CN113917969B - System and method for improving temperature drift performance of high-precision temperature control circuit - Google Patents
System and method for improving temperature drift performance of high-precision temperature control circuit Download PDFInfo
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- CN113917969B CN113917969B CN202111012005.2A CN202111012005A CN113917969B CN 113917969 B CN113917969 B CN 113917969B CN 202111012005 A CN202111012005 A CN 202111012005A CN 113917969 B CN113917969 B CN 113917969B
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F1/00—Automatic systems in which deviations of an electric quantity from one or more predetermined values are detected at the output of the system and fed back to a device within the system to restore the detected quantity to its predetermined value or values, i.e. retroactive systems
- G05F1/10—Regulating voltage or current
- G05F1/46—Regulating voltage or current wherein the variable actually regulated by the final control device is dc
- G05F1/56—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices
- G05F1/565—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor
- G05F1/567—Regulating voltage or current wherein the variable actually regulated by the final control device is dc using semiconductor devices in series with the load as final control devices sensing a condition of the system or its load in addition to means responsive to deviations in the output of the system, e.g. current, voltage, power factor for temperature compensation
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- Control Of Temperature (AREA)
Abstract
The invention relates to a system and a method for improving temperature drift performance of a high-precision temperature control circuit, which adopts a circuit component form to design, places a bridge precise resistor in a temperature control environment to optimize bridge power supply, a preamplifier and an ARM in the temperature control environment, simultaneously comprises high-power heating devices such as DC-DC and MOS tubes and the like in the temperature control environment, reasonably distributes a system heat source, and splits an integrated temperature control circuit into primary temperature control and secondary temperature control according to different requirements of the temperature environment. The invention reduces the temperature drift of the whole temperature control circuit and solves the problem of reducing the temperature control series by optimizing the layout in a very limited space. The gravity meter testing device can improve the testing performance, the maintenance performance and the reliability of the gravity meter; meanwhile, the method is not only limited to improving the performance of the gravity meter, but also can be widely used for occasions for realizing high-precision temperature control in a limited space.
Description
Technical Field
The invention belongs to the technical field of high-precision temperature control, and particularly relates to a system and a method for improving the temperature drift performance of a high-precision temperature control circuit.
Background
The ocean gravity field information has very important application value in various fields such as ocean resource development, earth science research, battlefield environment construction, combat guarantee and the like. With the gradual advancement of naval development strategy transformation, the construction of the ocean battlefield environment increasingly tightens the requirements for guaranteeing large-scale and high-precision gravity information. Marine gravimetric measurements include subsea gravimetric measurements, sea surface gravimetric measurements, marine aeronautical gravimetric measurements, and satellite marine gravimetric measurements. Among the numerous technical means for detecting the ocean gravity field information, shipborne ocean gravity measurement is the most effective way for acquiring high-precision and high-frequency ocean gravity field information at present, and is particularly suitable for measuring deep water areas in wide sea areas. The gravity measuring instrument is an important component of the development of the marine gravity measuring technology, a typical instrument is a marine gravity instrument, the resolution of the marine gravity instrument widely applied abroad at present can reach 0.01mGAL, and the measuring precision under the general sea condition is better than 1mGAL.
In order to realize the gravity measurement of unmanned boats, unmanned aerial vehicles and unmanned submersible vehicles, a relative gravity meter is required to be equipped, and the volume and the weight of the gravity meter are required to be very high due to extremely narrow carrier space. The given working temperature range in the environment requirement is-20 ℃ to +40 ℃, the span is larger, and each 0.01 ℃ temperature change will generate a gravity output error of about 0.6 mGlul, the standard system overall index, the quasi-static precision is 1 mGlul (1 sigma), the temperature stability of the gravity sensor is required to be better than 0.01 ℃, and a multi-stage temperature control method is generally adopted in a wide temperature range.
According to the past design experience, the temperature control index requirement of-20 ℃ to +40 ℃ which is better than 0.01 ℃ is usually realized by three-stage temperature control, but the temperature control points of the outermost stage are required to be gradually improved, and the temperature in the system when the system works for a long time under the environment temperature of 40 ℃ without heating control is required. In this way, the temperature of the temperature control point of the innermost layer is relatively high, and the working performance of the electronic component in the temperature control environment is affected. Meanwhile, the heating plates and the heat-insulating materials are wrapped step by step, so that the volume and the weight of the equipment can be obviously increased, and the requirement of carrying the equipment by unmanned measuring carriers is not met.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a system and a method for improving the temperature drift performance of a high-precision temperature control circuit, which are used for reasonably distributing temperature-sensitive electronic components and heating components and simultaneously constructing a bridge circuit to reduce the temperature drift of the whole temperature control circuit.
The invention solves the technical problems by adopting the following technical scheme:
a system for improving temperature drift performance of a high-precision temperature control circuit comprises a primary temperature control structure of a gravity meter system and a secondary temperature control structure of a gravity sensor, wherein the primary temperature control structure of the gravity meter system controls the temperature of a servo loop board and a low-power device part of the temperature control board, and the secondary temperature control structure controls the temperature of the gravity sensor.
And moreover, the gravity meter system internally comprises an MOS tube and a DC-DC module, and the MOS tube and the DC-DC module are arranged outside the primary temperature control structure.
Moreover, the low power device parts of the servo loop board and the temperature control board are controlled by an independent primary temperature control structure.
Moreover, the secondary temperature control structure includes: gravity sensor, inlayer temperature control point, temperature acquisition board, outer heating plate, inlayer heating plate, outer temperature control point and gravity sensor installation cavity, gravity sensor's bottom is connected with the gravity appearance system through the support, gravity sensor's top is connected with gravity sensor installation cavity, outer heating plate is adorned in gravity appearance system's inner wall admittedly, inlayer heating plate is installed in gravity sensor support bottom, and keep apart with outer hot plate through ceramic heat insulating pad, inlayer temperature control point sets up on gravity sensor support, outer temperature control point sets up in gravity sensor installation cavity's bottom, temperature acquisition board is adorned in gravity sensor installation cavity side admittedly
And moreover, the temperature acquisition board comprises a temperature control circuit, the temperature control circuit comprises a DC/DC converter, an LDO (low dropout regulator), a temperature measuring bridge circuit, a preamplifier, an ARM chip and a power amplifier, the temperature measuring circuit is respectively connected with an inner temperature control point and an outer temperature measuring point, the temperature measuring circuit, the preamplifier, the ARM chip and the power amplifier are connected in series, the power amplifier is respectively connected with an inner heating plate and an outer heating plate, the output end of the DC/DC converter is connected with the input end of the LDO, and the output end of the LDO is respectively connected with the temperature measuring bridge circuit, the preamplifier and the ARM chip.
Moreover, the DC/DC converter is arranged outside the secondary temperature control structure.
A method of a system for improving the temperature drift performance of a high-precision temperature-controlled circuit, comprising the steps of:
step 1, respectively detecting the current ambient temperature at an inner layer temperature control point and an outer layer temperature control point, and transmitting a temperature signal to a temperature measuring bridge circuit;
step 2, the temperature measuring bridge circuit calculates difference values between the temperatures detected by the inner layer temperature control point and the outer layer temperature control point and the preset inner layer temperature and the preset outer layer temperature, and converts the difference values into voltage signals to be transmitted to the preamplifier;
step 3, amplifying the input voltage signal by a preamplifier and inputting the amplified voltage signal into an ARM chip;
step 4, an A/D conversion module in the ARM chip converts an input voltage signal, and outputs a control signal of a power amplifier through a PWM module in the ARM chip after PID algorithm and data processing;
and 5, controlling the current flowing through the inner heating sheet and the outer heating sheet after receiving the control signal by the power amplifier, and returning to the step 1.
The invention has the advantages and positive effects that:
the invention adopts the circuit assembly form to design, the bridge circuit precise resistor is placed in the temperature control environment to optimize the bridge circuit power supply, the preamplifier and the ARM are all placed in the temperature control environment, and meanwhile, the temperature control environment comprises high-power heating devices such as DC-DC and MOS tubes and the like, and the integrated temperature control circuit is split into primary temperature control and secondary temperature control according to different requirements of the temperature environment in a mode of reasonably distributing the heat source of the system. The invention reduces the temperature drift of the whole temperature control circuit and solves the problem of reducing the temperature control series by optimizing the layout in a very limited space. The gravity meter testing device can improve the testing performance, the maintenance performance and the reliability of the gravity meter; meanwhile, the method is not only limited to improving the performance of the gravity meter, but also can be widely used for occasions for realizing high-precision temperature control in a limited space.
Drawings
FIG. 1 is a diagram of a temperature control portion of the present invention;
FIG. 2 is a diagram of a two-stage temperature control architecture of the present invention;
FIG. 3 is a schematic diagram of a two-stage temperature control circuit according to the present invention;
FIG. 4 is a DC-DC optimized block diagram of the two-stage temperature control bridge of the present invention.
Description of the drawings:
1-a first-stage temperature control structure; 2-a secondary temperature control structure; 3-an inner layer temperature control point; 4-a temperature acquisition plate; 5-an outer layer heating plate;
6-an inner layer heating plate; 7-an outer layer temperature control point; 8-a gravity sensor mounting cavity;
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
A system for improving the temperature drift performance of a high-precision temperature control circuit is shown in figure 1, and comprises a primary temperature control structure 1 of a gravity meter system and a secondary temperature control structure 2 of a gravity sensor, wherein the primary temperature control structure is used for controlling the temperature of a servo loop board and a low-power device part of the temperature control board due to the fact that the temperature control precision of the circuit board is low, and the servo loop board and the low-power device part of the temperature control board are controlled by an independent primary temperature control structure. Through the measures such as optimizing temperature control equipment and optimizing parameters, the primary temperature control structure reaches the full temperature range of 0.031 ℃ (comprising the temperature changing process). Wherein the MOS tube contained in the gravity meter system is arranged outside the primary temperature control structure.
As shown in fig. 2, the secondary temperature control structure performs temperature control on the gravity sensor. The secondary temperature control structure comprises: the gravity sensor, inlayer temperature control point 3, temperature acquisition board 4, outer heating plate 5, inlayer heating plate 6, outer temperature control point 7 and gravity sensor installation cavity 8, gravity sensor's bottom passes through the support and is connected with the gravity appearance system, gravity sensor's top is connected with gravity sensor installation cavity, outer heating plate is adorned in gravity appearance system's inner wall admittedly, inlayer heating plate is adorned admittedly on the support around gravity sensor to keep apart with outer heating plate through ceramic heat insulating pad, inlayer temperature control point sets up on gravity sensor support, outer temperature control point sets up in gravity sensor installation cavity's bottom, temperature acquisition board is adorned admittedly in gravity sensor installation cavity side and is continuous with inlayer temperature control point, outer heating plate, inlayer heating plate and outer temperature control point. Meanwhile, a part of the temperature control circuit in the temperature control acquisition board, which is greatly influenced by temperature, is placed in the secondary temperature control structure so as to improve the influence of temperature drift.
As shown in fig. 3 and 4, the temperature control circuit in the temperature control acquisition board includes: the temperature measuring circuit, the preamplifier, the ARM chip and the power amplifier are connected in series, the power amplifier is respectively connected with the inner heating plate and the outer heating plate, the output end of the DC/DC converter is connected with the input end of the LDO, and the output end of the LDO is respectively connected with the temperature measuring bridge, the preamplifier and the ARM chip. And the DC/DC converter is arranged outside the secondary temperature control structure.
Because the change of the power supply of the temperature acquisition board also directly affects the temperature control precision, the calculation shows that the temperature index of the power supply DC-DC is 10 ppm/DEG C, and if the power supply DC-DC is not in the temperature control environment, the voltage changes:
3.3×10ppm/℃×(40+20)℃＝2.0mV
the temperature point at which 2.0mV is approximately equivalent to 1231Ω as seen across the bridge varies:
2.0mV/(3.3V/(1000+1231)Ω)/3＝0.45Ω
the temperature is calculated to be 0.12 ℃ and 12 times of the temperature control precision of 0.01 ℃, so that the temperature acquisition board DC-DC must be optimally designed, as shown in figure 4. The DC/DC rear connection LDO mode is adopted, and the LDO simultaneously supplies power for the temperature measuring bridge circuit, the preamplifier and the ARM chip. The reference voltage of the operational amplifier is half of the output of the LDO, the reference voltage of the A/D module in the ARM is also supplied to the same LDO, and the temperature digital quantity after A/D conversion is irrelevant to the voltage of the temperature measuring bridge circuit through calculation, so that the temperature control precision is not influenced by the power supply temperature drift of the temperature measuring bridge circuit, the temperature drift performance of a temperature control circuit is greatly improved, and the temperature control precision is improved.
A method of a system for improving the temperature drift performance of a high-precision temperature-controlled circuit, comprising the steps of:
step 1, respectively detecting the current ambient temperature at an inner layer temperature control point and an outer layer temperature control point, and transmitting a temperature signal to a temperature measuring bridge circuit;
step 2, the temperature measuring bridge circuit calculates difference values between the temperatures detected by the inner layer temperature control point and the outer layer temperature control point and the preset inner layer temperature and the preset outer layer temperature, and converts the difference values into voltage signals to be transmitted to the preamplifier;
step 3, amplifying the input voltage signal by a preamplifier and inputting the amplified voltage signal into an ARM chip;
step 4, an A/D conversion module in the ARM chip converts an input voltage signal, and outputs a control signal of a power amplifier through a PWM module in the ARM chip after PID algorithm and data processing;
step 5, after receiving the control signal, the power amplifier controls the current flowing through the inner heating plate and the outer heating plate, and returns to the step 1; along with the smaller and smaller difference between the temperature of the temperature measuring point and the preset temperature, the heating current is smaller and smaller, and finally, the stable heat preservation state is achieved.
It should be emphasized that the examples described herein are illustrative rather than limiting, and therefore the invention includes, but is not limited to, the examples described in the detailed description, as other embodiments derived from the technical solutions of the invention by a person skilled in the art are equally within the scope of the invention.
Claims (2)
1. A system for improving temperature drift performance of a high-precision temperature control circuit is characterized in that: the gravity sensor comprises a first-stage temperature control structure of a gravity meter system and a second-stage temperature control structure of the gravity sensor, wherein the first-stage temperature control structure of the gravity meter system controls the temperature of a servo loop board and a low-power device part of the temperature control board, and the second-stage temperature control structure controls the temperature of the gravity sensor;
the gravity meter system comprises an MOS tube and a DC-DC module, wherein the MOS tube and the DC-DC module are arranged outside the primary temperature control structure;
the low-power device parts of the servo loop board and the temperature control board are controlled by an independent primary temperature control structure;
the secondary temperature control structure comprises: the gravity sensor comprises a gravity sensor, an inner layer temperature control point, a temperature acquisition plate, an outer layer heating plate, an inner layer heating plate, an outer layer temperature control point and a gravity sensor installation cavity, wherein the bottom of the gravity sensor is connected with a gravity meter system through a support, the top of the gravity sensor is connected with the gravity sensor installation cavity, the outer layer heating plate is fixedly arranged on the inner wall of the gravity meter system, the inner layer heating plate is arranged at the bottom of the gravity sensor support and is isolated from an outer layer heating plate through a ceramic heat insulation pad, the inner layer temperature control point is arranged on the gravity sensor support, the outer layer temperature control point is arranged at the bottom of the gravity sensor installation cavity, and the temperature acquisition plate is fixedly arranged on the side edge of the gravity sensor installation cavity;
the temperature acquisition board comprises a temperature control circuit, wherein the temperature control circuit comprises a DC/DC converter, an LDO (low dropout regulator), a temperature measuring bridge circuit, a preamplifier, an ARM chip and a power amplifier, the temperature control point on the inner layer and the temperature measuring point on the outer layer are respectively connected with the temperature measuring circuit, the preamplifier, the ARM chip and the power amplifier are connected in series, the power amplifier is respectively connected with the inner heating plate and the outer heating plate, the output end of the DC/DC converter is connected with the input end of the LDO, and the output end of the LDO is respectively connected with the temperature measuring bridge circuit, the preamplifier and the ARM chip;
the DC/DC converter is arranged outside the secondary temperature control structure.
2. A method of improving the temperature drift performance of a high-precision temperature-controlled circuit as set forth in claim 1, wherein: the method comprises the following steps:
step 1, respectively detecting the current ambient temperature at an inner layer temperature control point and an outer layer temperature control point, and transmitting a temperature signal to a temperature measuring bridge circuit;
step 2, the temperature measuring bridge circuit calculates difference values between the temperatures detected by the inner layer temperature control point and the outer layer temperature control point and the preset inner layer temperature and the preset outer layer temperature, and converts the difference values into voltage signals to be transmitted to the preamplifier;
step 3, amplifying the input voltage signal by a preamplifier and inputting the amplified voltage signal into an ARM chip;
step 4, an A/D conversion module in the ARM chip converts an input voltage signal, and outputs a control signal of a power amplifier through a PWM module in the ARM chip after PID algorithm and data processing;
and 5, controlling the current flowing through the inner heating sheet and the outer heating sheet after receiving the control signal by the power amplifier, and returning to the step 1.
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| CN202111012005.2A CN113917969B (en) | 2021-08-31 | 2021-08-31 | System and method for improving temperature drift performance of high-precision temperature control circuit |
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