CN113917272B - Electrified aging test device for electronic components - Google Patents

Abstract

The invention relates to an electrified aging test device for electronic components, wherein a box body of the electrified aging test device is divided into a test bin and a data acquisition bin by a heat insulation wall. The heat preservation wall comprises a pair of heat preservation partition plates arranged on the left and right sides, and the thickness of each heat preservation partition plate is smaller than 50 mm. All set up a plurality of slots on the heat preservation baffle, a plurality of slots on a pair of heat preservation baffle meet one-to-one and form a plurality of first through-holes. Electronic components is located the test bin, and the data acquisition board passes the thermal insulation partition board through first through-hole after, links to each other with electronic components, and the rear portion of data acquisition board is located the data acquisition storehouse. The heat-insulating partition board is in interference fit with the data acquisition board. The device has two operating condition, when being in high temperature test state, and the test chamber lets in high-temperature gas, and the temperature is 0 ~ 200 ℃. When the test chamber is in a low-temperature test state, low-temperature gas is introduced into the test chamber at the temperature of-80-0 ℃, and dry gas in the data acquisition chamber enters and is blown, so that the data acquisition chamber is dry and condensed water is not easy to generate.

Description

Electrified aging test device for electronic components

Technical Field

The invention relates to an electrified aging test device for electronic components.

Background

The semiconductor and 5G industries in China are under great support of government policies, sufficient talents are reserved, and the development of enterprises is accelerated under the promotion of great investment. The government has placed and vigorously supported several industries, including semiconductors, as early as 2015 as a key industry in its "chinese manufacturing 2025" program. Especially, in an environment where the 5G communication technology has led to the global market, electronic components such as chips and modules applied to the industries such as communication and semiconductors are very important. Therefore, testing the performance reliability of the electronic device is an essential step.

Among them, the performance test requires checking the chemical change or physical damage of the product caused by expansion with heat or contraction with cold under the continuous environment of extremely high temperature or extremely low temperature. The aging test device is common performance test equipment, a product to be tested is placed in a box body, corresponding performance data of the product to be tested under the condition of extreme temperature is collected through high-temperature and low-temperature power-on test, and finally a defective product in the product to be tested is screened out.

If a common high-low temperature box needs to be subjected to live-line testing, the data acquisition board and electronic components to be tested need to be completely placed in the test bin for testing, the impact on the data acquisition board is very large, the test result can be influenced, the data acquisition board is extremely easy to damage, and the test cost is increased. However, in the conventional live-line aging test box in the prior art, the function is single, and only high-temperature tests can be performed, for example, in the devices disclosed in patent application nos. CN202021232990.9, CN201810494187.3, and CN201911422880.0, the carrier board connected with the product to be tested is disposed in the test chamber, and the data acquisition board is disposed outside the test chamber, and the carrier board and the data acquisition board are separated (formed into two boards), so that the data acquisition board and the electronic component to be tested are in different temperature environments, and then the high-temperature tests can be performed normally. Although the problem of impact of high and low temperature environments on the data acquisition board is solved, the electronic components can be subjected to live aging test only in the high-temperature environment.

If carry out low temperature live test, the temperature of test bin in the box is extremely low, causes the baffle surface temperature to reduce, therefore one side surface of baffle easily because of normal atmospheric temperature gas liquefaction the problem such as comdenstion water, frosting appear, finally damages the data acquisition board, consequently can't carry out low temperature live test.

Further, under the limitation of test requirements, part of electronic components and data acquisition boards need to be directly connected in a butt joint mode, the data acquisition boards need to be integrated, and the integrated data acquisition boards cannot be made into two split boards, namely a carrier board (arranged in the test bin and used for connecting products to be tested) and a data acquisition board (arranged outside the test bin). Further, receive the size restriction of data acquisition board, the baffle thickness in test bin also receives the restriction, can't increase the thermal-insulated effect of heat preservation through increasing baffle thickness. Aiming at the test requirements of such electronic components, a charged aging test device integrating high-temperature and low-temperature charged tests is urgently needed.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a live aging test apparatus.

In order to achieve the purpose, the invention provides the following technical scheme:

the application provides an electrified aging testing device of electronic product, this electrified aging testing device include the box, be located the box and around the test bin and the data acquisition storehouse that set up, separate through the heat preservation wall between test bin and the data acquisition storehouse. The test bin is used for testing electronic components in the test bin.

The electrified aging test device further comprises a plurality of data acquisition boards, a plurality of interfaces used for being connected with electronic components are arranged on the front portions of the data acquisition boards, and a data acquisition circuit is integrally arranged on the rear portions of the data acquisition boards.

The heat preservation wall includes a pair of heat preservation baffle that bilateral symmetry set up, and the thickness of heat preservation baffle is less than 50mm, and this thickness is far less than the heat preservation baffle thickness among the high temperature electrified aging testing device among the prior art to this circuit layout requirement on satisfying the data acquisition board of integration among the aging testing device. A pair of heat preservation baffles are respectively inserted into the box body from the left side and the right side of the box body and are butted. A plurality of slots which are arranged from top to bottom are formed in the pair of heat preservation partition plates, and the slots in the pair of heat preservation partition plates are in one-to-one correspondence to be connected with the left side and the right side of the data acquisition board in an inserting mode. Furthermore, a plurality of slots on a pair of heat preservation baffles are connected in a one-to-one correspondence manner to form a plurality of first through holes, the middle part of the data acquisition board is accommodated in the first through holes, the front part of the data acquisition board is positioned in the test bin, and the rear part of the data acquisition board is positioned in the data acquisition bin, so that the data acquisition circuit on the data acquisition board is prevented from being impacted by high and low temperature tests, and the service life of the data acquisition board is greatly prolonged. Further, interference fit between first through-hole and the data acquisition board to make closely laminate between above-mentioned data acquisition board and the thermal insulation partition plate, reduce the gas loss in the test bin.

The wall of the test bin is provided with a first air inlet connected with the air outlet end of the heat flow instrument and a plurality of air supply channels, one end of each air supply channel is communicated with the first air inlet, and the other end of each air supply channel is communicated with the test bin, so that the heating/cooling efficiency in the test bin is accelerated, and the temperature of each area in the bin is uniformly distributed. The charged aging test device has a high-temperature test state and a low-temperature test state, when the charged aging test device is in the high-temperature test state, the inlet gas of the first gas inlet is high-temperature gas, and the temperature of the high-temperature gas is 0-200 ℃; when the charged aging test device is in a low-temperature test state, the inlet air of the first air inlet is low-temperature gas, and the temperature of the low-temperature gas is-80-0 ℃.

And a second air inlet for dry air to enter is formed in the bin wall of the data acquisition bin. When the electrified aging test device is in a low-temperature test state, the second air inlet is opened, so that dry gas enters and sweeps the data acquisition bin, the data acquisition bin is dried, condensed water is not generated, and the surface of the heat-preservation partition plate is ensured to be frostless.

Preferably, the bin walls on the left side and the right side of the data acquisition bin are provided with second air inlets, dry air blown out by the second air inlets directly blows the heat-insulating partition plate, the distance between the second air inlets and the heat-insulating partition plate in the front-back direction is 3-50mm, and the included angle formed by the gas outflow direction of the second air inlets and the rear side surface of the heat-insulating partition plate ranges from 0 degree to 30 degrees, so that water condensation and frost formation on the rear side surface of the heat-insulating partition plate are effectively prevented.

Preferably, one side of heat preservation baffle towards data acquisition storehouse sets up heating element, and when ageing testing arrangement was in low temperature test state, heating element started to reduce the temperature difference between heat preservation baffle rear side surface and the environment, thereby prevent heat preservation baffle's rear side surface condensate, frost more effectively.

Preferably, the insulating spacer comprises: the heat preservation plate, set up the elastic gasket of both sides around the heat preservation plate, set up the metal sheet in the outside of the elastic gasket of both sides around respectively. The heat preservation plate is provided with a plurality of first grooves arranged from top to bottom, the elastic gasket is provided with a plurality of second grooves arranged from top to bottom, the metal plate is provided with a plurality of third grooves arranged from top to bottom, and the first grooves and the second grooves corresponding to the positions form the slots. And the size of the third groove in the vertical direction is larger than that of the first groove and the second groove. Therefore, when the pair of heat preservation baffles are butted, the heat preservation plates of the pair of heat preservation baffles are butted and abutted against the elastic gaskets, and a gap is reserved between the metal plates of the pair of heat preservation baffles. The data acquisition board is closely attached to the heat insulation partition board due to the arrangement of the three grooves, and no gap is generated, so that no gas leakage exists between the data acquisition board and the heat insulation partition board. Meanwhile, when the adjacent heat-insulation partition plates are butted by the gap between the metal plate and the elastic gasket, gas in the test bin cannot leak along the joints of the heat-insulation partition plates, so that the generation of condensed water is further avoided, and the frostless surface of the heat-insulation partition plates is ensured.

Preferably, a sealing element is arranged at the part of each heat-preservation partition plate connected with the box body, so that gas loss between the heat-preservation partition plates and the box body is reduced.

Preferably, the heat-insulation partition board is connected with the box body through the fastening device, and when the fastening device locks the heat-insulation partition board on the box body, the elastic gaskets are extruded from two sides, so that the two adjacent heat-insulation partition boards are tightly connected without gas leakage.

Preferably, the air supply channels are uniformly arranged on at least one bin wall of the test bin from top to bottom in sequence, so that the temperature of each row of electronic components in the test bin is synchronously increased or decreased, the detection efficiency of the aging test is improved, and the detection result is more accurate.

Preferably, a plurality of handles which are convenient for carrying the live aging test device are arranged on the outer side wall of the live aging test device.

Preferably, a fan is arranged in the data acquisition bin, and when the electrified aging test device is in a low-temperature test state, the fan is started to blow the data acquisition bin, so that the evaporation of liquid on the rear side face of the heat-insulation partition plate is accelerated.

Preferably, the bin wall of the test bin and the bin wall of the data acquisition bin are both provided with air outlets for maintaining stable air pressure in the bin body.

The invention has the beneficial effects that: the electrified aging test device is not limited by the type of the data acquisition board, widens the range of electronic components which can be tested, realizes the high-temperature and low-temperature electrified aging test of the electronic components by adopting the integrated data acquisition board, and widens the range of the electronic components which can be tested; this electrified aging testing device sets up the ultra-thin heat preservation baffle of detachable in box inside, sets up through its structure for when carrying out low temperature aging testing to electronic components, heat preservation baffle rear side surface can not generate the comdenstion water, can not frost. Meanwhile, the data acquisition bin is blown by dry air, so that the humidity in the data acquisition bin can be reduced, the liquid evaporation rate on the surface of the heat-insulating partition plate is accelerated, and the problem that the material is damaged due to condensation water and frosting of the heat-insulating partition plate is further solved. On the other hand, the heating assembly is arranged on the rear side surface of the heat-insulating partition plate, so that the temperature difference between the rear side surface of the heat-insulating partition plate and the environment is further reduced. Meanwhile, the electrified aging test device is not limited by test requirements due to the structure, and the test difficulty is reduced.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.

Drawings

Fig. 1 is a schematic view of an overall structure of an electrified aging test device for an electronic component according to an embodiment of the present invention.

Fig. 2 is a schematic view of an overall structure of the live aging test apparatus for electronic components according to the embodiment of the present invention.

Fig. 3 is a right side view of the live aging test apparatus for electronic components according to the embodiment of the present invention.

Fig. 4 is a left side view of the live aging test apparatus for electronic components according to the embodiment of the present invention.

Fig. 5 is a side view of the internal structure of the live aging test apparatus for electronic components according to the embodiment of the present invention.

Fig. 6 is a schematic view of an internal structure of a test chamber of the live aging test device for electronic components according to the embodiment of the present invention.

Fig. 7 is a sectional view of a thermal insulating spacer of the device for testing charged degradation of electronic components according to the embodiment of the present invention.

Fig. 8 is a schematic structural view of a heat-insulating partition plate of the live-line aging test device for electronic components according to the embodiment of the present invention.

Fig. 9 is an enlarged view of the structure of part a of fig. 8 according to the present invention.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.

Referring to fig. 1 to 6, the present application provides an electrified aging testing device for electronic components, which includes a box 500 and a heat preservation wall disposed inside the box 500, wherein a plurality of handles convenient for carrying the electrified aging testing device are disposed on the side surface of the box 500.

The thermal insulation wall includes at least one pair of thermal insulation partitions 100, and the number of the thermal insulation partitions 100 is 2 in the following description. The pair of thermal insulation partitions 100 are inserted from the left and right sides of the case 500 and detachably connected to the case 500. When the pair of thermal insulation partition plates 100 are inserted into the box body 500, the box body 500 is divided into the test bin 200 and the data collection bin 300 which are arranged in parallel in the front and the back by the pair of thermal insulation partition plates 100. Wherein, the left and right side walls of the box body 500 are provided with second through holes for the heat-insulating partition board 100 to be inserted into. The thickness of the thermal insulation partition board 100 is less than 50mm, which is much less than the thickness of the thermal insulation partition board in the high-temperature live-line aging test device in the prior art, so as to meet the circuit layout requirements on the data acquisition board 420 to be described below.

The charged aging test device further comprises a plurality of data acquisition boards 420, an interface 421 is arranged at the front part of each data acquisition board 420, and the electronic component 410 is inserted into the interface 421 during testing to realize data transmission with the data acquisition boards 420. The data acquisition board 420 is integrated with a data acquisition circuit at the rear for processing and analyzing the acquired data.

For convenience of description, the slots 140 on the left insulating partition 100 are defined as first slots, the slots 140 on the right insulating partition 100 are defined as second slots, and the positions of the first slots and the second slots are in one-to-one correspondence, and correspond to the number of the data acquisition boards 420. After the pair of thermal insulation partition boards 100 is inserted into the box body 500, the corresponding first slot and second slot are respectively inserted into the left and right sides of one data acquisition board 420. Further, the corresponding first slot and the second slot are connected to form a first through hole, and the middle part of the data acquisition board 420 is accommodated in the first through hole, so that the front part of the data acquisition board 420 is located in the test chamber 200, and the rear part of the data acquisition board 420 is located in the data acquisition chamber 300, thereby avoiding the impact of high and low temperature tests on a data acquisition circuit on the data acquisition board 420, and greatly prolonging the service life of the data acquisition board 420. Further, interference fit between the first through hole and the data acquisition board 420 is achieved, so that the data acquisition board 420 is tightly attached to the heat insulation partition board 100, and gas loss in the test chamber 200 is reduced.

Specifically, a first air inlet 210 is disposed on a wall of the test chamber 200, the first air inlet 210 is connected to an air outlet end of the thermal flowmeter, and high-temperature or low-temperature gas is delivered into the test chamber 200 through the thermal flowmeter to reach a temperature required by the test. The charged aging test device has a high-temperature test state and a low-temperature test state, when the charged aging test device is in the high-temperature test state, the inlet gas of the first gas inlet 210 is high-temperature gas, and the temperature of the high-temperature gas is 0-200 ℃; when the charged aging test device is in a low-temperature test state, the inlet gas of the first gas inlet 210 is low-temperature gas, and the temperature of the low-temperature gas is-80 ℃ to 0 ℃.

