CN113909155A - Cutting detection method of LED circuit board and LED circuit board structure - Google Patents

Cutting detection method of LED circuit board and LED circuit board structure Download PDF

Info

Publication number
CN113909155A
CN113909155A CN202111165305.4A CN202111165305A CN113909155A CN 113909155 A CN113909155 A CN 113909155A CN 202111165305 A CN202111165305 A CN 202111165305A CN 113909155 A CN113909155 A CN 113909155A
Authority
CN
China
Prior art keywords
circuit board
ink
full
led display
led circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202111165305.4A
Other languages
Chinese (zh)
Other versions
CN113909155B (en
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hubei Xinying Photoelectric Co ltd
Original Assignee
Hubei Xinying Photoelectric Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hubei Xinying Photoelectric Co ltd filed Critical Hubei Xinying Photoelectric Co ltd
Priority to CN202111165305.4A priority Critical patent/CN113909155B/en
Publication of CN113909155A publication Critical patent/CN113909155A/en
Application granted granted Critical
Publication of CN113909155B publication Critical patent/CN113909155B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C2301/00—Sorting according to destination
    • B07C2301/0008—Electronic Devices, e.g. keyboard, displays

Abstract

The application discloses a cutting detection method of an LED circuit board and an LED circuit board structure, relating to the technical field of LEDs and comprising the following steps: covering the LED circuit board with ink once, covering the metal via holes and the metal wires of the LED circuit board, and not covering the bonding pads; the primary ink on the front sides of the adjacent full-color LED display structures are not connected, and in a single full-color LED display structure, the distance from the edge of the primary ink on the front side to the edge of the full-color LED display structure is greater than a preset distance; carrying out secondary ink covering on the front surface of the LED circuit board after the primary ink covering to cover the area between the edges of two adjacent primary inks on the front surface, wherein the secondary ink is fluorescent ink; the LED circuit board is cut to obtain a plurality of full-color LED display units, fluorescence detection is carried out on four side faces of each full-color LED display unit respectively, and all the full-color LED display units with fluorescence reaction on the side faces are cut qualified products. This application can realize the screening to the defective products, reduces the outflow of defective products.

Description

Cutting detection method of LED circuit board and LED circuit board structure
Technical Field
The application relates to the technical field of LEDs, in particular to a cutting detection method of an LED circuit board and an LED circuit board structure.
Background
At present, in an all-in-one full-color display structure, because the distance between a circuit structure and an edge is small, a pad of a functional area is too close to an edge cutting area, and the tolerance of the existing cutting process is greater than that of a reserved position, the functional area is easily damaged, and the integral reliability of a product is influenced; in addition, the whole size of the product is small, the condition of deviation is easy to occur when the product is cut, manual or equipment inspection is not facilitated due to the small size and the design of the original structure, defective products are difficult to remove, and therefore a lot of defective products flow out, and the whole yield and performance of the product are reduced.
Disclosure of Invention
Aiming at one of the defects in the prior art, the application aims to provide a cutting detection method of an LED circuit board and an LED circuit board structure so as to solve the problems that poor products are difficult to remove in the related art, and the overall yield and performance of the products are low.
The first aspect of the present application provides a method for cutting and detecting an LED circuit board, where the LED circuit board is formed by arranging a plurality of full-color LED display unit arrays, and the method includes:
covering the LED circuit board with ink once, covering the metal via holes and the metal wires of the LED circuit board, and not covering the bonding pads; the primary ink on the front sides of the adjacent full-color LED display structures are not connected, and in a single full-color LED display structure, the distance from the edge of the primary ink on the front side to the edge of the full-color LED display structure is greater than a preset distance;
carrying out secondary ink covering on the front surface of the LED circuit board after the primary ink covering to cover the area between the edges of two adjacent primary inks on the front surface, wherein the secondary ink is fluorescent ink;
the LED circuit board is cut to obtain a plurality of full-color LED display units, the four side faces of each full-color LED display unit are respectively subjected to fluorescence detection, and the full-color LED display units with fluorescence reaction on all the side faces are cut qualified products.
In some embodiments, the ink covering on the LED circuit board comprises:
coating solder resist ink on the LED circuit board;
covering the solder resist film on the solder resist ink of the LED circuit board, and then carrying out exposure treatment; the solder mask film comprises a plurality of groups of outline windowing lines, and each group of outline windowing lines respectively correspond to the shape outline of the primary ink to be formed on a full-color LED display unit;
and developing the exposed LED circuit board to remove the solder resist ink corresponding to the area outside the outline windowing line, and forming the solder resist ink in the rest part into primary ink.
In some embodiments, the secondary ink is a fluorescent ink that is only excited by invisible light.
In some embodiments, the fluorescence detection is performed on four sides of each full-color LED display unit, specifically including:
and sequentially irradiating four side surfaces of each full-color LED display unit by adopting an invisible light source, and respectively identifying whether a fluorescence reaction exists by using a CCD (charge coupled device) lens.
In some embodiments, the invisible light is ultraviolet light or infrared light.
In some embodiments, before the step of performing the ink covering on the LED circuit board, the method further includes:
and sequentially carrying out acid washing, primary water washing, plate grinding, secondary water washing and drying on the LED circuit board.
In some embodiments, the secondary water washing step includes ultrasonic water washing and rinsing with clean water.
This application second aspect provides a LED circuit board structure, and it includes:
the LED circuit board is formed by arranging a plurality of full-color LED display unit arrays;
the first ink layer is used for covering the metal through holes and the metal wires of the LED circuit board and does not cover the bonding pads; the first ink layers on the front sides of the adjacent full-color LED display structures are not connected, and in a single full-color LED display structure, the distance from the edge of the first ink layer on the front side to the edge of the full-color LED display structure is greater than a preset distance;
and the second ink layer is used for covering the area between the edges of two adjacent first ink layers, and the second ink layer adopts fluorescent ink.
In some embodiments, the full-color LED display unit includes an upper circuit board and a lower circuit board, and the upper circuit board and the lower circuit board are connected through a metal via.
In some embodiments, the upper circuit board is equally divided into four regions by a cross, and the upper circuit board is provided with:
two die bond pad assemblies;
the two pixel units are arranged on one die bond pad component, and the four pixel units are respectively positioned in each area of the upper layer circuit board; each pixel unit comprises three light-emitting chips, the three light-emitting chips are positioned on the same straight line, and the three light-emitting chips in different pixel units are arranged in a translational symmetry manner;
the plurality of B pole bonding pads are arranged in one-to-one correspondence with each light-emitting chip and are respectively connected with the B poles of the corresponding light-emitting chips, and the A pole of each light-emitting chip is respectively connected with the die bonding pad component where the A pole of each light-emitting chip is located; the polarity of the A pole is opposite to that of the B pole.
The beneficial effect that technical scheme that this application provided brought includes:
according to the cutting detection method of the LED circuit board and the LED circuit board structure, primary ink covering and secondary ink covering are sequentially carried out on the LED circuit board, so that in a single full-color LED display structure, the distance from the front primary ink edge to the edge of the full-color LED display structure is larger than a preset distance, the secondary ink is fluorescent ink and covers the area between the front adjacent two primary ink edges, then the LED circuit board can be cut to obtain a plurality of full-color LED display units, fluorescence detection is respectively carried out on four side surfaces of each full-color LED display unit, and the full-color LED display units with fluorescence reactions on all side surfaces are used as cut qualified products; the screening method effectively screens the defective products, reduces the outflow of the defective products, and increases the overall yield and performance of the product.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic front view of a full-color LED display unit in step S1 in the embodiment of the present application;
FIG. 2 is a schematic rear view of the full-color LED display unit in step S1 in the embodiment of the present application;
FIG. 3 is a schematic front view of the full-color LED display unit in step S2 in the embodiment of the present application;
fig. 4 is a schematic structural diagram of an upper layer circuit board in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a lower layer circuit board in the embodiment of the present application.
Reference numerals:
1. an upper layer circuit board; 2. a die bond pad assembly; 3. die bonding pads; 4. a connecting section; 5. a first pixel unit; 6. a second pixel unit; 7. a third pixel unit; 8. a fourth pixel unit; 9. a common A-pole pad; 10. a second extension portion; 11. a blue light chip; 12. a green chip; 13. a red light chip; 14. a lower layer circuit board; 15. a first blue light B-pole bonding pad; 16. a second blue light B pole bonding pad; 17. a third blue light B pole bonding pad; 18. a fourth blue light B pole bonding pad; 19. a first green B-pole pad; 20. a second green B-pole pad; 21. a third green B-pole pad; 22. a fourth green B-pole pad; 23. a first red B-pole pad; 24. a second red light B pole pad; 25. a third red B-pole bonding pad; 26. a fourth red B-pole bonding pad; 27. a first lower layer pad; 28. a second lower layer pad; 29. a third lower layer pad; 30. a fourth lower layer pad; 31. a fifth lower layer pad; 32. a sixth lower layer pad; 33. a seventh lower layer pad; 34. an eighth lower layer pad;
101. primary printing ink; 102. and (5) secondary ink.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
The embodiment of the application provides a cutting detection method of an LED circuit board, which can solve the problems that in the related technology, bad products are difficult to remove, and the overall yield and performance of the products are low.
The LED circuit board of the embodiment of the application is formed by arranging a plurality of full-color LED display unit arrays, and the cutting detection method of the LED circuit board comprises the following steps:
s1, performing ink covering on the LED circuit board once to cover the metal via holes and the metal wires of the LED circuit board and not to cover the bonding pads; the primary ink 101 on the front sides of the adjacent full-color LED display structures are not connected, and in a single full-color LED display structure, the distance from the edge of the primary ink 101 on the front side to the edge of the full-color LED display structure is larger than a preset distance.
Alternatively, the preset distance may be set according to actual process conditions, so as to avoid that the tolerance of the primary ink 101 covering process causes the primary ink 101 to cover the functional region such as the pad. In this embodiment, the predetermined distance is 65 um.
And S2, performing secondary ink covering on the front surface of the LED circuit board after the primary ink covering to cover the area between the edges of two adjacent primary inks 101 on the front surface, wherein the secondary ink 102 is fluorescent ink. The front side of the LED circuit board is the front side of the full-color LED display structure.
And S3, cutting the LED circuit board covered with the printing ink to obtain a plurality of full-color LED display units covered with the printing ink, and respectively carrying out fluorescence detection on four side surfaces of each full-color LED display unit, wherein the full-color LED display units with fluorescence reaction on all side surfaces are cut qualified products, and the full-color LED display units without fluorescence reaction on any side surface are cut defective products.
In the cutting detection method of the embodiment, the LED circuit board is sequentially subjected to primary ink covering and secondary ink covering, so that in a single full-color LED display structure, the distance from the edge of the primary ink on the front side to the edge of the full-color LED display structure is greater than a preset distance, the secondary ink is fluorescent ink and covers an area between two adjacent edges of the primary ink on the front side, then the LED circuit board can be cut to obtain a plurality of full-color LED display units, the four side surfaces of each full-color LED display unit are respectively subjected to fluorescence detection, and the full-color LED display units with all side surfaces having fluorescence reaction are used as cut qualified products; the method effectively screens the defective products, reduces the outflow of the defective products, and increases the overall yield and performance of the product.
As shown in fig. 1 and fig. 2, in the present embodiment, on the basis of the above embodiment, the step S1 of performing ink covering on the LED circuit board for one time specifically includes the following steps:
firstly, coating solder resist ink on the LED circuit board; wherein, use the equipment of printing solder mask oil to print the front of solder mask ink to all places of LED circuit board, whole LED circuit board is all covered by the ink. Not only can reduce the warping degree of the LED circuit board, but also can prevent the circuit from leaking.
Then, covering the solder resist film on the solder resist ink of the LED circuit board, and then carrying out exposure treatment; the solder mask film comprises a plurality of groups of outline windowing lines, and each group of outline windowing lines respectively correspond to the shape outline of the one-time printing ink to be formed on one full-color LED display unit. In this embodiment, the primary ink shapes on the front and back of the LED circuit board are different.
And finally, developing the exposed LED circuit board to remove the solder mask ink corresponding to the areas outside each group of outline windowing lines, and forming the solder mask ink of the rest parts into primary ink 101. In this embodiment, the coverage of the primary ink can be controlled at all the pad edges.
Preferably, because this full-color LED display element is the full-color lamp pearl of RGB, the RGB tricolor can mix out the light of various different colours, consequently, for avoiding using the effect that visible wave band can influence the product when normally using, above-mentioned fluorescent ink is the fluorescent ink that only receives the excitation of invisible light to realize photoluminescence's cold light phenomenon.
Optionally, the invisible light is ultraviolet light or infrared light.
In this embodiment, the fluorescent ink is UV (ultraviolet) fluorescent ink to meet the use requirements of exposure and development.
As shown in fig. 3, in the present embodiment, in the step S2, the front surface of the LED circuit board after being covered with the primary ink is covered with the secondary ink, and the covering principle is as the primary ink covering process, and the main difference is that the outline windowing line on the solder mask film corresponds to the outline of the secondary ink shape to be formed on the front surface of the LED circuit board.
In this embodiment, after the second ink covering, the ratio of the ink covering on the front side and the back side of each full-color LED display unit may be greater than 60%.
Optionally, after the front surface of the LED circuit board is covered with the second ink, the back surface of the LED circuit board may be covered with the third ink, so as to identify the direction.
Further, in step S3, the fluorescence detection is performed on each of the four side surfaces of the full-color LED display unit, specifically including the steps of:
the four side surfaces of each full-color LED display unit are sequentially irradiated by a light source of invisible light, and a CCD (Charge Coupled Device) lens is used to identify whether there is a fluorescent reaction.
The cutting does not have unusual full-color LED display element and should have fluorescence reaction in four sides, if there is any side fluorescence reaction that does not appear, then judges this full-color LED display element cutting damage, when cutting promptly, cuts this full-color LED display element's functional area, needs to reject.
In this embodiment, in the step S1, before the LED circuit board is covered with the ink for one time, the method further includes the following steps:
and sequentially carrying out acid washing, primary water washing, plate grinding, secondary water washing and drying on the LED circuit board.
Preferably, the secondary water washing step includes ultrasonic water washing, clear water rinsing, and the like.
In this embodiment, since the surface of the circuit copper on the LED circuit board is oxidized to a certain extent after the circuit copper is exposed, the oxidation and the removal of the impurities such as oil stains need to be performed by an acid washing step. Through the plate grinding step, the printing ink can be better combined with the LED circuit board.
The embodiment of the application also provides an LED circuit board structure, which comprises an LED circuit board, a first ink layer and a second ink layer.
The LED circuit board is formed by arranging a plurality of full-color LED display unit arrays.
The first ink layer is used for covering the metal through holes and the metal wires of the LED circuit board and not covering the bonding pads; the first ink layer on the front side of the adjacent full-color LED display structures are not connected, and in a single full-color LED display structure, the distance from the edge of the first ink layer on the front side to the edge of the full-color LED display structure is greater than a preset distance.
The second ink layer is used for covering the area between the edges of the two adjacent first ink layers, and the second ink layer adopts fluorescent ink.
The LED circuit board structure of this embodiment cuts the back, can obtain a plurality of full-color LED display element that have first printing ink layer and second printing ink layer that cover, full-color LED display element covers promptly and has above-mentioned once printing ink and secondary printing ink, carries out fluorescence detection through four sides to every full-color LED display element respectively, and all sides all have fluorescence reaction's full-color LED display element for cutting qualified product, and any side does not have fluorescence reaction's full-color LED display element and is the bad product of cutting.
As shown in fig. 4 and fig. 5, in the present embodiment, the full-color LED display unit includes an upper circuit board 1 on the front surface and a lower circuit board 14 on the back surface, a plurality of metal vias are correspondingly formed between the upper circuit board 1 and the lower circuit board 14, and the upper circuit board 1 and the lower circuit board 14 are connected by the metal vias.
Furthermore, the upper layer circuit board 1 is equally divided into four areas by a cross, and two die bond pad assemblies 2, four pixel units and a plurality of B pole bonding pads are arranged on the upper layer circuit board.
Two pixel units are arranged on a die bond pad assembly 2, and the four pixel units are respectively positioned in each area of the upper layer circuit board 1; each pixel unit comprises three light-emitting chips, the three light-emitting chips are located on the same straight line, and the three light-emitting chips in different pixel units are arranged in a translation symmetry mode.
The plurality of the B pole bonding pads are respectively arranged corresponding to each light-emitting chip one to one, the plurality of the B pole bonding pads are respectively connected with the B poles of the corresponding light-emitting chips, and the A pole of each light-emitting chip is respectively connected with the wafer bonding pad assembly 2 where the A pole of each light-emitting chip is located; the polarity of the A pole is opposite to that of the B pole.
Further, each of the above-described die bond pad assemblies 2 includes two die bond pads 3, two common a-pole pads 9, and one connecting segment 4.
Each die bond pad 3 is provided with a pixel unit.
Each common a-pole pad 9 is an L-shaped pad formed by extending the right side of one die bond pad 3, and each common a-pole pad is connected to the a pole of an adjacent pixel unit. Namely, the A poles of the three light emitting chips of each pixel unit are electrically connected with the adjacent common A pole bonding pad, so that the common ends of two pixel units in the same row are connected together.
The L-shaped bonding pad comprises a first extension part formed by extending the right side of the die bonding pad 3 and a second extension part 10 extending from the tail end of the first extension part; the extending directions of the four second extending portions 10 are the same.
The connecting section 4 is used for connecting the two die bond pads 3, and the connecting section 4 is arranged close to the edge of the upper layer circuit board 1.
In this embodiment, in the four regions, the first pixel unit 5 and the second pixel unit 6 are respectively arranged in the upper row from left to right, and the third pixel unit 7 and the fourth pixel unit 8 are respectively arranged in the lower row from left to right.
One end of the connecting segment 4 between the first pixel unit 5 and the second pixel unit 6 is connected with the common a pole pad 9 formed by extending the die bonding pad 3 where the first pixel unit 5 is located, and the other end of the connecting segment 4 is connected with the die bonding pad 3 where the second pixel unit 6 is located.
Two die bonding pads 3 are respectively connected to two ends of the connecting segment 4 between the third pixel unit 7 and the fourth pixel unit 8, namely the die bonding pads 3 where the third pixel unit 7 and the fourth pixel unit 8 are respectively connected.
Specifically, when the common a-pole pad 9 is a common negative-pole pad, the B-pole pad is a positive-pole pad; when the common a-electrode pad 9 is a common positive electrode pad, the B-electrode pad is a negative electrode pad.
On the basis of the above embodiment, in this embodiment, the three light emitting chips in each pixel unit sequentially include the blue light chip 11, the green light chip 12, and the red light chip 13 from top to bottom, the blue light chip 11 and the green light chip 12 are in a horizontal structure, and the red light chip 13 is in a vertical structure.
Further, the a pole of the red light chip 13 is fixedly connected to the corresponding die bond pad 3 through a conductive material, so that the electrical connection with the common a pole pad 9 is realized, and the manufacturing process is saved. The blue light chip 11 and the green light chip 12 are both fixedly connected to the corresponding die bonding pad 3 through insulating materials. The extending directions of the four second extending portions 10 are the same so that the second extending portions 10 are electrically connected to the a poles of the adjacent blue and green chips 11 and 12.
In this embodiment, the B pole of the red light chip 13, and the a pole and the B pole of the blue light chip 11 and the green light chip 12 are electrically connected to the corresponding pad areas through bonding wires.
In this embodiment, the conductive material is a conductive adhesive, and the insulating material is an insulating adhesive, so as to increase the connection reliability of the LED display unit.
Optionally, the lower circuit board 14 includes eight lower pads distributed at equal intervals along the circumferential direction, four of the pads being located at four corners of the lower circuit board 14.
Each land group is electrically connected to one lower land, and each connecting segment 4 is electrically connected to one lower land, respectively.
In the present embodiment, the eight lower layer pads are the first lower layer pad 27, the second lower layer pad 28, the third lower layer pad 29, the fourth lower layer pad 30, the fifth lower layer pad 31, the sixth lower layer pad 32, the seventh lower layer pad 33, and the eighth lower layer pad 34, respectively.
Further, the plurality of B-pole pads include a first blue pad group, a second blue pad group, a first green pad group, a second green pad group, a first red pad group, and a second red pad group.
The first blue light pad group comprises a first blue light B pole pad 15 corresponding to the blue light chip 11 in the first pixel unit 5 and a third blue light B pole pad 17 corresponding to the blue light chip 11 in the third pixel unit 7, the first blue light B pole pad 15 and the third blue light B pole pad 17 are connected through a lead on the upper-layer circuit board 1, and the first blue light B pole pad 15 is further connected to the first lower-layer pad 27 through a metal via hole.
The second blue light pad group includes a second blue light B-pole pad 16 corresponding to the blue light chip 11 in the second pixel unit 6 and a fourth blue light B-pole pad 18 corresponding to the blue light chip 11 in the fourth pixel unit 8, the second blue light B-pole pad 16 and the fourth blue light B-pole pad 18 are connected through the conducting wire on the upper layer circuit board 1, and the conducting wire is connected to the conducting wire connected to the second lower layer pad 28 through a metal via hole.
The first green pad group comprises a first green B-pole pad 19 corresponding to the green chip 12 in the first pixel unit 5 and a third green B-pole pad 21 corresponding to the green chip 12 in the third pixel unit 7, the first green B-pole pad 19 and the third green B-pole pad 21 are connected through a lead on the upper-layer circuit board 1, the lead is positioned between the first red B-pole pad 23 and the second blue B-pole pad 16, and the lead is connected to a seventh lower-layer pad 33 through a metal via hole;
the second green pad group includes a second green B-pole pad 20 corresponding to the green chip 12 in the second pixel unit 6, and a fourth green B-pole pad 22 corresponding to the green chip 12 in the fourth pixel unit 8, the second green B-pole pad 20 and the fourth green B-pole pad 22 are connected by a conducting wire on the lower layer circuit board 14, the conducting wire connected with the fourth green B-pole pad 22 at one end of the conducting wire is connected by a metal via, the other end of the conducting wire is connected to the eighth lower layer pad 34, and the conducting wire connected with the second green B-pole pad 20 is connected with the eighth lower layer pad 34 by a metal via.
The first red light pad group comprises a first red light B pole pad 23 corresponding to the red light chip 13 in the first pixel unit 5 and a third red light B pole pad 25 corresponding to the red light chip 13 in the third pixel unit 7, the first red light B pole pad 23 and the third red light B pole pad 25 are connected through a lead on the lower layer circuit board 14, one end of the lead is connected with the first red light B pole pad 23 through a metal through hole, the other end of the lead is connected to the third lower layer pad 29, and the third red light B pole pad 25 is connected with the third lower layer pad 29 through a metal through hole.
The second red light pad group includes a second red light B pole pad 24 corresponding to the red light chip 13 in the second pixel unit 6, and a fourth red light B pole pad 26 corresponding to the red light chip 13 in the fourth pixel unit 8, the second red light B pole pad 24 and the fourth red light B pole pad 26 are connected through a wire on the lower layer circuit board 14, one end of the wire is connected with the second red light B pole pad 24 through a metal via, the other end of the wire is connected to the fourth lower layer pad 30, the fourth red light B pole pad 26 is connected with the fourth lower layer pad 30 through a metal via, the wire is a curved routing wire, and bypasses the wire connected with the second green light B pole pad 20 to meet the requirement of the distance in each direction, so as to be connected to the upper layer circuit board 1.
In this embodiment, the connection segment 4 located above is connected to the fifth lower pad 31 through a metal via, and the connection segment 4 located below is connected to the sixth lower pad 32 through a metal via.
The full-color LED display element of this embodiment, promotion based on PCB board processing procedure technology precision, make the pad interval can reach minimum 70 um's distance, and then through carrying out optimization design again to whole pad structure, can realize that the three luminescent chip in every pixel is translation symmetrical arrangement, and overall structure is inseparabler, be convenient for walk the line, effectively increase the cooperation state between upper circuit board and the lower floor's circuit board, and make the pad edge increase to the distance at full-color LED display element edge, and be not less than 75um, reduce and draw inclined to one side probability.
The LED circuit board structure of this embodiment is applicable to above-mentioned each cutting detection method, utilizes the change to full-color LED display element overall arrangement to and the change of printing ink structure and technology, can realize quick and effectual cutting detection, increases the recognition efficiency, reduces the outflow of defective products, with the holistic yield of increase product and performance.
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is noted that, in the present application, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A cutting detection method of an LED circuit board is characterized in that the LED circuit board is formed by arranging a plurality of full-color LED display unit arrays, and the method comprises the following steps:
covering the LED circuit board with ink once, covering the metal via holes and the metal wires of the LED circuit board, and not covering the bonding pads; the primary ink (101) on the front sides of the adjacent full-color LED display structures are not connected, and in a single full-color LED display structure, the distance from the edge of the primary ink (101) on the front side to the edge of the full-color LED display structure is greater than a preset distance;
carrying out secondary ink covering on the front surface of the LED circuit board after the primary ink covering to cover the area between the edges of two adjacent primary inks (101) on the front surface, wherein the secondary ink (102) is fluorescent ink;
the LED circuit board is cut to obtain a plurality of full-color LED display units, the four side faces of each full-color LED display unit are respectively subjected to fluorescence detection, and all the full-color LED display units with fluorescence reaction on the side faces are cut into qualified products.
2. The method for detecting the cutting of the LED circuit board according to claim 1, wherein the LED circuit board is covered with ink once, and specifically comprises:
coating solder resist ink on the LED circuit board;
covering the solder resist film on the solder resist ink of the LED circuit board, and then carrying out exposure treatment; the solder mask film comprises a plurality of groups of outline windowing lines, and each group of outline windowing lines respectively correspond to the shape outline of the primary ink to be formed on a full-color LED display unit;
and developing the exposed LED circuit board to remove the solder mask ink corresponding to the area outside the outline windowing line, and forming the residual solder mask ink into primary ink (101).
3. The method for detecting the cutting of the LED wiring board according to claim 1, characterized in that: the secondary ink (102) is a fluorescent ink that is only excited by invisible light.
4. The method for detecting the cutting of the LED circuit board according to claim 3, wherein the fluorescence detection is performed on four side surfaces of each full-color LED display unit, specifically comprising:
and sequentially irradiating four side surfaces of each full-color LED display unit by adopting an invisible light source, and respectively identifying whether a fluorescence reaction exists by using a CCD (charge coupled device) lens.
5. The method for detecting the cutting of the LED wiring board according to claim 4, wherein: the invisible light is ultraviolet light or infrared light.
6. The method for detecting the cutting of the LED circuit board according to claim 1, wherein before the LED circuit board is covered with the ink for one time, the method further comprises:
and sequentially carrying out acid washing, primary water washing, plate grinding, secondary water washing and drying on the LED circuit board.
7. The method for detecting the cutting of the LED wiring board according to claim 6, wherein: the secondary water washing step comprises ultrasonic water washing and clear water rinsing.
8. An LED circuit board structure, characterized in that, it includes:
the LED circuit board is formed by arranging a plurality of full-color LED display unit arrays;
the first ink layer is used for covering the metal through holes and the metal wires of the LED circuit board and does not cover the bonding pads; the first ink layers on the front sides of the adjacent full-color LED display structures are not connected, and in a single full-color LED display structure, the distance from the edge of the first ink layer on the front side to the edge of the full-color LED display structure is greater than a preset distance;
and the second ink layer is used for covering the area between the edges of two adjacent first ink layers, and the second ink layer adopts fluorescent ink.
9. The LED circuit board structure of claim 8, wherein: full-color LED display element includes upper circuit board (1) and lower floor's circuit board (14), pass through metal via hole connection between upper circuit board (1) and lower floor's circuit board (14).
10. The LED circuit board structure according to claim 9, characterized in that the upper circuit board (1) is equally divided into four areas by a cross, and the upper circuit board (1) is provided with:
two die bond pad assemblies (2);
the two pixel units are arranged on one die bond pad assembly (2), and the four pixel units are respectively positioned in each area of the upper-layer circuit board (1); each pixel unit comprises three light-emitting chips, the three light-emitting chips are positioned on the same straight line, and the three light-emitting chips in different pixel units are arranged in a translational symmetry manner;
the plurality of B pole bonding pads are arranged in one-to-one correspondence with each light-emitting chip and are respectively connected with the B poles of the corresponding light-emitting chips, and the A pole of each light-emitting chip is respectively connected with the die bonding pad assembly (2) where the A pole is located; the polarity of the A pole is opposite to that of the B pole.
CN202111165305.4A 2021-09-30 2021-09-30 Cutting detection method of LED circuit board and LED circuit board structure Active CN113909155B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111165305.4A CN113909155B (en) 2021-09-30 2021-09-30 Cutting detection method of LED circuit board and LED circuit board structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111165305.4A CN113909155B (en) 2021-09-30 2021-09-30 Cutting detection method of LED circuit board and LED circuit board structure

Publications (2)

Publication Number Publication Date
CN113909155A true CN113909155A (en) 2022-01-11
CN113909155B CN113909155B (en) 2023-08-01

Family

ID=79237928

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111165305.4A Active CN113909155B (en) 2021-09-30 2021-09-30 Cutting detection method of LED circuit board and LED circuit board structure

Country Status (1)

Country Link
CN (1) CN113909155B (en)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103179796A (en) * 2013-03-05 2013-06-26 泰和电路科技（惠州）有限公司 Circuit board manufacturing method and circuit board manufactured by same
CN203659372U (en) * 2014-01-03 2014-06-18 深圳市奥蕾达光电技术有限公司 LED display screen and full color LED light emitting panel
CN104815805A (en) * 2015-03-19 2015-08-05 南昌大学 Automatic screening system and screening method for LED chips
KR20160017697A (en) * 2014-07-31 2016-02-17 (주)위시스 Method for Manufacturing LED Device Using Phosphor Film Attaching Method
CN205595328U (en) * 2015-12-07 2016-09-21 常州市武进区半导体照明应用技术研究院 Full -color LED encapsulation structure
CN106025040A (en) * 2016-07-13 2016-10-12 扬州中科半导体照明有限公司 Single-sided light emission light emitting element and production method thereof
CN209184860U (en) * 2018-09-28 2019-07-30 深圳市洲明科技股份有限公司 PCB substrate, LED integration packaging display module and display device
CN209238462U (en) * 2018-09-13 2019-08-13 漯河银鸽生活纸产有限公司 Roll toilet paper paper device for eliminating
CN110125042A (en) * 2019-04-12 2019-08-16 中北大学 A kind of sorting machine
CN110461954A (en) * 2017-03-27 2019-11-15 尔吉斯股份公司 Coating for tagged plastic, the method for tagged plastic, for identification method of tagged plastic and its application in sorting plastic refuse
CN112934756A (en) * 2021-03-31 2021-06-11 吉安市木林森显示器件有限公司 Novel LED chip mass sorting method

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103179796A (en) * 2013-03-05 2013-06-26 泰和电路科技（惠州）有限公司 Circuit board manufacturing method and circuit board manufactured by same
CN203659372U (en) * 2014-01-03 2014-06-18 深圳市奥蕾达光电技术有限公司 LED display screen and full color LED light emitting panel
KR20160017697A (en) * 2014-07-31 2016-02-17 (주)위시스 Method for Manufacturing LED Device Using Phosphor Film Attaching Method
CN104815805A (en) * 2015-03-19 2015-08-05 南昌大学 Automatic screening system and screening method for LED chips
CN205595328U (en) * 2015-12-07 2016-09-21 常州市武进区半导体照明应用技术研究院 Full -color LED encapsulation structure
CN106025040A (en) * 2016-07-13 2016-10-12 扬州中科半导体照明有限公司 Single-sided light emission light emitting element and production method thereof
CN110461954A (en) * 2017-03-27 2019-11-15 尔吉斯股份公司 Coating for tagged plastic, the method for tagged plastic, for identification method of tagged plastic and its application in sorting plastic refuse
CN209238462U (en) * 2018-09-13 2019-08-13 漯河银鸽生活纸产有限公司 Roll toilet paper paper device for eliminating
CN209184860U (en) * 2018-09-28 2019-07-30 深圳市洲明科技股份有限公司 PCB substrate, LED integration packaging display module and display device
CN110125042A (en) * 2019-04-12 2019-08-16 中北大学 A kind of sorting machine
CN112934756A (en) * 2021-03-31 2021-06-11 吉安市木林森显示器件有限公司 Novel LED chip mass sorting method

Also Published As

Publication number Publication date
CN113909155B (en) 2023-08-01

Similar Documents

Publication Publication Date Title
TWI445218B (en) Light emitting diode package and manufacturing method thereof
JP4456102B2 (en) Backlight assembly and liquid crystal display module using the same
CN100435362C (en) Light-emitting diode
CN110233200B (en) Three-dimensional integrated structure of Micro LED and manufacturing method
US20060261292A1 (en) Light emitting device package and method for manufacturing the same
TW202209714A (en) Light emitting unit and display apparatus
CN111263893A (en) Method and device for inspecting LED chip, and method for manufacturing LED display
US7838878B2 (en) Semiconductor-based sub-mounts for optoelectronic devices with conductive paths to facilitate testing and binning
WO2010071131A1 (en) Light emission apparatus
KR20130128841A (en) Semiconductor light emitting device having a multi-cell array and manufacturing method for the same, light emitting module and illumination apparatus
WO2013150882A1 (en) Led light emitting apparatus
US20110199772A1 (en) Light-emitting device and illumination device
CN102478172A (en) Illumination apparatus
KR100862454B1 (en) Backlight unit having leds and method for manufacturing the same
CN113314498B (en) Circuit board, lamp panel, backlight module and display device
CN113909155A (en) Cutting detection method of LED circuit board and LED circuit board structure
WO2011136446A1 (en) Optical package and method of manufacturing the same
KR20110049114A (en) Light emitting diode package and lcd module including the same
CN112735286A (en) LED lamp bead
CN209880654U (en) Three-dimensional integrated structure of Micro LED
WO2013002588A2 (en) Motherboard for a printed circuit board for an led, printed circuit board, led unit, illuminating device, and method for manufacturing same
CN115036301A (en) Substrate module, manufacturing method of substrate module and display module
JP2008227176A (en) Light-emitting device and manufacturing method thereof
JP6982489B2 (en) Light emitting device and manufacturing method of light emitting device
WO2016028098A1 (en) Metal core printed circuit board and method for manufacturing same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant