CN113917899A - MOM integrated system of semiconductor MES system - Google Patents
MOM integrated system of semiconductor MES system Download PDFInfo
- Publication number
- CN113917899A CN113917899A CN202111165615.6A CN202111165615A CN113917899A CN 113917899 A CN113917899 A CN 113917899A CN 202111165615 A CN202111165615 A CN 202111165615A CN 113917899 A CN113917899 A CN 113917899A
- Authority
- CN
- China
- Prior art keywords
- module
- mom
- semiconductor
- mes
- ocap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000003070 Statistical process control Methods 0.000 claims abstract description 31
- 230000009471 action Effects 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 claims abstract description 12
- 238000012360 testing method Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- 241000953555 Theama Species 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 230000010354 integration Effects 0.000 abstract description 16
- 230000004044 response Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 230000003993 interaction Effects 0.000 description 2
- 230000007175 bidirectional communication Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention provides a MOM integrated system of a semiconductor MES system, which is characterized by comprising the following components: the system comprises a built-in statistical process control SPC module, a real-time scheduler RTD module, an activity manager AMA module and an uncontrolled action plan OCAP module, wherein all the modules are directly called with each other. The integration cost is effectively reduced, the time for ringing is reduced, the time for entering and exiting in the production process is reduced, and the production efficiency is further improved.
Description
Technical Field
The invention relates to an MOM (machine-to-machine) integrated system of a semiconductor MES (manufacturing execution system), belonging to the field of semiconductor manufacturing.
Background
In a semiconductor 12-inch wafer production CIM system, MES, SPC, RTD, AMA and OCAP systems are included to improve the production efficiency and quality. In the latest generation MES system location defined by MESA, these systems all belong to the application layer of MOM (manufacturing Operations management). Since these systems are traditionally provided by different platforms from different vendors, as shown in fig. 4, these systems all need to be integrated via Message Bus, which adds to the complexity of integration and the Overhead of response time to the production process.
Disclosure of Invention
The invention aims to provide a system MOM integrated system of a semiconductor MES, which effectively reduces the integration cost, reduces the response time, reduces the time for entering and exiting in the production process and further improves the production efficiency.
The invention adopts the following technical scheme:
a MOM integrated system for a semiconductor MES system, comprising: the system comprises a built-in statistical process control SPC module, a real-time scheduler RTD module, an activity manager AMA module and an uncontrolled action plan OCAP module, wherein all the modules are directly called with each other.
Further, the MOM integration system of the semiconductor MES system according to the present invention is characterized in that: the MES system allows for the opening or closing and invocation of the statistical process control SPC module, the real time scheduler RTD module, the Activity manager AMA module, and the runaway action plan OCAP module.
Further, the MOM integration system of the semiconductor MES system according to the present invention is characterized in that: and in the test of the MES product, a statistical process control SPC module, a real-time scheduler RTD module, an activity manager AMA module and a runaway action plan OCAP module are added for calling and testing.
Further, the MOM integration system of the semiconductor MES system according to the present invention is characterized in that: the modules are directly called by EJB, and an external message bus MessageBus is not used.
Further, the MOM integration system of the semiconductor MES system according to the present invention is characterized in that: during the inter-module inter-call, a single session connection is maintained with the generic relational database DB.
Further, the MOM integration system of the semiconductor MES system according to the present invention is characterized in that: the ESB, the SPC module, the RTD module, the AMA module and the OCAP module form an EJB pool.
Further, the MOM integration system of the semiconductor MES system according to the present invention is characterized in that: the system also comprises a thread pool and a connection pool which are communicated with the EJB pool.
Further, the MOM integration system of the semiconductor MES system according to the present invention is characterized in that: in the process of inter-module calling, the calling of multiple modules is completed by single submission.
The MOM integrated system of the semiconductor MES system has the following advantages:
(1) interaction among the modules does not need to pass through Message Bus, and the Overhead of external response time is completely eliminated.
(2) The Application Server adds functions to the system by calling between modules, completes integration in advance according to the standard of the product, tests without redesigning in each project, accelerates the online time of new functions, and saves resources. Without new requirements, the resources required for design and integration are reduced to zero.
(3) In the inter-module calling process, Single session connection with DB is kept, multi-module calling is completed by Single Commit, and the problem of Partial Commit cannot occur.
Drawings
FIG. 1 is a schematic diagram of the modularization of SPC, RTD, AMA, OCAP systems.
FIG. 2 is the module business logic.
FIG. 3 is a diagram illustrating the direct call relationship between modules.
Fig. 4 is a schematic diagram of a conventional module inter-calling through a Message Bus.
FIG. 5 is a schematic of the Partial Commit problem.
Detailed Description
The following describes embodiments of the present invention with reference to the drawings.
As shown in fig. 1 to 3, the MOM integrated system of the semiconductor MES system includes a built-in statistical process control SPC module, a real time scheduler RTD module, an activity manager AMA module, and an uncontrolled action plan OCAP module, which are directly called each other.
MES refers to a manufacturing execution system, which is an information hub between planning and production to acquire, analyze and process various products and production related information on a production site in real time. The MES is between the planning layer and the field operation control layer and is mainly responsible for production management and scheduling fulfillment. The MES provides a system integration of quality control, document management, and production scheduling functions on a unified platform by controlling all plant resources including materials, equipment, personnel, process instructions, and facilities. And a large amount of real-time data is collected in the production process, real-time events are processed in time, the bidirectional communication capacity between the planning layer and the production control layer is kept, corresponding data of the upper layer and the lower layer are received, and a processing result and a production instruction are fed back.
The MES system of this embodiment allows for the opening or closing and invocation of the SPC module, RTD module, AMA module, and OCAP module. Modules are called directly from each other in the EJB pool without using an external message bus MessageBus as shown in fig. 4.
During the inter-module inter-call, a single session connection is maintained with the generic relational database DB.
The functions of statistical process control SPC, a real-time scheduler RTD, an activity manager AMA and an uncontrolled action plan OCAP are directly built into the MES system to be used as one of the modules of the MES system, and the protocol of calling among the modules to replace an external Message Bus is used to form the partial function integration of the MOM.
At the module design stage of MES product, statistical process control SPC, real-time scheduler RTD, activity manager AMA and uncontrolled action plan OCAP module are directly added.
The MES function allows the opening or closing and the calling of the SPC, RTD, AMA, OCAP module, and does not use the external Message Bus during the calling process, thereby reducing the Overhead or reducing the Overhead to zero.
In the test of MES product, statistical process control SPC, real time scheduler RTD, activity manager AMA and uncontrolled action plan OCAP module are added for calling test, and in the subsequent project, the test can be started quickly.
Among the modular functions, the Partial Commit probability drops to zero, as shown in fig. 5.
As shown in FIG. 2, the Wildfly platform is used to build the business logic of each module: the EAP of the client or APP sends a request to transmit information to the MES and the database through Nginx and Message Bus.
As shown in fig. 3, the MES system includes: thread Pool, EJB Pool, and connection Pool ConnectionPool. The EJB pool includes Statistical Process Control (SPC), real time scheduler (RTD), Activity Manager (AMA), uncontrolled action plan (OCAP) and MBS modules, and MSG and ESB modules. As shown in FIG. 3, the SPC, RTD, AMA, OCAP and MBS modules all have a direct call connection therebetween. And the thread pool and the connection pool are connected with the EJB pool. In the process of inter-module calling, the calling of multiple modules is completed by single submission.
In this embodiment, interaction between modules does not need to pass through Message Bus, thereby completely eliminating Overhead of external response time, and the Overhead is generated as shown in fig. 4.
The Application Server adds functions to the system by calling between modules, completes integration in advance according to the standard of the product, tests without redesigning in each project, accelerates the online time of new functions, and saves resources. Without new requirements, the resources required for design and integration are reduced to zero.
In the inter-module calling process, Single session connection with DB is kept, multi-module calling is completed by Single Commit, and the problem of Partial Commit cannot occur.
Claims (8)
1. A MOM integrated system for a semiconductor MES system, comprising:
the system comprises a built-in statistical process control SPC module, a real-time scheduler RTD module, an activity manager AMA module and an uncontrolled action plan OCAP module, wherein all the modules are directly called with each other.
2. The MOM integrated system for a semiconductor MES system of claim 1, wherein:
the MES system allows for the opening or closing and invocation of the statistical process control SPC module, the real time scheduler RTD module, the Activity manager AMA module, and the runaway action plan OCAP module.
3. The MOM integrated system for a semiconductor MES system of claim 1, wherein:
and in the test of the MES product, a statistical process control SPC module, a real-time scheduler RTD module, an activity manager AMA module and a runaway action plan OCAP module are added for calling and testing.
4. The MOM integrated system for a semiconductor MES system of claim 1, wherein:
modules are directly called in EJB without using external message bus messageBus.
5. The MOM integrated system for a semiconductor MES system of claim 1, wherein:
during the inter-module inter-call, a single session connection is maintained with the generic relational database DB.
6. The MOM integrated system for a semiconductor MES system of claim 1, wherein:
the ESB, the SPC module, the RTD module, the AMA module and the OCAP module form an EJB pool.
7. The MOM integrated system for a semiconductor MES system of claim 1, wherein:
the system also comprises a thread pool and a connection pool which are communicated with the EJB pool.
