper cover 300, the conductive base 400, and the conductive connection part 500.

The voltage generating device 100 is used for generating a radio frequency voltage. Specifically, the voltage generating apparatus 100 may be disposed outside the cavity 200.

The interior of the chamber 200 is for placing a substrate to be processed and the upper portion may have an opening.

The upper cover 300 may cover the opening of the cavity 200, thereby closing the cavity 200. The upper cover 300 includes an air box 310. The interior of the gas box 310 may be used to introduce source gases. Meanwhile, the gas box 310 is an electrically conductive gas box 310. As an example, the material of the gas box 310 may be an aluminum alloy.

The conductive base 400 is disposed on top of the gas box 310. The conductive base 400 includes at least one of at least one capacitor structure 410 and a conductive strip 420. That is, the number of capacitor structures 410 may be one or a plurality. The number of the conductive bars 420 may be one or more.

The capacitor structure 410 includes an outer conductive portion 411 and an inner conductive portion 412 that are insulated from each other. The outer conductive part 411 is hollow inside. The inner conductive portion 412 is located within the hollow interior of the outer conductive portion 411.

As an example, the outer conductive portion 411 may have a hollow columnar shape such as a hollow square column shape or a columnar shape. The inner conductive part 412 may be rod-shaped to penetrate inside the outer conductive part 411. An insulating medium can be arranged between the two. The shape of the inner conductive part 412 may be adapted to the inner surface of the outer conductive part 411. For example, when the inner surface of the outer conductive portion 411 is cylindrical, the inner conductive portion 412 may have a cylindrical shape.

The conductive strips 420 are connected by the capacitor structure 410 to form a closed conductive loop structure 10. As an example, the conductive strip 420 may be a copper bar or the like.

Specifically, when the conductive strip 420 may connect one capacitor structure 410, it may connect the outer conductive portion 411 of the capacitor structure 410, or may connect the inner conductive portion 412 of the capacitor structure 410. There is no limitation in this regard. Also, when the number of the conductive strips 420 and the capacitor structures 410 is more than one, each of the capacitor structures 410 may be provided to connect each of the conductive strips 420 through the outer conductive portion 411 or the inner conductive portion 412 to form a closed conductive ring structure, or a part of the capacitor structures 410 may be provided to connect the conductive strips 420 through the outer conductive portion 411 and another part of the capacitor structures 410 may be provided to connect the conductive strips 420 through the inner conductive portion 412. There is no limitation in this regard.

The conductive connection part 500 connects the voltage generating device 100 with the closed conductive loop structure 10. Specifically, the conductive connection 500 may be constituted by a conductive rod structure.

The closed conductive loop structure 10 is in contact with the outer surface of the gas box 310 so as to be electrically connected thereto.

Specifically, the conductive strip 420 is in contact with the outer surface of the gas box 310. Meanwhile, a portion (the outer conductive portion 411 or the inner conductive portion 412) of the capacitor structure 410 connected to the conductive strip 420 is in contact with the outer surface of the gas tank 310, and a portion (the inner conductive portion 412 or the outer conductive portion 411) of the capacitor structure 410 not connected to the conductive strip 420 is grounded and is insulated from the outer surface of the gas tank 310.

Therefore, when the cavity apparatus of the present embodiment is used for process manufacturing, a substrate to be processed may be first placed in the cavity 200. The cavity 200 is then sealed by the upper cover 300. Then, the voltage generating device 100 is activated to generate a radio frequency voltage, and the electric energy is transmitted to the closed conductive loop structure 10 through the conductive connection part 500. The closed conductive loop structure 10 contacts the outer surface of the gas box 310 to uniformly transfer the electric power to the various locations of the gas box 310. Therefore, the embodiment can enable the gas box 310 for obtaining the radio frequency voltage to uniformly ionize the source gas introduced into the gas box to form plasma, thereby improving the quality of the film formed on the substrate to be processed.

Meanwhile, the connection portion of each conductive strip 420 of the closed conductive loop structure 10 is the outer conductive portion 411 or the inner conductive portion 412 of the capacitor structure 410. Accordingly, the closed conductive loop structure 10 may effectively filter the radio frequency signal transmitted to the closed conductive loop structure 10 through the capacitor structure 410, thereby making the radio frequency voltage applied to the gas box 310 more stable.

Meanwhile, when a plurality of the chamber apparatuses of the present embodiment are utilized to perform operations simultaneously, the radio frequency signal transmission effects on the gas boxes of the respective chambers 200 can be made uniform, and the gas ionization effect in each chamber 200 is almost the same. Therefore, compared with the conventional apparatus, the apparatus of the present embodiment can be used for production, and a large amount of processing time can be saved.

In one embodiment, the specific shape of the closed conductive loop structure 10 may be annular. In the same region, the circumference is shortest compared with other shapes, so that the radio frequency signal radiation time can be effectively reduced.

Of course, in other embodiments, the specific shape of the closed conductive loop structure 10 may be other closed loop shapes, such as an elliptical loop, or a polygonal loop shape, etc. At this time, the electric energy can be more uniformly transmitted to each position of the gas relative to the conventional equipment, so that the ionization uniformity in the gas box is improved.

In one embodiment, each conductive strip 420 is connected by an outer conductive portion 411 to form a closed conductive loop structure 10, thereby facilitating the fabrication of the conductive base 400.

At this time, each of the conductive strips 420 and the outer conductive portion 411 of each of the capacitor structures 410 are in contact with the outer surface of the gas box 310. While the inner conductive portion 412 of each capacitor structure 410 is grounded and insulated from the outer surface of the gas box 310.

Specifically, as an example, the conductive strip 420 may be connected to the outer surface of the outer conductive part 411. And insulating media may be provided between the inner conductive portion 412 and the gas box 310 and between the outer conductive portion 411.

Here, it is understood that the number of the conductive strips 420 and the capacitor structures 410 may be plural or one. When the conductive strip 420 is one, it may have a non-closed loop shape, and both ends may be connected through the outer conductive portion 411 of one capacitor structure 410.

When the conductive base 400 includes a plurality of capacitor structures 410 and a plurality of conductive strips 420, as an example, referring to fig. 2, conductive connection portions 500 may be provided to be connected to each of the outer conductive portions 411.

In particular, when the conductive base 400 includes a plurality of capacitor structures 410 and a plurality of conductive strips 420, each capacitor structure 410 and each conductive strip 420 may be uniformly distributed on the closed conductive loop structure 10, thereby improving the uniformity of the radio frequency signal transmission.

At this time, the rf signal on the conductive connection portion 500 may flow from each outer conductive portion 411 to the closed conductive loop structure 10, so that the signal on each portion of the closed conductive loop structure 10 is more stable and uniform, and thus the rf energy is more uniformly transmitted to each position of the air box 310.

It will be appreciated that the particular form of the conductive connection 500 in fig. 2 is merely an example, and that other particular forms are possible, without limitation.

Of course, when the conductive base 400 includes a plurality of capacitor structures 410 and a plurality of conductive strips 420, the conductive connection portion 500 may be configured to be connected to only one of the outer conductive portions 411 (see fig. 3). There is no limitation in this regard.

In one embodiment, each conductive strip 420 is connected by an inner conductive portion 412 to form a closed conductive loop structure 10, thereby facilitating the fabrication of the conductive base 400.

At this time, each of the conductive strips 420 and the inner conductive portion 412 of each of the capacitor structures 410 are in contact with the outer surface of the gas box 310. While the outer conductive portion 411 of each capacitor structure 410 is grounded and insulated from the outer surface of the gas box 310.

Specifically, as an example, the outer conductive part 411 may be disposed at a distance from the gas box 310 and the conductive strip 420. The inner conductive portion 412 may pass through the outer conductive portion 411 to connect the conductive strip 420.

Here, it is understood that the number of the conductive strips 420 and the capacitor structures 410 may be plural or one. When the conductive strip 420 is one, it may have a non-closed loop shape, and both ends may be connected through the inner conductive portion 412 of one capacitor structure 410.

When the conductive base 400 includes a plurality of capacitor structures 410 and a plurality of conductive strips 420, as an example, referring to fig. 4, conductive connection portions 500 may be provided to be connected to each of the inner conductive portions 412.

At this time, the rf signals on the conductive connection portion 500 may flow from each inner conductive portion 412 to the closed conductive loop structure 10, so that the signals around the closed conductive loop structure 10 are more stable and uniform, and thus the rf energy is more uniformly transmitted to each position of the air box 310.

Of course, when the conductive base 400 includes a plurality of capacitor structures 410 and a plurality of conductive strips 420, the conductive connection portion 500 may be configured to connect with only one of the inner conductive portions 412 (see fig. 5). There is no limitation in this regard.

In one embodiment, referring to fig. 1, the conductive connection 500 connects the conductive strips 420 such that the rf signal is directed to the closed conductive loop structure 10 via the conductive strips 420.

At this time, the respective conductive strips 420 may be connected to form a closed conductive loop structure through the outer conductive portions 411, or may be connected to form a closed conductive loop structure 10 through the inner conductive portions 412. Alternatively, the closed conductive loop structure 10 may have other forms, without limitation. Meanwhile, the number of the conductive bars 420 and the capacitor structures 410 is not limited in this embodiment.

In one embodiment, referring to fig. 6, the conductive base 400 includes a plurality of capacitor structures 410 and a plurality of conductive strips 420, and the conductive connection portion 500 is connected to each of the conductive strips 420.

At this time, the rf signal on the conductive connection 500 may flow from each conductive strip 420 to the closed conductive loop structure 10, so that the signal on each portion of the closed conductive loop structure 10 is more stable and uniform, and thus the rf energy is more uniformly transmitted to each position of the air box 310.

In one embodiment, the cavity apparatus further comprises a first connector. As an example, the first connection element may in particular be a screw.

The first connector secures the conductive strip 420 to the top of the gas box 310 and is in contact with the surface of the gas box 310. By securing the conductive strips 420, the electrical connection of the closed conductive loop structure 10 to the gas box 310 may be made more reliable.

In one embodiment, the first connector secures the conductive strip 420 to the top of the gas box 310 while also connecting the conductive connection 500 to the conductive strip 420. At this time, the installation process between the conductive connection part 500, the conductive strip 420, and the air box 310 can be simplified.

In one embodiment, the conductive connection 500 is integrally formed with the conductive strip 420. Specifically, when the cavity apparatus includes a plurality of conductive strips 420, the conductive connection part 500 may be connected to each of the conductive strips 420 as a single structure, or may be connected to one or more of the conductive strips 420 as a single structure.

Alternatively, the conductive connection 500 is integrally formed with each of the inner conductive portions 412. Specifically, when the cavity apparatus includes a plurality of capacitor structures 410, the conductive connection part 500 may be connected to each of the inner conductive parts 412 of the respective capacitor structures 410 as a single structure, or may be connected to one or more of the inner conductive parts 412 of the capacitor structures 410 as a single structure.

Alternatively, the conductive connection part 500 is integrally formed with each of the outer conductive parts 411. In particular, when the cavity apparatus includes a plurality of capacitor structures 410, the conductive connection part 500 may be connected to the outer conductive part 411 of each capacitor structure 410 as a single structure, or may be connected to the outer conductive part 411 of one or more of the capacitor structures 410 as a single structure.

The components connected into an integral structure can be formed in a one-time processing and molding process, so that the electrical connection between the conductive connection portion 500 and the closed conductive ring structure 10 can be more reliable in this embodiment.

Of course, in other embodiments, the connection between the conductive connection part 500 and each part (the conductive strip 420, the outer conductive part 411 and the inner conductive part 412) of the conductive base 400 may be performed by welding or the like in addition to the connection with the connection member by integral molding.

In one embodiment, referring to fig. 7, the cavity apparatus further comprises a second connector 600. The second connector 600 secures the inner conductive portion 412 to the top of the gas box 310 so that the relevant portion of the capacitor structure 410 (either the outer conductive portion 411 or the inner conductive portion 412) can make good contact with the gas box 310.

As an example, the second connector 600 may be a screw in particular.

Furthermore, in some embodiments, the inner conductive portion 412 and the outer conductive portion 411 of the capacitor structure 410 may be fixed by different connectors, respectively.

For example, the outer conductive part 411 may be provided in a structure integrally formed with the conductive strip 420 so as to be fixed to the air box 310 together with the conductive strip 420 when the conductive strip 420 is fixed to the air box 310 by the first connector. And the inner conductive part 412 is fixed by the second connector 600. At this time, as an example, the capacitance of the capacitor structure 410 may also be adjusted by adjusting the position of the second connector 600 with respect to the gas box 310, and thus adjusting the distance between the inner conductive portion 412 with respect to the outer conductive portion 411 fixed to the gas box 310. Specifically, when the second connector 600 is a screw, the position of the second connector 600 with respect to the air box 310 may be adjusted by tightening the screw.

In other embodiments, each capacitor structure 410 may be formed separately, and the inner conductive portion 412 and the outer conductive portion 411 may be formed as a unitary structure prior to being mounted to the gas box 310.

In one embodiment, the cavity apparatus further comprises an insulating housing. The insulating housing covers the conductive base 400, so that the conductive base 400 is well insulated and protected.

In one embodiment, the upper cover 300 further includes a showerhead 320. The showerhead 320 communicates with the gas box 310 for injecting plasma into the chamber 200.

Specifically, the source gas in the gas box 310 is ionized under the high-energy rf signal of the gas box 310 to generate plasma. Then, the plasma is uniformly injected into the chamber 200 by the showerhead 320. Then, the process gas in the chamber 200 is ionized by plasma (plasma), thereby forming a thin film on the substrate to be processed in the chamber 200.

The conventional chamber apparatus causes non-uniformity of ionization of the source gas in the gas box 310 due to discharge of electric power through one side point, thereby causing non-uniformity of plasma in the gas box 310, respectively. At this time, an arc phenomenon may be generated on the showerhead 320, thereby affecting the lifetime of the showerhead 320.

In the embodiment of the present application, the closed conductive ring structure 10 contacting with the outer surface of the gas box 310 is formed by providing the conductive base 400, so that the source gas in the gas box 310 is uniformly ionized, and the plasma in the gas box 310 is uniformly distributed. At this time, the arc phenomenon can be effectively generated, which is further beneficial to improving the service life of the nozzle 320.

In one embodiment, the chamber apparatus further comprises a base. The susceptor is positioned within the chamber 200 for placement of a substrate to be processed.

As an example, the base may include a heater. The substrate to be processed may be placed on a heater. The heater is used for properly heating the substrate to be processed, so that the quality of a film formed on the substrate to be processed can be effectively improved.

It should be understood that in the drawings of the above-described related embodiments, the top of the inner conductive portion 412 of each capacitor structure 410 is disposed higher than the surface of the outer conductive portion 411 for easy understanding. However, the embodiments of the present application are not limited thereto. In some embodiments, the top of the inner conductive portion 41 is lower than or equal to the surface of the outer conductive portion 411, which may be more practical.

It should also be understood that the shapes, numbers and location distributions of the inner conductive portions 412, the outer conductive portions 411, the conductive strips 420, etc. in the capacitor structure 410 are merely exemplary, and are not limiting of the present application.

In the description of the present specification, reference to the terms "some embodiments," "other embodiments," "ideal embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims

1. A cavity apparatus, comprising:

voltage generating means for generating a radio frequency voltage;

the cavity is internally used for placing a substrate to be processed;

2. The cavity apparatus of claim 1, wherein each of the conductive strips is connected by the outer conductive portion to form a closed conductive loop structure.

3. The cavity apparatus of claim 2, wherein the conductive base comprises a plurality of capacitor structures and a plurality of conductive strips, the conductive connection being connected to each of the outer conductive portions.

4. The cavity apparatus according to claim 1, wherein each of said conductive strips is connected by said inner conductive portion to form a closed conductive loop structure.

5. The cavity apparatus according to claim 4, wherein the conductive base comprises a plurality of capacitor structures and a plurality of conductive strips, the conductive connection being connected to each of the inner conductive portions.

6. The cavity apparatus of claim 1, wherein the conductive connection connects the conductive strip.

7. The cavity apparatus of claim 6, wherein the conductive base comprises a plurality of capacitor structures and a plurality of conductive strips, the conductive connection being connected to each of the conductive strips.

8. The cavity apparatus of claim 6, wherein the cavity apparatus further comprises:

9. The chamber apparatus of claim 8, wherein the first connector secures a conductive strip to the top of the gas box while also connecting the conductive connection to the conductive strip.

10. The cavity apparatus of claim 1, wherein the conductive connection is of unitary construction with the conductive strip.

11. The cavity apparatus of claim 1, wherein the cavity apparatus further comprises:

12. The cavity apparatus of claim 1, wherein the cavity apparatus further comprises:

and the insulating shell is used for coating the conductive base.

13. The chamber apparatus of claim 1, wherein the upper lid further comprises a showerhead in communication with the gas box for injecting plasma into the chamber.

14. The cavity apparatus of claim 1, wherein the cavity apparatus further comprises:

15. The chamber apparatus of claim 14, wherein the base comprises a heater.