Further, the wall of the testing chamber 200 is provided with a plurality of air supply channels 220, one end of each air supply channel 220 is communicated with the first air inlet 210, and the other end is communicated with the chamber body of the testing chamber 200. The air supply channels 220 are uniformly arranged on one or more walls of the test chamber 200 from top to bottom, so as to supply the air input from the first air inlet 210 to different positions of the test chamber 200. Preferably, the plurality of air supply channels 220 are uniformly arranged on the left or right bin wall, or the air supply channels 220 may be arranged on both bin walls, so as to increase the air supply efficiency. Further, when a plurality of rows of electronic components 410 to be tested are disposed in the test chamber 200, the air supply channels 220 are disposed above each row of electronic components 410 in a one-to-one correspondence manner, so that the temperatures of the electronic components 410 in the test chamber 200 are consistent, and the heating and cooling efficiencies in the test chamber 200 are greatly improved.

The data collection bin 300 is provided with a second air inlet 310, the second air inlet 310 is used for allowing dry air to enter the data collection bin 300, when the electrified aging test device is in a low-temperature test state, the second air inlet 310 is opened to blow and sweep the data collection bin 300, so that the data collection bin 300 is kept dry, no condensate water is generated, and the rear side of the heat-insulating partition plate 100 is guaranteed to be frostless.

Further, the bin walls on the left side and the right side of the data collection bin 300 are provided with second air inlets 310, dry air blown out by the second air inlets 310 directly sweeps the heat-insulating partition plate 100, the distance range between the second air inlets 310 and the heat-insulating partition plate 100 in the front-back direction is 3 mm-50 mm, the included angle range between the air inlet direction in the second air inlets 310 and the rear side surface of the heat-insulating partition plate 100 is 0-30 degrees, and therefore water condensation and frosting of the rear side surface of the heat-insulating partition plate 100 are effectively prevented.

Preferably, a fan 320 is further disposed in the data collection bin 300 to accelerate the flow rate of the dry gas in the data collection bin 300, and increase the evaporation rate of the liquid on the surface of the heat insulation partition board 100, so as to more effectively prevent the water condensation and frost formation on the rear side surface of the heat insulation partition board 100.

Preferably, the walls of the test chamber 200 and the data collecting chamber 300 are provided with gas outlets 430 for gas to flow out, so that the gas pressure in the test chamber 200 and the data collecting chamber 300 is stable. Further, the test chamber 200 and the data collection chamber 300 are provided with chamber doors for taking articles in the chamber, and further, the chamber doors of the test chamber 200 are heat-insulating doors. Preferably, an observation window is arranged on a bin door of the test bin 200, so that an operator can observe the internal condition conveniently. Furthermore, the material of observation window is the transparent material that has the heat preservation effect. Since the side wall structure of the box 500 of the live weathering test apparatus is the prior art, this is not specifically defined and described in the present application.

Referring to fig. 7 to 9, each insulation partition 100 includes an insulation board 110, elastic spacers 120 disposed on front and rear surfaces of the insulation board 110, and metal plates 130 disposed on outer surfaces of the elastic spacers 120. Specifically, the heat insulation board 110 has a plurality of first grooves arranged from top to bottom, the elastic pad 120 has a plurality of second grooves arranged from top to bottom, and the metal plate 130 has a plurality of third grooves arranged from top to bottom. And the positions of the first groove, the second groove and the third groove are all in one-to-one correspondence. The first slot and the corresponding second slot together form the slot 140. Wherein the third groove is larger than the first groove and the second groove in the vertical direction. For convenience of description, a distance between upper and lower sidewall walls of the third groove is defined as a first distance, a distance between upper and lower sidewall walls of the second groove is defined as a second distance, and a distance between upper and lower sidewall walls of the third groove is defined as a third distance. That is, the first distance is equal to the second distance, and the third distance is greater than the second distance and the first distance. The arrangement of the first distance and the second distance being smaller than the third distance makes the edge of the elastic pad 120 not covered by the metal plate 130, so that the edge of the elastic pad 120 is exposed in the bin environment. Therefore, when the data acquisition board 420 is inserted into the slots 140 of the thermal insulation partition board 100, the first through holes formed by the connection of the pair of slots 140 form an interference fit with the data acquisition board 420, thereby avoiding the loss of high-temperature gas or low-temperature gas in the test chamber 200.

Preferably, a heating unit is disposed on the rear side surface of the thermal insulation partition 100, and when low-temperature gas enters the test chamber 200, the heating unit is activated to increase the temperature of the rear side surface of the thermal insulation partition 100, thereby further preventing condensation and frost from occurring on the rear side surface of the thermal insulation partition 100. Optionally, the heating assembly is any product, device, or apparatus capable of performing a heating function in the prior art, such as a heating wire, a heating pad, a heating resistor, and the like, and the application is not limited to the heating assembly.

Preferably, the pair of thermal insulation partition boards 100 are both vertically arranged, and the pair of thermal insulation partition boards 100 are arranged in a left-right manner. At the joint of the pair of heat insulation partition boards 100, the elastic pad 120 and the heat insulation board 110 both extend away from the body thereof, so that the edge of the elastic pad 120 is exposed. For example, the right edges of the heat insulating plate 110 and the elastic pad 120 in the left heat insulating partition plate 100 extend to the right, and the left edges of the heat insulating plate 110 and the elastic pad 120 in the right heat insulating partition plate 100 extend to the left. When two left and right insulation baffle 100 dock mutually, the side of two left and right insulation baffle 100 inside elastic gasket 120 offsets, and the side of two inside heated boards 110 of two left and right insulation baffle 100 offsets, avoids arousing the high temperature gas or the low temperature gas loss in the test bin 200 to avoid congealing, frosting.

Preferably, the elastic gasket 120 and the sealing member are made of elastic elastomer material such as silicone rubber or rubber. Further, any material with a thermal coefficient less than or equal to 0.12 in the prior art of the material of the insulation board 110 in the insulation partition board 100 is preferably a high-density polyurethane foam insulation board 110.

Further, when the thermal insulation partition 100 is inserted into the box body 500, a fastening device is disposed on a side surface exposed outside the box body 500, and the fastening device is used for fastening the thermal insulation partition 100 to the box body 500. Simultaneously, when the tight spiral-lock device with heat preservation baffle 100 and box 500 looks interlocking regularly, all inwards extrude a pair of heat preservation baffle 100, finally inwards extrude resilient pads 120 and heated board 110 in the horizontal direction to make zonulae occludens between a pair of heat preservation baffle 100, so that gas in test chamber 200 can't reveal through the gap between the adjacent heat preservation baffle 100, further avoid appearing revealing the heat preservation baffle 100 trailing flank temperature reduction that arouses because of air conditioning. Optionally, the fastening device is any structure capable of achieving a tightening function in the prior art, such as a screw, a bolt, a handle lock, and the like, and the application is not limited. Further, a sealing member is provided at a junction of each thermal insulation partition 100 and the case 500 to increase sealing performance of the case 500.

Preferably, a handle for facilitating the extraction of the thermal insulation partition 100 is also disposed on one side of the thermal insulation partition 100 exposed outside the box body 500, and the handle is preferably a hidden handle, and the disposition manner of the handle is not particularly limited in the present application. Further, the handle is any product capable of achieving the functions in the prior art, and the specific structure of the handle is not limited in any way in the application.

This electrified aging testing device's working process:

when the charged aging test device is in a high-temperature test state, the first air inlet 210 is opened, the air is high-temperature gas with the temperature of less than or equal to 200 ℃, and the second air inlet 310 is in an opened or closed state. At this time, the temperature in the test chamber 200 rises, and the data acquisition board 420 acquires the data of the electronic component 410 in the high-temperature test state.

When the charged aging test device is in a low-temperature test state, the first air inlet 210 is opened, and the inlet air is low-temperature gas with the temperature of more than or equal to minus 80 ℃. Meanwhile, the second air inlet 310 is opened, the dry air enters, and the fan 320 is started to blow the inside of the data collection bin 300, so that the humidity in the data collection bin 300 is reduced, and the evaporation of the liquid on the rear side surface of the heat insulation partition plate 100 is accelerated. On the other hand, when the charged aging test device is in a low-temperature test state, the heating assembly is turned on to heat the rear side surface of the heat-insulating partition plate 100, so that the difference between the temperature of the rear side surface of the heat-insulating partition plate 100 and the ambient temperature in the data collection bin 300 is greatly reduced, and condensation water and frosting caused by the temperature reduction of the rear side surface of the heat-insulating partition plate 100 are further avoided. At this time, the temperature in the test chamber 200 is reduced, the temperature of the rear side surface of the thermal insulation partition plate 100 does not change, and the rear side surface of the thermal insulation partition plate 100 has no condensed water or frost, so that the data acquisition board 420 is not easily damaged or fails when acquiring the low-temperature test state data of the electronic component 410.

In summary, the live aging test device for the electronic component in the embodiment is not limited by the type of the data acquisition board, and widens the range of the electronic component capable of being tested, so that the high-temperature and low-temperature live aging test of the electronic component by using the integrated data acquisition board is realized, and the range of the electronic component capable of being tested is widened; this electrified aging testing device sets up the ultra-thin heat preservation baffle of detachable in box inside, sets up through its structure for when carrying out low temperature aging testing to electronic components, heat preservation baffle rear side surface can not generate the comdenstion water, can not frost. Meanwhile, the data acquisition bin is blown by dry air, so that the humidity in the data acquisition bin can be reduced, the liquid evaporation rate on the surface of the heat-insulating partition plate is accelerated, and the problem that the material is damaged due to condensation water and frosting of the heat-insulating partition plate is further solved. On the other hand, the heating assembly is arranged on the rear side surface of the heat-insulating partition plate, so that the temperature difference between the rear side surface of the heat-insulating partition plate and the environment is further reduced. Meanwhile, the electrified aging test device is not limited by test requirements due to the structure, and the test difficulty is reduced.

In the description of the orientation of the present application, the description is made with reference to the normal use of the charged deterioration testing apparatus. The use of the insulating spacer as a reference to define the side of the test chamber as "front" and the side of the data acquisition chamber as "back" is for ease of describing and simplifying the present invention, and is not intended to indicate or imply that the device or component referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the present invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. An electrified aging test device for electronic components comprises a box body (500), a test bin (200) and a data acquisition bin (300), wherein the test bin (200) and the data acquisition bin (300) are positioned in the box body (500) and are arranged in front and at the back, the test bin (200) and the data acquisition bin (300) are separated by a heat insulation wall, and the test bin (200) is used for testing the electronic components (410) in the test bin; the electrified aging test device is characterized by further comprising a plurality of data acquisition boards (420), wherein the front parts of the data acquisition boards (420) are provided with interfaces (421) used for connecting the electronic components (410), and the rear parts of the data acquisition boards (420) are integrated with data acquisition circuits;

the heat-insulation wall comprises a pair of heat-insulation partition plates (100) which are arranged in a bilateral symmetry mode, the thickness of each heat-insulation partition plate (100) is smaller than 50mm, and the heat-insulation partition plates (100) are inserted into the box body (500) from the left side and the right side of the box body (500) and are in butt joint with each other; a plurality of slots (140) are formed in each of the pair of heat-insulating partition plates (100) from top to bottom, the plurality of slots (140) in each of the pair of heat-insulating partition plates (100) are correspondingly and respectively inserted into the left side and the right side of each data acquisition board (420), the corresponding slots (140) in each of the pair of heat-insulating partition plates (100) are connected to form a first through hole for accommodating the middle of each data acquisition board (420), the front part of each data acquisition board (420) is located in the test bin (200), the rear part of each data acquisition board (420) is located in the data acquisition bin (300), and the first through hole is in interference fit with the data acquisition boards (420);

the wall of the test bin (200) is provided with a first air inlet (210) connected with the air outlet end of the heat flow instrument, and a plurality of air supply channels (220) with one end communicated with the first air inlet (210) and the other end communicated with the test bin (200);

a second air inlet (310) for dry air to enter is formed in the bin wall of the data acquisition bin (300);

the charged aging test device has a high-temperature test state and a low-temperature test state, when the charged aging test device is in the high-temperature test state, the inlet air of the first air inlet (210) is high-temperature gas, and the temperature of the high-temperature gas is 0-200 ℃; when the charged aging test device is in a low-temperature test state, the air inlet of the first air inlet (210) is low-temperature gas, the temperature of the low-temperature gas is-80-0 ℃, and the second air inlet (310) is opened.

2. The charged aging test device for the electronic components as claimed in claim 1, wherein the second air inlets (310) are disposed on the walls of the left and right sides of the data collection bin (300), the distance between the second air inlets (310) and the heat-insulating partition plate (100) in the front-back direction is 3 mm-50 mm, and the included angle formed between the air outlet direction of the second air inlets (310) and the rear side surface of the heat-insulating partition plate (100) is 0-30 °.

3. The device for testing the charged aging of the electronic components as claimed in claim 1, wherein a side of the heat-insulating partition board (100) facing the data collection bin (300) is provided with a heating assembly, and the heating assembly is started when the device for testing the charged aging is in a low-temperature testing state.

4. The device for testing the charged aging of electronic components as claimed in claim 1, wherein the thermal insulating partition (100) comprises: the heat insulation plate comprises a heat insulation plate (110), elastic gaskets (120) arranged on the front side and the rear side of the heat insulation plate (110), and metal plates (130) respectively arranged on the outer sides of the elastic gaskets (120) on the front side and the rear side; the heat insulation plate (110) is provided with a plurality of first grooves which are arranged from top to bottom, the elastic gasket (120) is provided with a plurality of second grooves which are arranged from top to bottom, the metal plate (130) is provided with a plurality of third grooves which are arranged from top to bottom, and the first grooves and the second grooves corresponding to the positions of the first grooves form the slots (140); the size of the third groove in the vertical direction is larger than that of the first groove and the second groove; when the pair of heat preservation partition plates (100) are butted, the heat preservation plates (110) of the pair of heat preservation partition plates (100) are butted and abutted against the elastic gaskets (120), and a gap is formed between the metal plates (130) of the pair of heat preservation partition plates (100).

5. The device for testing the charged aging of electronic components as claimed in claim 4, wherein the thermal insulation partition boards (100) are detachably inserted into the box body (500), and when the pair of thermal insulation partition boards (100) are inserted into the box body (500) and butted, each thermal insulation partition board (100) and the box body (500) are locked with each other by a fastening device.

6. The device for the charged aging test of the electronic components as claimed in claim 1, wherein a sealing member is provided at a portion of each of the thermal insulating partition plates (100) connected to the case (500).

7. The device for the charged aging test of the electronic components as claimed in claim 1, wherein the plurality of air supply channels (220) are uniformly arranged on at least one chamber wall of the test chamber (200) from top to bottom in sequence.

8. The device for testing the charged aging of electronic components as claimed in claim 1, wherein a plurality of handles for carrying the device are disposed on the outer side wall of the box (500).

9. The device for the charged aging test of electronic components as claimed in claim 1, wherein a fan (320) is disposed in the data collection chamber (300).

10. The electrified aging test device for electronic components as claimed in claim 1, wherein the wall of the test chamber (200) and the wall of the data collection chamber (300) are both provided with air outlets (430) for maintaining stable air pressure in the chamber.

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