8. The MOM integrated system for a semiconductor MES system of claim 5, wherein:
in the process of inter-module calling, the calling of multiple modules is completed by single submission.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111165615.6A CN113917899A (en) | 2021-09-30 | 2021-09-30 | MOM integrated system of semiconductor MES system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111165615.6A CN113917899A (en) | 2021-09-30 | 2021-09-30 | MOM integrated system of semiconductor MES system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113917899A true CN113917899A (en) | 2022-01-11 |
Family
ID=79237908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111165615.6A Pending CN113917899A (en) | 2021-09-30 | 2021-09-30 | MOM integrated system of semiconductor MES system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113917899A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050075748A1 (en) * | 2003-10-02 | 2005-04-07 | International Business Machines Corporation | Method and system for automating issue resolution in manufacturing execution and material control systems |
| CN113327060A (en) * | 2021-06-25 | 2021-08-31 | 武汉慧远智控科技有限公司 | Intelligent factory management system and method thereof |
-
2021
- 2021-09-30 CN CN202111165615.6A patent/CN113917899A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050075748A1 (en) * | 2003-10-02 | 2005-04-07 | International Business Machines Corporation | Method and system for automating issue resolution in manufacturing execution and material control systems |
| CN1614527A (en) * | 2003-10-02 | 2005-05-11 | 国际商业机器公司 | Method and system for automating issue resolution in manufacturing execution and material control systems |
| CN113327060A (en) * | 2021-06-25 | 2021-08-31 | 武汉慧远智控科技有限公司 | Intelligent factory management system and method thereof |
Non-Patent Citations (6)
| Title |
|---|
| 刘敏;严隽薇;: "基于SOA的网格化制造模式及体系结构", 同济大学学报(自然科学版), no. 02, pages 239 - 243 * |
| 王宇波, 司书宾: "基于组件技术的计划调度系统开发服务模型", 中国制造业信息化, no. 04, 10 April 2004 (2004-04-10) * |
| 王诚: "以产能为导向的半导体设备管理系统应用研究", 《中国优秀硕士学位论文全文数据库经济管理科学辑(月刊)》, no. 06, 15 June 2012 (2012-06-15), pages 15 - 43 * |
| 王诚: "以产能为导向的半导体设备管理系统应用研究", no. 06, pages 15 - 43 * |
| 胡剑军等: "一种基于性能模型的中间件自配置架构", 《软件学报》, no. 9, 30 September 2007 (2007-09-30), pages 2117 - 2129 * |
| 蒲加永;邹本振;: "基于RIA模式的小站集中管理信息系统设计", 铁路计算机应用, no. 07, 28 July 2012 (2012-07-28) * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108400917A (en) | A kind of edge calculations gateway and system towards intelligence manufacture | |
| EP1815410A1 (en) | Scheduling system and work order scheduling protocol for such a system | |
| US20060095914A1 (en) | System and method for job scheduling | |
| CN113268319A (en) | Business process customization and distributed process scheduling method based on micro-service architecture | |
| CN102347983A (en) | ESB (Enterprise Service Bus) system in SOA (Service-Oriented Architecture) | |
| CN102156642A (en) | Implementation method and system for universal business process management interfaces | |
| CN111240935B (en) | Automatic intelligent operation and maintenance system and operation and maintenance method | |
| CN104657150A (en) | Automatic operation and maintenance method under cluster environment | |
| CN110611707A (en) | Task scheduling method and device | |
| CN111064672A (en) | Cloud platform communication system, election method and resource scheduling management method | |
| CN111932099A (en) | Marketing business management system and marketing business management method | |
| CN111526049B (en) | Operation and maintenance system, operation and maintenance method, electronic device and storage medium | |
| CN111324460B (en) | Power monitoring control system and method based on cloud computing platform | |
| CN114461355A (en) | Heterogeneous computing cluster unified management method and device, electronic equipment and storage medium | |
| CN115829538A (en) | Terminal operation and maintenance service management system | |
| CN111447096A (en) | Election method and election system based on cloud platform communication system | |
| CN113658351A (en) | Product production method and device, electronic equipment and storage medium | |
| CN113917899A (en) | MOM integrated system of semiconductor MES system | |
| CN112633850A (en) | Method for realizing service flow automation by managing, calling and monitoring RPA robot | |
| CN110636127B (en) | Communication processing method and system between information data | |
| CN111738806A (en) | Cloud manufacturing platform for SMT intelligent manufacturing | |
| CN115509714A (en) | Task processing method and device, electronic equipment and storage medium | |
| CN115017171A (en) | Data processing method and device in multi-time zone scene, electronic equipment and medium | |
| Yurtsever et al. | Computerized manufacturing monitoring and dispatch system | |
| EP1659521A1 (en) | A production scheduling method and system, related computer program product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |